CN105611726A - Rigid-flex board and mobile terminal - Google Patents

Rigid-flex board and mobile terminal Download PDF

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Publication number
CN105611726A
CN105611726A CN201610105639.5A CN201610105639A CN105611726A CN 105611726 A CN105611726 A CN 105611726A CN 201610105639 A CN201610105639 A CN 201610105639A CN 105611726 A CN105611726 A CN 105611726A
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CN
China
Prior art keywords
circuit board
pcb
printed circuit
earth connection
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610105639.5A
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Chinese (zh)
Other versions
CN105611726B (en
Inventor
曾元清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201610105639.5A priority Critical patent/CN105611726B/en
Publication of CN105611726A publication Critical patent/CN105611726A/en
Application granted granted Critical
Publication of CN105611726B publication Critical patent/CN105611726B/en
Expired - Fee Related legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a rigid-flex board and a mobile terminal. The rigid-flex board comprises a printed circuit board and a flexible circuit board, wherein the flexible circuit board is connected with one end of the printed circuit board and provided with a first grounding line and a plurality of first signal lines, the first grounding line is arranged on one side, near to the flexible circuit board, of the printed circuit board, a plurality of via holes are formed on the first grounding line and pass through the printed circuit board, and the plurality of first signal lines are arranged on one side of the first grounding line and arranged far away from the flexible circuit board. In the rigid-flex board and the mobile terminal, provided by the invention, the first grounding line is arranged on the printed circuit board, and the plurality of via holes are formed on the first grounding line; and when the material is removed by laser, the grounding function of the printed circuit board still can be achieved by means of the plurality of via holes if the first grounding line is damaged by the laser, thus, grounding failure is prevented to cause that the signal lines cannot be connected with a signal, a functional circuit on the printed circuit board is ensured to be implemented, and the application reliability of the rigid-flex board is improved.

