CN105557075B - 用于柔性电路的导体焊盘和包括所述导体焊盘的柔性电路 - Google Patents

用于柔性电路的导体焊盘和包括所述导体焊盘的柔性电路 Download PDF

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CN105557075B
CN105557075B CN201480045451.5A CN201480045451A CN105557075B CN 105557075 B CN105557075 B CN 105557075B CN 201480045451 A CN201480045451 A CN 201480045451A CN 105557075 B CN105557075 B CN 105557075B
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protrusion
segmentation
conductor pad
contact area
edge
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CN105557075A (zh
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S.文克
E.A.小皮卡
Q.戴
R.贾纳
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Osram Sylvania Inc
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Osram Sylvania Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/005—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips for several lighting devices in an end-to-end arrangement, i.e. light tracks
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    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01—ELECTRIC ELEMENTS
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/385—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
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Abstract

提供了导体焊盘（102‑1，…，102‑n）和包括导体焊盘的柔性电路（100）。导体焊盘包括：第一接触区域（125）；第二接触区域（130）；以及主体部分（110），被配置为在第一接触区域和第二接触区域之间建立导电路径。主体部分包括周界边沿，周界边沿具有至少第一凸起分段和第二凸起分段，其中第一非凸起分段被部署在第一凸起分段和第二凸起分段之间。还提供了构造柔性电路以促进柔性电路的卷对卷制造的方法。

Description

用于柔性电路的导体焊盘和包括所述导体焊盘的柔性电路
相关申请的交叉引用
本申请是国际申请并且要求2014年5月31日提交的并且题为“CONDUCTOR PAD FORFLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORATING THE SAME”的美国专利申请No.14/292,829的优先权，该美国专利申请是如下申请的非临时申请并且要求如下申请的优先权：2013年8月16日提交的并且题为“CONDUCTOR PADS FOR THERMAL DISSIPATION”的美国临时专利申请No.61/866,683以及2014年3月28日提交的并且题为“CONDUCTOR PADFOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORATING THE SAME”的美国临时专利申请No.61/971,914，这些申请的整体内容被通过引用包括于此。
技术领域
本申请涉及电气电路，并且更特别地，涉及用于柔性电气电路的导体焊盘以及包括所述导体焊盘的柔性电路。
背景技术
电气电路典型地是使用分立的电子封装（诸如发光二极管（下文中为LED或多个LED）或其它固态光源）而被形成的，分立的电子封装被安装在由相对地刚性的材料（诸如纤维加强的环氧树脂（例如FR4）或聚酰亚胺）制成的电路衬底上。电路衬底一般被处理以在其表面上承载导电迹线、导体焊盘和/或印刷电路的其它组件。电子封装可以被安装到导体焊盘以由此将电子封装耦接到导电迹线并且建立电气电路。
