CN105607349A - PI liquid coating method - Google Patents

PI liquid coating method Download PDF

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Publication number
CN105607349A
CN105607349A CN201610143237.4A CN201610143237A CN105607349A CN 105607349 A CN105607349 A CN 105607349A CN 201610143237 A CN201610143237 A CN 201610143237A CN 105607349 A CN105607349 A CN 105607349A
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China
Prior art keywords
substrate
light shield
area
liquid coating
coating process
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Granted
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CN201610143237.4A
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Chinese (zh)
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CN105607349B (en
Inventor
朱美娜
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to CN201610143237.4A priority Critical patent/CN105607349B/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/133711Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by organic films, e.g. polymeric films
    • G02F1/133723Polyimide, polyamide-imide

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention provides a PI liquid coating method. A first light cover and a second light cover are adopted, wherein the length of the first light cover and the length of the second light cover are equal to the width and length of a substrate respectively. A first shading area and a second shading area are arranged on the wide edge of the first light cover and the wide edge of the second light cover, wherein the width of the first shading area and the width of the second shading area are equal to the width of frame adhesives. After irradiating the substrate through the first light cover for the first time, an ultraviolet light source is rotated by 90 degrees and irradiates the substrate through the second light cover for the second time; a second area located on the substrate is irradiated by ultraviolet light twice, and therefore the concentration of organic matter is low. A first area is irradiated less than two times, the concentration of organic matter is high, PI liquid is not dispersed to the first area from the second area easily, the precision of PI liquid coating is controlled, the quality of an alignment film is improved, and defects of products are reduced.

Description

PI liquid coating process
Technical field
The present invention relates to technical field of liquid crystal display, relate in particular to a kind of PI liquid coating process.
Background technology
Along with the development of Display Technique, liquid crystal display (LiquidCrystalDisplay, LCD) with haveThe planes such as OLED display (OrganicLightEmittingDiode, OLED) show dressPut because thering is the advantages such as the thin and applied range of high image quality, power saving, fuselage, and be widely used in handMechanical, electrically look, the various consumption such as personal digital assistant, digital camera, notebook computer, desktop computerProperty electronic product, becomes the main flow in display unit.
Liquid crystal display major part on existing market is backlight liquid crystal display, and it comprises liquid crystal displayPanel and backlight module (backlightmodule). The operation principle of display panels is at film crystalPipe array base palte (ThinFilmTransistorArraySubstrate, TFTArraySubstrate) is with colorBetween colo(u)r filter substrate (ColorFilter, CF), pour into liquid crystal molecule, and apply on two plate basesDriving voltage is controlled the direction of rotation of liquid crystal molecule, so that the light refraction of backlight module is out produced to pictureFace.
For liquid crystal molecule is arranged according to specific direction of rotation, need to be at thin film transistor (TFT) arrayThe inner side of substrate and colored filter substrate makes alignment film, and alignment film can be used for limiting joining of liquid crystal moleculeTo state. Traditional method for manufacturing alignment film is that (Polyimide gathers by the PI that is dissolved with macromolecular compoundAcid imide) liquid is sprayed on the real estate that need to make alignment film, heats afterwards PI liquid or use ultraviolet lightingPenetrate PI liquid, make the macromolecular compound of its dissolving produce polymerisation, form large with the long-chain of tilt angleMolecular solid polymer, the active force between these polymer and liquid crystal molecule is stronger, make liquid crystal molecule according toThe direction of tilt angle is arranged.
In the coating process of actual PI liquid, usually because the state of TFT or CF substrate surface affectsThe Painting effect of PI film. PI liquid is generally hydroaropic substance, easily expands on the surface that organic substance residues is moreLoose uneven, and then cause TFT-LCD product to occur broken bright spot, affect the quality of product. In addition exist,Adopt the method for inkjet printing to carry out in the process of PI liquid coating, generally control by PI liquid change in patternThe precision of PI liquid coating processed, is coated in the viewing area of substrate PI liquid equably, but the methodIn the time that the surface state of substrate is inconsistent, may cause the diffusion of PI liquid to exceed, and then affect that frame glue is coated with orPerson produces periphery defect (defect).
