CN105623338A - Special photocuring waterproof coating for wire enamel and preparation method thereof - Google Patents
Special photocuring waterproof coating for wire enamel and preparation method thereof Download PDFInfo
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- CN105623338A CN105623338A CN201610209693.4A CN201610209693A CN105623338A CN 105623338 A CN105623338 A CN 105623338A CN 201610209693 A CN201610209693 A CN 201610209693A CN 105623338 A CN105623338 A CN 105623338A
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- water
- photocuring
- wire enamel
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- photosensitive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/308—Wires with resins
Abstract
The invention discloses a special photocuring waterproof coating for wire enamel and a preparation method thereof. The waterproof coating is composed of the following components in percentage by weight: 20-45% of polyurethane modified acrylate photosensitive resin, 20-60% of polyurethane resin, 14-30% of waterproof fluorocarbon functional diluter, 5-10% of photosensitive crosslinking diluter and 1-5% of photoinitiator. The photocuring waterproof coating is prepared by mixing and carrying out prepolymerization reaction on the components at 20-25 DEG C. The photocuring waterproof coating for enameled wire surface treatment can satisfy the requirements for breakdown resistance and waterproofness: the breakdown voltage is greater than or equal to 3.5kv, no pore is generated when the coating is stretched to rupture underwater, bent under water or kneaded underwater, and the normal salt-water pin-hole is less than or equal to 1. The photocuring way is utilized to solve the problems of high energy consumption, great environmental hazards and the like in the existing wire enamel, and brings in convenience and actual benefits for the enterprise production.
Description
Technical field
The invention belongs to water-repellancy light solidifying coating synthesis technical field, it is specifically related to a kind of the photocuring water-proof coating and its preparation method that are applicable to enamelled wire surface process.
Background technology
It is fast that light solidifying coating has curing speed, production efficiency height; Solidification value is low, Energy harvesting height; The advantages such as volatile matter is few, safety non-pollution. It is defined as province's energy, resource-saving, coating new variety nuisanceless, high efficiency at present. At electronics, rubber and plastic, nuclear energy etc., thermo-responsive and some special dimension are applied and popularization.
But light solidifying coating have not been reported in the application of enamelled wire surface, commercially available wire enamel is nearly all solvent-borne type baking finish, to horsepower requirements height, environmental influence is big, do not meet the subject requirement of current energy-conserving and environment-protective, bring great unfavorable factor to enterprise production and management yet; And the existence of solvent, also for the compactness of film, weathering resistance etc. cause certain infringement. Our unit combines with relevant enterprise, develop a kind of light solidifying coating resin material (such as CN2015102217864), the resin complex of itself and Jiangsu Heng Xing painting company limited is used, and it is aided with suitable high interface fluorine carbon thinner and the photosensitive crosslinked thinner of functional type, obtain the photolytic activity wire enamel product innovation that a class has efficient hydrophobic function. The present invention is therefore.
Summary of the invention
The object of the invention is to provide a kind of photocuring water-proof coating being applicable to enamelled wire surface process, solve the problems such as existing wire enamel consumes energy, environmental hazard is big, meanwhile, the light solidifying coating obtained has extremely good waterproof effect, the performance such as water-proof climate resisting substantially improving enameled wire.
In order to solve these problems of the prior art, technical scheme provided by the invention is: the photocuring water-proof coating that a kind of wire enamel is special, and it is made up of following component by weight percentage:
Polyurethane-modified polyacrylate photosensitive resin 20-45%, urethane resin 20-60%, water-repellancy fluorine carbon function thinner 14-30%, photosensitive bridging property thinner 5-10%, light-initiated dose of 1-5%.
Preferably, described polyurethane-modified polyacrylate photosensitive resin is polyurethane-modified monofunctional vinylformic acid macromonomer, and its structural formula is: CH2=C (X)-C (O)-O-[(CH2-C (Y)-O) n-C (O)-NH---] m, wherein X=H or CH3; Y=H or CH3; N=10-20; M=3-5.