发明内容
尽管这样的电路是有用的，相对地刚性的电路衬底的使用可能强加设计限制。因此已经开发了技术以生产由柔性衬底材料（诸如塑料和聚酯材料）制造出的柔性电路。柔性电路允许在设计上的自由度并且可以使用卷对卷制造技术来进行构造。在卷对卷制造技术中，可以通过将电子封装耦接到柔性衬底材料的连续网上的导电迹线来建立柔性电路。卷对卷制造可以促进高性能柔性的或卷起的电子器件（诸如LED照明阵列、太阳能面板、显示器、射频标识（RFID）器件等）的有效率的大规模生产。
实施例被配置为促进其上被提供有一个或多个导体焊盘的柔性衬底的收卷（rolling）。卷对卷制造可以被用于在柔性衬底上形成导体焊盘以及/或者将电子封装耦接到导体焊盘中的相关联的焊盘以建立柔性电路。尽管实施例在此被与柔性照明电路有关地描述，但是根据在此描述的实施例的导体焊盘可以被用于构造用于在任何类型的器件（包括例如，太阳能面板、显示器（诸如电子纸、计算机或电视显示器）、射频标识（RFID）器件等）中使用的柔性电路。根据在此描述的实施例的导体焊盘包括具有周界边沿的导电材料，该周界边沿具有至少第一凸起分段和第二凸起分段以及部署在第一凸起分段和第二凸起分段之间的至少一个非凸起分段。该配置促进导体焊盘和其上形成有导体焊盘的柔性衬底的收卷，并且还促进来自耦接到导体焊盘的电子器件的热的扩散。
在实施例中，提供了一种导体焊盘。导体焊盘包括：第一接触区域；第二接触区域；以及主体部分，被配置为在第一接触区域和第二接触区域之间建立导电路径，主体部分包括具有周界边沿的导电材料，周界边沿包括：第一凸起分段；第二凸起分段；以及部署在第一凸起分段和第二凸起分段之间的第一非凸起分段。
在相关的实施例中，第一非凸起分段可以是凹陷分段。在另一相关的实施例中，第一接触区域和第二接触区域可以被导体焊盘的水平轴横贯。在又一相关的实施例中，第一接触区域和第二接触区域可以相对于导体焊盘的水平轴被垂直地彼此间隔开。在再一相关的实施例中，第一凸起分段可以在距水平轴的距离H1处具有第一凸起分段最外边沿，并且第二凸起分段可以在距水平轴的距离H2处限定周界边沿的最外边沿，其中距离H2可以大于距离H1。
在又一再一相关的实施例中，第一接触区域和第一凸起分段可以在导体焊盘的接近端部处，并且第一凸起分段可以以角度θ1在远离第一接触区域的方向上延伸，其中θ1可以是正的角度。在再一又一相关的实施例中，第二凸起分段可以以角度θ2在远离水平轴的方向上从第一非凸起分段向上延伸，其中θ2可以在0度和45度之间（包括0度和45度）。在又一相关的实施例中，导体焊盘可以包括第三凸起分段和部署在第二凸起分段和第三凸起分段之间的第二非凸起分段。在进一步的相关的实施例中，第二凸起分段可以在距水平轴的距离H2处限定周界边沿的最外边沿，第三凸起分段可以在距水平轴的距离H3处具有第三凸起分段最外边沿，并且其中距离H2可以大于距离H3。在另一进一步相关的实施例中，导体焊盘可以包括第四凸起分段以及部署在第三凸起分段和第四凸起分段之间的第三非凸起分段。在进一步的相关的实施例中，第二凸起分段可以在距水平轴的距离H2处限定周界边沿的最外边沿，第四凸起分段可以在距水平轴的距离H4处具有第四凸起分段最外边沿，并且其中距离H2可以大于距离H4。在另一进一步相关的实施例中，第四凸起分段可以以角度θ3朝向第二接触区域向下延伸，其中θ3可以在0度和45度之间（包括0度和45度）。
在再一又一相关的实施例中，第一接触区域和第二接触区域可以与主体部分集成地形成。
在另一实施例中，提供了一种柔性电路。柔性电路包括：柔性衬底；部署在柔性衬底上的多个导体焊盘，多个导体焊盘中的每个包括：第一接触区域；第二接触区域；以及主体部分，被配置为在第一接触区域和第二接触区域之间建立导电路径，主体部分包括具有周界边沿的导电材料，周界边沿包括：第一凸起分段；第二凸起分段；以及部署在第一凸起分段和第二凸起分段之间的第一非凸起分段，以及多个电子封装，多个电子封装中的每个被耦接到导体焊盘中的一个的第一接触区域和接触焊盘中相邻的一个接触焊盘的第二接触区域。
在相关的实施例中，多个导体焊盘中的导体焊盘的至少一个的第一非凸起分段可以是凹陷分段。在另一相关的实施例中，多个导体焊盘中的导体焊盘的至少一个的第一接触区域和第二接触区域可以被该导体焊盘的水平轴横贯。在又一相关的实施例中，多个导体焊盘中的导体焊盘的至少一个的第一接触区域和第二接触区域可以相对于该导体焊盘的水平轴被垂直地彼此间隔开。在再一相关的实施例中，多个导体焊盘中的导体焊盘的至少一个的第一凸起分段可以在距水平轴的距离H1处具有第一凸起分段最外边沿，该导体焊盘的第二凸起分段可以在距水平轴的距离H2处限定周界边沿的最外边沿，并且距离H2可以大于距离H1。