Summary of the invention
The object of the present invention is to provide a kind of PI liquid coating process, can improve the essence of PI liquid coatingDegree, the one-tenth film quality of raising alignment film, prevents that the diffusion of PI liquid from exceeding, and reduces the defect of product.
For achieving the above object, the invention provides a kind of PI liquid coating process, comprise the following steps:
Step 1, provide a substrate, a super ultraviolet light source, one first light shield, one second light shield and a biographySeeing-off deck;
The length of described the first light shield equals the width of substrate;
Described the first light shield comprises: one first transparent area and the two ends that lay respectively at the first transparent area are along instituteState the first shading region of two strips of the width extension of the first light shield;
The length of described the second light shield equals the length of substrate;
Described the second light shield comprises: the second transparent area and the two ends that lay respectively at the second transparent area along described inThe second shading region of two strips that the width of the second light shield extends;
Step 2, the first light shield is arranged under super ultraviolet light source, substrate is placed on conveying machine, makeA broadside of substrate aligns with a long limit of the first light shield, and conveying machine starts to transmit substrate, super purpleOuter light source irradiates substrate through the first light shield, until another of substrate broadside also with the first light shieldAnother long limit alignment till;
Step 3, the second light shield is arranged under super ultraviolet light source, by substrate clockwise or be rotated counterclockwiseAfter 90 °, be placed on again on conveying machine, make long limit of substrate and a long limit pair of the second light shieldTogether, conveying machine starts to transmit substrate, and super ultraviolet light source irradiates substrate through the second light shield, straightTill aliging to another long limit of substrate and another long limit of the second light shield, thereby form on substrateThe first area that organic concentration is different and second area, described first area is for being positioned at described substrate edgesThrough once and not passing through the light-struck region of extreme ultraviolet, described second area is for being positioned at described substrateCentral authorities through twice light-struck region of extreme ultraviolet, described first area surrounds described second area;
Step 4, PI liquid is coated on to the second area of substrate.
Substrate in described step 1 is process wet-cleaned in last processing procedure.
Substrate in described step 1 is thin-film transistor array base-plate.
Substrate in described step 1 is colorful film optical filtering substrate.
Substrate in described step 1 is glass substrate.
The organic concentration of described first area is greater than the organic concentration of described second area.
Described first area is the region of described base plate coating frame glue, and its width equals the width of frame glue.
In described step 3, the direction of substrate rotation is clockwise.
In described step 3, the direction of substrate rotation is counterclockwise.
In described step 2 and step 3, conveying machine at the uniform velocity transmits substrate.
Beneficial effect of the present invention: PI liquid coating process provided by the invention, provide length respectively with baseThe first light shield that plate width and substrate are equal in length and the second light shield, and wide at the first light shield and the second light shieldThe edge at place, limit arranges the first shading region and the second shading region that width is frame glue width, and substrate is placedOn conveying machine, make extreme ultraviolet linear light by the first light shield, substrate be irradiated, afterwards by 90 ° of substratesAfter rotation, make extreme ultraviolet linear light by the second light shield, substrate be irradiated, owing to being positioned at of substrate centerTwo regions are through twice extreme ultraviolet irradiation, and the organic matter of surface distributed is less, and PI liquid is evenly distributed,Alignment film quality is better; First area part is through once irradiating, and part not process is irradiated, surface pointThe organic matter of cloth is more, produces the different region of organic concentration on substrate, and PI liquid is difficult for from second areaDiffuse to first area, can improve PI liquid coating precision, prevent that the diffusion of PI liquid from exceeding, and affects frame glueCoating or generation periphery defect, the one-tenth film quality of lifting alignment film, the defect of minimizing product.
Brief description of the drawings
In order further to understand feature of the present invention and technology contents, refer to following about thisBright detailed description and accompanying drawing, but accompanying drawing only provides reference and explanation use, is not used for the present invention to addWith restriction.
In accompanying drawing,
Fig. 1 is the flow chart of the PI liquid coating process in the present invention;
Fig. 2 is the structure chart of the first light shield of step 1 in PI liquid coating process of the present invention;
Fig. 3 is the structure chart of the second light shield of step 1 in PI liquid coating process of the present invention;
Fig. 4 is that schematic diagram is looked on a left side for step 2 in PI liquid coating process of the present invention;
Fig. 5 is the schematic top plan view of step 2 in PI liquid coating process of the present invention;
Fig. 6 is that schematic diagram is looked on a left side for step 3 in PI liquid coating process of the present invention;
Fig. 7 is the schematic top plan view of step 3 in PI liquid coating process of the present invention;
Fig. 8 is the signal through twice extreme ultraviolet irradiation metacoxal plate in PI liquid coating process of the present inventionFigure.