Preferably, described urethane resin is the QA/155-1746 resin of Jiangsu Heng Xing painting company limited.
Preferably, described water-repellancy fluorine carbon function thinner is selected from one or more kinds of any mixing of following carboxylic compound: trifluoroethyl methacrylate, vinylformic acid six fluorine fourth ester, the pungent ester of Hexafluorobutyl mathacrylate methacrylic acid 13 fluorine, the different pungent ester of vinylformic acid 13 fluorine, dodecafluoroheptyl methacrylate.
Preferably, described photosensitive bridging property thinner be selected from following in one or more kinds of any mixing: Diethylene Glycol two (methyl) acrylate, triethylene glycol two (methyl) acrylate, polyoxyethylene glycol (200) two (methyl) acrylate, pentaerythritol acrylate trimethyl.
Preferably; described light-initiated dose be selected from following in one or more kinds of any mixing: 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio group) phenyl]-1-acetone, 2-hydroxy-2-methyl-1-phenyl-acetone, 2; 4; 6-trimethylbenzoy-dipheny phosphine oxide, 2; 4,6-trimethylbenzoyl phenyl phosphinic acid ethyl ester, methyl benzoylformate.
The special photocuring water-proof coating of the wire enamel that the present invention prepares has efficient hydrophobic function.
Preferably, the photocuring water-proof coating that a kind of wire enamel is special, its component and weight ratio are as follows:
Polyurethane-modified polyacrylate photosensitive resin 20-45%, urethane resin 20-45%, water-repellancy fluorine carbon function thinner 15-20%, photosensitive bridging property thinner 5-10%, light-initiated dose of 1-5%; Said components is mixed when temperature is 20-25 DEG C the obtained photocuring water-proof coating of prepolymerization reaction.
Preferably, the photocuring water-proof coating that a kind of wire enamel is special, its component and weight ratio are as follows:
Polyurethane-modified polyacrylate photosensitive resin 20%, urethane resin 60%, water-repellancy fluorine carbon function thinner 15%, photosensitive bridging property thinner 10%, light-initiated dose 5%; Said components is mixed when temperature is 20-25 DEG C the obtained photocuring water-proof coating of prepolymerization reaction.
Preferably, the photocuring water-proof coating that a kind of wire enamel is special, its component and weight ratio are as follows:
Polyurethane-modified polyacrylate photosensitive resin 25%, QA/155-1746 urethane resin 45%, water-repellancy fluorine carbon function thinner 20%, photosensitive bridging property thinner 8%, light-initiated dose 2%; Said components is mixed when temperature is 20-25 DEG C the obtained photocuring water-proof coating of prepolymerization reaction.
The preparation method of the photocuring water-proof coating that a second aspect of the present invention provides a kind of wire enamel special, comprises the steps,
(1) polyurethane-modified polyacrylate photosensitive resin and urethane resin is got in proportion, through high-speed stirring 10-20min under normal temperature;
(2) water-repellancy fluorine carbon function thinner, photosensitive bridging property thinner is slowly added to, in reactor, stirring until mixing;
(3) slowly add light-initiated dose under stirring, stir even sealing and obtain photo-cured coating.
Preferably, described preparation method carries out at 20-25 DEG C.
Embodiment
Below in conjunction with specific embodiment, such scheme is described further. It will be understood that these embodiments are not limited to for illustration of the present invention limit the scope of the invention. The implementation condition adopted in embodiment can do further adjustment according to the condition of concrete producer, and unreceipted implementation condition is generally the condition in normal experiment.
The preparation method that polyurethane-modified polyacrylate is photosensitive, refers to patent CN2015102217864.
Embodiment 1 is got toluene 50g and molecular weight polypropylene glycol 100g and is dropped in reaction flask, is warmed up to 110 DEG C of reflux dewatering 2hrs; Adding a small amount of catalyzer, stirring until mixing. Under holding temperature 80 DEG C of conditions, slowly drip and add hexamethylene diisocyanate 33g, reaction 2hrs. Adding stopper, more dropwise add methacrylic chloride 21g, it is photosensitive that reaction 1.5hrs can obtain polyurethane-modified polyacrylate.