在又一再一相关的实施例中，多个导体焊盘中的导体焊盘的至少一个的第一接触区域和第一凸起分段可以在该导体焊盘的接近端部处，并且第一凸起分段可以以角度θ1在远离第一接触区域的方向上延伸，其中θ1可以是正的角度。在再一又一相关的实施例中，多个导体焊盘中的导体焊盘的至少一个的第二凸起分段可以以角度θ2在远离水平轴的方向上从第一非凸起分段向上延伸，其中θ2可以在0度和45度之间（包括0度和45度）。在又一再一相关的实施例中，多个导体焊盘中的导体焊盘的至少一个可以包括第三凸起分段和部署在第二凸起分段和第三凸起分段之间的第二非凸起分段。在进一步的相关的实施例中，第二凸起分段可以在距水平轴的距离H2处限定周界边沿的最外边沿，第三凸起分段可以在距水平轴的距离H3处具有第三凸起分段最外边沿，并且距离H2可以大于距离H3。在另一进一步相关的实施例中，多个导体焊盘中的导体焊盘的至少一个可以包括第四凸起分段以及部署在第三凸起分段和第四凸起分段之间的第三非凸起分段。在进一步的相关的实施例中，第二凸起分段可以在距水平轴的距离H2处限定周界边沿的最外边沿，第四凸起分段可以在距水平轴的距离距离H4处具有第四凸起分段最外边沿，并且距离H2可以大于距离H4。在另一进一步相关的实施例中，第四凸起分段可以以角度θ3朝向第二接触区域向下延伸，其中θ3可以在0度和45度之间（包括0度和45度）。
在另一实施例中，提供了一种构造柔性电路以促进柔性电路的卷对卷制造的方法。所述方法包括：在柔性衬底上提供多个导体焊盘，导体焊盘的每个包括：第一接触区域；第二接触区域；以及主体部分，被配置为在第一接触区域和第二接触区域之间建立导电路径，主体部分包括具有周界边沿的导电材料，周界边沿包括：第一凸起分段；第二凸起分段；以及部署在第一凸起分段和第二凸起分段之间的第一非凸起分段；以及将多个电子封装耦接到多个导体焊盘，多个电子封装的每个被耦接至导体焊盘中的一个的第一接触区域以及接触焊盘中相邻的一个接触焊盘的第二接触区域。
附图说明
根据如在其中贯穿不同的视图同样的参考符号提及相同部分的随附附图中图解那样的在此公开的特定实施例的如下的描述，在此公开的前述的以及其它的目的、特征和优点将是明显的。附图未必成比例，相反重点被放在图解在此公开的原理上。
图1概略地图解根据在此公开的实施例的柔性电路的一个示例。
图2是根据在此公开的实施例的导体焊盘的一个示例的顶视图。
图3是根据在此公开的实施例的导体焊盘的另一示例的顶视图。
图4是根据在此公开的实施例的导体焊盘的另一示例的顶视图。
图5是根据在此公开的实施例的导体焊盘的另一示例的顶视图。
图6是根据在此公开的实施例的导体焊盘的另一示例的顶视图。
图7是根据在此公开的实施例的导体焊盘的布置的顶视图。
图8是根据在此公开的实施例的包括一个或多个导体焊盘的柔性光引擎的横截面视图。
具体实施方式
如自始至终地使用的那样，术语（多个）固态光源提及一个或多个发光二极管（LED）、有机发光二极管（OLED）、聚合物发光二极管（PLED）以及任何其它固态光发射器，包括发光电化学电池和其它材料以及/或者它们的组合（无论是被串联地连接、并联地连接以及/或者其组合）。
现在转到图1，在图1图解了包括多个导体焊盘102-1、102-2、102-3…102-n的柔性电路100的示例性实施例的顶视图。多个导体焊盘102-1、102-2、102-3…102-n中的导体焊盘的每个包括主体部分110、第一接触区域125以及第二接触区域130。在每个导体焊盘中，主体部分110在第一接触区域125和第二接触区域130之间建立导电路径。柔性电路100包括衬底105和多个电子封装120-1、120-2…120-（n-1）。多个电子封装120-1、120-2…120-（n-1）中的电子封装可以并且在一些实施例中确实包括一个或多个固态光源和/或其它电子组件，并且被电耦接在多个导体焊盘102-1、102-2、102-3…102-n中的第一接触区域125和导体焊盘中相邻的一个导体焊盘的第二接触区域130之间。在衬底105的端部处的导体焊盘102-1、102-n可以并且在一些实施例中被耦接到电功率源135。通过电功率源135供给到多个电子封装120-1、120-2…120-（n-1）的电功率可以并且在一些实施例中确实引起光从多个电子封装120-1、120-2…120-（n-1）内的一个或多个固态光源发出。
衬底105可以并且在一些实施例中确实由适合用于用作为用于电子器件的柔性衬底的任何材料或材料的组合而形成。在一些实施例中，衬底105采用柔性片、编织和/或非编织材料、柔性合成物以及它们的组合等的形式。柔性衬底105可以例如并且在一些实施例中确实由任何合适地柔性的材料（诸如但不限制于聚合物、聚合物合成物、聚合物纤维合成物、金属、层压物或它们的组合）形成。可以被用于形成这样的片的合适的聚合物材料的非限制性示例包括可构形的聚合物，诸如聚乙烯（PE）、聚丙烯（PP）、聚对苯二甲酸乙二酯（PET）、聚酰亚胺（PI）、聚酰胺、聚萘二甲酸乙二醇酯（PEN）、聚醚醚酮（PEEK）以及它们的组合等。
