CN105583484B - A kind of fibre optical sensor is without gel packaging system and method - Google Patents

A kind of fibre optical sensor is without gel packaging system and method Download PDF

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Publication number
CN105583484B
CN105583484B CN201510945519.1A CN201510945519A CN105583484B CN 105583484 B CN105583484 B CN 105583484B CN 201510945519 A CN201510945519 A CN 201510945519A CN 105583484 B CN105583484 B CN 105583484B
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China
Prior art keywords
solder
optical fiber
fiber
heating head
support frame
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CN105583484A (en
Inventor
王东礼
史青
宁佳晨
孙舟璐
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Aerospace Long March Launch Vehicle Technology Co Ltd
Beijing Institute of Telemetry Technology
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Aerospace Long March Launch Vehicle Technology Co Ltd
Beijing Institute of Telemetry Technology
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/005Soldering by means of radiant energy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances
    • B23K3/047Heating appliances electric
    • B23K3/0475Heating appliances electric using induction effects, e.g. Kelvin or skin effects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances
    • B23K3/047Heating appliances electric
    • B23K3/053Heating appliances electric using resistance wires
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/087Soldering or brazing jigs, fixtures or clamping means

Abstract

The present invention relates to a kind of fibre optical sensor without gel packaging system and method, belong to fibre-optic sensor package technical field.The inventive system comprises optic fiber grating wavelength detection device, the first fiber clamp, the second fiber clamp, the first winding axle, the second winding axle and heater.Prestress application part in the device of the present invention focuses on ensureing that optical fiber during big strained tensile does not slide axially or damaged the surface coating layer of optical fiber, by increasing optical fiber and winding the contact area between axle Optical Fiber Winding on Optical Fiber Winding axle, the tension uniform of optical fiber is converted into optical fiber with winding the frictional force of axle, the stress between reduction fiber clamp and optical fiber;Prestressing force is applied by removable support frame in the device of the present invention, and during application, the wavelength change of fiber grating is monitored by optic fiber grating wavelength detection device, ensures the uniformity of production.

Description

A kind of fibre optical sensor is without gel packaging system and method
Technical field
The present invention relates to a kind of fibre optical sensor without gel packaging system and method, belong to fibre-optic sensor package technology neck Domain.
Background technology
Fibre optical sensor with its passive, small volume, electromagnetism interference, rotproofness is strong, multiplexing capacity is strong the advantages that extensively should For fields such as Industry Control, civil structure, fire-fighting security protection, Aero-Space and derived energy chemicals.Fiber-optic grating sensor is near Optical sensor with fastest developing speed over year, domestic some colleges and universities and enterprise can make and produce various construction packages at present Fiber-optic grating sensor, such as Harbin Institute of Technology, Dalian University of Technology, Beijing Institute of Technology, Kunming University of Science and Technology, electronics University of Science and Technology, Wuhan science and engineering Guang Ke Co., Ltds etc..Most of fiber-optic grating sensor both for the measurement under normal temperature, but Measuring under the high temperature conditions, traditional fiber-optic grating sensor are usually required in fields such as Aero-Space, oil exploitations It is difficult to meet that the domestic fiber-optic grating sensor in the requirement accurately measured under hot conditions, especially China uses glue to encapsulate substantially, This method can not be such that fiber-optic grating sensor uses under the high temperature conditions.Foreign countries can not also provide the light of more than 300 DEG C of heatproof Fiber sensor.There is colloid creep properties is big, high temperature resistance high humidity environment ability, condition of cure are multiple for conventional bonding method Miscellaneous, the deficiencies of cure cycle is long, precision and the use of fibre optical sensor are have impact on, while limit the production effect of fibre optical sensor Rate.In recent years, Some Universities and enterprise try to explore that fibre optical sensor encapsulate without gel using high temperature resistant solder, the party Method has the characteristics that intensity height, high temperature resistant, speed of welding are fast, and the temperature in use that can lift fiber-optic grating sensor reaches 300 More than DEG C.The Rao Yun rivers team of University of Electronic Science and Technology is directed to research of the fibre optical sensor without gel packaging technology always, utilizes The glass solder of doping metals completes the fiber grating of polyimide coating layer and the welding of stainless steel structure, is entered using electric iron The heating and melting of row solder, the feasibility of this kind of method is demonstrated from principle, but also have a certain distance apart from practical. The encapsulation of high-temperature resistant optical fiber grating sensor needs satisfaction following at 2 points:1st, the temperature that heater allows for reaching enough makes Solder fully melts, while can not damage optical fiber;2nd, in welding process, it is necessary to applied by fiber clamp to grating and in advance should Power, grating can be influenceed by more than 300 DEG C temperature during encapsulation, thus the prestressing force applied allow for offsetting encapsulating structure by The length of thermal expansion, the stretching of optical fiber reach 5000 μ ε sometimes, and otherwise welding terminates rear fiber grating part bending occurs. Traditional fiber clamp can not provide so big pulling force in the case of ensureing that optical fiber is skid-resistant.