The preparation method of the photocuring water-proof coating of polymer base material surface treatment
Embodiment 2
Get the photosensitive 20g of polyurethane-modified polyacrylate and the emerging QA/155-1746 urethane resin 60g of perseverance, through high-speed stirring 15min under normal temperature. Slowly add water-repellancy fluorine carbon function thinner 14g (wherein vinylformic acid six fluorine fourth ester 10g, the pungent ester 4g of methacrylic acid 13 fluorine), photosensitive bridging property thinner 5g (ethylene glycol dimethacrylate 2g, polyethylene glycol dimethacrylate 3g) drop in reactor, stir until mixing. Slowly add light-initiated dose of 1-hydroxycyclohexyl phenyl ketone 1g under stirring, stir even sealing and obtain photo-cured coating I. Being coated on copper wire substrate surface through upper machine to find, this coating can meet that wire enamel is resistance to punctures the requirement with water resistance: voltage breakdown >=3.5kv, is stretched to fracture atresia under water, and bending atresia, crumples atresia under water, normality salt solution pin hole 1 under water.
Embodiment 3
Get the photosensitive 25g of polyurethane-modified polyacrylate and the emerging QA/155-1746 urethane resin 45g of perseverance, through high-speed stirring 15min under normal temperature. Slowly add water-repellancy fluorine carbon function thinner 20g (wherein vinylformic acid six fluorine fourth ester 10g, the pungent ester 5g of methacrylic acid 13 fluorine, Hexafluorobutyl mathacrylate 5g, dodecafluoroheptyl methacrylate 5g), photosensitive bridging property thinner 8g (TEGDMA 3g, polyethylene glycol dimethacrylate 2g, tetramethylolmethane trimethacrylate acid number 3g) drop in reactor, stir until mixing. Slowly add light-initiated dose of 1-hydroxycyclohexyl phenyl ketone 2g (1-hydroxycyclohexyl phenyl ketone 1g, 2,4,6-trimethylbenzoy-dipheny phosphine oxide 1g) under stirring, stir even sealing and obtain photo-cured coating II. Being coated on copper wire substrate surface through upper machine to find, this coating can meet that wire enamel is resistance to punctures the requirement with water resistance: voltage breakdown >=3.5kv, is stretched to fracture atresia under water, and bending atresia, crumples atresia under water, normality salt solution pin hole 1 under water.
Embodiment 4
Get the photosensitive 30g of polyurethane-modified polyacrylate and the emerging QA/155-1746 urethane resin 30g of perseverance, through high-speed stirring 15min under normal temperature. Slowly add water-repellancy fluorine carbon function thinner 30g (wherein vinylformic acid six fluorine fourth ester 10g, Hexafluorobutyl mathacrylate 10g, dodecafluoroheptyl methacrylate 5g, trifluoroethyl methacrylate 5g), photosensitive bridging property thinner 5g (ethylene glycol dimethacrylate 2g, polyethylene glycol dimethacrylate 2g, tetramethylolmethane trimethacrylate acid number 1g) drop in reactor, stir until mixing. Slowly add light-initiated dose of 5g (1-hydroxycyclohexyl phenyl ketone 2g, 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio group) phenyl]-1-acetone 3g) under stirring, stir even sealing and obtain photo-cured coating II. Being coated on copper wire substrate surface through upper machine to find, this coating can meet that wire enamel is resistance to punctures the requirement with water resistance: voltage breakdown >=3.5kv, is stretched to fracture atresia under water, and bending atresia, crumples atresia under water, normality salt solution pin hole 1 under water.
