CN105609655B - The production method of organic light emitting display panel - Google Patents
The production method of organic light emitting display panel Download PDFInfo
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- CN105609655B CN105609655B CN201511000340.5A CN201511000340A CN105609655B CN 105609655 B CN105609655 B CN 105609655B CN 201511000340 A CN201511000340 A CN 201511000340A CN 105609655 B CN105609655 B CN 105609655B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The present invention provides a kind of production method of organic light emitting display panel, including：Organic light emitting display motherboard is formed, organic light emitting display motherboard is formed and includes：One substrate is provided, multiple organic light-emitting units are formed in the first surface of substrate；Thin-film encapsulation layer is formed, organic light-emitting units are between thin-film encapsulation layer and substrate；Protective layer is formed, protective layer is located at surface of the encapsulated layer far from organic light-emitting units；Organic light emitting display motherboard is cut, forms multiple organic light emitting display panels；The first water blocking layer is formed in organic light emitting display panel, the first water blocking layer is located at surface of the protective layer far from encapsulated layer, and the first water blocking layer includes at least one layer of first inorganic film.The production method of organic light emitting display panel provided by the present invention can effectively reduce water vapour and oxygen by erosion of the crackle to metallic cathode and organic material inside display panel, improve the reliability of product.
Description
Technical field
The present invention relates to display field more particularly to a kind of production methods of organic light emitting display panel.
Background technology
What organic light emitting display (OLED, Organic Light Emitting Diode) can be widely used must
Want basis be device can for a long time, stablize, continuously work.It has been found that when OLED device works after a certain period of time, hair
Light part will appear blackspot, and electrode section will appear bubble, and this phenomenon is considered as the main reason for leading to component failure.It is black
The Crack cause of spot and bubble is in addition to the fuel factor of device organic function layer, the mainly metallic cathode of device, organic function layer
With from the chemical reaction between steam that the device external world is penetrated into, oxygen.In order to improve OLED lives of product, need by encapsulation
It manages that water vapour and oxygen from the device external world is isolated.
Thin-film package is packaged type widely used at present, during the processing procedure of display panel, multiple display panels
Simultaneously be produced on a motherboard, to the end of processing procedure after, motherboard is cut, so as to form multiple independent display surfaces
Plate, in cutting, currently used technology has machine cuts and laser cutting.Machine cuts are due to pressure meeting of the cutter head to panel
Thin-film encapsulation layer is caused to be cracked since marginal position, can equally be generated and split due to fuel factor using laser cutting mode
Line, then for steam and oxygen, from side, infiltration provides path for the generation of crackle.Meanwhile cut stress can to display layer device and
Thin-film encapsulation layer causes certain destruction.
Invention content
In view of this, the present invention provides a kind of organic light emitting display panels and preparation method thereof.
The one side of the embodiment of the present invention provides a kind of organic light emitting display panel, including：
Substrate, substrate have first surface, the second surface opposite with first surface and connection first surface and second
Multiple side surfaces on surface；
Organic light-emitting units, positioned at substrate first surface；
Thin-film encapsulation layer, organic light-emitting units are between substrate and thin-film encapsulation layer；
Protective layer, protective layer are located at surface of the encapsulated layer far from organic light-emitting units, and protective layer includes the first organic film
And adhesion layer, adhesion layer is between encapsulated layer and the first organic film；
First water blocking layer, the first water blocking layer are located at surface of the protective layer far from the encapsulated layer, and the first water blocking layer is included extremely
Few one layer of first inorganic film.
The another aspect of the embodiment of the present invention provides a kind of production method of organic light emitting display panel, including：
Organic light emitting display motherboard is formed, organic light emitting display motherboard is formed and includes：A substrate is provided, substrate has first
Surface and opposite second surface；
Multiple organic light-emitting units are formed in the first surface of substrate；
Thin-film encapsulation layer is formed, organic light-emitting units are between thin-film encapsulation layer and substrate；
Protective layer is formed, protective layer is located at surface of the encapsulated layer far from organic light-emitting units, and it is organic that protective layer includes first
Film layer and adhesion layer, adhesion layer is between encapsulated layer and the first organic film；
Organic light emitting display motherboard is cut, forms multiple organic light emitting display panels, each organic light emitting display
The substrate of panel further includes multiple side surfaces of connection first surface and second surface；
The first water blocking layer is formed in organic light emitting display panel, the first water blocking layer is located at table of the protective layer far from encapsulated layer
Face, the first water blocking layer include at least one layer of first inorganic film.