The content of the invention
The technology of the present invention solves problem:Overcome the deficiencies in the prior art, propose that a kind of fibre optical sensor seals without gel Assembling device and method.
The present invention technical solution be:
A kind of fibre optical sensor is without gel packaging system, and the device is used for stainless steel case chip and the optical fiber with grating It is packaged, has solder on stainless steel case chip;
The device include optic fiber grating wavelength detection device, the first fiber clamp, the second fiber clamp, first winding axle, Second winding axle and heater;
One end of optical fiber is connected with optic fiber grating wavelength detection device, and the other end of optical fiber first passes through the first fiber clamp and entered Row clamping after around first winding axle after with the solder contact on stainless steel case chip, then further around cross second winding axle after pass through Second fiber clamp is clamped;
Described heater is used to heat the solder on stainless steel case chip.
The radius of first winding axle and the second winding axle is not less than 30mm.
The winding number of turns of the optical fiber on the first winding axle and the second winding axle is not less than 3 circles.
The device also includes the first guide channel, and the first guide channel is between the first winding axle and stainless steel case chip, light Fibre be wrapped on the first winding axle after passes through the first guide channel, then with the solder contact on stainless steel case chip.
The device also includes the second guide channel, and the second guide channel is located between stainless steel case chip and the second winding axle, light It is wrapped in after passing through the second guide channel after the fine solder contact with stainless steel case chip on the second winding axle.
Described heater includes the first heating head, the second heating head and removable heating head;First heating head is used for To being heated below the first solder, the second heating head is used for being heated below the second solder;Removable heating head By being moved in the top of the first solder and the top of the second solder, the top to the first solder or the top of the second solder are realized Heating.
The device also includes magnet and thermal insulation layer, and thermal insulation layer is fixed on formation magnetic locating dowel, magnetic locating dowel on magnet Between the first heating head and the second heating head, the stainless device also includes the first support frame, and the first fiber clamp, first twine From left to right it is sequentially fixed on the first support frame around axle and the first guide channel.
The device also includes the second support frame, and the first heating head, magnet and the second heating head are from left to right sequentially fixed at On second support frame.
The device also includes removable support frame, and the second guide channel, the second winding axle and the second fiber clamp are from left to right It is sequentially fixed on removable support frame.
The device also includes the 3rd support frame, and the 3rd support frame is used to be supported removable heating head, makes may move Heating head can move above the first solder and the second solder.
There is grating on optical fiber between the first solder and the second solder.
Thermal insulation layer is pasted onto on magnet by high-temp glue, has external screw thread on magnet, there is screwed hole, magnet on the second support frame External screw thread and the second support frame on screwed hole coordinate so that the setting height(from bottom) of magnet is adjustable.
The mode of heating of first heating head, the second heating head and removable heating head is sensing heating, light heating or resistance Silk radiant heating.
The equal Ceramics of material of second support frame and the 3rd support frame.
A kind of fibre optical sensor is without gel method for packing, step:
(1) removable heating head is moved to the surface of the first solder, while starts the first heating head and may move and add Hot head heats to the first solder, and heating-up temperature is the fusion temperature of the first solder, and the heat time is complete to the first solder Fusing, it is complete to naturally cool to room temperature i.e. the first solder solidification after the first solder is completely melt, and is examined with optic fiber grating wavelength Measurement equipment records the wavelength X 1 of now fiber grating;
(2) moved right removable support frame, and optical fiber is stretched, and is stretched to the detection of optic fiber grating wavelength detection device Wavelength to fiber grating is λ 2;
(3) removable heating head is moved to the surface of the second solder, while starts the second heating head and may move and add Hot head heats to the second solder, and heating-up temperature is the fusion temperature of the second solder, and the heat time is complete to the second solder Fusing, it is complete to naturally cool to room temperature i.e. the second solder solidification after the second solder is completely melt;
(4) the first fiber clamp and the second fiber clamp are unclamped, the stainless steel case chip and optical fiber that weld together are taken Under, that is, obtain fibre optical sensor.