Embodiment 5
Get the photosensitive 40g of polyurethane-modified polyacrylate and the emerging QA/155-1746 urethane resin 20g of perseverance, through high-speed stirring 15min under normal temperature. Slowly add water-repellancy fluorine carbon function thinner 25g (wherein vinylformic acid six fluorine fourth ester 10g, Hexafluorobutyl mathacrylate 10g, trifluoroethyl methacrylate 5g), photosensitive bridging property thinner 10g (ethylene glycol dimethacrylate 4g, TEGDMA 3g, polyethylene glycol dimethacrylate 3g) drop in reactor, stir until mixing. Slowly add light-initiated dose of 5g (1-hydroxycyclohexyl phenyl ketone 2g, methyl benzoylformate 3g) under stirring, stir even sealing and obtain photo-cured coating II. Being coated on copper wire substrate surface through upper machine to find, this coating can meet that wire enamel is resistance to punctures the requirement with water resistance: voltage breakdown >=3.5kv, is stretched to fracture atresia under water, and bending atresia, crumples atresia under water, normality salt solution pin hole 1 under water.
Embodiment 6
Get the photosensitive 45g of polyurethane-modified polyacrylate and the emerging QA/155-1746 urethane resin 20g of perseverance, through high-speed stirring 15min under normal temperature. Slowly add water-repellancy fluorine carbon function thinner 20g (wherein methacrylic acid 13 fluorine pungent ester 2g, the different pungent ester 10g of vinylformic acid 13 fluorine, Hexafluorobutyl mathacrylate 3g, trifluoroethyl methacrylate 5g), photosensitive bridging property thinner 10g (ethylene glycol dimethacrylate 4g, TEGDMA 3g, polyethylene glycol dimethacrylate 3g) drop in reactor, stir until mixing. Slowly add light-initiated dose of 5g (methyl benzoylformate 3g, 2-hydroxy-2-methyl-1-phenyl-acetone 2g) under stirring, stir even sealing and obtain photo-cured coating II. Being coated on copper wire substrate surface through upper machine to find, this coating can meet that wire enamel is resistance to punctures the requirement with water resistance: voltage breakdown >=3.5kv, is stretched to fracture atresia under water, and bending atresia, crumples atresia under water, normality salt solution pin hole 1 under water.
Confirmed by above contrast application examples, the photocuring water-proof coating of the enamelled wire surface process that the present invention obtains, can meet that wire enamel is resistance to punctures the requirement with water resistance: voltage breakdown >=3.5kv, it is stretched to fracture atresia under water, bending atresia under water, crumple atresia under water, normality salt solution pin hole 1. Utilize photocuring approach to solve the difficult problems such as existing wire enamel highly energy-consuming, environmental hazard are big, bring facility and actual benefit for enterprise produces.
Above-mentioned example, only for the technical conceive of the present invention and feature are described, its object is to allow person skilled in the art can understand the content of the present invention and implement according to this, can not limit the scope of the invention with this. All equivalent transformations of doing according to spirit of the invention or modification, all should be encompassed within protection scope of the present invention.
Claims (8)
1. the photocuring water-proof coating that a wire enamel is special, it is characterised in that, it is made up of following component by weight percentage:
Polyurethane-modified polyacrylate photosensitive resin 20-45%, urethane resin 20-60%, water-repellancy fluorine carbon function thinner 14-30%, photosensitive bridging property thinner 5-10%, light-initiated dose of 1-5%.
2. the photocuring water-proof coating that wire enamel according to claim 1 is special, it is characterised in that, described polyurethane-modified polyacrylate photosensitive resin is polyurethane-modified monofunctional vinylformic acid macromonomer, and its structural formula is: CH2=C (X)-C (O)-O-[(CH2-C (Y)-O) n-C (O)-NH---] m, wherein X=H or CH3; Y=H or CH3; N=10-20; M=3-5.
3. the photocuring water-proof coating that wire enamel according to claim 1 is special, it is characterised in that, described urethane resin is the QA/155-1746 resin of Jiangsu Heng Xing painting company limited.
4. the photocuring water-proof coating that wire enamel according to claim 1 is special, it is characterized in that, described water-repellancy fluorine carbon function thinner is selected from one or more kinds of any mixing of following carboxylic compound: trifluoroethyl methacrylate, vinylformic acid six fluorine fourth ester, the pungent ester of Hexafluorobutyl mathacrylate methacrylic acid 13 fluorine, the different pungent ester of vinylformic acid 13 fluorine, dodecafluoroheptyl methacrylate.
