CN105601170A - Regenerative wallboard insulating layer - Google Patents
Regenerative wallboard insulating layer Download PDFInfo
- Publication number
- CN105601170A CN105601170A CN201610106197.6A CN201610106197A CN105601170A CN 105601170 A CN105601170 A CN 105601170A CN 201610106197 A CN201610106197 A CN 201610106197A CN 105601170 A CN105601170 A CN 105601170A
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- CN
- China
- Prior art keywords
- regenerative
- weight portions
- insulation layer
- wallboard
- stalk
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/14—Polyepoxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2201/00—Mortars, concrete or artificial stone characterised by specific physical values
- C04B2201/30—Mortars, concrete or artificial stone characterised by specific physical values for heat transfer properties such as thermal insulation values, e.g. R-values
- C04B2201/32—Mortars, concrete or artificial stone characterised by specific physical values for heat transfer properties such as thermal insulation values, e.g. R-values for the thermal conductivity, e.g. K-factors
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2201/00—Mortars, concrete or artificial stone characterised by specific physical values
- C04B2201/50—Mortars, concrete or artificial stone characterised by specific physical values for the mechanical strength
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/91—Use of waste materials as fillers for mortars or concrete
Abstract
The invention relates to a regenerative wallboard insulating layer. The regenerative wallboard insulating layer is prepared from, by weight, 20-30 parts of straw, 30-50 parts of wood chips, 50-60 parts of bisphenol A epoxy resin particles, 10-15 parts of polypropylene granules and 8-12 parts of ethylenediamine. The insulating layer is good in energy conservation, environmental protection and heat preservation effect. Meanwhile, according to a provided preparation method, steps are simple, production efficiency is high, and product quality is good.
Description
Technical field
The present invention relates to be applicable to the regenerative wallboard heat-insulation layer of building heat-insulation and heat-preservation use and its preparation method.
Background technology
Along with China's urban and rural buildings develops rapidly and the continuous increase of population, society increases substantially to the demand of construction material, thereby the demand of the solid brick materials for wall of building material market to traditional employing clay sintering increases and makes small towns clay brick field obtain unprecedented development, China approximately need consume 750,000 mu, soil because producing solid clay brick every year. Current still developing country of China, large population base, can utilize cultivated area limited, per capita cultivated land's scarcity of resources, in order to realize the sustainable development of economic society, reduce the loss of building trade to land resource, carry out new building material imperative to substitute traditional solid brick materials for wall.
Summary of the invention
The object of the present invention is to provide the regenerative wallboard heat-insulation layer of a kind of economical environment-protective, high insulating effect that the method for preparing this heat-insulation layer is provided simultaneously.
The present invention is achieved through the following technical solutions:
A kind of regenerative wallboard heat-insulation layer, it comprises the raw material of following components by weight percent:
Stalk, 20 ~ 30 weight portions;
Wood chip, 30 ~ 50 weight portions;
Bisphenol A type epoxy resin particle, 50 ~ 60 weight portions;
PP GRANULES, 10 ~ 15 weight portions;
Ethylenediamine, 8 ~ 12 weight portions.
Preferably, it comprises the raw material of following components by weight percent:
Stalk, 25 weight portions;
Wood chip, 40 weight portions;
Bisphenol A type epoxy resin particle, 53 weight portions;
PP GRANULES, 12 weight portions;
Ethylenediamine, 9 weight portions.
Further, described PP GRANULES is that particle diameter is 3mm, the cylindrical particle that thickness is 3mm.
A method of preparing above-mentioned regenerative wallboard heat-insulation layer, it comprises the steps:
1. stalk and wood chip are cut in cutting machine to the long short material of 8mm ~ 10mm, then through beating crusher by its hammer out width be 1 ~ 2mm, the fines that thickness is 0.5 ~ 1.0mm, is deposited in rain shade natural air drying;
2. stalk, wood chip and PP GRANULES after pulverizing are added in mixer, stir 2 ~ 2.5min, then add bisphenol A type epoxy resin particle, stir, obtain siccative;
3. ethylenediamine is added in the siccative being stirred, stir, and pour in mould;
4. mould is placed at 70 DEG C ~ 80 DEG C and is incubated 1 ~ 2 hour, obtains regenerative wallboard heat-insulation layer.
In preparation method, the fines thickness of described step in is 1. 0.8mm.
In preparation method, described step 4. middle holding temperature is 75 DEG C, and the time is 1.5 hours.
Beneficial effect of the present invention is:
1. adopt the mixture of wood chip and stalk as heat-insulation layer main body, not only alleviated the weight of heat-insulation layer, the waste resource of recycling simultaneously, energy-conserving and environment-protective.
2. PP GRANULES is that particle diameter is 3mm, the cylindrical particle that thickness is 3mm. Increase the heat-proof quality of body of wall.
3. use bisphenol A type epoxy resin as adhesive, ethylenediamine is curing agent, increases the bond properties of each component, makes heat-insulation layer more closely knit, improves heat insulation effect.