λ 2 determination method is in described step (2):
λ 2=λ 1+A (K1-K2) T+ λ 0
Wherein, A is the coefficient of strain of optical fiber;
K1 is the thermal coefficient of expansion of stainless steel case chip;
K2 is the thermal coefficient of expansion of optical fiber;
T is the glass transition temperature of the second solder;
λ 0 is the prestretching wavelength of fibre optical sensor.
Beneficial effect
(1) device of the invention can realize that being welded without gel between fiber grating and encapsulating structure encapsulates, and be applied to The welding of a variety of solders;
(2) method of the invention is simple to operate, and obtained fibre optical sensor heat-resisting property is good;
(3) electric iron welding is compared to, method of the invention will not be to optical fiber in itself while welding quality is ensured Produce damage, while fibre optical sensor sensitivity grating can be given to apply enough prestressing force, be easy to implement fibre optical sensor from Dynamicization large-scale production, it disclosure satisfy that the production requirement of fiber-optic grating sensor;
(4) multiple heating heads are distributed in around stainless steel case chip in device of the invention, and can pass through the height of magnet Degree the first heating head of regulation and the distance between the second heating head and stainless steel case chip, and then change welding temperature, and weld Temperature and opening/closing time are also controllable;Removable heating head movement can be also controlled to complete sensor other positions pad simultaneously Welding;
(5) fiber clamp, guide channel and winding axle three coordinate completion to fix optical fiber in device of the invention, may move Support frame is used to apply optical fiber prestressing force, and optic fiber grating wavelength detection device is used to monitor optical fiber light during prestress application The change of grid centre wavelength;
(6) device of the invention, which can be realized, carries out up and down while heats to solder, ensures solder and stainless steel case chip The temperature difference it is smaller, be easy to merging between solder and stainless steel case chip, heating can select sensing heating, light heating, resistance The modes such as silk radiant heating;
(7) material selection of the second support frame and the 3rd support frame ceramics in device of the invention, its thermal resistance is big, resistance to height Temperature, the material to have insulated;
(8) magnet can realize the magnetic positioning to ferromagnetism encapsulating structure, simple and convenient, compared with it in device of the invention His positioning method is more flexible, both can guarantee that the positioning of stainless steel case chip, enables stainless steel case chip should according to application again The change in location of optical fiber enters line slip fine setting after power, prevents stress concentration from causing encapsulating structure to cut off optical fiber;
(9) there is one layer of heat-barrier material between magnet and stainless steel case chip in device of the invention, prevent stainless steel from encapsulating The heat of piece is guided by magnet;
(10) optical fiber during focusing on ensureing big strained tensile of the prestress application part in device of the invention The surface coating layer of optical fiber is not slid axially or damages, by the way that Optical Fiber Winding is increased into optical fiber on Optical Fiber Winding axle With the contact area between winding axle, the tension uniform of optical fiber is converted into optical fiber with winding the frictional force of axle, reduction optical fiber Stress between fixture and optical fiber;
(11) diameter of the winding axle in device of the invention is more than or equal to 30mm, avoids the winding radius of optical fiber is too small from leading Light loss is caused, influences the signal measurement during on-line monitoring;
(12) guide channel in device of the invention is used to ensure between the first fiber clamp and the first winding axle Optical fiber, the optical fiber between the first guide channel and the second guide channel and positioned at second winding axle and the second fiber clamp between Optical fiber it is conllinear;
Guide channel is used to ensure that optical fiber is conllinear with the line of the first heating head central point and the second heating head central point, eliminates The fiber position skew caused by the Optical Fiber Winding and the crooked influence welding effect for applying optical fiber after prestressing force;
(13) prestressing force is applied by removable support frame in device of the invention, can use manual mode or It is that automatic control mode is carried out, ensures force process steady and smooth, it is reproducible;During application, pass through optic fiber grating wavelength Detection device monitors the wavelength change of fiber grating, ensures the uniformity of production.
Brief description of the drawings
Fig. 1 is the structure composition schematic diagram of the present invention, wherein, 1- optic fiber grating wavelength detection devices, 2- optical fiber, 3- first Fiber clamp, the fiber clamps of 4- second, the support frames of 5- first, the winding axles of 6- first, the winding axles of 7- second, the guide channels of 8- first, The guide channels of 9- second, the support frames of 10- second, the heating heads of 11- first, the heating heads of 12- second, 13- may move heating head, 14- magnetic Iron, 15- thermal insulation layers, 16- may move support frame, 17- stainless steel case chips, 18 first solders, the solders of 19- second, 20- the 3rd Support.