5. the photocuring water-proof coating that wire enamel according to claim 1 is special, it is characterized in that, described photosensitive bridging property thinner be selected from following in one or more kinds of any mixing: Diethylene Glycol two (methyl) acrylate, triethylene glycol two (methyl) acrylate, polyoxyethylene glycol (200) two (methyl) acrylate, pentaerythritol acrylate trimethyl.
6. the photocuring water-proof coating that wire enamel according to claim 1 is special; it is characterized in that; described light-initiated dose be selected from following in one or more kinds of any mixing: 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio group) phenyl]-1-acetone, 2-hydroxy-2-methyl-1-phenyl-acetone, 2; 4; 6-trimethylbenzoy-dipheny phosphine oxide, 2; 4,6-trimethylbenzoyl phenyl phosphinic acid ethyl ester, methyl benzoylformate.
7. prepare the method for the special photocuring water-proof coating of wire enamel as described in item as arbitrary in claim 1-6, it is characterised in that, comprise the steps,
(1) polyurethane-modified polyacrylate photosensitive resin and urethane resin is got in proportion to reactor, through high-speed stirring 10-20min under normal temperature;
(2) water-repellancy fluorine carbon function thinner, photosensitive bridging property thinner is slowly added to, in described reactor, stirring until mixing;
(3) slowly add light-initiated dose under stirring, stir even sealing and obtain photo-cured coating.
8. preparation method according to claim 7, it is characterised in that, described preparation method carries out at 20-25 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610209693.4A CN105623338A (en) | 2016-04-06 | 2016-04-06 | Special photocuring waterproof coating for wire enamel and preparation method thereof |
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| CN201610209693.4A CN105623338A (en) | 2016-04-06 | 2016-04-06 | Special photocuring waterproof coating for wire enamel and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106012666A (en) * | 2016-06-30 | 2016-10-12 | 常熟理工学院 | UV (ultraviolet) photocuring waterproof coating and preparation method thereof |
| CN108878040A (en) * | 2018-06-27 | 2018-11-23 | 浙江龙鹰光电科技有限公司 | The enameled wire of resistance to thermal cycle |
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| CN104726000A (en) * | 2015-03-18 | 2015-06-24 | 常熟理工学院 | 180-grade straight welded polyurethane wire enamel and preparation method thereof |
| CN104804491A (en) * | 2014-01-24 | 2015-07-29 | 程威军 | High-temperature resistance UV and moisture double-curing three-proofing lacquer |
| CN105349025A (en) * | 2015-12-16 | 2016-02-24 | 常熟理工学院 | Light-cured waterproof coating for polymer substrate and preparation method of light-cured waterproof coating |
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2016
- 2016-04-06 CN CN201610209693.4A patent/CN105623338A/en active Pending
Patent Citations (6)
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| CN103589320A (en) * | 2012-08-13 | 2014-02-19 | 深圳市微步电子有限责任公司 | Conformal coating for protection of printed circuit board, and preparation method and usage method thereof |
| CN104804491A (en) * | 2014-01-24 | 2015-07-29 | 程威军 | High-temperature resistance UV and moisture double-curing three-proofing lacquer |
| CN103965764A (en) * | 2014-04-15 | 2014-08-06 | 丹阳四达化工有限公司 | Synthetic method of polyester type polyurethane enamelled wire varnish with high heat-resistant grade |
| CN104017476A (en) * | 2014-05-30 | 2014-09-03 | 百川化工(如皋)有限公司 | Production method of 180-level polyurethane wire enamel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106012666A (en) * | 2016-06-30 | 2016-10-12 | 常熟理工学院 | UV (ultraviolet) photocuring waterproof coating and preparation method thereof |
| CN108878040A (en) * | 2018-06-27 | 2018-11-23 | 浙江龙鹰光电科技有限公司 | The enameled wire of resistance to thermal cycle |
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