CN105618423A - Ultrasonic vibration cleaning treatment method used for production line for removing hole wall dirt of multi-layer printing board - Google Patents
Ultrasonic vibration cleaning treatment method used for production line for removing hole wall dirt of multi-layer printing board Download PDFInfo
- Publication number
- CN105618423A CN105618423A CN201410543008.2A CN201410543008A CN105618423A CN 105618423 A CN105618423 A CN 105618423A CN 201410543008 A CN201410543008 A CN 201410543008A CN 105618423 A CN105618423 A CN 105618423A
- Authority
- CN
- China
- Prior art keywords
- ultrasonic vibration
- hole wall
- treatment method
- cleaning treatment
- production line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Provided is an ultrasonic vibration cleaning treatment method used for a production line for removing hole wall dirt of a multi-layer printing board capable of rapidly cleaning residual concentrated sulfuric acid of holes, and completely cleaning hole-wall dirt dissolving in residual concentrated sulfuric acid of holes so that back etching effect is uniform. Ultrasonic vibration rods are placed in a cleaning tank. Residual concentrated sulfuric acid in holes is rapidly cleared away by adopting ultrasonic vibration. Therefore, residual concentrated sulfuric acid in holes and hole-wall dirt dissolving in residual concentrated sulfuric acid can be completely cleared away so that the uniform back etching effect is formed.
Description
Art
The present invention relates to multiple-layer printed board hole metallization pre-treatment field, remove hole wall before particularly relating to multiple-layer printed board hole metallization and bore the cleaning treatment field of dirty production line.
Technical background
Removing hole wall brill dirt is the technological process that Production of Multilayer Printed Circuit Board must have. At present, what the chemical solution that PCB Production field removal hole wall brill is dirty was commonly used has concentrated sulphuric acid system, alkalinity potassium permanganate system, chromic acid system etc. When using concentrated sulphuric acid system to remove hole wall brill dirt, after Drill dirt cleaning, the cleaning treatment of hole wall is most important, water cleaning treatment effect conventional at present is unsatisfactory, in cleaning process mesopore, the concentrated sulphuric acid of residual can not quickly effectively be removed, cause the brill dirt meeting secondary pollution hole wall being dissolved in hole in residual concentrated sulphuric acid on the one hand, in the opposing party's face, residual concentrated sulphuric acid may proceed to hole wall is produced etchback effect, so will result in hole wall etchback uneven, the electric property of printed board and the reliability of printed board time serious, can be affected.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, patent of the present invention provides a kind of multilayer board and removes the dirty production line ultrasonic vibration cleaning treatment method of hole wall brill. Utilize ultrasonic vibration cleaning treatment method can quickly residual concentrated sulphuric acid in cleaning hole, prevent the brill dirt secondary pollution hole wall that is dissolved in residual concentrated sulphuric acid, the etchback effect of uniformity can be formed simultaneously.
The technical solution adopted in the present invention is: when adopting concentrated sulphuric acid system to remove hole wall brill dirt, a kind of cleaning treatment method utilizing Vltrasonic device is provided, cell body diagonal positions at rinse bath respectively installs the ultrasonic vibration rod (cell body volume is about the rinse bath of 200L and installs two ultrasonic vibration rods) that power is 800-1000W, has ultrasonic transducer in ultrasonic vibration rod. ultrasonic transducer becomes the mechanical wave of same frequency by the 25-27KHz high frequency current transitions that supersonic generator is produced by piezoelectric effect, radially vibrations are converted to along transducer axle center by longitudinally vibrations thick and fast with hyperacoustic form, horizontal transmission enters in cleanout fluid, vibrations produce micro-bubble, micro-bubble is from generation, grow into the moment formation instantaneous high pressure broken rapidly, continuously instantaneous high pressure constantly bombards residual concentrated sulphuric acid in the hole of multilayer board, the concentrated sulphuric acid of residual in the multiple-layer printed board hole being immersed in rinse bath can quickly thoroughly be removed in hole, reach thoroughly to clean the effect of hole wall. consider that rinse bath is faintly acid, ultrasonic vibration rod material selection rustless steel.