Embodiment
The invention discloses a kind of fibre optical sensor without gel method for packing, for realize fiber grating and encapsulating structure it Between welding encapsulation, integrally heated by structure positioning, structure, several parts such as grating prestress application form.Structure positioning uses Magnetic mode, it is more flexible compared with other positioning methods, the positioning of structure is both can guarantee that, after enabling structure again according to stress is applied The change in location of optical fiber enters line slip fine setting, prevents stress concentration from causing encapsulating structure to cut off optical fiber.Overall mode of heating Ensure that the temperature difference of solder and encapsulating structure is smaller, be easy to merging between solder and structure, mode of heating is added simultaneously using multiple spot The mode of hot or overall sensing heating, heating-up temperature and heating location are controllable.Grating prestress application ensures big strained tensile During optical fiber do not slide axially or damage the surface coating layer of optical fiber, by the way that Optical Fiber Winding is increased on winding axle Add optical fiber and wind the contact area between axle, the tension uniform of optical fiber is converted into optical fiber with winding the frictional force of axle, in advance Stress is manually or computer controlled one-dimensional displacement platform is applied, and is monitored by wavelength detecting equipment, protects Demonstrate,prove the uniformity of sensor welding.This method has the features such as simple to operate, controllability is strong, production efficiency is high.
Several parts such as the device of the present invention is integrally heated by structure positioning, structure, grating prestress application form.Its feature It is:The encapsulating structure position portion includes heating fixing support rack, magnet and thermal insulation layer, thermal insulation layer and is pasted onto with high-temp glue On magnet, the magnetic locating dowel of encapsulating structure is formed, magnetic locating dowel is arranged on heating fixing support rack, and setting height(from bottom) can Adjust.Encapsulating structure entirety heating part includes multiple heating heads, multi-dimensional displacement platform, displacement platform controller and heating head control Device.Multiple heating heads are distributed in around encapsulating structure, and can by multi-dimensional displacement platform courses its distance between with solder, And then change welding temperature.Welding temperature and opening/closing time can also be controlled by heating head controller.Grating prestressing force Applying portion includes stretching fixing support rack, one dimension displacement platform, fiber clamp, guide channel, winding axle and optic fiber grating wavelength Detection device.Fiber clamp, guide channel and winding axle three, which coordinate, to complete to fix optical fiber, and one dimension displacement platform is used for grating Apply prestressing force.Optic fiber grating wavelength detection device is used for the change for monitoring fiber bragg grating center wavelength during prestress application Change.
Heating part by the way of encapsulating structure and solder integrally heat, ensure the temperature difference of solder and encapsulating structure compared with It is small, it is easy to merging between solder and structure.Heating can select the modes such as sensing heating, light heating, resistance wire radiant heating. Head bracket is heated using thermal resistance is big, high temperature resistant, the material to have insulated.
Heating head is controlled using multi-dimensional moving platform, can be by controlling the distance between heating head and solder to adjust Welding temperature is saved, while can also control heating head movement to complete the welding of sensor other positions pad.
Magnet can be realized to be positioned to the magnetic of ferromagnetism encapsulating structure, and simple and convenient is cleverer compared with other positioning methods It is living, the positioning of structure had both been can guarantee that, structure is entered line slip fine setting according to the change in location of optical fiber after application stress again, prevents Only stress concentration causes encapsulating structure to cut off optical fiber.The height adjustable of magnet, for adjusting ferromagnetism encapsulating structure with adding The distance between hot head, and then adjust the heating-up temperature of encapsulating structure.Have between magnet and ferromagnetism encapsulating structure one layer it is heat-insulated Material, prevent the heat of encapsulating structure from being guided by magnet.
Prestress application part focus on ensureing big strained tensile during optical fiber do not slide axially or damage The surface coating layer of bad optical fiber, by increasing optical fiber and winding the contact surface between axle Optical Fiber Winding on Optical Fiber Winding axle Product, the tension uniform of optical fiber is converted into optical fiber with winding the frictional force of axle, the stress between reduction fiber clamp and optical fiber.
The diameter of Optical Fiber Winding axle is more than 30mm, avoids the winding radius of optical fiber is too small from causing light loss, influences to supervise online Signal measurement during survey.
Guide channel is used to ensure that optical fiber axial direction is axially coincident with heating head, eliminates the fiber position caused by Optical Fiber Winding Skew and the crooked influence welding effect for applying optical fiber after prestressing force.