Description

Rigid Flex and mobile terminal
Technical field
The present invention relates to circuit board technology field, relate in particular to a kind of Rigid Flex and mobile terminal.
Background technology
Rigid Flex is exactly FPC and rigid wiring board, through operations such as pressings, by related processRequirement is combined, the wiring board with FPC characteristic and rigid wiring board characteristic of formation.
At present, carrying out laser cutting removal material constantly, because laser itself has certain width, whenWhen ground path and signal line are set on hardboard, it is likely to the signal line on hardboard or ground connectionCircuit circuit causes and burns out or damage, thereby has influence on the performance of circuit, can pull apart with hard serious timeCabling on the connected soft board of plate, thus cause the functional circuit on soft board to lose efficacy, cannot ensure soft or hard combinationThe dependability of plate.
Summary of the invention
In view of the above-mentioned problems in the prior art, technical problem to be solved by this invention is, providesWhen one prevents from carrying out laser ablation material, hardboard circuit is caused to damage, guarantee the soft or hard knot of dependabilityPlywood and mobile terminal.
To achieve these goals, embodiment of the present invention provides following technical scheme:
First aspect, the invention provides a kind of Rigid Flex, and it comprises printed circuit board (PCB) and is connected in printingThe flexible PCB of circuit board one end, is provided with the first earth connection and some on described printed circuit board (PCB)One signal lead, described the first earth connection is located at a side of the contiguous described flexible PCB of described printed circuit board (PCB),On described the first earth connection, offer several via holes, described several via holes walking along described the first earth connectionLine direction spread configuration, and described several via holes all run through described printed circuit board (PCB), described someOne signal lead is arranged at a side of described the first earth connection, and described some first signal cablings away fromDescribed flexible PCB setting.
Wherein, the wire diameter of described the first earth connection is greater than the wire diameter of described first signal cabling.
Wherein, the wire diameter of described the first earth connection is more than or equal to 1mm.
Wherein, described printed circuit board (PCB) comprises and the first surface that is oppositely arranged and second establishes on described first surfaceBe equipped with described the first earth connection, described several via holes all connect to described second.
Wherein, described second upper corresponding described the first earth connection is provided with the second earth connection, and described inThe wire diameter of the second earth connection is identical with described the first earth connection.
Wherein, on described some first signal cablings, all offer signal via, and described signal viaBe through on described second.
Wherein, the hole wall of described signal via is coated with metal coating, and described metal coating is metallic copperCoating or metallic tin coating.
Wherein, described second upper corresponding described some first signal cabling are provided with some second lettersNumber cabling, is provided with the electric-conductor that connects described first signal cabling and secondary signal cabling in described signal via.
Wherein, the distance between two adjacent described first signal cablings all equates.
Second aspect, the present invention also provides a kind of mobile terminal, and described mobile terminal comprises body, is located atThe mainboard of described body interior and the Rigid Flex as described in above-mentioned first aspect, described Rigid FlexBe located on described mainboard, and be electrically connected with described mainboard.
Rigid Flex provided by the invention and mobile terminal, by being close to flexible circuit at printed circuit board (PCB)In one side of plate, the first earth connection is set, and on the first earth connection, several via holes is set. When carrying out laserWhile removing material, if when laser causes damage to this first earth connection, utilize these several via holes still canRealize the grounding function of printed circuit board (PCB), thereby prevent its earthing failure and cause signal lead cannot connect letterNumber, guaranteed the realization of the functional circuit on printed circuit board (PCB), and then improved the use of Rigid Flex canLean on property.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, below will be to implementingIn example or description of the Prior Art, the accompanying drawing of required use is briefly described, and apparently, the following describesIn accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not payingGo out under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the schematic diagram of the Rigid Flex that provides of the embodiment of the present invention;
Fig. 2 is the schematic diagram of the other one side of Fig. 1.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearlyChu, intactly description, obviously, described embodiment is only the present invention's part embodiment, instead ofWhole embodiment. Based on the embodiment in the present invention, those of ordinary skill in the art are not making creationThe every other embodiment obtaining under property work prerequisite, belongs to the scope of protection of the invention.
For ease of describe, can use here such as " ... under ", " ... below ", D score, " ...On ", " on " etc. space relativity term element or feature and another (a bit) as shown in FIG. describedThe relation of element or feature. Be appreciated that when element or layer be called as another element or layer " on "," be connected to " or " being couple to " another element or when layer, it can be directly on another element or layer, straightAnother element or layer received in succession or be couple to, or element or layer between two parties can be had.
Be appreciated that terminology used here is only in order to describe specific embodiment, does not really want to limit the present invention.While here use, unless context separately has clearly statement, otherwise singulative " " and " being somebody's turn to do " also purportComprising plural form. Further, in the time using in this manual, term " comprises " and/or " bagContaining " show the existence of described feature, entirety, step, element and/or assembly, but do not get rid of one or moreThe existence of other features, entirety, step, element, assembly and/or its combination or increase. Description is follow-up to be retouchedState as implementing preferred embodiments of the present invention, right described description is to illustrate that rule of the present invention is order, not in order to limit scope of the present invention. Protection scope of the present invention is when defining depending on claimsPerson is as the criterion.
See also Fig. 1 and Fig. 2, a kind of Rigid Flex 100 provided by the invention, described soft or hard combinationPlate 100 comprises printed circuit board (PCB) 10 and is connected in the flexible PCB 20 of described printed circuit board (PCB) 10 one end.On described printed circuit board (PCB) 10, be provided with the first earth connection 11 and some first signal cablings 12, described inThe first earth connection 11 is located at a side of described printed circuit board (PCB) 10 contiguous described flexible PCBs 20. DescribedOn one earth connection 11, offer several via holes 111, described several via holes 11 are along described the first earth connection 11Direction of routing spread configuration, and described several via holes 111 all run through described printed circuit board (PCB) 10. InstituteState the side that some first signal cablings 12 are arranged at described the first earth connection 11, and described someFirst signal cabling 12 arranges away from described flexible PCB 20. Be understandable that described soft or hard combinationPlate 100 is applied in mobile terminal, and this mobile terminal can be mobile phone, panel computer, notebook computer etc.,Conduction between the electronic component that described Rigid Flex 100 is responsible in mobile terminal.