Compared with prior art, the invention has the beneficial effects as follows: simple in construction, technique easily realize, effect is obvious, it is possible to thoroughly solves to adopt concentrated sulphuric acid system to remove the hole wall that when multilayer board hole wall bores dirty, hole wall cleaning treatment does not thoroughly cause and bores dirty and that etchback is uneven quality problems.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the present invention is further described.
Fig. 1 is the ultrasonic unit schematic diagram of the present invention, and 1 is supersonic generator, and 2 is ultrasonic transducer.
Fig. 2 is that ultrasonic unit is at the installation site schematic diagram (top view) cleaning cell body.
Fig. 3 takes the metallograph comparison diagram of multilayer board plated through-hole before and after ultrasonic vibration cleaning treatment method, Fig. 3 a is the metallograph again polluting hole wall owing to remaining the brill dirt dissolved in sulphuric acid in hole, Fig. 3 b is that the hole wall caused owing to remaining the effect of sulphuric acid in hole is recessed uneven metallograph, and the hole wall that cleans up that Fig. 3 c is after adopting ultrasonic vibration rinser is recessed uniform metallograph.
Claims (5)
1. a multilayer board is removed hole wall and is bored dirty production line ultrasonic vibration cleaning treatment method, it is characterised in that respectively installing a ultrasonic vibration rod in rinse bath diagonal positions, ultrasonic vibration rod is connected to the supersonic generator outside rinse bath.
2. multilayer board according to claim 1 is removed hole wall and is bored dirty production line ultrasonic vibration cleaning treatment method, it is characterised in that ultrasonic vibration bar matter is rustless steel.
3. multilayer board according to claim 1 is removed hole wall and is bored dirty production line ultrasonic vibration cleaning treatment method, it is characterised in that the supersonic generator being connected with ultrasonic vibration rod can produce 25-27KHz high frequency electric.
4. multilayer board according to claim 1 is removed hole wall and is bored dirty production line ultrasonic vibration cleaning treatment method, it is characterised in that the power of ultrasonic vibration rod is 800-1000W.
5. the multilayer board according to claim 1-claim 4 is removed hole wall and is bored dirty production line ultrasonic vibration cleaning treatment method, it is characterised in that when rinse bath volume is about 200L, install two ultrasonic vibration rods in diagonal positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410543008.2A CN105618423A (en) | 2014-10-15 | 2014-10-15 | Ultrasonic vibration cleaning treatment method used for production line for removing hole wall dirt of multi-layer printing board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410543008.2A CN105618423A (en) | 2014-10-15 | 2014-10-15 | Ultrasonic vibration cleaning treatment method used for production line for removing hole wall dirt of multi-layer printing board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105618423A true CN105618423A (en) | 2016-06-01 |
Family
ID=56033987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410543008.2A Pending CN105618423A (en) | 2014-10-15 | 2014-10-15 | Ultrasonic vibration cleaning treatment method used for production line for removing hole wall dirt of multi-layer printing board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105618423A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113814224A (en) * | 2021-08-23 | 2021-12-21 | 中国电子科技集团公司第十五研究所 | Printed board hole wall drilling dirt treatment method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1166693A (en) * | 1996-05-28 | 1997-12-03 | 佳能株式会社 | Cleaning methods of porous surface and semiconductor surface |
| US20040074514A1 (en) * | 2000-01-11 | 2004-04-22 | Seagate Technology Llc | Method & apparatus for single disc ultrasonic cleaning |
| WO2004078371A1 (en) * | 2003-03-07 | 2004-09-16 | Jung Shin Electronic Co., Ltd. | Cleaning tank of a cleaning device with fixed ultrasonic generator |
| JP2008068221A (en) * | 2006-09-15 | 2008-03-27 | Pre-Tech Co Ltd | Ultrasonic cleaning device |