Prestressing force can use manual mode either computer control mode by controlling one dimension displacement platform to be applied Carry out, ensure force process steady and smooth, it is reproducible.During application, light is monitored by optic fiber grating wavelength detection device The wavelength change of fine grating, ensure the uniformity of production.
A kind of fibre optical sensor includes optic fiber grating wavelength detection device 1, the first optical fiber without gel packaging system, the device Fixture 3, the second fiber clamp 4, the first support frame 5, first winding axle 6, second wind axle 7, the guiding of the first guide channel 8, second Groove 9, the second support frame 10, the first heating head 11, the second heating head 12, removable heating head 13, magnet 14, thermal insulation layer 15, can The support frame 20 of movable supporting frame 16 and the 3rd;
First fiber clamp 3, the first winding guide channel 8 of axle 6 and first is from left to right sequentially fixed at the first support frame 5 On;
First heating head 11, the heating head 12 of magnet 14 and second are from left to right sequentially fixed on the second support frame 10;
Thermal insulation layer 15 is fixed on magnet 14;
Second guide channel 9, the second winding fiber clamp 4 of axle 7 and second is from left to right sequentially fixed at removable support frame On 16;
Stainless steel case chip 17 is by the magnetic-adsorption of magnet 14 on thermal insulation layer 15;Have first on stainless steel case chip 17 The solder 19 of solder 18 and second;
One end of optical fiber 2 is connected with optic fiber grating wavelength detection device 1, and the other end of optical fiber 2 sequentially passes through the first optical fiber Fixture 2, first winds axle 6, the first guide channel 8, the first solder 18, the second solder 19, the second guide channel 9, second winding axle 7 and Second fiber clamp 4;
There is grating on optical fiber 2 between the first solder 18 and the second solder 19;
First fiber clamp 2 and the second fiber clamp 4 are used to clamp optical fiber 2;
First winding axle 6 and second winds axle 7 and is used to be wound optical fiber 2, with increasing friction force;
First guide channel 8 and the second guide channel 9 are used to position optical fiber 2;
First heating head 11 is used to heat the lower section of the first solder 18, and the second heating head 12 is used for the second solder Heated 19 lower section;
3rd support frame 20 is used to be supported removable heating head 13, and may move heating head 13 can be in the first solder 18 and second the top of solder 19 move, so as to add to the top of the first solder 18 or the top of the second solder 19 Heat.
Thermal insulation layer 15 is pasted onto on magnet 14 with high-temp glue, forms magnetic locating dowel, there is external screw thread on magnet 14, second The upper screwed hole of support 10, the screwed hole on the external screw thread of magnet 14 and the second support frame 10 coordinate so that the installation of magnet 14 is high Spend adjustable;
The mode of heating of first heating head 11, the second heating head 12 and removable heating head 13 is sensing heating, light heating Or resistance wire radiant heating;
The equal Ceramics of material of second support frame 10 and the 3rd support frame 20;
The radius that first winding axle 6 and second winds axle 7 is not less than 30mm, and optical fiber is wound in the first winding axle 6 and second The winding number of turns on axle 7 is not less than 3 circles;
The effect of first guide channel 8 and the second guide channel 9 be ensure positioned at the first fiber clamp 3 with first wind axle 6 it Between optical fiber 2, the optical fiber 2 between the first guide channel 8 and the second guide channel 9 and positioned at second winding the light of axle 7 and second Optical fiber 2 between fine fixture 4 is conllinear.
The distance between first solder 18 and the second solder 19 are the 1/2 of the length of stainless steel case chip 17, the first solder 18 Left end apart from stainless steel case chip 17 is the 1/4 of the length of stainless steel case chip 17, and the second solder 19 is apart from stainless steel case chip 17 right-hand member is the 1/4 of the length of stainless steel case chip 17.
A kind of fibre optical sensor is without gel method for packing, step:
(1) removable heating head 13 is moved to the surface of the first solder 18, while starts the first heating head 11 and can Mobile heating head 13 heats to the first solder 18, and heating-up temperature is the fusion temperature of the first solder 18, and the heat time is extremely First solder 18 is completely melt that room temperature is naturally cooled to after the first solder 18 is completely melt, and (i.e. the first solder 18 has solidified Entirely), and with optic fiber grating wavelength detection device 1 wavelength X 1 of now fiber grating is recorded;
(2) moved right removable support frame 16, and optical fiber 2 is stretched, and is stretched to fine grating wavelength detection device 1 and is examined The wavelength for measuring fiber grating is λ 2;
(3) removable heating head 13 is moved to the surface of the second solder 19, while starts the second heating head 12 and can Mobile heating head 13 heats to the second solder 19, and heating-up temperature is the fusion temperature of the second solder 19, and the heat time is extremely Second solder 19 is completely melt that room temperature is naturally cooled to after the second solder 19 is completely melt, and (i.e. the second solder 19 has solidified Entirely);
(4) the first fiber clamp 3 and the second fiber clamp 4 are unclamped, by the stainless steel weld tabs 17 welded together and optical fiber 2 Remove, that is, obtain fibre optical sensor.