Detailed description of the invention
Technological means and the effect thereof taked for further setting forth the present invention, below in conjunction with of the present inventionPreferred embodiment and accompanying drawing thereof are described in detail.
Refer to Fig. 1, the invention provides a kind of PI liquid coating process, comprise the following steps:
Step 1, refer to Fig. 4, and in conjunction with Fig. 2 and Fig. 3, provide a substrate 100, a super ultraviolet light source200, one first light shield 300, one second light shield 400 and a conveying machine 500.
The length of described the first light shield 300 equals the width of substrate 100;
Described the first light shield 300 comprises: one first transparent area 320 and lay respectively at the first transparent area 320The first shading region 310 of two strips that extend along the width of described the first light shield 300 at two ends.
The length of described the second light shield 400 equals the length of substrate 100;
Described the second light shield 400 comprises: the second transparent area 420 and lay respectively at two of the second transparent area 420The second shading region 410 of two strips that end extends along the width of described the second light shield 400.
Particularly, establishing M, N and K is positive number, and the length of described substrate 100 is M, and width is N,The width of described the first shading region 310 and the second shading region 410 is K. Substrate 100 can be liquid crystal displayThe thin-film transistor array base-plate of panel or colorful film optical filtering substrate. Preferably, described substrate 100 isGlass substrate.
Especially, described substrate 100 process wet-cleaned in last processing procedure. Described super ultraviolet light source 200Can launch extreme ultraviolet light (ExtremeUltravioletLithography, EUV), when extreme ultraviolet lightWhen EUV is irradiated on substrate 100, can interrupt the substrate 100 upper organic keys in surface, generate oxygen(O) free radical is carbon dioxide (CO by organic substance decomposing2) and water (H2O), so remove baseThe organic matter on plate 100 surfaces.
Step 2, please refer to Fig. 4 and Fig. 5, the first light shield 300 is arranged to super ultraviolet light source 200 times, by basePlate 100 is placed on conveying machine 500, make one of broadside of substrate 100 and the first light shield 300 longLimit alignment, conveying machine 500 starts to transmit substrate 100, and super ultraviolet light source 200 is right through the first light shield 300Substrate 100 irradiates, until another broadside of substrate 100 also with another long limit of the first light shield 300Till alignment.
Please refer to Fig. 5, due to the effect of the first light shield 300, on conveying machine 500 with respect to extreme ultraviolet lightThe first fringe region 111 that edge's width at the place, long limit of the substrate 100 of source 200 uniform motion is KBlocked in step 3 and be not irradiated to by extreme ultraviolet light EUV all the time by the first shading region 310, and by twoAlthough the first folded zone line 121 of a fringe region 111 is irradiated by extreme ultraviolet light EUV, while irradiationBetween not long, surperficial organic matter part is eliminated.
Step 3, please refer to Fig. 6 and Fig. 7, the second light shield 400 is arranged to super ultraviolet light source 200 times, by baseAfter plate 100 half-twists, be placed on again on conveying machine 500, make long limit and second light shield of substrate 100400 one long limit alignment, conveying machine 500 starts to transmit substrate 100, and super ultraviolet light source 200 is through theTwo light shields 400 irradiate substrate 100, until another long limit of substrate 100 and the second light shield 400Till another long limit alignment.
Alternatively, the direction of rotation of substrate 100 can be clockwise or counterclockwise.
Please refer to Fig. 7, due to the effect of the second light shield 400, on conveying machine 500 with respect to extreme ultraviolet lightThe second fringe region 112 that the edge place width at the substrate 100 broadside places of source 200 uniform motion is K is byTwo shading regions 410 are blocked in step 4 and are not irradiated to by extreme ultraviolet light EUV all the time, and the second marginal zoneThe second folded zone line 122 of territory 112 is irradiated by extreme ultraviolet light EUV again, makes surperficial organic matter portionDivide and further eliminated.
