CN105598858A - Thermosetting resin binder diamond grinder - Google Patents
Thermosetting resin binder diamond grinder Download PDFInfo
- Publication number
- CN105598858A CN105598858A CN201410586146.9A CN201410586146A CN105598858A CN 105598858 A CN105598858 A CN 105598858A CN 201410586146 A CN201410586146 A CN 201410586146A CN 105598858 A CN105598858 A CN 105598858A
- Authority
- CN
- China
- Prior art keywords
- thermosetting resin
- grinding tool
- tool according
- resin binder
- compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a thermosetting resin binder diamond grinder, which comprises an artificial diamond abrasive or a kind of micro powder and a thermosetting resin composition. The artificial diamond abrasive or the micro powder is dispersed in the thermosetting resin composition in a uniform way; the mass ratio of the artificial diamond abrasive and the thermosetting resin composition is from 1:99 to 1:4; the thermosetting resin composition comprises a thermosetting resin, an amphiphilic block copolymer dispersed in the resin, an organic phosphorus flame retardant dispersed in the resin, a curing agent, a curing accelerator, a thixotropic agent and other filling materials. By taking the thermosetting resin toughened by the amphiphilic block copolymer as a binder, a diamond grinder produced thereby has better toughness (impact resistance and anti-breaking property), a longer service life and a lower cost; by taking the thermosetting resin modified by the organic phosphorus flame retardant as the binder, the diamond grinder produced thereby has a better flame resistance and thermal stability. Therefore, the grinder is suitable for dry grinding.
Description
Technical field
The invention belongs to diamond abrasive tool field, particularly a kind of diamond abrasive tool of thermosetting resin as bonding agent that adopt.
Background technology
As the diamond abrasive tool of the inorganic non-metallic hard brittle materials such as grinding and polishing concrete, stone material and pottery compared to traditional grinding tool such as carborundum, corundum, it is advantageous that higher productivity ratio and lower cost, the conventional resins binder diamond grinding tool that thermosetting resin binder diamond grinding tool makes compared to powdex HTHP sulfuration process, it is advantageous that its mechanical performance and heat endurance strengthen, there is longer service life, and applicable dry milling; Preparation technology is more convenient, manufacture energy consumption reduces greatly, and the production cycle shortens greatly, has higher cost performance.
Summary of the invention
The invention provides a kind of thermosetting resin binder diamond grinding tool, its composition comprises diamond abrasive material or micro mist and compositions of thermosetting resin, described diamond abrasive material or micro mist are dispersed in described compositions of thermosetting resin, the mass ratio of described diamond abrasive material and compositions of thermosetting resin is 1:99 to 1:4, and described compositions of thermosetting resin comprises thermosetting resin, be dispersed in amphiphilic block copolymer in resin, be dispersed in organic phosphorus flame retardant, curing agent, curing accelerator, thixotropic agent and other fillers in resin.
As improvement of the present invention, described diamond abrasive material or micro mist are diamond abrasive material or the synthetic diamond micropowder that crystalline form is sharp, self-sharpening good, irregularly shaped and intensity is low.
As to further improvement of the present invention, described thermosetting resin is any in epoxy resin, epoxy vinyl ester resin, unsaturated polyester resin.
As to further improvement of the present invention, described amphiphilic block copolymer weight accounts for the 1%-5% of described compositions of thermosetting resin.
As to further improvement of the present invention, described amphiphilic block copolymer comprises diblock copolymer, line style three blocks, line style four blocks, many block structures of high-order more, side chain block structure or star block structure etc.
As to further improvement of the present invention, the weight of described curing agent accounts for the 1%-70% of described compositions of thermosetting resin.
As to further improvement of the present invention, the weight of stating curing accelerator accounts for the 1%-10% of described compositions of thermosetting resin.
As to further improvement of the present invention, described thixotropic agent is any in aerosil, bentonite, mica or two or more mixtures.
As to further improvement of the present invention, the weight of described thixotropic agent accounts for the 0.1%-5% of described compositions of thermosetting resin.
Beneficial effect of the present invention is: the diamond abrasive tool that adopts amphiphilic block copolymer-toughened thermosetting resin to prepare as bonding agent has better toughness (impact resistance and resistance to fracture), make it have longer service life and low cost more, the diamond abrasive tool that adopts the thermosetting resin of organic phosphorus flame retardant modification to prepare as bonding agent has better anti-flammability and heat endurance, makes its applicable dry milling.
Detailed description of the invention
Describe the preferred embodiments of the present invention below in detail.