λ 2 determination method is in described step (2):
λ 2=λ 1+A (K1-K2) T+ λ 0
Wherein, A is the coefficient of strain of optical fiber;
K1 is the thermal coefficient of expansion of stainless steel case chip 17;
K2 is the thermal coefficient of expansion of optical fiber;
T is the glass transition temperature of the second solder;
λ 0 is the prestretching wavelength of fibre optical sensor.
Embodiment
Below in conjunction with the accompanying drawings embodiments of the invention are given with detailed description, the present embodiment using technical solution of the present invention as Premise, detailed embodiment is given, but protection scope of the present invention is not limited to following embodiments.
Without gel packaging system, the device includes optic fiber grating wavelength detection and set a kind of fibre optical sensor as shown in Figure 1 Standby 1, first fiber clamp 3, the second fiber clamp 4, the first support frame 5, first winding axle 6, second wind axle 7, first and guided Groove 8, the second guide channel 9, the second support frame 10, the first heating head 11, the second heating head 12, removable heating head 13, magnet 14, Thermal insulation layer 15, the removable support frame 20 of support frame 16 and the 3rd;
First fiber clamp 3, the first winding guide channel 8 of axle 6 and first is from left to right sequentially fixed at the first support frame 5 On;First heating head 11, the heating head 12 of magnet 14 and second are from left to right sequentially fixed on the second support frame 10;Thermal insulation layer 15 It is fixed on magnet 14;Second guide channel 9, the second winding fiber clamp 4 of axle 7 and second is from left to right sequentially fixed at removable On support frame 16;
Stainless steel case chip 17 is by the magnetic-adsorption of magnet 14 on thermal insulation layer 15;Have first on stainless steel case chip 17 The solder 19 of solder 18 and second;
One end of optical fiber 2 is connected with optic fiber grating wavelength detection device 1, and the other end of optical fiber 2 sequentially passes through the first optical fiber Fixture 2, first winds axle 6, the first guide channel 8, the first solder 18, the second solder 19, the second guide channel 9, second winding axle 7 and Second fiber clamp 4;There is grating on optical fiber 2 between the first solder 18 and the second solder 19;First fiber clamp 2 and Two fiber clamps 4 are used to clamp optical fiber 2;First winding axle 6 and second winds axle 7 and is used to be wound optical fiber 2, with Increasing friction force;First guide channel 8 and the second guide channel 9 are used to position optical fiber 2;First heating head 11 is used for first The lower section of solder 18 is heated, and the second heating head 12 is used to heat the lower section of the second solder 19;
3rd support frame 20 is used to be supported removable heating head 13, and may move heating head 13 can be in the first solder 18 and second the top of solder 19 move, so as to add to the top of the first solder 18 or the top of the second solder 19 Heat.
Thermal insulation layer 15 is pasted onto on magnet 14 with high-temp glue, forms magnetic locating dowel, there is external screw thread on magnet 14, second The upper screwed hole of support 10, the screwed hole on the external screw thread of magnet 14 and the second support frame 10 coordinate so that the installation of magnet 14 is high Spend adjustable;
The mode of heating of the first heating head 11, the second heating head 12 and removable heating head 13 is electricity in the present embodiment Silk radiant heating pattern is hindered, possesses the advantages of heating efficiency height, simple in construction;
The equal Ceramics material of material of second support frame 10 and the 3rd support frame 20, there is big thermal resistance, high temperature resistant, insulation The characteristics of good, operator is prevented to be burned or get an electric shock.
The radius that first winding axle 6 and second winds axle 7 is 35mm, and optical fiber is wound on axle 7 in the first winding axle 6 and second The winding number of turns for 3 circle;
First guide channel 8 and the second guide channel 9 are used to ensure the central point of 2 and first heating head of optical fiber 11 and the second heating head The line of 12 central points is conllinear;
Optical fiber 2 in the present embodiment is the single-mode fiber with polyimide coating, and solder used is that fusing point is 400 DEG C Glass solder, glass transition temperature be 260 DEG C.
