CN105623917A - Circuit board cleaning agent - Google Patents
Circuit board cleaning agent Download PDFInfo
- Publication number
- CN105623917A CN105623917A CN201610094063.7A CN201610094063A CN105623917A CN 105623917 A CN105623917 A CN 105623917A CN 201610094063 A CN201610094063 A CN 201610094063A CN 105623917 A CN105623917 A CN 105623917A
- Authority
- CN
- China
- Prior art keywords
- parts
- content
- cleaning agent
- circuit board
- phenylenediamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3942—Inorganic per-compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
- C11D7/14—Silicates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/36—Organic compounds containing phosphorus
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a circuit board cleaning agent.The circuit board cleaning agent is prepared from, by weight, 10-15 parts of hydrogen peroxide, 25-35 parts of butyl acetate, 1.5-3.5 parts of phosphonic carboxylic acid, 4-9 parts of o-phenylenediamine, 3-6 parts of citric acid, 12-20 parts of silicate and 55-65 parts of water.In this way, the circuit board cleaning agent cannot cause any damage to a circuit board, does not damage electronic components on the circuit board, can thoroughly remove stains attached to the circuit board and is better in oil removal effect, higher in cleaning efficiency and wider in use range.
Description
Technical field
The present invention relates to abluent field, particularly relate to a kind of pcb cleaning agent.
Background technology
Generally there are electronic devices and components due to circuit board, are therefore not suitable for cleaning with water, and apply special Xi Banshui and be carried out, and it must also be ensured that wiring board and electronic devices and components above thereof can not be damaged when cleaning.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of better effects if of deoiling, cleaning efficiency is higher, use wider pcb cleaning agent.
For solving above-mentioned technical problem, the present invention provides a kind of pcb cleaning agent, including: hydrogen peroxide, butyl acetate, phosphine carboxylic acid, o-phenylenediamine, citric acid, silicate and water, described content of hydrogen peroxide is 10-15 part, and described butyl acetate content is 25-35 part, described phosphine carboxylic acid content is 1.5-3.5 part, described o-phenylenediamine content is 4-9 part, and described citric acid content is 3-6 part, and described silicate content is 12-20 part, described water content is 55-65 part, and described content is weight proportion.
In a preferred embodiment of the present invention, described content of hydrogen peroxide is 10 parts, described butyl acetate content is 25 parts, described phosphine carboxylic acid content is 1.5 parts, described o-phenylenediamine content is 4 parts, and described citric acid content is 3 parts, and described silicate content is 12 parts, described water content is 55 parts, and described content is weight proportion.
In a preferred embodiment of the present invention, described content of hydrogen peroxide is 15 parts, described butyl acetate content is 35 parts, described phosphine carboxylic acid content is 3.5 parts, described o-phenylenediamine content is 9 parts, and described citric acid content is 6 parts, and described silicate content is 20 parts, described water content is 65 parts, and described content is weight proportion.
In a preferred embodiment of the present invention, described content of hydrogen peroxide is 12 parts, described butyl acetate content is 30 parts, described phosphine carboxylic acid content is 3 parts, described o-phenylenediamine content is 5 parts, and described citric acid content is 5 parts, and described silicate content is 15 parts, described water content is 60 parts, and described content is weight proportion.
The invention has the beneficial effects as follows: wiring board will not be caused any damage by pcb cleaning agent of the present invention, without damage wiring board on electronic devices and components, can thoroughly remove again wiring board has spot, better effects if of deoiling, cleaning efficiency is higher, it is wider to use.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments. Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
Embodiment 1
A kind of pcb cleaning agent, including: hydrogen peroxide, butyl acetate, phosphine carboxylic acid, o-phenylenediamine, citric acid, silicate and water, described content of hydrogen peroxide is 10 parts, described butyl acetate content is 25 parts, and described phosphine carboxylic acid content is 1.5 parts, and described o-phenylenediamine content is 4 parts, described citric acid content is 3 parts, described silicate content is 12 parts, and described water content is 55 parts, and described content is weight proportion.
Embodiment 2
A kind of pcb cleaning agent, including: hydrogen peroxide, butyl acetate, phosphine carboxylic acid, o-phenylenediamine, citric acid, silicate and water, described content of hydrogen peroxide is 15 parts, described butyl acetate content is 35 parts, and described phosphine carboxylic acid content is 3.5 parts, and described o-phenylenediamine content is 9 parts, described citric acid content is 6 parts, described silicate content is 20 parts, and described water content is 65 parts, and described content is weight proportion.