A kind of thermosetting resin binder diamond grinding tool, be mainly used in grinding and polishing concrete, stone material, pottery, the crisp material of the inorganic non-metallics such as glass, its composition comprises diamond abrasive material and compositions of thermosetting resin, diamond also can be prepared into micro mist shape, described diamond abrasive material or micro mist are that crystalline form is sharp, self-sharpening is good, irregularly shaped and intensity is low diamond abrasive material or synthetic diamond micropowder, described diamond abrasive material is dispersed in described compositions of thermosetting resin, the mass ratio of described diamond abrasive material and compositions of thermosetting resin is 1:99 to 1:4, concrete score is determined according to actual needs, the ground of grinding and polishing different hardness is just selected different proportionings, described compositions of thermosetting resin comprises thermosetting resin, be dispersed in the amphiphilic block copolymer in resin, be dispersed in the organic phosphorus flame retardant in resin, curing agent, curing accelerator, thixotropic agent and other fillers, grinding tool can produce violent high temperature while use, therefore, the anti-flammability of grinding tool and stability are very important, can be effectively fire-retardant by organic phosphorus flame retardant, wherein said thermosetting resin is epoxy resin, epoxy vinyl ester resin, any in unsaturated polyester resin, just be described further as an example of epoxy resin example below, epoxy resin is one of engineering resin of extensive use, epoxy resin forms glassy net, show excellent solvent resistance and corrosion resistance, good bonding force, rationally high glass transition temperature, epoxy resin comprises multiple epoxide, epoxide is also called the epoxy resin of polyepoxide, polyepoxide can be the haplotype (diglycidyl ether of for example bisphenol-A, novolaks basic ring epoxy resins and three epoxies), the more unsaturated monoepoxide of the high-grade resin of HMW or polymerization (for example, glycidyl acrylate, GMA, allyl glycidyl ether) to homopolymers or copolymer, epoxide average per molecule contains at least one side chain or end 1, 2-epoxy radicals (vicinal epoxy radicals), epoxy resin is 170 to 250 epoxide equivalent preferably, the amount of polyepoxide can be 30 % by weight to 90 % by weight.
In the present invention, described amphiphilic block copolymer weight accounts for the 1%-5% of described compositions of thermosetting resin, described amphiphilic block copolymer comprises diblock copolymer, line style three blocks, line style four blocks, more block structures of high-order, side chain block structure or star block structure etc., amphiphilic block copolymer is the amphiphilic block copolymer that contains the miscible block of at least one epoxy resin and at least one epoxy resin unmixing block, wherein unmixing block comprises at least one structure, the structure of described unmixing block part comprises one or more alkylene oxide with four carbon atom at least but monomeric unit. wherein miscible block contains poly-ethylene oxide block, propylene oxide block or poly-(oxirane-altogether-expoxy propane) block, and unmixing block contains polybutylene oxide block, poly-epoxy hexane block or poly-epoxy dodecane block. wherein at least one miscible block of amphiphilic block copolymer is poly-(oxirane), and at least one unmixing block is poly-(epoxy butane), the composition epoxy resin of amphiphilic block copolymer modification has better ductility (fracture toughness), (for example other crucial working properties have been kept simultaneously, viscosity) and behavior character (for example, glass transition temperature and modulus).
In the present invention, the weight of described curing agent accounts for the 1%-70% of described compositions of thermosetting resin, curing agent can be selected to have and contain active group, for example amine and their derivative, in addition, the epoxy resin of oxygenatedchemicals for example carboxylic acid-terminated polyester, acid anhydrides, phenolic resins, amino formaldehyde resin, phenol, bisphenol-A, cresols-novolac resin and phenol end-blocking can be used as curing agent, in addition, sulfur-containing compound also can be used as curing agent, and the reacting epoxy base of the active group that curing agent contains and epoxy resin has reactivity.
In the present invention, the weight of described curing accelerator accounts for the 1%-10% of described compositions of thermosetting resin, promotes to solidify by curing accelerator, improves curing efficiency and solidification effect.
In the present invention, described thixotropic agent is any in aerosil, bentonite, mica or two or more mixtures, the weight of described thixotropic agent accounts for the 0.1%-5% of described compositions of thermosetting resin, the thixotropy that can improve product by increasing thixotropic agent, thixotropy refers to that the viscosity of material under additional shearing is not having the character of the material of the viscosity under additional shearing lower than this material.
The above-mentioned thermosetting of always carrying, just thermosetting is done to more detailed introduction below, be more convenient for like this understanding, thermosetting is that resin or the plastic compound of the end-state in them as finished product is substantially insoluble and not molten, further, thermosetting resin is liquid in their preparation or some stage of processing conventionally, it is by heat, catalysis or some other chemical modes solidify, after solidifying completely, thermosets can not be softening again by heating, thermosets is to form to form the polymer chain of the variable-length of three networks by being bonded to each other by covalent bond, thermosetting epoxy resin material can obtain as amine reacts by for example thermosetting epoxy resin and curing agent.