4. preparation method of the present invention is optimized the solidification process of bisphenol A type epoxy resin, makes heat-insulation layer stable homogeneous, has equipment requirement low simultaneously, and step is simple, with short production cycle, the advantage that product qualified rate is high.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described in detail. Protection domain of the present invention is not limited to embodiment, makes any change and also belong to the scope of protection of the invention in the scope that those skilled in the art limit in claim.
In following examples, described stalk is agricultural stalk, includes but not limited to the agricultural crop straws such as corn, wheat and paddy rice.
In following examples, described wood chip can be waste wood or bamboo wastes.
In following examples, the quality of described ethylenediamine is in the quality of pure ethylenediamine.
In following examples, described PP GRANULES is that particle diameter is 3mm, the cylindrical particle that thickness is 3mm.
Embodiment 1
Raw material composition: maize straw, 20kg; Waste wood, 30kg; Bisphenol A type epoxy resin particle (domestic model is E-03 (609)), 50kg; PP GRANULES, 10kg; Ethylenediamine, 8kg.
The preparation of employing following steps:
1. stalk and wood chip are cut in cutting machine to the long short material of 8mm ~ 10mm, then through beating crusher by its hammer out width be 1 ~ 2mm, the fines that thickness is 0.5mm, is deposited in rain shade natural air drying;
2. stalk, wood chip and PP GRANULES after pulverizing are added in mixer, stir 2 ~ 2.5min, then add bisphenol A type epoxy resin particle, stir, obtain siccative;
3. ethylenediamine is added in the siccative being stirred, stir, and pour in mould;
4. mould is placed at 70 DEG C and is incubated 1 hour, obtains regenerative wallboard heat-insulation layer.
The Performance Detection of wallboard:
Wallboard thickness is 30mm; 1.2 times of bending resistance breaking loads (0.75 times is qualified), it is qualified that drying shrinkage value 0.6mm/m(is less than 0.8mm/m); Impact resistance 7 times (5 times are qualified), suspension force 1000N(800N is qualified), sound-proofing 50dB(40dB is qualified), water absorption rate 7% left and right; Exterior wall heat transfer coefficient is 0.5W/ (m2K)。
Embodiment 2
Raw material composition: wheat stalk, 30kg; Useless bamboo wood bits, 50kg; Bisphenol A type epoxy resin particle (domestic model is E-06 (607)), 60kg; PP GRANULES, 15kg; Ethylenediamine, 12kg.
The preparation of employing following steps:
1. wheat stalk and useless bamboo wood bits are cut into the long short material of 8mm ~ 10mm in cutting machine, then through beating crusher by its hammer out width be 1 ~ 2mm, the fines that thickness is 1.0mm, is deposited in rain shade natural air drying;
2. stalk, wood chip and PP GRANULES after pulverizing are added in mixer, stir 2 ~ 2.5min, then add bisphenol A type epoxy resin particle, stir, obtain siccative;
3. ethylenediamine is added in the siccative being stirred, stir, and pour in mould;
4. mould is placed at 80 DEG C and is incubated 2 hours, obtains regenerative wallboard heat-insulation layer.
The Performance Detection of wallboard:
Wallboard thickness is 30mm; 1.3 times of bending resistance breaking loads (0.75 times is qualified), it is qualified that drying shrinkage value 0.6mm/m(is less than 0.8mm/m); Impact resistance 8 times (5 times are qualified), suspension force 1150N(800N is qualified), sound-proofing 55dB(40dB is qualified), water absorption rate 7% left and right; Exterior wall heat transfer coefficient is 0.8W/ (m2K)。
Embodiment 3
Raw material composition: maize straw, 10kg; Wheat stalk, 10kg; Rice straw, 5kg; Waste wood, 20kg; Useless bamboo wood bits, 20kg; Bisphenol A type epoxy resin particle (domestic model is E-12 (604)), 53kg; PP GRANULES, 12kg; Ethylenediamine, 9kg.
The preparation of employing following steps:
1. wheat stalk and useless bamboo wood bits are cut into the long short material of 8mm ~ 10mm in cutting machine, then through beating crusher by its hammer out width be 1 ~ 2mm, the fines that thickness is 0.8mm, is deposited in rain shade natural air drying;
2. stalk, wood chip and PP GRANULES after pulverizing are added in mixer, stir 2 ~ 2.5min, then add bisphenol A type epoxy resin particle, stir, obtain siccative;
3. ethylenediamine is added in the siccative being stirred, stir, and pour in mould;
4. mould is placed at 75 DEG C and is incubated 1.5 hours, obtains regenerative wallboard heat-insulation layer.
The Performance Detection of wallboard:
Wallboard thickness is 30mm; 1.5 times of bending resistance breaking loads (0.75 times is qualified), it is qualified that drying shrinkage value 0.4mm/m(is less than 0.8mm/m); Impact resistance 10 times (5 times are qualified), suspension force 1300N(800N is qualified), sound-proofing 60dB(40dB is qualified), water absorption rate 5% left and right; Exterior wall heat transfer coefficient is 0.4W/ (m2K)。
According to the above embodiments, the present invention is described in detail. It should be noted that, above embodiment is just to illustrating invention. Do not departing under the prerequisite of spirit of the present invention and essence, those skilled in the art can design multiple alternative of the present invention and improvement project, within it all should be understood to be in protection scope of the present invention.
