CN105611801B - 微流道散热结构及方法 - Google Patents
微流道散热结构及方法 Download PDFInfo
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- CN105611801B CN105611801B CN201510989157.6A CN201510989157A CN105611801B CN 105611801 B CN105611801 B CN 105611801B CN 201510989157 A CN201510989157 A CN 201510989157A CN 105611801 B CN105611801 B CN 105611801B
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- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
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- 238000005520 cutting process Methods 0.000 description 2
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- 238000005530 etching Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
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Priority Applications (1)
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CN201510989157.6A CN105611801B (zh) | 2015-12-24 | 2015-12-24 | 微流道散热结构及方法 |
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CN201510989157.6A CN105611801B (zh) | 2015-12-24 | 2015-12-24 | 微流道散热结构及方法 |
Publications (2)
Publication Number | Publication Date |
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CN105611801A CN105611801A (zh) | 2016-05-25 |
CN105611801B true CN105611801B (zh) | 2017-09-29 |
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CN201510989157.6A Active CN105611801B (zh) | 2015-12-24 | 2015-12-24 | 微流道散热结构及方法 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107275299B (zh) * | 2017-05-26 | 2019-08-20 | 北京大学 | 一种微通道换热器及其制作方法 |
CN107240578B (zh) * | 2017-07-21 | 2019-07-30 | 西安电子科技大学 | 三维集成电路的碳化硅微流道散热结构及其制作方法 |
CN107860247B (zh) * | 2017-10-10 | 2019-12-27 | 深圳航天东方红海特卫星有限公司 | 一种换热槽道螺旋式分布的扩热板 |
CN107679339B (zh) * | 2017-10-20 | 2021-10-19 | 东南大学 | 微槽道散热冷板开槽方法 |
CN108093552A (zh) * | 2017-12-13 | 2018-05-29 | 中国科学院近代物理研究所 | 一种用于加速器中子源的微流道靶系统 |
CN109121369A (zh) * | 2018-09-30 | 2019-01-01 | 西安微电子技术研究所 | 一种结合微流道的快速传导间接液冷散热结构 |
CN110161438A (zh) * | 2019-05-20 | 2019-08-23 | 华中科技大学 | 一种高温核磁共振探头的冷却装置及其应用 |
CN114126331B (zh) * | 2020-08-26 | 2023-06-02 | 广东美的暖通设备有限公司 | 空调装置以及电控盒 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5544703A (en) * | 1993-05-18 | 1996-08-13 | Vicarb | Plate heat exchanger |
CN104167399A (zh) * | 2014-05-14 | 2014-11-26 | 北京工业大学 | 错位复杂微通道微型换热器 |
CN105161473A (zh) * | 2015-07-09 | 2015-12-16 | 江苏中圣压力容器装备制造有限公司 | 硅基毛细泵回路微型冷却器 |
CN205232669U (zh) * | 2015-12-24 | 2016-05-11 | 深圳市华讯方舟微电子科技有限公司 | 微流道散热结构 |
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2015
- 2015-12-24 CN CN201510989157.6A patent/CN105611801B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5544703A (en) * | 1993-05-18 | 1996-08-13 | Vicarb | Plate heat exchanger |
CN104167399A (zh) * | 2014-05-14 | 2014-11-26 | 北京工业大学 | 错位复杂微通道微型换热器 |
CN105161473A (zh) * | 2015-07-09 | 2015-12-16 | 江苏中圣压力容器装备制造有限公司 | 硅基毛细泵回路微型冷却器 |
CN205232669U (zh) * | 2015-12-24 | 2016-05-11 | 深圳市华讯方舟微电子科技有限公司 | 微流道散热结构 |
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Address after: 518102 Guangdong Province, Baoan District Xixiang street Shenzhen City Tian Yi Lu Chen Tian Bao Industrial District 37 Building 2 floor East Applicant after: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. Applicant after: CHINA COMMUNICATION TECHNOLOGY Co.,Ltd. Address before: 518102 Guangdong Province, Baoan District Xixiang street Shenzhen City Tian Yi Lu Chen Tian Bao Industrial District 37 Building 2 floor East Applicant before: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. Applicant before: CHINA COMMUNICATION TECHNOLOGY Co.,Ltd. |
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Inventor after: Wu Guangsheng Inventor after: Bi Xiaobin Inventor after: Yao Jianke Inventor after: Ding Qing Inventor after: Huang Yongjiang Inventor after: Li Xiaocong Inventor before: Bi Xiaobin Inventor before: Yao Jianke Inventor before: Ding Qing |
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Effective date of registration: 20171009 Address after: 518102 Guangdong Province, Baoan District Xixiang street Shenzhen City Tian Yi Lu Chen Tian Bao Industrial District 37 Building 2 floor East Co-patentee after: SHENZHEN INSTITUTE OF TERAHERTZ TECHNOLOGY AND INNOVATION Co.,Ltd. Patentee after: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. Address before: 518102 Guangdong Province, Baoan District Xixiang street Shenzhen City Tian Yi Lu Chen Tian Bao Industrial District 37 Building 2 floor East Co-patentee before: CHINA COMMUNICATION TECHNOLOGY Co.,Ltd. Patentee before: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20220608 Address after: 518102 room 404, building 37, chentian Industrial Zone, chentian community, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Huaxun ark Photoelectric Technology Co.,Ltd. Address before: 518102 East, 2nd floor, building 37, chentian Industrial Zone, Baotian 1st Road, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. Patentee before: SHENZHEN INSTITUTE OF TERAHERTZ TECHNOLOGY AND INNOVATION Co.,Ltd. |
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