Organic light emitting display panel provided by the present invention and preparation method thereof, tool has the advantage that：
The present invention is shown after organic light emitting display motherboard cuts and to form multiple organic light emitting display panels in organic light emission
Show one layer of first water blocking layer of setting on the protective layer of panel, the first water blocking layer can cover the film envelope of organic light emitting display panel
The crackle that dress layer generates during cutting, so as to be effectively reduced water vapour and oxygen by crackle in display panel
The erosion of the metallic cathode and organic material in portion improves the reliability of product.
Description of the drawings
Fig. 1 is the schematic diagram of a kind of organic light emitting display panel that the embodiment of the present invention one provides；
Fig. 2 is the schematic diagram of another organic light emitting display panel that the embodiment of the present invention one provides；
Fig. 3 is a kind of schematic diagram of organic light emitting display panel provided by Embodiment 2 of the present invention；
Fig. 4 is the schematic diagram of another organic light emitting display panel provided by Embodiment 2 of the present invention；
Fig. 5 is a kind of schematic diagram of organic light-emitting display device provided by Embodiment 2 of the present invention；
Fig. 6 provides a kind of flow diagram of the production method of organic light emitting display panel for the embodiment of the present invention three；
Fig. 7 is the flow diagram that organic light emitting display motherboard is formed in the embodiment of the present invention three；
Fig. 8 A are the vertical view of organic light emitting display motherboard formed in the embodiment of the present invention three；
Fig. 8 B are the organic light emitting display panel formed after cutting organic light emitting display motherboard in the embodiment of the present invention three
Schematic diagram；
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention rather than the restriction to the invention.It also should be noted that in order to
Convenient for description, illustrated only in attached drawing with inventing relevant part.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Embodiment one
Fig. 1 is a kind of schematic diagram of organic light emitting display panel provided in an embodiment of the present invention, as shown in Figure 1, organic hair
Light display panel 100, including：
Substrate 101, substrate 101 have first surface 1011, the second surface 1012 opposite with first surface 1011 and
Connect multiple side surfaces 1013 of first surface 1011 and second surface 1012；
Organic light-emitting units 102, positioned at 101 first surface 1011 of substrate；
Thin-film encapsulation layer 103, organic light-emitting units 102 are between substrate 101 and thin-film encapsulation layer 103；
Protective layer 104, protective layer 104 are located at surface of the encapsulated layer 103 far from organic light-emitting units 102, and protective layer 104 wraps
The first organic film 1041 and adhesion layer 1042 are included, adhesion layer 1042 is located between 103 and first organic film 1041 of encapsulated layer；
First water blocking layer 105, the first water blocking layer 105 are located at surface of the protective layer 104 far from the encapsulated layer 103, and first
Water blocking layer 105 includes at least one layer of first inorganic film 1051.
In the present embodiment, organic light-emitting units 102 are the luminescent devices of organic light emitting display panel, usually by anode, sky
Cave implanted layer, hole transmission layer, organic luminous layer, electron transfer layer, electron injecting layer and cathode are formed, the sky of anode transmitting
The electronics of cave and emission of cathode is compound in organic luminous layer and emits photon realization and shines, and hole injection layer, has hole transmission layer
Machine luminescent layer, electron transfer layer, electron injecting layer are organic material, these organic materials and metallic cathode easily by steam and
The influence of oxygen and fail.Thin-film encapsulation layer 103 coats organic light-emitting units, forms the encapsulated layer of barrier water oxygen, this implementation
In example, thin-film encapsulation layer 103 can be single inorganic film, or the overlapping configuration of multilayer organic layer and electrodeless layer, to this
It does not limit.
Protective layer 104 is located at surface of the encapsulated layer 103 far from organic light-emitting units 102, to organic light emitting display panel
Internal components have further protection effect, can effectively prevent scraping of the external environment to organic light emitting display panel.