Claims (6)
1. a regenerative wallboard heat-insulation layer, is characterized in that, it comprises the raw material of following components by weight percent:
Stalk, 20 ~ 30 weight portions;
Wood chip, 30 ~ 50 weight portions;
Bisphenol A type epoxy resin particle, 50 ~ 60 weight portions;
PP GRANULES, 10 ~ 15 weight portions;
Ethylenediamine, 8 ~ 12 weight portions.
2. a kind of regenerative wallboard heat-insulation layer according to claim 1, is characterized in that, it comprises the raw material of following components by weight percent:
Stalk, 25 weight portions;
Wood chip, 40 weight portions;
Bisphenol A type epoxy resin particle, 53 weight portions;
PP GRANULES, 12 weight portions;
Ethylenediamine, 9 weight portions.
3. a kind of regenerative wallboard heat-insulation layer according to claim 1, is characterized in that, described PP GRANULES is that particle diameter is 3mm, the cylindrical particle that thickness is 3mm.
4. a preparation method for the regenerative wallboard heat-insulation layer described in claim 1 ~ 3 any one, is characterized in that, it comprises the steps:
1. stalk and wood chip are cut in cutting machine to the long short material of 8mm ~ 10mm, then through beating crusher by its hammer out width be 1 ~ 2mm, the fines that thickness is 0.5 ~ 1.0mm, is deposited in rain shade natural air drying;
2. stalk, wood chip and PP GRANULES after pulverizing are added in mixer, stir 2 ~ 2.5min, then add bisphenol A type epoxy resin particle, stir, obtain siccative;
3. ethylenediamine is added in the siccative being stirred, stir, and pour in mould;
4. mould is placed at 70 DEG C ~ 80 DEG C and is incubated 1 ~ 2 hour, obtains regenerative wallboard heat-insulation layer.
5. the preparation method of regenerative wallboard heat-insulation layer according to claim 4, is characterized in that, the fines thickness of described step in is 1. 0.8mm.
6. the preparation method of regenerative wallboard heat-insulation layer according to claim 4, is characterized in that, described step 4. middle holding temperature is 75 DEG C, and the time is 1.5 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610106197.6A CN105601170A (en) | 2016-02-26 | 2016-02-26 | Regenerative wallboard insulating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610106197.6A CN105601170A (en) | 2016-02-26 | 2016-02-26 | Regenerative wallboard insulating layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105601170A true CN105601170A (en) | 2016-05-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610106197.6A Pending CN105601170A (en) | 2016-02-26 | 2016-02-26 | Regenerative wallboard insulating layer |
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| Country | Link |
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| CN (1) | CN105601170A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101439956A (en) * | 2008-12-16 | 2009-05-27 | 山东建筑大学 | Energy-saving environment-protecting ecological composite panels and preparation thereof |
| CN102433957A (en) * | 2011-12-30 | 2012-05-02 | 南京工业大学 | Novel composite partition wall board and production technology thereof |
| KR20120105122A (en) * | 2011-03-15 | 2012-09-25 | 한서포리머주식회사 | Eco-friendly composition with two liquids type of ceramic anticorrosive paint and its preparing method |
| CN104031398A (en) * | 2014-06-25 | 2014-09-10 | 无锡市崇安区科技创业服务中心 | Anti-radiation wall board and preparation method thereof |
| CN104030627A (en) * | 2014-06-25 | 2014-09-10 | 无锡市崇安区科技创业服务中心 | Thermal insulation wallboard and preparation method thereof |
| CN107494223A (en) * | 2017-09-01 | 2017-12-22 | 池洪源 | A kind of straw substrate is without native seedling cultivation of rice pad |
-
2016
- 2016-02-26 CN CN201610106197.6A patent/CN105601170A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101439956A (en) * | 2008-12-16 | 2009-05-27 | 山东建筑大学 | Energy-saving environment-protecting ecological composite panels and preparation thereof |
| KR20120105122A (en) * | 2011-03-15 | 2012-09-25 | 한서포리머주식회사 | Eco-friendly composition with two liquids type of ceramic anticorrosive paint and its preparing method |
| CN102433957A (en) * | 2011-12-30 | 2012-05-02 | 南京工业大学 | Novel composite partition wall board and production technology thereof |
| CN104031398A (en) * | 2014-06-25 | 2014-09-10 | 无锡市崇安区科技创业服务中心 | Anti-radiation wall board and preparation method thereof |
| CN104030627A (en) * | 2014-06-25 | 2014-09-10 | 无锡市崇安区科技创业服务中心 | Thermal insulation wallboard and preparation method thereof |
| CN107494223A (en) * | 2017-09-01 | 2017-12-22 | 池洪源 | A kind of straw substrate is without native seedling cultivation of rice pad |
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