CN105623538A

CN105623538A - Epoxy resin conductive adhesive capable of effectively decreasing vibration and reducing noise

Info

Publication number: CN105623538A
Application number: CN201410615307.2A
Authority: CN
Inventors: 王晓东
Original assignee: Nanjing Ailu New Energy Technology Co Ltd
Current assignee: Nanjing Ailu New Energy Technology Co Ltd
Priority date: 2014-11-05
Filing date: 2014-11-05
Publication date: 2016-06-01

Abstract

The invention discloses an epoxy resin conductive adhesive capable of effectively decreasing vibration and reducing noise. The epoxy resin conductive adhesive comprises the following raw materials by mass percentage: 15-20% of nano silver powder, 15-20% of nano magnesium powder, 3-8% of nano silicon powder, 35-55% of epoxy resin, 10-15% of butyl acrylate monomer, 0.5-1.5% of a coupling agent, 1.5-2.5% of a plasticizer, 2-3% of a curing agent and 0-15% of a diluent. According to the invention, high damping characteristic of the nano magnesium powder can be used for increasing the vibration and noise reduction effects of the conductive adhesive, the nano silver powder can be used for increasing the conduction performance of the conductive adhesive, and each performance index of the conductive adhesive can be greatly increased by employing the modified epoxy resin. The conductive adhesive has good conductivity and economy, and is capable of effectively decreasing vibration and reducing noise.

Description

A kind of can the epoxide resin conductive adhesive of effective damping noise reduction

Technical field

The present invention relates to a kind of can the epoxide resin conductive adhesive of effective damping noise reduction.

Background technology

Along with the fast development of electronics industry, circuit assembly develops to lightness, miniaturization and high performance direction. In order to ensure the highly reliable operation of electronic product, the encapsulation connecting various electronic devices and components also therefore suffers from concern increasingly with connecting material.

Conducting resinl is as a kind of special adhesive having electric conductivity concurrently, compared with traditional solder, it have connection temperature low, without cleaning, being applicable to the advantage such as finer lead spacing and high density components assembling, be expected to become the circuit assembly material of a new generation's occuping market main flow. But, conducting resinl there is also silver and migrates the problems such as danger is big, cost is high, damping noise reduction performance is undesirable, limits conducting resinl and applies on a large scale.

Summary of the invention

It is an object of the invention to customer service prior art not enough, it is provided that can the conducting resinl product of effective damping noise reduction.

In order to reach above technique effect, technical scheme is as follows:

A kind of can the epoxide resin conductive adhesive of effective damping noise reduction, its proportioning raw materials includes by mass percentage:

Nanometer silver powder 15��20%;

Nanometer Mg powder 15��20%;

Nano silica fume 3%��8%;

Epoxy resin 35��55%;

Butyl acrylate 10��15%;

Coupling agent 0.5��1.5%;

Plasticizer 1.5��2.5%;

Firming agent 2��3%;

Diluent 0��15%.

Preferably, its proportioning raw materials includes by mass percentage:

Nanometer silver powder 17%;

Nanometer Mg powder 17%;

Nano silica fume 5%;

Epoxy resin 38%;

Butyl acrylate 13%;

Coupling agent 1%;

Plasticizer 2%;

Firming agent 2%;

Diluent 5%.

Further, described epoxy resin is the one in modifying epoxy resin by organosilicon, organic titanium modified epoxy and organic boron modified epoxy.

Further, described coupling agent is titanate coupling agent.

Further, described plasticizer is the one in M-phthalic acid dibutyl ester, dioctyl isophthalate, dibutyl terephthalate, DOTP, diglycol benzoate, decanedioic acid propanediol polyester.

Further, described firming agent is the one in diamino-cyclohexane, di-2-ethylhexylphosphine oxide hexamethylene alkanamine or diethylenetriamine.

Further, described diluent is the one in isopropanol, butanone, dibutyl ethylene glycol ether.

The present invention compared with prior art has the advantages that:

The present invention provide a kind of can the epoxide resin conductive adhesive of effective damping noise reduction, utilize the high damping characteristic of nanometer Mg powder, improve the damping noise reduction effect of conducting resinl, utilize nanometer silver powder to improve the electric conductivity of conducting resinl, and adopt modified epoxy to substantially increase the property indices of conducting resinl. The conducting resinl of the present invention has good electric conductivity and economy, and can damping noise reduction effectively.

Detailed description of the invention

Describing technical scheme in detail below in conjunction with specific embodiment, illustrative examples and explanation in this present invention are used for explaining technical scheme, but not as a limitation of the invention.

Embodiment 1:

Nanometer silver powder 17%;

Nanometer Mg powder 17%;

Nano silica fume 5%;

Epoxy resin 38%;

Butyl acrylate 13%;

Coupling agent 1%;

Plasticizer 2%;

Firming agent 2%;

Diluent 5%.

Described epoxy resin is modifying epoxy resin by organosilicon; Described coupling agent is titanate coupling agent; Described plasticizer is M-phthalic acid dibutyl ester; Described firming agent is diamino-cyclohexane; Described diluent is isopropanol.

The above is the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention; can also making some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.

Claims

1. one kind can the epoxide resin conductive adhesive of effective damping noise reduction, it is characterised in that: its proportioning raw materials includes by mass percentage:

Nanometer silver powder 15��20%;

Nanometer Mg powder 15��20%;

Nano silica fume 3%��8%;

Epoxy resin 35��55%;

Butyl acrylate 10��15%;

Coupling agent 0.5��1.5%;

Plasticizer 1.5��2.5%;

Firming agent 2��3%;

Diluent 0��15%.

2. according to claim 1 a kind of can the epoxide resin conductive adhesive of effective damping noise reduction, it is characterised in that: its proportioning raw materials includes by mass percentage:

Nanometer silver powder 17%;

Nanometer Mg powder 17%;

Nano silica fume 5%;

Epoxy resin 38%;

Butyl acrylate 13%;

Coupling agent 1%;

Plasticizer 2%;

Firming agent 2%;

Diluent 5%.

3. a kind of according to any one of claim 1 or 2 can the epoxide resin conductive adhesive of effective damping noise reduction, it is characterised in that: described epoxy resin is the one in modifying epoxy resin by organosilicon, organic titanium modified epoxy and organic boron modified epoxy.

4. a kind of according to any one of claim 1 or 2 can the epoxide resin conductive adhesive of effective damping noise reduction, it is characterised in that: described coupling agent is titanate coupling agent.

5. a kind of according to any one of claim 1 or 2 can the epoxide resin conductive adhesive of effective damping noise reduction, it is characterised in that: described plasticizer is the one in M-phthalic acid dibutyl ester, dioctyl isophthalate, dibutyl terephthalate, DOTP, diglycol benzoate, decanedioic acid propanediol polyester.

6. a kind of according to any one of claim 1 or 2 can the epoxide resin conductive adhesive of effective damping noise reduction, it is characterised in that: described firming agent is the one in diamino-cyclohexane, di-2-ethylhexylphosphine oxide hexamethylene alkanamine or diethylenetriamine.

7. a kind of according to any one of claim 1 or 2 can the epoxide resin conductive adhesive of effective damping noise reduction, it is characterised in that: described diluent is the one in isopropanol, butanone, dibutyl ethylene glycol ether.