In the manufacturing process of organic light emitting display panel, multiple display panels typically are formed on one greatly substrate, are referred to as to have
Machine luminescence display motherboard, motherboard carry out small pieces cutting after completing, form multiple organic light emitting display panels again.Protective layer
104 can play thin-film encapsulation layer 103 in cutting process first of protective action, reduce cutting process to thin-film encapsulation layer
103 destruction.In the present embodiment, protective layer 104 includes at least one layer of first organic film 1041 and one layer of adhesion layer 1042, the
One organic film 1041 is bonded by adhesion layer 1042 with thin-film encapsulation layer 103, however, it is desirable to explanation, protective layer
104 can also have other film layer structures, and to this, the present embodiment does not limit, and the first organic film 1041 can in the present embodiment
With not with adhesion layer 1042 directly in conjunction with, between organic film 1041 and adhesion layer 1042 can also have protective layer 104 appoint
It anticipates other film layers.
First water blocking layer 105 is located at surface of the protective layer 104 far from encapsulated layer 103, and the first water blocking layer 105 includes at least one
The first inorganic film 1051 of layer.In the present embodiment, the setting of the first water blocking layer 105 is organic light emitting display panel is formed
Two protection, since inorganic layer has good iris action to water oxygen, so, different from protective layer 104, the first water blocking layer
105 primarily to prevent the steam of external environment from invading the inside of organic light emitting display panel, prevents steam from destroying organic
Luminescent layer causes to show bad.
When organic light emitting display motherboard is cut, thin-film encapsulation layer 103 can not be kept away by a degree of destruction
The meeting exempted from cracks, and crackle can further be spread, and seriously affects thin-film encapsulation layer 103 to display panel internal components
Packaging effect.First water blocking layer 105 can cover the crackle of thin-film encapsulation layer 103, effectively compensate for thin-film encapsulation layer 103
The decline of packaging effect caused by due to the generation of crackle further improves the reliability of organic light emitting display panel.
In the present embodiment, substrate 101 can be flexible base board, and flexible display panels can be formed using flexible base board.
With continued reference to Fig. 2, Fig. 2 is the schematic diagram of another organic light emitting display panel provided in this embodiment, with Fig. 1 institutes
The identical part of the embodiment shown, details are not described herein again, and the difference lies in as shown in Fig. 2, the first water blocking layer 205 includes
At least one first side 205a (part of dotted line frame in such as Fig. 2), first side 205a is towards a side surface of substrate 201
2013 extensions.It should be noted that part in dotted line frame is simply to illustrate that first side 205a and the schematic figure that provides
Show, encapsulated layer can also can further be covered with the side surface of protective mulch 204 to first side 205a in the present embodiment
203 side surface or the side surface 2013 for further covering substrate 201.
First water blocking layer 205 is located at surface of the protective layer 204 far from encapsulated layer 203, in organic light emitting display panel
Portion's device plays the further iris action to water oxygen.In the cutting process of organic light emitting display motherboard, thin-film encapsulation layer 203
Crackle usually generated since the side of thin-film encapsulation layer, and extend along encapsulated layer to the surface of display panel, so as to right
Thin-film encapsulation layer 203 causes the destruction of large area.First water blocking layer 205 of the present embodiment includes at least one first side
205a, first side 205a can cover the side crackle of thin-film encapsulation layer 203, further block the water in external environment
The intrusion of vapour and oxygen to internal components, and the first side 205a of the first water blocking layer 205 realizes thin-film encapsulation layer 203 and wraps
It wraps up in, extension of the side crackle to panel surface can be alleviated.
Optionally, a side surface 2013 of at least one first side 205a coverings substrate 201, the first water blocking layer 205
Display panel whole face can be wrapped up, cut off the intrusion path of water oxygen in external environment, and to thin-film encapsulation layer 203, guarantor
Sheath 204 and substrate 201 all form protective effect, so as to further promote the reliability of organic light emitting display panel.
Embodiment two
With continued reference to Fig. 3, Fig. 3 is a kind of schematic diagram of organic light emitting display panel provided by Embodiment 2 of the present invention, with
The identical part of embodiment one, details are not described herein again, and the difference lies in as shown in figure 3, organic light emitting display panel 300 is also
Including：Second water blocking layer 306, the second water blocking layer 306 are located at the second surface 3012 of substrate 301, and the second water blocking layer 306 is included extremely
Few one layer of second inorganic film 3061.