Embodiment 3
A kind of pcb cleaning agent, including: hydrogen peroxide, butyl acetate, phosphine carboxylic acid, o-phenylenediamine, citric acid, silicate and water, described content of hydrogen peroxide is 12 parts, described butyl acetate content is 30 parts, and described phosphine carboxylic acid content is 3 parts, and described o-phenylenediamine content is 5 parts, described citric acid content is 5 parts, described silicate content is 15 parts, and described water content is 60 parts, and described content is weight proportion.
It is different from prior art, wiring board will not be caused any damage by pcb cleaning agent of the present invention, without damage wiring board on electronic devices and components, can thoroughly remove again wiring board has spot, better effects if of deoiling, cleaning efficiency is higher, it is wider to use.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical field, all in like manner include in the scope of patent protection of the present invention.
Claims (4)
1. a pcb cleaning agent, it is characterized in that, including: hydrogen peroxide, butyl acetate, phosphine carboxylic acid, o-phenylenediamine, citric acid, silicate and water, described content of hydrogen peroxide is 10-15 part, and described butyl acetate content is 25-35 part, described phosphine carboxylic acid content is 1.5-3.5 part, described o-phenylenediamine content is 4-9 part, and described citric acid content is 3-6 part, and described silicate content is 12-20 part, described water content is 55-65 part, and described content is weight proportion.
2. pcb cleaning agent according to claim 1, it is characterized in that, described content of hydrogen peroxide is 10 parts, described butyl acetate content is 25 parts, and described phosphine carboxylic acid content is 1.5 parts, and described o-phenylenediamine content is 4 parts, described citric acid content is 3 parts, described silicate content is 12 parts, and described water content is 55 parts, and described content is weight proportion.
3. pcb cleaning agent according to claim 1, it is characterized in that, described content of hydrogen peroxide is 15 parts, described butyl acetate content is 35 parts, and described phosphine carboxylic acid content is 3.5 parts, and described o-phenylenediamine content is 9 parts, described citric acid content is 6 parts, described silicate content is 20 parts, and described water content is 65 parts, and described content is weight proportion.
4. pcb cleaning agent according to claim 1, it is characterized in that, described content of hydrogen peroxide is 12 parts, described butyl acetate content is 30 parts, and described phosphine carboxylic acid content is 3 parts, and described o-phenylenediamine content is 5 parts, described citric acid content is 5 parts, described silicate content is 15 parts, and described water content is 60 parts, and described content is weight proportion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610094063.7A CN105623917A (en) | 2016-02-22 | 2016-02-22 | Circuit board cleaning agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610094063.7A CN105623917A (en) | 2016-02-22 | 2016-02-22 | Circuit board cleaning agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105623917A true CN105623917A (en) | 2016-06-01 |
Family
ID=56039272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610094063.7A Pending CN105623917A (en) | 2016-02-22 | 2016-02-22 | Circuit board cleaning agent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105623917A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106398892A (en) * | 2016-08-30 | 2017-02-15 | 乐凯特科技铜陵有限公司 | Circuit board cleaning agent with excellent cleaning performance |
| CN108004045A (en) * | 2017-12-13 | 2018-05-08 | 柳州科瑞科技有限公司 | A kind of cleaning agent for printed circuit board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0463898A (en) * | 1990-05-25 | 1992-02-28 | Diversey Corp | Flux cleaner for printed circuit board |
| CN103555452A (en) * | 2013-10-30 | 2014-02-05 | 合肥市华美光电科技有限公司 | Emulsion type cleaning agent for printed circuit board and preparation method for emulsion type cleaning agent |
| CN103614248A (en) * | 2013-11-05 | 2014-03-05 | 昆山宏凌电子有限公司 | Cleaning agent for electronic equipment |
-
2016
- 2016-02-22 CN CN201610094063.7A patent/CN105623917A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0463898A (en) * | 1990-05-25 | 1992-02-28 | Diversey Corp | Flux cleaner for printed circuit board |
| CN103555452A (en) * | 2013-10-30 | 2014-02-05 | 合肥市华美光电科技有限公司 | Emulsion type cleaning agent for printed circuit board and preparation method for emulsion type cleaning agent |
| CN103614248A (en) * | 2013-11-05 | 2014-03-05 | 昆山宏凌电子有限公司 | Cleaning agent for electronic equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106398892A (en) * | 2016-08-30 | 2017-02-15 | 乐凯特科技铜陵有限公司 | Circuit board cleaning agent with excellent cleaning performance |
| CN108004045A (en) * | 2017-12-13 | 2018-05-08 | 柳州科瑞科技有限公司 | A kind of cleaning agent for printed circuit board and preparation method thereof |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160601 |
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| RJ01 | Rejection of invention patent application after publication |