Adopt resinoid bond as auxiliary material, cost is low, increased the physical property such as toughness, ductility of grinding tool simultaneously, improve the property easy to use of grinding tool, life cycle is long, also reduced accordingly use cost, the shortcoming and defect that this has changed traditional grinding tool to a great extent, has great practicality and breakthrough.
Above-described embodiment non-limiting product form of the present invention and style, suitable variation or modification that any person of an ordinary skill in the technical field does it, all should be considered as not departing from patent category of the present invention.
Claims (9)
1. a thermosetting resin binder diamond grinding tool, it is characterized in that: its composition comprises diamond abrasive material or micro mist and compositions of thermosetting resin, described diamond abrasive material or micro mist are dispersed in described compositions of thermosetting resin, the weight ratio of described diamond abrasive material and compositions of thermosetting resin is 1:99 to 1:4, and described compositions of thermosetting resin comprises thermosetting resin, be dispersed in amphiphilic block copolymer in resin, be dispersed in organic phosphorus flame retardant, curing agent, curing accelerator, thixotropic agent and other fillers in resin.
2. thermosetting resin binder diamond grinding tool according to claim 1, is characterized in that: described diamond abrasive material or micro mist are diamond abrasive material or the synthetic diamond micropowder that crystalline form is sharp, self-sharpening good, irregularly shaped and intensity is low.
3. thermosetting resin binder diamond grinding tool according to claim 1, it is characterized in that: described amphiphilic block copolymer comprises diblock copolymer, line style three blocks, line style four blocks, many block structures of high-order more, side chain block structure or star block structure etc.
4. thermosetting resin binder diamond grinding tool according to claim 1, is characterized in that: described amphiphilic block copolymer weight accounts for the 1%-5% of described compositions of thermosetting resin.
5. thermosetting resin binder diamond grinding tool according to claim 1, is characterized in that: the weight of described organic phosphorus flame retardant accounts for the 3%-15% of described compositions of thermosetting resin.
6. thermosetting resin binder diamond grinding tool according to claim 1, is characterized in that: the weight of described curing agent accounts for the 1%-70% of described compositions of thermosetting resin.
7. thermosetting resin binder diamond grinding tool according to claim 1, is characterized in that: the weight of described curing accelerator accounts for the 1%-10% of described compositions of thermosetting resin.
8. thermosetting resin binder diamond grinding tool according to claim 1, is characterized in that: described thixotropic agent is selected from any in aerosil, bentonite, mica or two or more mixtures.
9. thermosetting resin binder diamond grinding tool according to claim 1, is characterized in that: the weight of described thixotropic agent accounts for the 0.1%-5% of described compositions of thermosetting resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410586146.9A CN105598858B (en) | 2014-10-29 | 2014-10-29 | Thermosetting resin binder diamond grinding tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410586146.9A CN105598858B (en) | 2014-10-29 | 2014-10-29 | Thermosetting resin binder diamond grinding tool |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105598858A true CN105598858A (en) | 2016-05-25 |
CN105598858B CN105598858B (en) | 2018-11-09 |
Family
ID=55979468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410586146.9A Active CN105598858B (en) | 2014-10-29 | 2014-10-29 | Thermosetting resin binder diamond grinding tool |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105598858B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112794731A (en) * | 2020-12-31 | 2021-05-14 | 湖北钊晟新材料科技有限公司 | Quartz stone plate baking and curing process |
CN113319742A (en) * | 2021-06-09 | 2021-08-31 | 江苏锋芒复合材料科技集团有限公司 | Preparation method of abrasive with grinding and polishing functions |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1762660A (en) * | 2004-10-22 | 2006-04-26 | 郑州人造金刚石及制品工程技术研究中心 | Diamond resin grinder |
CN101056936A (en) * | 2004-11-10 | 2007-10-17 | 陶氏环球技术公司 | Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom |
CN101200053A (en) * | 2006-12-13 | 2008-06-18 | 广东奔朗超硬材料制品有限公司 | Abrasive tool of epoxy resin combined with compounded abrasive |