The present embodiment sets the second water blocking layer 306 in the second surface 3012 of substrate 301, and the second water blocking layer 306 is included extremely
Few one layer of inorganic film 3061, inorganic film have good iris action to water oxygen.Second water blocking layer, 306 one side is to substrate
Protective effect is formd, prevents destruction of the external environment to substrate, influences the internal components of display panel, on the other hand, right
In the cutting process of substrate, substrate edges may be damaged, and path, the second water blocking layer 306 are provided for water oxygen intrusion
This damage can be effectively made up, so as to prevent extraneous steam and oxygen from invading display panel from the edge of substrate 301
Inside improves the reliability of display panel.The third aspect, the base that the electrode (not shown)s of organic light-emitting units is arranged on
301 first surface of plate and close substrate 301, and a plurality of electrode cabling (not shown), usual electrode are distributed on substrate 301
Cabling is metal routing, is easily corroded, and causes the destruction to organic light emitting display panel, in second substrate surface setting the
Two water blocking layers 306 can play the electrode and electrode cabling of substrate first surface the protective effect of isolation water oxygen.
In the present embodiment, there can also be layer protective layer between the second water blocking layer 306 and substrate 301, protective layer can
It prevents display panel from being acted on by the external force of external environment, display panel is prevented to be damaged due to being scratched, the present invention is to protecting
The structure of sheath is not construed as limiting.
Fig. 4 is the schematic diagram of another organic light emitting display panel provided in this embodiment, as shown in figure 4, organic light emission
Second water blocking layer 406 of display panel 400 has at least one second side 406a, and second side 406a is towards protective layer 404
(including the first organic film 4041 and adhesion layer 4042) extension.It should be noted that the part in dotted line frame is intended merely to
Bright second side 406a and the schematic illustration provided can cover second side 406a in the present embodiment the side of substrate 401
Surface can also further cover the side surface or the further side surface of protective mulch 404 of encapsulated layer, this implementation
Example does not limit this.
Further the electrode to substrate, on substrate, electrode cabling and film seal for the setting of second side 406a
It fills layer and organic light-emitting units forms protective effect.
Optionally, it is at least part of overlapping with continued reference to Fig. 4, first side 405a and second side 406a, crossover region
Domain is as shown in Fig. 4 407.
In the cutting process of organic light emitting display motherboard, the crackle of thin-film encapsulation layer is usually from the side of thin-film encapsulation layer
Start to generate, and extend along encapsulated layer to the surface of display panel, so as to cause the destruction of large area to thin-film encapsulation layer.Cause
And the second side 406a of the first side 405a of the first water blocking layer 405 and the second water blocking layer 406 forms 407 energy of overlapping region
Enough cover the side crackle of thin-film encapsulation layer so that extraneous steam and oxygen cannot be invaded by the side crackle of thin-film encapsulation layer
Enter the inside to display panel, there is preferably resistance compared to individual first side 405a or individual second side 406a
The effect of water oxygen.
It should be noted that in order to prevent substrate 401 by external environment scraping and destruction, the second of substrate 401
Layer protective layer 404 can also be set on surface 4012, including at least one layer of first organic film 4041 and adhesion layer 4042, the
One organic film 4041 can be bonded by adhesion layer 4042 with substrate, and protective layer 404 can also include other film layer structures, this
Invention is not construed as limiting this.
Optionally, the first organic film 4041 can be polyethylene terephthalate, polyethylene naphthalate
And any one or a few in cyclic olefin polymer.These materials have excellent physical machine within the scope of wider temperature
Tool performance, and electrical insulating property is excellent, has good creep resistance, fatigue durability, rub resistance and dimensional stability.The
The thickness of one organic film 4041 can be 5~50 μm, and when the thickness of the first organic film is less than 5 μm, abrasion resistance is poor, no
Internal components can be formed with effective protective effect, when the first organic film thickness be more than 50 μm, influence the saturating of display panel
Light rate and unfavorable to the bending of organic light emitting display panel.
With continued reference to Fig. 5, Fig. 5 is a kind of schematic diagram of organic light-emitting display device provided in this embodiment, such as Fig. 5 institutes
Show, the first water blocking layer 505 can also include at least one layer of second organic film 5052, and the second organic film 5052 and first is inorganic
Film layer 5051 is alternately superimposed on, and the first outside of the water blocking layer 505 far from protective layer 504 is the first inorganic film 5051.