Further, through step 4 with after step 5, on substrate 100, form organic matter state different firstRegion 110 and second area 120, described first area 110 for be positioned at described substrate frontside edge through oneInferior and do not pass through the light-struck region of extreme ultraviolet, described second area 120 is for being arranged in described substrate 100Centre through twice light-struck region of extreme ultraviolet, described first area 110 surrounds described second area120. The organic concentration of described first area 110 is greater than the organic concentration of described second area 120.
Concrete, in described step 2 and step 3, conveying machine at the uniform velocity transmits substrate.
Step 4, please refer to Fig. 6, PI liquid is coated on to the second area 120 on substrate 100.
Particularly, due to the first zone line 121 and the step being irradiated to by extreme ultraviolet light EUV in step 3It is overlapping that the second zone line 122 being mapped to by extreme ultraviolet illumination in 4 has part, this part overlapping regionBe the second area 120 on substrate 100, because second area 120 is through the extreme ultraviolet irradiation of twice,Make its surperficial organic concentration lower, PI liquid is better in the diffusivity of second area 120, can be evenCoating; In the first fringe region 111 not being mapped to by extreme ultraviolet illumination in step 3 and step 4 not by extreme ultravioletThe summation of the second fringe region 112 that illumination is mapped to is the first area 110 on substrate 100, in the firstth districtIn territory 110, an illumination has been in subregion in step 3 or step 4, and in substrate 100 cornersThe intersection that four regions 123 are the first fringe region 111 and the second fringe region 112 was not subject to illumination,Therefore the organic concentration on 110 surfaces, first area is higher, and PI liquid is difficult for diffusion.
Because second area 120 organic concentrations on substrate 100 are lower, first area 110 organic concentrationsHeight, is coated on PI liquid after the second area 120 on substrate 100, and PI liquid can be equably in Second RegionThe interior diffusion in territory 120, the quality of alignment film is better, simultaneously because first area 110 on substrate 100 surrounds theTwo regions 120, and the organic concentration of first area 110 to be greater than the organic matter of described second area 120 denseDegree, PI liquid is difficult to be diffused into first area 110 from second area 120, and then can prevent the diffusion of PI liquidExceed, affect the coating of frame glue or produce periphery defect. First area 110 on substrate 100 is for rearAmong continuous processing procedure, be coated with frame glue for the one-tenth box processing procedure at display panels by thin film transistor (TFT) array basePlate and colorful film substrate in combination.
In sum, PI liquid coating process provided by the invention, provide length respectively with substrate width andThe first light shield that substrate is equal in length and the second light shield, and at the first light shield and the second light shield broadside placeEdge arranges the first shading region and the second shading region that width is frame glue width, and substrate is placed on to conveyerOn platform, make extreme ultraviolet linear light by the first light shield, substrate be irradiated, will after 90 ° of rotations of substrate, make afterwardsExtreme ultraviolet linear light irradiates substrate by the second light shield, owing to being positioned at the second area warp of substrate centerCross extreme ultraviolet irradiation twice, the organic matter of surface distributed is less, PI liquid is evenly distributed, alignment film productMatter is better; First area part is through once irradiating, and part is through irradiating, surface distributed organicThing is more, produces the different region of organic concentration on substrate, and PI liquid is difficult for diffusing to the from second areaOne region, can improve PI liquid coating precision, prevents that the diffusion of PI liquid from exceeding, affect that frame glue is coated with orProduce periphery defect, promote the one-tenth film quality of alignment film, reduce the defect of product.
The above, for the person of ordinary skill of the art, can be according to technical side of the present inventionCase and technical conceive are made other various corresponding changes and distortion, and all these changes and distortion are all answeredBelong to the protection domain of the accompanying claim of the present invention.