多个导体焊盘102-1、102-2、102-3…102-n中的导体焊盘的主体部分110可以并且在一些实施例中确实由具有对于电气应用而言足够的导电率的任何导电材料形成。多个导体焊盘102-1、102-2、102-3…102-n中的导体焊盘在其第一接触区域125和其第二接触区域130之间是电连续的，并且可以并且在一些实施例中确实被以连续的单位形状、或者以具有不连续（诸如在其中的开口）的形状形成。例如，多个导体焊盘102-1、102-2、102-3…102-n可以并且在一些实施例中确实由金属（诸如但不限制于铜、银、金或铝等，包括它们的组合）形成，金属可以被印刷、沉积和/或镀制在柔性衬底105的表面上从而对应于想要的图案。在一些实施例中，例如，多个导体焊盘102-1、102-2、102-3…102-n的一个或多个可以使用已知的显影—蚀刻—剥离（DES）处理而被形成在柔性衬底105上。
多个导体焊盘102-1、102-2、102-3…102-n中的导体焊盘的第一接触区域125和第二接触区域130由导电材料形成，并且可以并且在一些实施例中确实与该导体焊盘的主体部分110集成地形成，或者可以并且在一些实施例中确实被分离地形成并且被电耦接至该导体焊盘的主体部分110。第一接触区域125和第二接触区域130可以以被配置用于与多个电子封装120-1、120-2…120-（n-1）中的一个或多个电子封装电耦接的任何形状或尺寸来形成。当被耦接至多个电子封装120-1、120-2…120-（n-1）中的一个或多个电子封装时，多个导体焊盘102-1、102-2、102-3…102-n中的导体焊盘的第一接触区域125可以被连接为阴极并且该导体焊盘的第二接触区域130可以被连接为阳极。替换地，多个导体焊盘102-1、102-2、102-3…102-n中的导体焊盘的第一接触区域125可以被连接为阳极并且该导体焊盘的第二接触区域130可以被连接为阴极。
使用用于在多个电子封装120-1、120-2…120-（n-1）和多个导体焊盘102-1、102-2、102-3…102-n中的相邻的各导体焊盘的第一接触区域125和第二接触区域130之间建立和/或保持电连接的任何合适的手段，可以将多个电子封装120-1、120-2…120-（n-1）电耦接到多个导体焊盘102-1、102-2、102-3…102-n中的导体焊盘的相邻的各导体焊盘的第一接触区域125和第二接触区域130。例如，在一些实施例中，经由粘接、布线接合、管芯接合、焊接和它们的组合等（未全部示出）来将多个电子封装120-1、120-2…120-（n-1）电耦接到多个导体焊盘102-1、102-2、102-3…102-n中的相邻的各导体焊盘的第一接触区域125和第二接触区域130。
有利地，多个导体焊盘102-1、102-2、102-3…102-n的形状促进多个导体焊盘102-1、102-2、102-3…102-n和柔性电路100（其上多个导体焊盘102-1、102-2、102-3…102-n在由箭头140指示的收卷方向上）的收卷。柔性电路100的收卷可以并且在一些实施例中确实在柔性电路100的卷对卷制造期间以及/或者在柔性电路100的使用期间发生。多个导体焊盘102-1、102-2、102-3…102-n的形状还促进在柔性电路100的操作期间来自多个电子封装120-1、120-2…120-（n-1）的热的扩散。
为了容易解释，图1中图解的实施例100包括被耦接至伸长的柔性衬底105的导体焊盘102-1、102-2、102-3…102-n的单个串联连接的串。然而，要理解的是，柔性衬底105可以并且在一些实施例中确实被以各种形状和大小来提供，并且导体焊盘102-1、102-2、102-3…102-n的任何数量的串联和/或并联连接的串可以并且在一些实施例中确实被提供在柔性衬底105上。另外，图1中示出的多个导体焊盘102-1、102-2、102-3…102-n具有特定的配置。要理解的是，根据在此公开的实施例的导体焊盘102-1、102-2、102-3…102-n可以并且确实被以各种配置来提供（如下面描述那样），并且根据实施例的柔性电路100可以并且确实是利用与本公开一致的任何导体焊盘配置或者与本公开一致的不同的导体焊盘的组合来形成的。
图2图解导体焊盘102a，导体焊盘102a包括接近端部202、远侧端部204以及水平轴206。导体焊盘102a的周界边沿208具有与平行于水平轴206的线212相交的最外侧边沿210。导体焊盘102a的更低的最外侧边沿214与平行于水平轴206的线216相交。周界边沿208的接近的最外端部边沿218与垂直于水平轴206的线220相交，并且周界边沿208的远侧的最外端部边沿222与垂直于水平轴206的线224相交。最外侧边沿210和更低的最外侧边沿214之间的距离限定导体焊盘102a的宽度W，并且接近的最外端部边沿218和远侧的最外端部边沿222之间的距离限定导体焊盘102a的长度L。在图2中，长度L大于宽度W。然而，要理解的是，与本公开一致的导体焊盘（例如导体焊盘102a）可以并且在一些实施例中确实具有小于其宽度W的长度L，或者可以并且在一些实施例中确实具有等于其宽度W的长度L。