The first inorganic film 5051 in first water blocking layer 505 has the function of to obstruct steam and oxygen, but inorganic material
The material generally easy embrittlement when being bent or being acted on by external force, so as to reduce the ability of isolation water oxygen, and the second organic film
Layer 5052 can alleviate the accumulation of 5051 internal stress of the first inorganic film.The present embodiment is by setting the second organic film 5052
With being alternately superimposed on for the first inorganic film, enhance the resistant to bending of the first water blocking layer 505 and resist the ability that external force breaks ring.
Optionally, in the present embodiment, the second water blocking layer can also include at least one layer of third organic film, third organic film
Layer and the second inorganic film overlap setting, and outside of second water blocking layer far from the second substrate surface is second inoranic membrane
Layer.
Optionally, the second organic film or third organic film can be organo-silicon compound or aromatic series, aromatic series
One or more of diyl benzene or styrene can illustratively be included.
Second organic film or third organic film are mainly organic micromolecule compound material, and the thickness of film forming generally exists
0.1~1 μm, when film forming thickness is less than 0.1 μm, organic film cannot fully cover inorganic film, and inorganic film can not be risen
To the mitigation of effective stress, and the thickness of organic film is thicker, more unfavorable to the bending performance of display panel, this implementation
The thickness of example the second organic film of setting or third organic film is 0.1~1 μm, has both been taken into account to the first inorganic film or second
The stress relief effect of inorganic film in turn ensures the good bending performance of display panel.Optionally, the first inorganic film or
Second inorganic film can be one or more of silica, aluminium oxide, silicon nitride, silicon oxynitride, these materials have
The performance of good barrier steam and oxygen can form internal organic luminous layer protective effect, and light transmission rate is high, not shadow
Ring the display performance of display panel.The thickness of first inorganic film or the second inorganic film can be 0.01~0.1 μm.
Embodiment three
As shown in fig. 6, for the present embodiment provides a kind of flow diagram of the production method of organic light emitting display panel, have
The production method of machine light emitting display panel includes the following steps：
S1 forms organic light emitting display motherboard.
S2 cuts organic light emitting display motherboard, forms multiple organic light emitting display panels, and each organic light emission is shown
Show that the substrate of panel further includes multiple side surfaces of connection first surface and second surface.
S3, forms the first water blocking layer in organic light emitting display panel, and the first water blocking layer is located at protective layer far from encapsulated layer
Surface, the first water blocking layer includes at least one layer of first inorganic film.Specifically, for step S1, Fig. 7 is shape in the present embodiment
Into the flow diagram of organic light emitting display motherboard, Fig. 8 A are the vertical view of organic light emitting display motherboard formed in the present embodiment
Figure, Fig. 7 B are the schematic diagram of organic light emitting display panel formed after cutting organic light emitting display motherboard in the present embodiment.Knot
It closes with reference to figure 7, Fig. 8 A and Fig. 8 B, the step S1 for forming organic light emitting display motherboard 800 includes：
S1a, provides a substrate 801, and substrate 801 has first surface 8011 and opposite second surface 8012.
S1b forms multiple organic light-emitting units 802 in the first surface 8011 of substrate 801.
S1c forms thin-film encapsulation layer 803, and organic light-emitting units 802 are between thin-film encapsulation layer 803 and substrate 801.
S1d, forms protective layer 804, and protective layer 804 is located at table of the thin-film encapsulation layer 803 far from organic light-emitting units 802
Face, protective layer 804 include the first organic film 8041 and adhesion layer 8042, and adhesion layer 8042, which is located at encapsulated layer 803 and first, to be had
Between machine film layer 8041.
For step S1a, in the manufacturing process of organic light emitting display motherboard 800, substrate 801 can be flexible base board,
So as to which flexible display panels be prepared.When substrate 801 be flexible base board, a rigid glass substrate, flexible base can be first provided
Plate 801 is formed on glass substrate, when organic light emitting display motherboard completes, can first by organic light emitting display motherboard into
Row cutting, is then removed with glass substrate, can also first be removed organic light emitting display motherboard and glass substrate, then
Organic light emitting display motherboard is cut again, this is not limited by the present invention.
For step S1b, in the present embodiment, each organic light-emitting units 802 are represented in an organic light emitting display panel
The relevant component of all organic light emitting displays in portion, organic light-emitting units 802 can include it is multiple can emit it is red, green
The organic light emitting display pixel of color, blue or other colors.Multiple organic light emission lists are formed on 801 first surface 8011 of substrate
Member, multiple organic light emitting display panels can be formed on substrate 801 by represent.
For step S1c, the thin-film encapsulation layer 803 in the present embodiment forms protective effect to organic light-emitting units 802, subtracts
Corrosion function of few extraneous water oxygen to organic light-emitting units 802, thin-film encapsulation layer 803 can be the inorganic layer of individual layer, also may be used
That thinks multilayer organic layer and inorganic layer is alternately superimposed on structure, and the present embodiment does not limit this.
For step S1d, the first organic film 8041 can be pasted by adhesion layer 8042 and thin-film encapsulation layer 803
It closes, protective layer 804 has further protection effect to the internal components of organic light emitting display panel, can effectively prevent outside
Scraping of the environment to organic light emitting display panel.
First organic film 8041 can be polyethylene terephthalate, polyethylene naphthalate and cyclenes
Any one or a few in hydrocarbon polymer, these materials have excellent physical mechanical property within the scope of wider temperature,
And electrical insulating property is excellent, has good creep resistance, fatigue durability, rub resistance and dimensional stability.First is organic
The thickness of film layer 8041 can be 5~50 μm, and when the thickness of the first organic film is less than 5 μm, abrasion resistance is poor, it is impossible to internally
Portion's device forms effective protective effect, when the first organic film thickness be more than 50 μm, influence display panel light transmittance and
It is unfavorable to the bending of display panel.
Specifically, for step S2, organic light emitting display motherboard 800 is cut, forms multiple organic light emitting displays
The substrate 801 of panel 800b, each organic light emitting display panel 800b further include connection first surface 8011 and second surface
8012 multiple side surfaces 8013.
As shown in Figure 8 A, the cutting of organic light emitting display motherboard 800 along the cutting line in figure can be carried out, needed
Bright, the cutting line in figure is only schematical.Optionally, when substrate 801 be flexible base board, organic light emitting display motherboard
800 are located at the surface of a rigid substrates to ensure the flatness of manufacturing process, and the cutting process of organic light emitting display motherboard 800 can
It, can also be after motherboard 800 be detached with rigid substrates with before motherboard 800 is detached with rigid substrates.When in organic light emission
Display master blank 800 is cut before being detached with rigid substrates, and used cutting mode can be laser cutting, use high energy
Organic light emitting display motherboard 800 and rigid substrates are cut into small pieces, then carry out the stripping of rigid substrates by laser jointly.When having
Machine luminescence display motherboard 800 is cut after being detached with rigid substrates, and used cutting mode can be that blade is cut, and make
It is convenient with blade cutting operation, and heat loss will not be caused to organic light emitting display motherboard.
Specifically, for step S3, optionally, the first water blocking layer can include at least one first side, first side
Extend towards a side surface of substrate.
Optionally, a side surface of at least one first side covering substrate of the first water blocking layer.
In the present embodiment, the first inorganic film of at least one layer of formation can use chemical vapor deposition, physics gas gas phase
Any one method in deposition and atomic layer deposition is formed.
It optionally, can also be in 8012 shape of second surface of substrate after being cut to organic light emitting display motherboard 800
Into the second water blocking layer, form the second water blocking layer 8012 and include at least one layer of second inorganic film.
Optionally, the second water blocking layer can include at least one second side, and second side extends towards protective layer 804.
Optionally, at least some is overlapping for first side and second side.
It should be noted that the sequence that the second water blocking layer of the first water blocking layer and formation is formed in the present embodiment does not limit.
In the present embodiment, the first inorganic film or the second inorganic film can be silica, aluminium oxide, silicon nitride, nitrogen
One or more of silica can use chemical vapor deposition (CVD, Chemical Vapor Deposition), physics
Be vapor-deposited (PVD, Physical Vapor Deposition), atomic layer deposition (ALD, Atomic Layer
Deposition any one method in) is formed.Plasma enhanced chemical vapor deposition (PECVD, Plasma
Enhanced Chemical Vapor Deposition) be chemical vapor deposition one kind, settling chamber utilize glow discharge
Make the gas ionization containing film composed atom, be partially formed plasma, and plasma chemistry activity is very strong, it is easy to
It reacting, film is formed in substrate deposit, this method depositing temperature is low, small to the structure and physical influence of matrix, into
Film uniformity is good, and the thickness of film forming can be 0.01~0.1 μm.