The Rigid Flex 100 that the embodiment of the present invention provides is some by arranging on described the first earth connection 11The individual via hole 111 that runs through described printed circuit board (PCB) 10. In the time carrying out laser ablation material, the first earth connection 11While being burnt out by laser, utilize these several via holes 111 still can realize its grounding function, ensure described sealThe realization of the functional circuit on printed circuit board 10, has guaranteed the dependability of described Rigid Flex 100.
In the present embodiment, described printed circuit board (PCB) 10 is regular square plate. Described printed circuit board (PCB) 10 wrapsDraw together the first surface 13 that is oppositely arranged and second 14, described the first earth connection 11 is arranged at described first surface 13On. Particularly, the wire diameter of described the first earth connection 11 is greater than the wire diameter of described first signal cabling 12, andAnd preferably, the wire diameter of described the first earth connection 11 is greater than or equal to 1mm, thereby when carrying out laser ablationWhen material, because the wire diameter of described the first earth connection 11 is larger, be therefore not easy by laser burn or blow,Thereby can guarantee the realization of the grounding function of described printed circuit board (PCB) 10. Be understandable that, real at otherExecute in example, the wire diameter of described the first earth connection 11 also can arrange according to practical wiring situation.
Further, described the first earth connection 11 is arranged at described in the Edge Distance of described printed circuit board (PCB) 10The distance of flexible PCB 20 is greater than 1mm, so that described the first earth connection 11 and described flexible PCBThe connection of 20 upward wirings, when realizing the grounding function on described flexible PCB 20, also can prevent instituteWhen stating the first earth connection 11 and occurring blowing or burning, likely the circuit on described flexible PCB 20 is madeThe situation that becomes to damage.
Described several via holes 111 are opened on described the first earth connection 11. In the present embodiment, due to describedThe wire diameter of the first earth connection 11 is larger, and therefore, the aperture of described several via holes 111 is slightly smaller than described firstEarth connection 11, or the wire diameter phase of the aperture of described several via holes 111 and described the first earth connection 11Deng also can. Described several via holes 111 connect to described second 14 from described first surface 13, withFurther realize the grounding function of described printed circuit board (PCB) 10, and then in the time carrying out laser ablation material, if instituteWhen stating the first earth connection 11 and being blown by laser or damage, due to described several via holes 111 connect to described inSecond 14, therefore, described via hole 111 can serve as the ground hole of described printed circuit board (PCB) 10, thereby realThe grounding function of existing described printed circuit board (PCB) 10, and then ensure other functions on described printed circuit board (PCB) 10The normal operation of circuit. Preferably, the aperture of described several via holes 111 can be 0.5mm to 1.0mm.And in order to ensure the grounding function of described printed circuit board (PCB) 10, between two adjacent described via holes 111Spacing all equates.
Further, corresponding described the first earth connection 11 is provided with the second earth connection on described second 14141, and the wire diameter of described the second earth connection 141 is identical with described the first earth connection 11. Particularly, instituteState the first earth connection 11 and be connected to described the second earth connection 141 by described several via holes 111, to realizeThe grounding function of described printed circuit board (PCB) 10. In the time carrying out laser ablation material, if described the first earth connection 11Blown by laser or damage, described via hole 111 still can be connected to described the second earth connection 141, therebyCan make the grounding function of described printed circuit board (PCB) 10 be achieved. Be understandable that, in other enforcementIn example, the wire diameter of described the second earth connection 141 also can be not identical with the wire diameter of described the first earth connection 11, asThe wire diameter of described the second earth connection 141 be less than or be greater than described the first earth connection 11 all can, depending on concrete wiringSituation arranges.
Described some first signal cablings 12 are located at described the first earth connection 11 away from described flexible PCBA side of 20. In the present embodiment, described some first signal cablings 12 are in order to realize described printed circuit board (PCB)Signal transmission on 10. For the ease of wiring and ensure the continuity of signal, adjacent two described firstDistance between signal lead 12 equates. Described first signal cabling 12 is arranged on described first surface 13,And on described first signal cabling 12, offer signal via 121, described signal via 121 is through to instituteState on second 14. Particularly, described signal via 121 is opened in one of described first signal cabling 12On end, so that being connected of described first signal cabling 12 and other signal lead. Preferably, in order to strengthenThe overall construction intensity of described printed circuit board (PCB) 10, the hole wall of described signal via 121 is coated with metal coating(not shown), and described metal coating is metallic copper coating or metallic tin coating, to increase described printingTenor on circuit board 10, strengthens the overall construction intensity of described printed circuit board (PCB) 10.
Further, in described signal via 121, be provided with electric-conductor (not shown), described second 14Upper corresponding described some first signal cablings 12 are provided with some secondary signal cablings 142, described in leadElectricity part connects described first signal cabling 12 and secondary signal cabling 142, to realize described printed circuit board (PCB) 10On signal connect and signal transmission.
In the present embodiment, described flexible PCB 20 can be with the shape of described printed circuit board (PCB) 10 and matchesSquare plate. On described flexible PCB 20, be provided with ground path and signal line, described soft to realizeGrounding function and the signal transfer functions of property circuit board 20.
The present invention also provides a kind of mobile terminal (not shown), described mobile terminal comprise body (not shown),Be located at mainboard (not shown) and the described Rigid Flex 100 of described body interior, described Rigid Flex100 are located at described body interior, and are electrically connected with described mainboard. Described mobile terminal can be mobile phone, computer,Flat board, handheld device or media player etc.
Rigid Flex provided by the invention and mobile terminal, by being close to flexible circuit at printed circuit board (PCB)In one side of plate, the first earth connection is set, and on the first earth connection, several via holes is set. When carrying out laserWhile removing material, if when laser causes damage to this first earth connection, utilize these several via holes still canRealize the grounding function of printed circuit board (PCB), thereby prevent its earthing failure and cause signal lead cannot connect letterNumber, guaranteed the realization of the functional circuit on printed circuit board (PCB), and then improved the use of Rigid Flex canLean on property.
In the description of this description, reference term " embodiment ", " some embodiment ", " example ",The description of " concrete example ", " some examples " or similar " the first embodiment " etc. means in conjunction with this embodimentOr specific features, structure, material or feature that example is described are contained at least one embodiment of the present inventionOr in example. In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical enforcementExample or example. And specific features, structure, material or the feature of description can be at any one or manyIn individual embodiment or example with suitable mode combination.
Above-described embodiment, does not form the restriction to this technical scheme protection domain. Any upperState the amendment done within the spirit of embodiment and principle, be equal to and replace and improvement etc., all should be included in thisWithin the protection domain of technical scheme.

Claims (10)

1. a Rigid Flex, is characterized in that, it comprises printed circuit board (PCB) and is connected in printed circuit board (PCB)The flexible PCB of one end, is provided with the first earth connection and some first signals on described printed circuit board (PCB)Cabling, described the first earth connection is located at a side of the contiguous described flexible PCB of described printed circuit board (PCB), described inOn the first earth connection, offer several via holes, described several via holes are along the cabling side of described the first earth connectionTo spread configuration, and described several via holes all run through described printed circuit board (PCB), described some first lettersNumber cabling is arranged at a side of described the first earth connection, and described some first signal cablings are away from describedFlexible PCB arranges.
2. Rigid Flex as claimed in claim 1, is characterized in that, the wire diameter of described the first earth connectionBe greater than the wire diameter of described first signal cabling.
3. Rigid Flex as claimed in claim 1, is characterized in that, the wire diameter of described the first earth connectionBe more than or equal to 1mm.
4. Rigid Flex as claimed in claim 1, is characterized in that, described printed circuit board (PCB) comprises phaseTo arrange first surface and second, on described first surface, be provided with described the first earth connection, described severalVia hole all connects to described second.
5. Rigid Flex as claimed in claim 4, is characterized in that, described second upper corresponding instituteState the first earth connection and be provided with the second earth connection, and the wire diameter of described the second earth connection and described the first ground connectionLine is identical.
6. Rigid Flex as claimed in claim 4, is characterized in that, described some first signals are walkedOn line, all offer signal via, and described signal via is through on described second.
7. Rigid Flex as claimed in claim 6, is characterized in that, the hole wall of described signal via is coated withBe covered with metal coating, and described metal coating is metallic copper coating or metallic tin coating.
8. Rigid Flex as claimed in claim 7, is characterized in that, described second upper corresponding instituteState some first signal cablings and be provided with some secondary signal cablings, in described signal via, be provided with connectionThe electric-conductor of described first signal cabling and secondary signal cabling.
9. Rigid Flex according to claim 1, is characterized in that, adjacent two described firstDistance between signal lead all equates.
10. a mobile terminal, is characterized in that, described mobile terminal comprises body, is located in described bodyThe mainboard of portion and as described in claim 1 to 9 any one Rigid Flex, described Rigid Flex is establishedOn described mainboard, and be electrically connected with described mainboard.
CN201610105639.5A 2016-02-25 2016-02-25 Rigid Flex and mobile terminal Expired - Fee Related CN105611726B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610105639.5A CN105611726B (en) 2016-02-25 2016-02-25 Rigid Flex and mobile terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610105639.5A CN105611726B (en) 2016-02-25 2016-02-25 Rigid Flex and mobile terminal

Publications (2)

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CN105611726A true CN105611726A (en) 2016-05-25
CN105611726B CN105611726B (en) 2018-12-11

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102577646A (en) * 2009-09-30 2012-07-11 株式会社村田制作所 Circuit substrate and method of manufacture thereof
CN104221482A (en) * 2012-08-09 2014-12-17 株式会社村田制作所 High frequency signal transmission line and electronic apparatus
US20150319847A1 (en) * 2014-04-30 2015-11-05 Samsung Electro-Mechanics Co., Ltd. Wiring substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102577646A (en) * 2009-09-30 2012-07-11 株式会社村田制作所 Circuit substrate and method of manufacture thereof
CN104221482A (en) * 2012-08-09 2014-12-17 株式会社村田制作所 High frequency signal transmission line and electronic apparatus
US20150319847A1 (en) * 2014-04-30 2015-11-05 Samsung Electro-Mechanics Co., Ltd. Wiring substrate

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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18

Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18

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