导体焊盘102a的第一接触区域125被提供在接近端部202处并且导体焊盘102a的第二接触区域130被提供在远侧端部204处。第一接触区域125和第二接触区域130被水平轴206横贯。在图2中，第一接触区域125和第二接触区域130分别在接近端部202和远侧端部204处形成周界边沿208的部分，并且主体部分110形成周界边沿208的其余部分。然而，要理解的是，第一接触区域125和/或第二接触区域130可以并且在一些实施例中确实被向内地与周界边沿208间隔开，并且周界边沿可以并且在一些实施例中由主体部分110整体地形成。
继续参照图2，周界边沿208具有第一凸起分段A、第二凸起分段B、第三凸起分段C和第四凸起分段D。周界边沿208的凸起分段A、B、C和D被由周界边沿208的一个或多个非凸起分段NC-1、NC-2、NC-3彼此分离开，从而一个或多个非凸起分段NC-1、NC-2、NC-3被部署在凸起分段A、B、C和D中的任意两个之间。在导体焊盘102a中，周界边沿208是关于水平轴206对称的从而凸起分段A、B、C和D以及非凸起分段NC-1、NC-2、NC-3在水平轴206的相对侧上具有对应的凸起分段A1、B1、C1和D1以及非凸起分段NC1-1、NC1-2、NC1-3。
为了容易解释，导体焊盘102a以及与本公开一致的导体焊盘的其它实施例将被与在水平轴206的一侧上（例如，导体焊盘201a的顶侧）的周界边沿208的凸起分段A、B、C和/或D有关地描述。然而，要理解的是，与本公开一致的导体焊盘可以并且在一些实施例中确实具有形成在水平轴206的相对侧上的周界边沿208中的相同数量和配置的凸起分段A1、B1、C1和/或D1、或者不同数量和配置的凸起分段A1、B1、C1和/或D1。与本公开一致的导体焊盘可以并且在一些实施例中确实是关于水平轴对称的或非对称的。
如自始至终地使用的那样，在参照导体焊盘的周界边沿208使用时的术语“凸起分段”提及相对于导体焊盘平均起来为凸起的导体焊盘的周界边沿208的分段。凸起分段不需要具有连续的弧并且可以并且在一些实施例中确实具有一个或一些起伏、不连续和/或中性部分（只要周界边沿208的凸起分段平均起来为凸起的）。如自始至终地使用的那样，在参照导体焊盘的周界边沿208使用时的术语“凹陷分段”提及相对于导体焊盘平均起来为凹陷的导体焊盘的周界边沿208的分段。周界边沿208的凹陷分段不需要具有连续的弧并且可以并且在一些实施例中确实具有一个或一些起伏、不连续和/或中性部分（只要周界边沿208的凹陷分段相对于导体焊盘平均起来为凹陷的）。如自始至终地使用的那样，在参照导体焊盘的周界边沿208使用时的术语“中性分段”提及相对于导体焊盘平均起来不凸起或者相对于导体焊盘平均起来不凹陷的周界边沿208的分段。如自始至终地使用的那样，在参照导体焊盘的周界边沿208使用时的术语“非凸起分段”提及并非为凸起分段的导体焊盘的周界边沿208的分段。在自始至终地示出的实施例中，非凸起分段被图解为凹陷分段。然而，非凸起分段可以并且在一些实施例中确实是中性的分段或凹陷的分段。
在图2中图解的实施例102a中，第一凸起分段A被定位在接近端部202处并且以角度θ1在远离第一接触区域125的方向上向外延伸，然后朝着最外侧边沿210向上转向以限定接近的最外端部边沿218，并且然后在远侧端部204的方向上向内转向以限定第一凸起分段上部最外边沿230。第一凸起分段上部最外边沿230在距水平轴206的距离H1处与平行于水平轴206的线232相交。从垂直于水平轴206的线234测量角度θ1，并且在一些实施例中，θ1为正的角度。第一凸起分段A的向外指向的形状e（即，相对于第一接触区域125向外地）允许第一凸起分段A提供用于扩散由耦接到第一接触区域125和相邻的导体焊盘（例如，导体焊盘102-1、102-2、102-3…102-n（图1））的第二接触区域130的电子封装（例如，封装120-1、120-2…或120-（n-1）（图1））生成的热的热扩散区域。
第一非凸起分段NC-1被部署在第一凸起分段A和第二凸起分段B之间。第一非凸起分段NC-1在远侧端部204的方向上向内延伸并且然后朝着第二凸起分段B向上延伸。
第二凸起分段B以角度θ2在远离水平轴206的方向上从第一非凸起分段NC-1向上延伸，然后在远侧端部204的方向上转向以限定最外侧边沿210，并且然后朝着水平轴206远离最外侧边沿210而向下延伸。最外侧边沿210（由图2中的第二凸起分段B限定）在距水平轴206的距离H2处与线212相交。从垂直于水平轴206的线236测量角度θ2，并且在一些实施例中，θ2为在0度（以及/或者实质上为0度）和45度（以及/或者实质上为45度）之间的正角度（包括0度和45度）。第二凸起分段B的向外指向的形状（即相对于水平轴206向外地）提供促进导体焊盘102a（例如，当导体焊盘102a被耦接至柔性衬底105（图1）时）的热扩散和收卷的导体焊盘102a的增加的宽度。
第二非凸起分段NC-2被部署在第二凸起分段B和第三凸起分段C之间。第二非凸起分段NC-2在水平轴206的方向上从第二凸起分段B向下延伸，并且然后远离水平轴206并朝着第三凸起分段C而向上延伸。