Optionally, the step of forming the first water blocking layer further includes：Form at least one layer of second organic film, the second organic film
Layer and the first inorganic film overlap to be formed, and outside of first water blocking layer far from protective layer is the first inorganic film.
Optionally, the step of forming the second water blocking layer further includes：Form at least one layer of third organic film, third organic film
Layer and the second inorganic film overlap to be formed, and outside of second water blocking layer far from second substrate surface is the second inorganic film.
In the present embodiment, the second organic film or third organic film can be organo-silicon compound or aromatic series, virtue
Fragrant race can illustratively include one or more of diyl benzene or styrene, can use chemical vapor deposition, ink-jet
Any one method in printing and vapor deposition is formed.Inkjet printing is the currently used method for forming organic film, is being carried out
Before inkjet printing film forming, organic molecule presoma is prepared, by the jet array of ink-jet printer by organic molecule forerunner
Body is sprayed in the specific region of substrate, and organic molecule presoma free drawout on substrate comes, and then passes through heat or UV
The irradiation of (Ultra Violet, ultraviolet light) light makes organic layer curing so as to form organic film, the thickness of film forming generally 0.1~
1 μm, when film forming thickness is less than 0.1 μm, organic film cannot fully cover inorganic film, inorganic film can not be played effectively
Stress mitigation, and the thickness of organic film is thicker, more unfavorable to the bending performance of display panel, the present embodiment setting
The thickness of second organic film or third organic film is 0.1~1 μm, has both been taken into account to the first inorganic film or the second inoranic membrane
The stress relief effect of layer in turn ensures the good bending performance of display panel.
Above description is only presently preferred embodiments of the present invention and the explanation to institute's application technology principle.People in the art
Member should be appreciated that invention scope involved in the present invention, however it is not limited to the technology that the specific combination of above-mentioned technical characteristic forms
Scheme, while should also cover in the case where not departing from the inventive concept, it is carried out by above-mentioned technical characteristic or its equivalent feature
The other technical solutions for arbitrarily combining and being formed.Such as features described above has similar work(with the (but not limited to) disclosed in the present invention
The technical solution that the technical characteristic of energy is replaced mutually and formed.
Claims (14)
1. a kind of production method of organic light emitting display panel, which is characterized in that including：
Organic light emitting display motherboard is formed, the formation organic light emitting display motherboard includes：A substrate is provided, the substrate has
First surface and opposite second surface；
Multiple organic light-emitting units are formed in the first surface of the substrate；
Thin-film encapsulation layer is formed, the organic light-emitting units are between the thin-film encapsulation layer and the substrate, the film
Encapsulated layer is inorganic layer and the overlapping configuration of organic layer；
Protective layer is formed, the protective layer is located at surface of the encapsulated layer far from the organic light-emitting units, the protective layer
Including the first organic film and adhesion layer, the adhesion layer is between the encapsulated layer and first organic film；
The organic light emitting display motherboard is cut, forms multiple organic light emitting display panels, each organic light emission
The substrate of display panel further includes multiple side surfaces of connection first surface and second surface；
The first water blocking layer is formed in the organic light emitting display panel, first water blocking layer is located at the protective layer far from institute
The surface of encapsulated layer is stated, first water blocking layer includes at least one layer of first inorganic film.
2. the production method of display panel according to claim 1, which is characterized in that
The first water blocking layer of the formation includes forming at least one first side, and the first side is towards described one institute of substrate
State side surface extension.
3. the production method of display panel according to claim 2, which is characterized in that
At least one first side covers a side surface of the substrate.
4. the production method of display panel according to claim 2, which is characterized in that
It is described that the organic light emitting display motherboard is carried out to further include after cutting forms multiple organic light emitting display panels：Institute
The second surface for stating substrate forms the second water blocking layer, including forming at least one layer of second inorganic film.
5. the production method of display panel according to claim 4, it is characterised in that
The second surface in the substrate forms the second water blocking layer and includes：Form at least one second side, described second
Side extends towards the protective layer.