A kind of fibre optical sensor is without gel method for packing, step:
(1) removable heating head 13 is moved to the surface of the first solder 18, while starts the first heating head 11 and can Mobile heating head 13 heats to the first solder 18,400 DEG C of heating-up temperature, and heat time 80s melts to it, treats the first solder 18 are completely cooled down to room temperature, and the wavelength X 1=of now fiber grating is recorded with optic fiber grating wavelength detection device 1 1550.451nm;
(2) moved right removable support frame 16, and optical fiber 2 is stretched, and is stretched to fine grating wavelength detection device 1 and is examined The wavelength for measuring fiber grating is λ 2;
(3) removable heating head 13 is moved to the surface of the second solder 19, while starts the second heating head 12 and can Mobile heating head 13 heats to the second solder 19, and heating-up temperature is 400 DEG C, and the heat time, which is 80s, melts to it, and makes it Naturally cool to room temperature;
(4) the first fiber clamp 3 and the second fiber clamp 4 are unclamped, by the stainless steel weld tabs 17 welded together and optical fiber 2 Remove, that is, obtain fibre optical sensor.
λ 2 determination method is in described step (2):
λ 2=λ 1+A (K1-K2) T+ λ 0
In embodiment, coefficient of strain A=1.2 × 10 of optical fiber6pm/ε;
Thermal coefficient of expansion K1=16 × 10 of stainless steel case chip 17-6℃;
Thermal coefficient of expansion K2=5.5 × 10 of optical fiber-7℃;
T=260 DEG C of the glass transition temperature of second solder;
Prestretching wavelength X 0=2nm ± 0.1nm of fibre optical sensor.
Optic fiber grating wavelength is λ 1=1550.451nm;
λ 2=1554.99nm can be calculated by bringing above-mentioned parameter into formula;
Fibre optical sensor incoming fiber optic grating wavelength detection device 1 after welding is measured to the center of fibre optical sensor Wavelength is 1552.403nm, and the final prestretching wavelength that obtains is 1.952nm, meets pre- want to claim.As a result this method operation letter is shown Single, easy to use, the fibre optical sensor of making meets pre- want to claim.
Although the preferred embodiments of the present invention have been illustrated and described in detail, the spirit of the present invention or institute are not being departed from In the case of attached right, various modifications may be made, what this engineers and technicians to this area was apparent from.

Claims (9)

1. a kind of fibre optical sensor, without gel packaging system, the device is used for stainless steel case chip (17) and the light with grating Fine (2) are packaged, and stainless steel case chip has solder on (17);
It is characterized in that:The device includes optic fiber grating wavelength detection device (1), the first fiber clamp (3), the second fiber clamp (4), the first winding axle (6), the second winding axle (7) and heater;
One end of optical fiber (2) is connected with optic fiber grating wavelength detection device (1), and the other end of optical fiber (2) first passes through the first optical fiber Fixture (3) clamped after around first winding axle (6) afterwards with the solder contact on stainless steel case chip (17), then further around mistake Clamped after second winding axle (7) by the second fiber clamp (4);
Described heater is used to heat the solder on stainless steel case chip (17);
Described heater includes the first heating head (11), the second heating head (12) and removable heating head (13);Described There are the first solder (18) and the second solder (19) on stainless steel case chip (17), positioned at the first solder (18) and the second solder (19) Between optical fiber (2) on have grating;First heating head (11) is used for being heated below the first solder (18), the second heating Head (12) is used for being heated below the second solder (19);Removable heating head (13) passes through in the upper of the first solder (18) Side and the top of the second solder (19) are moved, realize it is to the top of the first solder (18) or the top of the second solder (19) plus Heat.
2. a kind of fibre optical sensor according to claim 1 is without gel packaging system, it is characterised in that:First winding axle (6) and the second radius for winding axle (7) is not less than 30mm, and optical fiber (2) is on the first winding axle (6) and the second winding axle (7) The number of turns is wound not less than 3 circles.
3. a kind of fibre optical sensor according to claim 1 is without gel packaging system, it is characterised in that:The device also includes First guide channel (8) and the second guide channel (9), the first guide channel (8) is positioned at the first winding axle (6) and stainless steel case chip (17) Between, optical fiber (2) passes through the first guide channel (8) after being wrapped on the first winding axle (6), then with stainless steel case chip (17) Solder contact;
Second guide channel (9) is located between stainless steel case chip (17) and the second winding axle (7), and optical fiber (2) encapsulates with stainless steel It is wrapped in after passing through the second guide channel (9) after solder contact on piece (17) on the second winding axle (7).
4. a kind of fibre optical sensor according to claim 1 is without gel packaging system, it is characterised in that:The device also includes Magnet (14) and thermal insulation layer (15), thermal insulation layer (15), which is fixed on magnet (14), forms magnetic locating dowel, and magnetic locating dowel is located at Between first heating head (11) and the second heating head (12), stainless steel case chip (17) by the magnetic-adsorption of magnet (14) every On thermosphere (15).
5. a kind of fibre optical sensor according to claim 1 is without gel packaging system, it is characterised in that:The device also includes First support frame (5), the second support frame (10), removable support frame (16) and the 3rd support frame (20);
First fiber clamp (3), the first winding axle (6) and the first guide channel (8) are from left to right sequentially fixed at the first support frame (5) on;
First heating head (11), magnet (14) and the second heating head (12) are from left to right sequentially fixed at the second support frame (10) On;
Second guide channel (9), the second winding axle (7) and the second fiber clamp (4) are from left to right sequentially fixed at removable support On frame (16);
3rd support frame (20) is used to be supported removable heating head (13), makes removable heating head (13) can be first Moved above solder (18) and the second solder (19).
6. a kind of fibre optical sensor according to claim 4 is without gel packaging system, it is characterised in that:Thermal insulation layer (15) is logical High temperature glue is crossed on magnet (14), there is external screw thread on magnet (14), there is screwed hole, magnet (14) on the second support frame (10) External screw thread and the second support frame (10) on screwed hole coordinate so that the setting height(from bottom) of magnet (14) is adjustable.
7. a kind of fibre optical sensor according to claim 1 is without gel packaging system, it is characterised in that:First heating head (11), the mode of heating of the second heating head (12) and removable heating head (13) is sensing heating, light heating or resistance wire radiation The equal Ceramics of material of heating, the second support frame (10) and the 3rd support frame (20).
8. a kind of fibre optical sensor using as described in claim 1-7 is any is carried out without gel encapsulation side without gel packaging system Method, it is characterised in that step is:
(1) removable heating head (13) is moved to the surface of the first solder (18), at the same start the first heating head (11) and Removable heating head (13) heats to the first solder (18), and heating-up temperature is the fusion temperature of the first solder (18), is heated Time, to be completely melt to the first solder (18), room temperature i.e. the first solder was naturally cooled to after the first solder (18) is completely melt (18) completion of cure, and with the wavelength X 1 of optic fiber grating wavelength detection device (1) record now fiber grating;
(2) moved right removable support frame (16), and optical fiber (2) is stretched, is stretched to optic fiber grating wavelength detection device (1) wavelength for detecting fiber grating is λ 2;
(3) removable heating head (13) is moved to the surface of the second solder (19), at the same start the second heating head (12) and Removable heating head (13) heats to the second solder (19), and heating-up temperature is the fusion temperature of the second solder (19), is heated Time, to be completely melt to the second solder (19), room temperature i.e. the second solder was naturally cooled to after the second solder (19) is completely melt (19) completion of cure;
(4) unclamp the first fiber clamp (3) and the second fiber clamp (4), by the stainless steel case chip (17) welded together and Optical fiber (2) is removed, that is, obtains fibre optical sensor.
9. no gel method for packing according to claim 8, it is characterised in that:λ 2 determination side in described step (2) Method is:
λ 2=λ 1+A (K1-K2) T+ λ 0
Wherein, A is the coefficient of strain of optical fiber;
K1 is the thermal coefficient of expansion of stainless steel case chip (17);
K2 is the thermal coefficient of expansion of optical fiber (2);
T is the glass transition temperature of the second solder (19);
λ 0 is the prestretching wavelength of fibre optical sensor.
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CN109029512A (en) * 2018-06-29 2018-12-18 中国船舶重工集团公司第七〇五研究所 A kind of fiber-optic grating sensor glass solder package system
CN109031408A (en) * 2018-08-17 2018-12-18 山东省科学院激光研究所 A kind of packaging system and method for fiber grating wave detector
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CN109351562A (en) * 2018-12-12 2019-02-19 法尔胜泓昇集团有限公司 A kind of apparatus system and its application method for fiber grating and the heating of sensor inner core gluing
CN111623811B (en) * 2020-04-22 2021-09-21 西北大学 High-temperature-resistant fiber grating sensor packaging device and method
CN112710336A (en) * 2020-12-14 2021-04-27 北京航天控制仪器研究所 Device and method for automatically controlling prestress in optical fiber sensor packaging process
CN114923430B (en) * 2022-04-19 2023-05-26 大连理工大学 Non-gel fiber grating strain sensor

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