| CN201261805Y (en) * | 2008-08-14 | 2009-06-24 | 惠州中京电子科技有限公司 | Copper precipitation unit of printed circuit board |
| CN101754593A (en) * | 2008-12-02 | 2010-06-23 | 北京华兴太极信息科技有限责任公司 | Pretreatment technology of flex-rigid multiple-layer printed board hole metallization |
| CN102548230A (en) * | 2012-02-10 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Device and method for ultrasonically rewashing printing ink of hole-plugging plate |
| CN202752272U (en) * | 2012-07-31 | 2013-02-27 | 深圳市化讯应用材料有限公司 | Device capable of cleaning glue refuse in drill hole of printed circuit board (PCB) |
-
2014
- 2014-10-15 CN CN201410543008.2A patent/CN105618423A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1166693A (en) * | 1996-05-28 | 1997-12-03 | 佳能株式会社 | Cleaning methods of porous surface and semiconductor surface |
| US20040074514A1 (en) * | 2000-01-11 | 2004-04-22 | Seagate Technology Llc | Method & apparatus for single disc ultrasonic cleaning |
| WO2004078371A1 (en) * | 2003-03-07 | 2004-09-16 | Jung Shin Electronic Co., Ltd. | Cleaning tank of a cleaning device with fixed ultrasonic generator |
| JP2008068221A (en) * | 2006-09-15 | 2008-03-27 | Pre-Tech Co Ltd | Ultrasonic cleaning device |
| CN201261805Y (en) * | 2008-08-14 | 2009-06-24 | 惠州中京电子科技有限公司 | Copper precipitation unit of printed circuit board |
| CN101754593A (en) * | 2008-12-02 | 2010-06-23 | 北京华兴太极信息科技有限责任公司 | Pretreatment technology of flex-rigid multiple-layer printed board hole metallization |
| CN102548230A (en) * | 2012-02-10 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Device and method for ultrasonically rewashing printing ink of hole-plugging plate |
| CN202752272U (en) * | 2012-07-31 | 2013-02-27 | 深圳市化讯应用材料有限公司 | Device capable of cleaning glue refuse in drill hole of printed circuit board (PCB) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113814224A (en) * | 2021-08-23 | 2021-12-21 | 中国电子科技集团公司第十五研究所 | Printed board hole wall drilling dirt treatment method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202752272U (en) | Device capable of cleaning glue refuse in drill hole of printed circuit board (PCB) | |
| CN101896039B (en) | Post treatment neutralizer for removing smears from alkaline permanganate in printed circuit board manufacture | |
| JPWO2016147995A1 (en) | Cleaning device | |
| CN102548230B (en) | Device and method for ultrasonically rewashing printing ink of hole-plugging plate | |
| CN103590058B (en) | Pcb board gets on the scavenging solution of palladium liquid and purging method | |
| CN104619123B (en) | A kind of production method of pcb board | |
| CN106149018A (en) | A kind of process for pcb board electro-coppering | |
| CN105618423A (en) | Ultrasonic vibration cleaning treatment method used for production line for removing hole wall dirt of multi-layer printing board | |
| CN102307435B (en) | Cleaning process for high-density interconnected printed circuit board (HDI PCB) | |
| CN105120598A (en) | Semi-hole PCB manufacturing method based on acid etching technology | |
| CN105188282A (en) | Copper deposition manufacturing process for PCB with high aspect ratio | |
| CN102139981A (en) | Method for oxidizing treatment of waste water by combining dipulse of ultrasonic waves and electrochemistry | |
| CN113969417A (en) | Electroplating method of circuit board and circuit board | |
| CN105682376B (en) | A kind of thickness copper high aspect ratio small-bore mainboard manufacture craft | |
| CN101892483A (en) | Ultrasonic passivation method for brass product | |
| CN203711401U (en) | Ultrasonic cleaning device | |
| CN201783483U (en) | Ultrasonic cleaning machine | |
| CN104073845A (en) | Gold plating method for PCB | |
| KR101271791B1 (en) | Method for cleaning metal sheet by using ozone micro-buble | |
| CN105648453B (en) | A kind of pcb board gets on the cleaning method of palladium liquid | |
| CN111050478B (en) | Method for removing slag from micron-sized pores of epoxy substrate | |
| CN204589313U (en) | A kind of etched foil washing unit | |
| CN211019500U (en) | Micro-etching treatment flushing device before PCB inner layer | |
| CN214718902U (en) | Spare part belt cleaning device of dual cleaning performance | |
| CN113814224A (en) | Printed board hole wall drilling dirt treatment method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160601 |