6. the production method of display panel according to claim 5, which is characterized in that
The first side and the second side are at least part of overlapping.
7. the production method of display panel according to claim 1, which is characterized in that
Formation first water blocking layer further includes to form at least one layer of second organic film,
Second organic film and first inorganic film overlap to form first water blocking layer,
The outside of first water blocking layer far from the protective layer is the first inorganic film.
8. the production method of display panel according to claim 4, which is characterized in that
Formation second water blocking layer further includes to form at least one layer of third organic film,
The third organic film and second inorganic film overlap to form second water blocking layer,
The outside of second water blocking layer far from the second substrate surface is the second inorganic film.
9. the production method of display panel according to claim 7, which is characterized in that
First organic film includes polyethylene terephthalate, polyethylene naphthalate and cyclic olefin polymerization
Any one or a few in object；
Second organic film includes organo-silicon compound or aromatic series；
First inorganic film includes one or more of silica, aluminium oxide, silicon nitride, silicon oxynitride.
10. the production method of display panel according to claim 8, which is characterized in that
First organic film includes polyethylene terephthalate, polyethylene naphthalate and cyclic olefin polymerization
Any one or a few in object；
The third organic film includes organo-silicon compound or aromatic series；
First inorganic film or second inorganic film are included in silica, aluminium oxide, silicon nitride, silicon oxynitride
It is one or more of.
11. the production method of display panel according to claim 9, which is characterized in that
The thickness for forming first organic film is 5~50 μm；
The thickness for forming second organic film is 0.1~1 μm；
The thickness for forming first inorganic film is 0.01~0.1 μm.
12. the production method of display panel according to claim 10, which is characterized in that
The thickness for forming first organic film is 5~50 μm；
The thickness for forming the third organic film is 0.1~1 μm；
The thickness for forming first inorganic film or second inorganic film is 0.01~0.1 μm.
13. the production method of display panel according to claim 11, which is characterized in that
First organic film is bonded by binding agent with the thin-film encapsulation layer；
First inorganic film uses any one side in chemical vapor deposition, physical vapour deposition (PVD) and atomic layer deposition
Method is formed；
Second organic film is formed using any one method in chemical vapor deposition, inkjet printing and vapor deposition.
14. the production method of display panel according to claim 12, which is characterized in that
First organic film is bonded by binding agent with the thin-film encapsulation layer；
First inorganic film or second inorganic film use chemical vapor deposition, physical vapour deposition (PVD) and atomic layer
Any one method in deposition is formed；
The third organic film is formed using any one method in chemical vapor deposition, inkjet printing and vapor deposition.
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| CN106784372A (en) | 2016-12-26 | 2017-05-31 | 武汉华星光电技术有限公司 | A kind of OLED thin-film packing structures and method |
| CN106935633B (en) * | 2017-05-23 | 2020-04-21 | 上海天马微电子有限公司 | Display panel and method for manufacturing display panel |
| JP6864111B2 (en) * | 2017-08-21 | 2021-04-21 | 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． | Display board, display device and manufacturing method of display board |
| CN110246988A (en) * | 2018-03-09 | 2019-09-17 | 上海和辉光电有限公司 | A kind of display panel and its manufacturing method, display master blank and display device |
| CN110391189B (en) * | 2018-04-19 | 2021-08-10 | 深圳未来新材料实业有限公司 | Packaging method of anti-reflection and anti-reflection film on flexible substrate |
| CN108649146B (en) * | 2018-06-15 | 2020-12-22 | 信利半导体有限公司 | Preparation method of flexible display device |
| CN109461823B (en) * | 2018-08-30 | 2020-11-10 | 昆山国显光电有限公司 | Packaging structure and packaging device |
| CN109524440B (en) * | 2018-11-21 | 2021-03-12 | 云谷（固安）科技有限公司 | Flexible display panel and device |
| CN109962180B (en) * | 2019-03-01 | 2020-11-10 | 昆山国显光电有限公司 | Preparation method of display panel |
| CN110265575A (en) * | 2019-06-26 | 2019-09-20 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN111261657B (en) * | 2020-01-21 | 2022-11-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113625500B (en) * | 2020-04-21 | 2024-04-16 | 元太科技工业股份有限公司 | Electronic paper packaging structure |
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