第三凸起分段C远离水平轴206从第二非凸起分段NC-2向上延伸，然后在远侧端部204的方向上转向以限定第三凸起分段上部最外边沿238，并且然后朝着水平轴206远离第三凸起分段上部最边沿238而向下延伸。第三凸起分段上部最外边沿238在距水平轴206的距离H3处与平行于水平轴206的线240相交。
第三非凸起分段NC-3被部署在第三凸起分段C和第四凸起分段D之间。第三非凸起分段NC-3在水平轴206的方向上从第三凸起分段C向下延伸，并且然后远离水平轴206并朝着第四凸起分段D向上延伸。
第四凸起分段D远离水平轴206从第三非凸起分段NC-3向上延伸，然后在远侧端部204的方向上转向以限定第四凸起分段上部最外边沿242，并且然后朝着水平轴206以角度θ3远离第四凸起分段上部最外边沿242而向下延伸以与第二接触区域130相交。第四凸起分段上部最外边沿242在距水平轴的距离H4处与平行于水平轴206的线246相交。从垂直于水平轴206的线244测量角度θ3，并且在一些实施例中角度θ3为在0度（以及/或者实质上为0度）和45度（以及/或者实质上为45度）之间的正角度（包括0度和45度）。第四凸起分段D的向下指向的形状（即朝着第二接触区域130向下地）允许第四凸起分段D的与相邻导体焊盘的第一凸起分段A相邻的定位，其中相邻导体焊盘的第一凸起分段A部分地包围耦接在第一接触区域125和相邻的导体焊盘（例如，导体焊盘102-1、102-2、102-3…102-n（图1））的第二接触区域130之间的电子封装（例如，封装120-1、120-2…或120-（n-1）（图1））。这促进例如在导体焊盘被耦接到柔性衬底105（图1）时的导体焊盘的热扩散和收卷。
在所图解的图2 的导体焊盘102a中，H2>H1,H2>H3>H4,并且H1实质上等于H3。另外，非凸起分段NC-1，NC-2和NC-3被配置为凹陷分段。该配置促进导体焊盘102a在从接近端部202朝向远侧端部204的收卷方向上（如由箭头248指示的那样）的收卷。然而，要理解的是，与本公开一致的导体焊盘可以被以各种配置来提供。例如，在所图解的导体焊盘102a中，H2可以大于或等于H1和H3，并且H3可以大于或等于H4。H1到H3的相对大小可以取决于在第一接触区域125和第二接触区域130之间的想要的距离以及由第一凸起分段A提供的想要的热扩散。因此，H1可以大于或等于H3，或者H3可以大于或等于H1。
与本公开一致的导体焊盘一般地促进从导体焊盘的宽端部（例如，导体焊盘102a的接近端部202）到导体焊盘的窄端部（例如，导体焊盘102a的远侧端部204）收卷。为了促进热扩散，生成大多数热的接触区域125或130可以并且在一些实施例中确实被定位在导体焊盘的宽端部处。例如，对于导体焊盘102a而言，接触区域125可以并且在一些实施例中确实与接触区域130相比生成更多的热并且被定位在导体焊盘120a的接近端部202处以促进热扩散。
与本公开一致的导体焊盘包括至少两个（例如如在图5中示出那样）凸起分段，例如，A,B,C或D，其中至少一个非凸起分段（例如，NC-1，NC-2或NC-3）被部署在水平轴206的每侧上的凸起分段之间，但是可以并且在一些实施例中确实被提供有任何数量的凸起分段。针对与本公开一致的导体焊盘选取的凸起分段的数量可以取决于导体焊盘上的第一接触区域125和第二接触区域130之间的想要的距离和其上形成导体焊盘的柔性电路105（图1）的想要的收卷直径而变化。在与本公开一致的导体焊盘中由非凸起分段分离开的更多的凸起分段可以促进导体焊盘的第一接触区域125和第二接触区域130之间的更长的距离，并且可以允许收卷成更收紧的直径。
图3、图4、图5和图6分别图解与本公开一致的导体焊盘的附加的实施例102b、102c、102d和102e。为了容易解释，将使用在描述图2中图解的导体焊盘102a中所使用的标号来描述导体焊盘102b、102c、102d和102e。特别是，“A分段”将提及在导体焊盘102b、102c、102d或102e的接近端部202处的并且具有图2中的第一凸起分段A的特性的凸起分段。“B分段”将提及紧挨地相邻于“A分段”的凸起分段（在A分段和B分段之间有非凸起分段）。B分段具有图2中的第二凸起分段B的特性。“D分段”将提及在导体焊盘102b、102c、102d和102e的远侧端部204处的并且具有图2中的第四凸起分段D的特性的凸起分段。“C分段”将提及在B分段和D分段之间的凸起分段。C分段具有图2中的第三凸起分段C的特性。与本公开一致的导体焊盘的任何实施例可以包括多个C分段。
图3中图解的导体焊盘102b包括A分段A、B分段B、两个C分段C1和C2，以及D分段。第一C分段C1具有上部最外边沿302，上部最外边沿302在距水平轴206的距离H3-1处与平行于水平轴206的线304相交。第二C分段C2具有上部最外边沿306，上部最外边沿306在距水平轴206的距离H3-2处与平行于水平轴206的线308相交。在所图解的导体焊盘102b中，H2>H1,H2>H3-1,H3-2>H4,并且H1实质上等于H3-1。
第一非凸起分段NC-1被部署在A分段A和B分段B之间。第二非凸起分段NC-2被部署在B分段B和第一C分段C1之间。第三非凸起分段NC-3被部署在第一C分段C1和第二C分段C2之间。第四非凸起分段NC-4被部署在第二C分段C2和D分段D之间。
图4中图解的导体焊盘102c包括A分段A、B分段B以及D分段D，即图4的导体焊盘102c不包括C 分段。第一非凸起分段NC-1被部署在A分段A和B分段B之间。第二非凸起分段NC-2被部署在B分段B和D分段之间。在所图解的导体焊盘102c中，H2>H1>H4。
图5中图解的导体焊盘102d仅包括两个凸起分段，即A分段A和B分段B，即图5的实施例不包括C分段或D分段。第一非凸起分段NC-1被部署在A分段A和B分段B之间。在所图解的导体焊盘102d中，H2>H1。
图6中图解的导体焊盘102e是关于其水平轴206非对称的与本公开一致的导体焊盘的示例。所图解的实施例102e在水平轴206的第一侧（即图6中的顶侧）上包括三个凸起分段，即A分段A、B分段B和D分段D，并且在水平轴206的第二侧上包括三个凸起分段，即A分段A1、B分段B1以及D分段D1。第一非凸起分段NC-1被部署在A分段A和B分段B之间，并且第二非凸起分段NC-2被部署在B分段B和D分段D之间。第一非凸起分段NC1-1被部署在A分段A1和B分段B1之间，并且第二非凸起分段NC1-2被部署在B分段B1和D分段D1之间。在所图解的导体焊盘102e中，H2>H1>H3。
导体焊盘102e包括第一接触区域125-1和第二接触区域130-1。第一接触区域125-1和第二接触区域130-1被相对于水平轴206彼此垂直地间隔开距离d1并且不与水平轴206相交。在这种配置的情况下，电子封装可以并且在一些实施例中确实被耦接到相邻的导体焊盘的被垂直地间隔开的接触区域。例如，如图6中示出那样，电子封装120-1可以被耦接在导体焊盘102e上的接触区域130-1和相邻的导体焊盘（未示出）的接触区域125-2之间。
图7示出柔性衬底1020上的导体焊盘1010-1、1010-2、1010-3以及1010-4的布置1000。尽管图7的布置1000包括四个导体焊盘，但是实施例并非被如此地限制，而是相反地四个焊盘被示出以仅仅为了容易图解而不是限制。布置1000在连续的行中的示出四个导体焊盘1010-1、1010-2、1010-3以及1010-4。在包括导体焊盘1010-1、1010-2、1010-3以及1010-4的平面中，导体焊盘1010-1、1010-2、1010-3以及1010-4具有一般地四边形的形状，其中每个焊盘的两个相对的角部被切除并且剩余的相对的角部在每个相邻的焊盘的方向上略微隆起。中心轴1030被示出为行进通过导体焊盘1010-1、1010-2、1010-3以及1010-4的中心，并且每个焊盘在由中心轴1030接触的焊盘的每侧上具有从焊盘延伸的小的突起，其中，在一些实施例中，小的突起在中心轴1030上居中。在一些实施例中，小的突起充当接触区域。
尽管导体焊盘1010-1、1010-2、1010-3以及1010-4未被与关于图1-图6示出并且描述的导体焊盘类似地构型，但是导体焊盘1010-1、1010-2、1010-3以及1010-4类似地起作用，因为它们使得能够进行柔性衬底1020在中心轴1030的方向上的收卷。导体焊盘1010-1、1010-2、1010-3以及1010-4使得能够在没有削弱电气器件（诸如图1中示出的电封装120中的一个）与导体焊盘1010-1、1010-2、1010-3以及1010-4中的一个或多个之间的接触的情况下进行收卷，并且同时维持良好的热耗散。导体焊盘1010-1、1010-2、1010-3以及1010-4中的每个的相对的突起角部和相对的被切除的角部在柔性衬底1020在中心轴1030的方向上收卷时减小应力。
在其中导体焊盘1010-1、1010-2、1010-3以及1010-4中的一个或多个提供用于一个或多个固态光源的电接触的实施例中，导体焊盘1010-1、1010-2、1010-3以及1010-4的形状的一个进一步的后果—特别是当在阵列中展开时（图7中未示出）—是放置在导体焊盘1010-1、1010-2、1010-3以及1010-4的顶部上的覆盖材料可能在一些位置和/或整体上上升或下落而在覆盖材料中创建小的峰和/或谷。这样的峰和/或谷可能并且在一些实施例中确实通过针对在覆盖材料的外表面附近和/或实质上附近和/或实质上沿着覆盖材料的外表面的光提供成角度的反射从而将有助于来自一个或多个固态光源的整体光分布。在一些实施例中，这是由于导体焊盘1010-1、1010-2、1010-3以及1010-4中的一个或多个的潜在地变化的厚度所致，并且在一些实施例中，这在导体焊盘1010-1、1010-2、1010-3以及1010-4的厚度上没有任何变化和/或实质上没有任何变化的情况下发生。尽管图7的导体焊盘1010-1、1010-2、1010-3以及1010-4的形状与图1-图6中示出的导体焊盘的形状有些不同，但是当由某种类型的覆盖材料（诸如但不限制于层压聚合物（诸如但不限制于PET）的一个或多个层）覆盖时同样的原理应用于图1-图6中示出的任何导体焊盘。这种效果被图解于图8中示出的柔性光引擎1100的横截面视图中。在图8中，柔性光引擎1100包括柔性衬底1120，柔性衬底1120包括一个或多个导体焊盘102、覆盖层1130、以及至少两个固态光源1110A和1110B。导体焊盘102的厚度在一些区域中把覆盖层1130向上推而创建峰，并且在其它区域中导体焊盘102的缺少造成在这样的区域中覆盖层1130更扁平地展开而创建谷。