Claims (10)

1. a PI liquid coating process, is characterized in that, comprises the following steps:
Step 1, provide a substrate (100), a super ultraviolet light source (200), one first light shield (300),One second light shield (400) and a conveying machine (500);
The length of described the first light shield (300) equals the width of substrate (100);
Described the first light shield (300) comprising: one first transparent area (320) and lay respectively at the first printing opacityFirst of two strips that extend along the width of described the first light shield (300) at the two ends in district (320) hideLight district (310);
The length of described the second light shield (400) equals the length of substrate (100);
Described the second light shield (400) comprising: the second transparent area (420) and lay respectively at the second transparent area(420) the second shading region of two strips that extend along the width of described the second light shield (400) at two ends(410);
Step 2, the first light shield (300) is arranged under super ultraviolet light source (200), by substrate(100) be placed on conveying machine (500) upper, make broadside and first light shield of substrate (100)(300) a long limit alignment, conveying machine (500) starts to transmit substrate (100), super ultraviolet light source(200) through the first light shield (300), substrate (100) is irradiated, until substrate (100) is anotherArticle one, till broadside aligns with another long limit of the first light shield (300);
Step 3, the second light shield (400) is arranged under super ultraviolet light source (200), by substrate(100) after half-twist, be placed on again conveying machine (500) above, make a long limit of substrate (100)Align with a long limit of the second light shield (400), conveying machine (500) starts to transmit substrate(100), super ultraviolet light source (200) irradiates substrate (100) through the second light shield (400),Until another long limit of substrate (100) and another long limit of the second light shield (400) align,Thereby at upper different first area (110) and the second areas of organic concentration that form of substrate (100)(120), described first area (110) for be positioned at described substrate (100) edge through once and do not haveThrough the light-struck region of extreme ultraviolet, described second area (120) is for being arranged in described substrate (100)Centre through twice light-struck region of extreme ultraviolet, described first area (110) surround described second area(120);
Step 4, PI liquid is coated on to the second area (120) of substrate (100).
2. PI liquid coating process as claimed in claim 1, is characterized in that the base in described step 1Plate (100) is process wet-cleaned in last processing procedure.
3. PI liquid coating process as claimed in claim 1, is characterized in that the base in described step 1Plate (100) is thin-film transistor array base-plate.
4. PI liquid coating process as claimed in claim 1, is characterized in that the base in described step 1Plate (100) is colorful film optical filtering substrate.
5. the PI liquid coating process as described in claim 3 or 4, is characterized in that, in described step 1Substrate (100) be glass substrate.
6. PI liquid coating process as claimed in claim 1, is characterized in that described first area(110) organic concentration is greater than the organic concentration of described second area (120).
7. PI liquid coating process as claimed in claim 1, is characterized in that described first area(110) be the region of described substrate (100) coating frame glue, its width equals the width of frame glue.
8. PI liquid coating process as claimed in claim 1, is characterized in that substrate in described step 3(100) direction of rotation is clockwise.
9. PI liquid coating process as claimed in claim 1, is characterized in that substrate in described step 3(100) direction of rotation is counterclockwise.
10. PI liquid coating process as claimed in claim 1, is characterized in that described step 2 and stepConveying machine in 3 (500) at the uniform velocity transmits substrate (100).
CN201610143237.4A 2016-03-14 2016-03-14 PI liquid coating method Active CN105607349B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017166821A1 (en) * 2016-03-29 2017-10-05 京东方科技集团股份有限公司 Method and apparatus for preparing alignment film
WO2019095509A1 (en) * 2017-11-15 2019-05-23 深圳市华星光电半导体显示技术有限公司 Alignment film coating machine and coating method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090202926A1 (en) * 2008-02-08 2009-08-13 Elpida Memory, Inc. Exposure mask and pattern forming method therefor
CN104035237A (en) * 2014-05-30 2014-09-10 京东方科技集团股份有限公司 Light alignment film, manufacturing method thereof and liquid crystal displayer
CN104722458A (en) * 2015-04-09 2015-06-24 武汉华星光电技术有限公司 Device and method for coating alignment liquid of substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090202926A1 (en) * 2008-02-08 2009-08-13 Elpida Memory, Inc. Exposure mask and pattern forming method therefor
CN104035237A (en) * 2014-05-30 2014-09-10 京东方科技集团股份有限公司 Light alignment film, manufacturing method thereof and liquid crystal displayer
CN104722458A (en) * 2015-04-09 2015-06-24 武汉华星光电技术有限公司 Device and method for coating alignment liquid of substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017166821A1 (en) * 2016-03-29 2017-10-05 京东方科技集团股份有限公司 Method and apparatus for preparing alignment film
WO2019095509A1 (en) * 2017-11-15 2019-05-23 深圳市华星光电半导体显示技术有限公司 Alignment film coating machine and coating method

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