US20110253943A1 (en) * | 2010-04-19 | 2011-10-20 | Trillion Science, Inc. | One part epoxy resin including a low profile additive |
CN102911631A (en) * | 2011-08-05 | 2013-02-06 | 汉高股份有限公司 | Adhesive composition with single-component epoxy structure |
CN103056788A (en) * | 2012-12-26 | 2013-04-24 | 厦门宇信金刚石工具有限公司 | Method for preparing sharp type epoxide resin binding agent diamond abrasive tool |
CN103509519A (en) * | 2013-04-06 | 2014-01-15 | 连新兰 | Epoxy resin abrasive paste |
CN104057403A (en) * | 2013-03-23 | 2014-09-24 | 厦门宇信金刚石工具有限公司 | Preparation method for epoxy resin binding agent diamond grinding tool with high polishing performance |
-
2014
- 2014-10-29 CN CN201410586146.9A patent/CN105598858B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1762660A (en) * | 2004-10-22 | 2006-04-26 | 郑州人造金刚石及制品工程技术研究中心 | Diamond resin grinder |
CN101056936A (en) * | 2004-11-10 | 2007-10-17 | 陶氏环球技术公司 | Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom |
CN101200053A (en) * | 2006-12-13 | 2008-06-18 | 广东奔朗超硬材料制品有限公司 | Abrasive tool of epoxy resin combined with compounded abrasive |
US20110253943A1 (en) * | 2010-04-19 | 2011-10-20 | Trillion Science, Inc. | One part epoxy resin including a low profile additive |
CN102911631A (en) * | 2011-08-05 | 2013-02-06 | 汉高股份有限公司 | Adhesive composition with single-component epoxy structure |
CN103056788A (en) * | 2012-12-26 | 2013-04-24 | 厦门宇信金刚石工具有限公司 | Method for preparing sharp type epoxide resin binding agent diamond abrasive tool |
CN104057403A (en) * | 2013-03-23 | 2014-09-24 | 厦门宇信金刚石工具有限公司 | Preparation method for epoxy resin binding agent diamond grinding tool with high polishing performance |
CN103509519A (en) * | 2013-04-06 | 2014-01-15 | 连新兰 | Epoxy resin abrasive paste |
Non-Patent Citations (1)
Title |
---|
臧建英等: "一种新型金刚石磨具树脂结合剂的制备", 《金刚石与磨料磨具工程》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112794731A (en) * | 2020-12-31 | 2021-05-14 | 湖北钊晟新材料科技有限公司 | Quartz stone plate baking and curing process |
CN113319742A (en) * | 2021-06-09 | 2021-08-31 | 江苏锋芒复合材料科技集团有限公司 | Preparation method of abrasive with grinding and polishing functions |
Also Published As
Publication number | Publication date |
---|---|
CN105598858B (en) | 2018-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103482904B (en) | A kind of modified epoxy mortar resistant abrasion patching material | |
CN103056788B (en) | A kind of preparation method of sharp epoxy resin binder diamond grinding tool | |
CN101056936B (en) | Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom | |
CN105255425B (en) | Temporary bond bi-component epoxy adhesive and its preparation method and application | |
CN104057403B (en) | A kind of preparation method of the epoxy resin binder diamond grinding tool with high polishing performance | |
RU2009127759A (en) | A NEW COVERING COMPOSITION FOR A SPLITTING FILLER AND A METHOD FOR PRODUCING IT | |
US20110284245A1 (en) | Fluid composition comprising particles and method of modifying a wellbore using the same | |
JP2011529118A5 (en) | ||
CN101423358A (en) | Method for preparing high impact resistant epoxy resin mortar | |
CN111868001B (en) | Epoxy resin composition for underwater grouting | |
RU2015122411A (en) | COMPOSITION MATERIALS FROM THERMORACTIVE RESIN CONTAINING INTERLAYER INCREASING PARTICULAR STRENGTH | |
CN109574548A (en) | A kind of low temperature rapid curing pit repairing material and preparation method thereof | |
KR20110139271A (en) | Curable compositions containing cyclic diamine and cured products therefrom | |
CN102286138A (en) | Heat-resistant epoxide resin composition for rapid pultrusion | |
AU764179B2 (en) | Curable epoxide composition and its use | |
CN106220892B (en) | Epoxy resin cure coating and preparation method thereof | |
CN102408675A (en) | Epoxy resin crack filling material and preparation method thereof | |
CN102417337A (en) | Polyurethane modified epoxy resin grouting material | |
CN112405377B (en) | Novel grinding wheel formula and grinding wheel production method | |
EP3976549B1 (en) | Slag-containing polymer concrete and grouting mortar | |
CN105598858A (en) | Thermosetting resin binder diamond grinder | |
JP2015093948A (en) | Epoxy resin curing agent using bis(aminomethyl)cyclohexane, epoxy resin composition and cured product | |
CN103773301A (en) | Thixotropic light adhesive for bonding buoyancy material module | |
CN102876269A (en) | High-strength epoxy adhesive and preparation method thereof | |
JP2023506043A (en) | Two-component (2K) curable adhesive composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |