CN105578709A - Circuit structure and manufacture method of circuit structure - Google Patents
Circuit structure and manufacture method of circuit structure Download PDFInfo
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- CN105578709A CN105578709A CN201410623940.6A CN201410623940A CN105578709A CN 105578709 A CN105578709 A CN 105578709A CN 201410623940 A CN201410623940 A CN 201410623940A CN 105578709 A CN105578709 A CN 105578709A
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Abstract
The invention discloses a circuit structure and a manufacture method of the circuit structure. The manufacture method comprises the following steps that: a substrate is provided, wherein the substrate comprises a first metal layer, a second metal layer and an etch stop layer, wherein the etch stop layer is arranged between the first metal layer and the second metal layer, the thickness of the second the metal layer is greater than the thickness of the first metal layer; with the etch stop layer adopted as a barrier, first patterning processing is performed on the second metal layer, so that a second patterned metal layer can be formed, wherein the second patterned metal layer includes a plurality of metal protruding blocks; second patterning processing is performed on the etch stop layer, so that the etch stop layer exposed by the second patterned metal layer can be removed; a first dielectric layer is formed on the second patterned metal layer; and the first metal layer is patterned to form a first patterned metal layer containing a plurality of circuit patterns, wherein the circuit patterns are corresponding to the metal protruding blocks.
Description
Technical field
The present invention relates to the manufacture method of a kind of line construction and line construction, and particularly relate to and be a kind ofly applied to the line construction of wiring board and the manufacture method of line construction.
Background technology
Along with scientific and technological progress, electronic product at large in modern society.In the necessary part of these electronic products, except the electronic components (electriccomponent) such as chip (chip) and passive device (passivecomponent), carrying is also indispensable strength member with the wiring board of these chips of configuration and passive device.
Existing wiring board can such as be made up of line layer, ground plane, bus plane and dielectric layer.Electronic component can be arranged on line layer, and is connected electrically.In addition, bus plane externally can connect the power supply of this wiring board electric power of supply, to drive the electronic component be installed on wiring board, and the input/out line of electronic component can be operated via line layer transmission.Ground plane is then configurable between line layer and bus plane.In addition, dielectric layer is arranged between line layer, ground plane and bus plane respectively, using the use as insulation.
In heat radiation problem, wiring board be in the past with line layer to transmit electronic component the used heat that derives, electronic component is allowed to keep at normal working temperature, but, due to electronic component the used heat that derives constantly in increase, general line layer thickness cannot meet the high electrical property efficiency of present wiring board and the demand of high cooling efficiency.In order to meet the processing demands of high electric current and high cooling efficiency now, the thickness increasing line layer certainly will be needed, so, thus adding circuit also and anti-welding making degree of difficulty, and then the yield of production is reduced, more improve production cost.
Summary of the invention
The invention provides the manufacture method of a kind of line construction and line construction, its manufacture craft is comparatively simple, and yield is higher.
The manufacture method of a kind of line construction of the present invention, it comprises the following steps.First, a base material is provided.Base material comprises a first metal layer, one second metal level and an etch stop layer.Etch stop layer is arranged between the first metal layer and the second metal level, and a thickness of the second metal level is greater than a thickness of the first metal layer.Then, a patterning photoresist oxidant layer is formed on the second metal level.Then, with patterning photoresist oxidant layer for etching mask, and be etching barrier with etch stop layer, one first patterning manufacture craft is carried out to the second metal level, to form one second patterned metal layer, wherein, the second patterned metal layer comprises multiple metal coupling.Then, with patterning photoresist oxidant layer for etching mask carries out one second patterning manufacture craft to etch stop layer, with remove the partially-etched stop layer that exposes by the second patterned metal layer.Then, patterning photoresist oxidant layer is removed.Afterwards, one first dielectric layer is formed on the second patterned metal layer.First dielectric layer covers the second patterned metal layer.Then, patterned first metal layer, to form one first patterned metal layer.First patterned metal layer comprises multiple line pattern, respectively corresponding metal coupling.
A kind of line construction of the present invention, it comprises a first metal layer, one first dielectric layer, multiple metal coupling, one second dielectric layer and multiple via.First dielectric layer is arranged on the first metal layer.Metal coupling is arranged at one of the first dielectric layer on the surface, and wherein, a thickness of each metal coupling is more than or equal in fact 100 microns.Second dielectric layer is arranged at the surface also covering metal projection of the first dielectric layer.Via is connected between metal coupling and the first metal layer.
The manufacture method of a kind of line construction of the present invention, it comprises the following steps.First, a base material is provided.Base material comprises a core layer, two release films and two the first metal layers.Release film is arranged at relative two of core layer on the surface respectively.The first metal layer is arranged on release film respectively.Then, two first dielectric layers are formed respectively on described two the first metal layers.Then, form two patterned metal layers respectively on described two first dielectric layers, wherein each patterned metal layer comprises multiple metal coupling, and a thickness of each metal coupling is more than or equal in fact 100 microns.Then, two second dielectric layers are formed respectively on described two patterned metal layers.Two second dielectric layers cover described two patterned metal layers respectively.Two release films are made to be separated with corresponding the first metal layer, to form separately independently two line constructions.
Based on above-mentioned, the present invention utilizes the three layers composite metal paper tinsel with the first metal layer, the second metal level and etch stop layer as the base material of line construction, the thinner thickness of its first metal layer, in order to form multiple line pattern, and the thickness of the second metal level is thicker, in order to form multiple metal coupling, as bus plane or the ground plane of line pattern, to reach the function carrying high electric current and carry out dispelling the heat.Be positioned at the etching barrier that middle etch stop layer then can be used as the patterning manufacture craft forming metal coupling, to prevent from hurting the first metal layer during etching the second metal level.Because described base material in order to make Double-side line layer, thus can decrease the number of times increasing layer, and simplify Making programme, and then can improve the yield of manufacture craft.
In addition, the present invention also can utilize its relative two surfaces of core layer combined type base material of being formed of superimposed two release films and two the first metal layers respectively, in a symmetrical manner respectively at the two-sided upper folded structure manufacture craft of carrying out line construction of this base material simultaneously, to form the thicker metal coupling of thickness and to be electrically connected with the first metal layer, as bus plane or the ground plane of the first metal layer, to reach the effect carrying high electric current and carry out dispelling the heat.Owing to being form folded structure in a symmetrical manner on base material, thus can reduce the number of times increasing layer, and after tearing plate open, two respective independently line constructions can be obtained simultaneously, effectively save the manufacture craft time, more can improve prouctiveness.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and the accompanying drawing appended by coordinating is described in detail below.
Accompanying drawing explanation
Figure 1A to Fig. 1 H is the flow process generalized section of the manufacture method of a kind of line construction of one embodiment of the invention;
Fig. 2 A to Fig. 2 F is the flow process generalized section of the manufacture method of a kind of line construction of one embodiment of the invention.
Symbol description
100,200: line construction
110,210: base material
112,216: the first metal layer
114,242: the second metal levels
114a: the second patterned metal layer
114b, 232: metal coupling
116: etch stop layer
120: photoresist oxidant layer
122: patterning photoresist oxidant layer
122a: opening
130,220: the first dielectric layers
132: the three metal levels
132a: the three patterned metal layer
140,240: the second dielectric layers
142: the four metal levels
212: core layer
214: release film
216a: smooth surface
216b: rough surface
230: patterned metal layer
250: via
D1: thickness
Embodiment
Figure 1A to Fig. 1 H is the flow process generalized section of the manufacture method of a kind of line construction according to one embodiment of the invention.The manufacture method of the line construction of the present embodiment comprises the following steps: first, to please refer to Figure 1A, provides a base material 110.Base material 110 comprises the first metal layer 112,1 second metal level 114 and an etch stop layer 116.Etch stop layer 116 is arranged between the first metal layer 112 and the second metal level 114, and as shown in Figure 1A, the thickness of the second metal level 114 is greater than the thickness of the first metal layer 112.In the present embodiment, the thickness of the first metal layer 112 can such as between 18 microns (μm) be to 70 microns, and the thickness of the second metal level 114 then can between 65 microns to 500 microns.Preferably, the thickness of the second metal level 114 can be more than or equal in fact 100 microns.In addition, the thickness of etch stop layer 116 can such as between 0.8 micron to 1.2 microns.Specifically, the first metal layer 112 can be the electrolysis (ElectroDeposit formed by sputter or electroplating manufacturing process, ED) Copper Foil, second metal level 114 then can be by heat and roll that manufacture craft formed roll (RolledandAnnealed, RA) Copper Foil.The first metal layer 112 and the common coated etch stop layer 116 of the second metal level 114 are to form base material 110.
Then, referring to Figure 1B and Fig. 1 C, each photoresist oxidant layer 120 that formed, on the first metal layer 112 and the second metal level 114, makes photoresist oxidant layer 120 cover the outer surface of the first metal layer 112 and the second metal level 114 respectively.Afterwards, then patterning is covered in the photoresist oxidant layer 120 on the second metal level 114, to form a patterning photoresist oxidant layer 122 on the second metal level 114.Patterning photoresist oxidant layer 122 has multiple opening 122a.Then, again with patterning photoresist oxidant layer 122 for etching mask, and with etch stop layer 116 for etching barrier, one first patterning manufacture craft is carried out to the second metal level 114 as shown in Figure 1B, to form one second patterned metal layer 114a as shown in Figure 1 C, wherein, the second patterned metal layer 114a comprises multiple metal coupling 114b.In the present embodiment, because the thickness of the second patterned metal layer 114a can be more than or equal in fact 100 microns, therefore, the thickness of each metal coupling 114b also can be more than or equal to 100 microns naturally.
In the present embodiment, aforesaid first patterning manufacture craft can be an alkali etching manufacture craft, that is, the etching solution used in first patterning manufacture craft is alkaline etching liquid, etch stop layer 116 then can be an alkali resistant etching layer, that is, etch stop layer 116 in the first patterning manufacture craft can not corrode by alkaline etching liquid, thus can provide an etching barrier to the first metal layer 112, make the first patterning manufacture craft can end at etch stop layer 116 and can not continue to etch the first metal layer 112.In the present embodiment, the material of etch stop layer 116 comprises the group that tin, lead, chromium, nickel, indium, zinc, tungsten, molybdenum or its combination in any are formed.Certainly, the present invention is not as limit.
Then, more as shown in figure ip, for etching mask, one second patterning manufacture craft is carried out to etch stop layer 116 with patterning photoresist oxidant layer 122, with remove the partially-etched stop layer 116 that exposes by the second patterned metal layer 114a.In the present embodiment, second patterning manufacture craft can be an acid etching manufacture craft, that is, the etching solution used in the second patterning manufacture craft is acidic etching liquid, etches with the partially-etched stop layer 116 exposed the second patterned metal layer 114a.In addition, the second patterning manufacture craft also can be the manufacture crafts such as dilution etching, fast-etching (flashetching) or exposure imaging.For example, dilution etching can such as use diluted etching solution to etch etch stop layer 116, to reduce its injury to the first metal layer 112, fast-etching then can be utilized the different of the etch-rate of chemical plating and plating and form the effect that difference etches, to remove the etch stop layer 116 such as formed by chemical plating.Certainly, have in any art and usually know that the knowledgeable should be appreciated that, the present embodiment is only in order to illustrate, the present invention is not as limit.
Then, referring to Fig. 1 D to Fig. 1 F, patterning photoresist oxidant layer 122 as shown in figure ip and photoresist oxidant layer 120 is removed to form the structure as Fig. 1 E.Afterwards, then form one first dielectric layer 130 on the second patterned metal layer 114a, wherein, the first dielectric layer 130 covers the second patterned metal layer 114a.In the present embodiment, the outer surface of the first dielectric layer 130 has one the 3rd metal level 132 as shown in fig. 1f, and forms the method for the first dielectric layer 130 on the second patterned metal layer 114a and can comprise pressing first dielectric layer 130 and the 3rd metal level 132 on the second patterned metal layer 114a.In addition, the present embodiment is also optionally before pressing first dielectric layer 130, one brown (brownoxidation) or roughening treatment are done to the structure of Fig. 1 E, to increase the adhesion between the second patterned metal layer 114a and the first dielectric layer 130.
Then, referring again to Fig. 1 F and Fig. 1 G, patterning manufacture craft is carried out to the first metal layer 112 as shown in Figure 1 F, to form one first patterned metal layer 112a as shown in Figure 1 G, wherein, first patterned metal layer 112a comprises multiple line pattern 112b, and it is corresponding metal coupling 114b respectively.Further, patterning manufacture craft is carried out to the 3rd metal level 132 as shown in Figure 1 F, to form one the 3rd patterned metal layer 132a as shown in Figure 1 G.So, the making of line construction 100 can tentatively be completed.
Afterwards, more as shown in fig. 1h, two second dielectric layers 140 can be formed respectively on the first patterned metal layer 112a and the 3rd patterned metal layer 132a.In the present embodiment, the outer surface of each second dielectric layer 140 can have one the 4th metal level 142 as shown in fig. 1h.Certainly, the present embodiment is only in order to illustrate, have in any art and usually know that the knowledgeable can delete or continue stacking required folded structure voluntarily according to product design, the present invention does not limit the folded structure number of plies of line construction.
So, the present embodiment utilizes the three layers composite metal paper tinsel with the first metal layer 112, second metal level 114 and etch stop layer 116 as the base material of line construction, wherein, the thinner thickness of the first metal layer 112, multiple line pattern 112b is formed by patterning manufacture craft, and the thickness of the second metal level 114 is thicker, multiple metal coupling 114b is formed by patterning manufacture craft, as bus plane or the ground plane of line pattern 112b, to reach the high electric current of carrying and to dispel the heat.Further, this composite metallic material in order to make Double-side line layer, thus can reduce the number of times increasing layer, and manufacture craft is comparatively simple, and then can improve the yield of manufacture craft.
Fig. 2 A to Fig. 2 F is the flow process generalized section of the manufacture method of a kind of line construction according to one embodiment of the invention.The present embodiment also provides the manufacture method of another kind of line construction, and first it comprise the following steps:, please refer to Fig. 2 A, provides a base material 210.Base material 210 comprises core layer 212, two release film (releasefilm) 214 and two the first metal layers 216.Release film 214 is arranged at relative two of core layer 212 on the surface as shown in Figure 2 A respectively, and the first metal layer 216 is then arranged on release film 214 respectively.In the present embodiment, the first metal layer 216 comprises a smooth surface 216a and the rough surface 216b relative to smooth surface 216a, and release film 214 is arranged on smooth surface 216a.That is, each release film 214 is arranged between the first metal layer 216 of core layer 212 and correspondence.Generally speaking, release film 214 is film separatory for surface has, and it does not have stickiness or only has slight stickiness after contacting under given conditions with specific material.
Then, please refer to Fig. 2 B, form two first dielectric layers 220 respectively on described two the first metal layers 216.In the present embodiment, the first dielectric layer 220 is arranged on the rough surface 216b of the first metal layer 216, and the material of the first dielectric layer 220 comprises the preferred material of thermal conductivity such as pottery or semi-solid preparation resin (prepreg, PP).Then, then form two patterned metal layers 230 as shown in Figure 2 C respectively on described two first dielectric layers 220, wherein, each patterned metal layer 230 comprises multiple metal coupling 232 as shown in Figure 2 C.In the present embodiment, the thickness of the first metal layer 216 can be in fact 5 ~ 70 microns.And a thickness D1 of each metal coupling 232 is more than or equal in fact 100 microns.
Then, please refer to Fig. 2 D, form two second dielectric layers 240 respectively on described two patterned metal layers 230.Two second dielectric layers 240 cover described two patterned metal layers 230 respectively.In the present embodiment, the material of the second dielectric layer 240 comprises the preferred material of thermal conductivity such as pottery or semi-solid preparation resin, and the outer surface of each second dielectric layer 240 can have one second metal level 242, and form the method for the second dielectric layer 240 on described patterned metal layer 230 and comprise pressing second dielectric layer 240 and the second metal level 242 on patterned metal layer 230.
Then.Please refer to Fig. 2 E, utilize release film 214 to be easy to the characteristic peeled off, make two release films 214 respectively with corresponding the first metal layer 216 be separated, to expose the smooth surface 216a of the first metal layer 216, and form respective independently two line constructions as shown in Figure 2 E.Afterwards, again as shown in Figure 2 F, multiple via 250 can be formed on each first dielectric layer 220, wherein, via 250 is connected between the first metal layer 216 of metal coupling 232 and correspondence, to be electrically connected the first metal layer 216 of metal coupling 232 and correspondence.So, the making of line construction 200 is namely tentatively completed.Certainly, the present embodiment is only in order to illustrate, have in any art and usually know that the knowledgeable can delete or continue stacking required folded structure voluntarily according to product design, the present invention does not limit the folded structure number of plies of line construction.
The line construction 200 completed according to above-mentioned manufacture method can as shown in Figure 2 F, and it comprises the first metal layer 216,1 first dielectric layer 220, multiple metal coupling 232,1 second dielectric layer 240 and multiple via 250.First dielectric layer 220 is arranged on the first metal layer 216, and wherein, the first metal layer 216 comprises a smooth surface 216a and the rough surface 216b relative to smooth surface 216a, and the first dielectric layer 220 is then be arranged on rough surface 216b.Metal coupling 232 is arranged on the surface of the first dielectric layer 220, and wherein, a thickness D1 of each metal coupling 232 is more than or equal in fact 100 microns.Second dielectric layer 240 is arranged at the surface also covering metal projection 232 of the first dielectric layer 220.Via 250 is connected between metal coupling 232 and the first metal layer 250.The material of the first dielectric layer 220 and the second dielectric layer 240 comprises the preferred material of thermal conductivity such as pottery or semi-solid preparation resin.
So, line construction 200 utilizes the combined type base material 210 with core layer 212, two release film 214 and two the first metal layers 216 in a symmetrical manner respectively at the two-sided upper folded structure manufacture craft of carrying out line construction 200 of this base material 210 simultaneously, therefore, after tearing plate open, two respective independently line constructions 200 can be obtained simultaneously, effective saving manufacture craft time, and improve prouctiveness.Further, the metal coupling 232 that line construction 200 more utilizes thickness to be more than or equal to 100 microns as the bus plane of the first metal layer 216 or ground plane, to reach the high electric current of carrying and to dispel the heat.
In sum, the present invention utilizes the three layers composite metal paper tinsel with the first metal layer, the second metal level and etch stop layer as the base material of line construction, wherein, the thinner thickness of the first metal layer, form multiple line pattern by patterning manufacture craft, and the thickness of the second metal level is thicker, forms multiple metal coupling by patterning manufacture craft, as bus plane or the ground plane of line pattern, to reach the function carrying high electric current and carry out dispelling the heat.Be positioned at the etching barrier that middle etch stop layer then can be used as patterning manufacture craft, to prevent from hurting the first metal layer during etching the second metal level.So, described base material in order to make Double-side line layer, thus can reduce increasing hierachy number, and manufacture craft is comparatively simple, and then can improve the yield of manufacture craft.
In addition, the present invention also can utilize the combined type base material with a core layer, two release films and two the first metal layers in a symmetrical manner respectively at the two-sided upper folded structure manufacture craft of carrying out line construction of this base material simultaneously, to form the thicker metal coupling of thickness and to be electrically connected with the first metal layer, using as the bus plane of the first metal layer or ground plane, to reach the high electric current of carrying and to dispel the heat.Owing to being form folded structure in a symmetrical manner on base material, thus can reduce the number of times increasing layer, and after tearing plate open, two respective independently line constructions can be obtained simultaneously, effectively save the manufacture craft time, and improve prouctiveness.
Although disclose the present invention in conjunction with above embodiment; but itself and be not used to limit the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the present invention; a little change and retouching can be done, therefore being as the criterion of should defining with the claim of enclosing of protection scope of the present invention.
Claims (18)
1. a manufacture method for line construction, comprising:
One base material is provided, this base material comprises a first metal layer, one second metal level and an etch stop layer, this etch stop layer is arranged between this first metal layer and this second metal level, and a thickness of this second metal level is greater than a thickness of this first metal layer;
Form a patterning photoresist oxidant layer on this second metal level;
With this patterning photoresist oxidant layer for etching mask, and with this etch stop layer for etching barrier, carry out one first patterning manufacture craft to this second metal level, to form one second patterned metal layer, this second patterned metal layer comprises multiple metal coupling;
With this patterning photoresist oxidant layer for etching mask carries out one second patterning manufacture craft to this etch stop layer, with remove this etch stop layer of part of exposing by this second patterned metal layer;
Remove this patterning photoresist oxidant layer;
Form one first dielectric layer on this second patterned metal layer; And
This first metal layer of patterning, to form one first patterned metal layer, this first patterned metal layer comprises multiple line pattern, respectively those metal couplings corresponding.
2. the manufacture method of line construction as claimed in claim 1, wherein this first patterning manufacture craft comprises an alkali etching manufacture craft.
3. the manufacture method of line construction as claimed in claim 2, wherein this etch stop layer comprises an alkali resistant etching layer.
4. the manufacture method of line construction as claimed in claim 2, wherein the material of this etch stop layer comprises the group that tin, lead, chromium, nickel, indium, zinc, tungsten, molybdenum or its combination are formed.
5. the manufacture method of line construction as claimed in claim 2, wherein this second patterning manufacture craft comprises acid etching, dilution etching, fast-etching or exposure imaging manufacture craft.
6. the manufacture method of line construction as claimed in claim 1, wherein respectively a thickness of this metal coupling is more than or equal in fact 100 microns (μm).
7. the manufacture method of line construction as claimed in claim 1, also comprises:
Before carrying out this first patterning manufacture craft, first cover a photoresist oxidant layer on this first metal layer; And
After carrying out this second patterning manufacture craft, remove this photoresist oxidant layer.
8. the manufacture method of line construction as claimed in claim 1, wherein an outer surface of this first dielectric layer has one the 3rd metal level, and the manufacture method of described line construction also comprises:
Patterning the 3rd metal level, to form one the 3rd patterned metal layer; And
Form two second dielectric layers respectively on this first patterned metal layer and the 3rd patterned metal layer.
9. a line construction, comprising:
The first metal layer;
First dielectric layer, is arranged on this first metal layer;
Multiple metal coupling, is arranged at one of this first dielectric layer on the surface, and wherein, respectively a thickness of this metal coupling is more than or equal in fact 100 microns;
Second dielectric layer, is arranged at this surface of this first dielectric layer and covers those metal couplings; And
Multiple via, is connected between those metal couplings and this first metal layer.
10. line construction as claimed in claim 1, also comprises one second metal level, is arranged on an outer surface of this second dielectric layer.
11. line constructions as claimed in claim 1, wherein this first metal layer comprises a smooth surface and a rough surface, and this smooth surface is relative to this rough surface, and this first dielectric layer is arranged on this rough surface.
12. line constructions as claimed in claim 1, wherein the material of this first dielectric layer and each this second dielectric layer comprises pottery or semi-solid preparation resin.
The manufacture method of 13. 1 kinds of line constructions, comprising:
There is provided a base material, this base material comprises a core layer, two release films and two the first metal layers, and this two release film is arranged at relative two of this core layer on the surface respectively, and this two the first metal layer is arranged on this two release film respectively;
Form two first dielectric layers respectively on this two the first metal layer;
Form two patterned metal layers respectively on this two first dielectric layer, wherein respectively this patterned metal layer comprises multiple metal coupling, and respectively a thickness of this metal coupling is more than or equal in fact 100 microns;
Form two second dielectric layers respectively on this two patterned metal layer, this two second dielectric layer covers this two patterned metal layer respectively; And
Make this two release film and corresponding the first metal layer and be separated, to form separately independently two line constructions.
The manufacture method of 14. line constructions as claimed in claim 13, also comprises:
After making this core layer be separated with this two release film, form multiple via on each this first dielectric layer, those vias are connected between the first metal layer of those metal couplings and correspondence.
The manufacture method of 15. line constructions as claimed in claim 1, wherein respectively an outer surface of this second dielectric layer has one second metal level.
The manufacture method of 16. line constructions as claimed in claim 1, wherein respectively this first metal layer comprises a smooth surface and a rough surface, and this smooth surface is relative to this rough surface, and this first dielectric layer is arranged on this rough surface.
The manufacture method of 17. line constructions as claimed in claim 1, wherein respectively the material of this first dielectric layer and each this second dielectric layer comprises pottery or semi-solid preparation resin.
The manufacture method of 18. line constructions as claimed in claim 1, wherein a thickness of this first metal layer is essentially 5 ~ 70 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410623940.6A CN105578709A (en) | 2014-11-07 | 2014-11-07 | Circuit structure and manufacture method of circuit structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410623940.6A CN105578709A (en) | 2014-11-07 | 2014-11-07 | Circuit structure and manufacture method of circuit structure |
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| CN105578709A true CN105578709A (en) | 2016-05-11 |
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| CN201410623940.6A Pending CN105578709A (en) | 2014-11-07 | 2014-11-07 | Circuit structure and manufacture method of circuit structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023159405A1 (en) * | 2022-02-24 | 2023-08-31 | 京东方科技集团股份有限公司 | Circuit board and manufacturing method therefor, functional backplane, backlight module, and display device |
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2014
- 2014-11-07 CN CN201410623940.6A patent/CN105578709A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023159405A1 (en) * | 2022-02-24 | 2023-08-31 | 京东方科技集团股份有限公司 | Circuit board and manufacturing method therefor, functional backplane, backlight module, and display device |
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Application publication date: 20160511 |