如在此的任何实施例中使用的那样，“电路”或“线路”例如可以单独地或以任何组合来包括硬布线线路、可编程线路、状态机线路和/或存储由可编程线路执行的指令的固件。
除非另外声明，词语“实质上”的使用可以被解释为包括精确的关系、条件、布置、定向和/或其它特性，以及如由本领域普通技术人员所理解那样的精确的关系、条件、布置、定向和/或其它特性的偏离（在这样的偏离不会本质地影响所公开的方法和系统的程度上）。
贯穿本公开的全体，用以修饰名词的量词“一”和/或“一个”、和/或“这个”的使用可以被理解为为了方便而使用并且包括所修饰的名词的一个或多于一个，除非另外地具体声明。术语“包含”、“包括”以及“具有”意图是包括的并且意味着除了所列出的要素之外可以存在附加的要素。
被描述以及/或者通过各图另外地被描绘以与其它事物通信、关联和/或基于其它事物的元件、组件、模块和/或它们的各部分可以被理解为以直接和/或间接的方式来这样通信于、关联于和或基于其它事物，除非在此另外地规定。
在空间上相对的术语，诸如“在…下方”、“在…下面”、“上部”、“下部”和“在…之上”等可以是为了描述容易而在此被使用以描述一个元件或特征相对于另外的（多个）元件或（多个）特征的关系，如在附图中图解的那样。这些空间上相对的术语意图涵盖除了附图中示出的定向之外的使用或操作中的器件的不同定向。例如，如果附图中的器件被翻转，则被描述为在其它元件或特征的“下面”或在其它元件或特征的“下方”的元件将然后被定向为在其它元件或特征“之上”。因此，示例性的术语“在…下面”可以涵盖在…之上和在…下面的定向这两者。器件可以被另外地定向（被旋转90度或处在其它定向）并且在此所使用的空间上相对的描述符被相应地解释。
尽管已经相对于其具体实施例描述了方法和系统，但是方法和系统并非被这样限制。明显地，根据上面的教导，许多修改和变化可以变得明显。本领域技术人员可以作出在此描述并且图解的各部分的细节、材料以及布置上的许多附加改变。

Claims (22)

1.一种导体焊盘，包括：
第一接触区域；
第二接触区域；以及
主体部分，被配置为在第一接触区域和第二接触区域之间建立导电路径，其中所述第一接触区域和所述第二接触区域被所述导体焊盘的水平轴横贯或者相对于所述水平轴被垂直地彼此间隔开，主体部分包括具有周界边沿的导电材料，周界边沿在所述水平轴的每侧上包括：
第一凸起分段；
第二凸起分段；以及
第一非凸起分段，部署在第一凸起分段和第二凸起分段之间。
2.根据权利要求1所述的导体焊盘，其中第一非凸起分段是凹陷分段。
3.根据权利要求1所述的导体焊盘，其中第一凸起分段在距水平轴的距离H1处具有第一凸起分段最外边沿，并且其中第二凸起分段在距水平轴的距离H2处限定周界边沿的最外边沿，其中距离H2大于距离H1。
4.根据权利要求1所述的导体焊盘，其中第一接触区域和第一凸起分段在导体焊盘的接近端部处，并且第一凸起分段以角度θ1在远离第一接触区域的方向上延伸，其中θ1是正的角度。
5.根据权利要求1所述的导体焊盘，其中第二凸起分段以角度θ2在远离水平轴的方向上从第一非凸起分段向上延伸，其中θ2在0度和45度之间，包括0度和45度。
6.根据权利要求1所述的导体焊盘，包括第三凸起分段和部署在第二凸起分段和第三凸起分段之间的第二非凸起分段。
7.根据权利要求6所述的导体焊盘，其中第二凸起分段在距水平轴的距离H2处限定周界边沿的最外边沿，其中第三凸起分段在距水平轴的距离H3处具有第三凸起分段最外边沿，并且其中距离H2大于距离H3。
8.根据权利要求6所述的导体焊盘，包括第四凸起分段以及部署在第三凸起分段和第四凸起分段之间的第三非凸起分段。
9.根据权利要求8所述的导体焊盘，其中第二凸起分段在距水平轴的距离H2处限定周界边沿的最外边沿，其中第四凸起分段在距水平轴的距离H4处具有第四凸起分段最外边沿，并且其中距离H2大于距离H4。
10.根据权利要求8所述的导体焊盘，其中第四凸起分段以角度θ3朝向第二接触区域向下延伸，其中θ3在0度和45度之间，包括0度和45度。
11.根据权利要求1所述的导体焊盘，其中第一接触区域和第二接触区域与主体部分集成地形成。
12.一种柔性电路，包括：
柔性衬底；
部署在柔性衬底上的多个导体焊盘，多个导体焊盘中的每个包括：
第一接触区域；
第二接触区域；以及
主体部分，被配置为在第一接触区域和第二接触区域之间建立导电路径，其中所述多个导体焊盘中的至少一个导体焊盘的第一接触区域和第二接触区域被该导体焊盘的水平轴横贯，或者相对于该导体焊盘的水平轴被垂直地彼此间隔开；主体部分包括具有周界边沿的导电材料，周界边沿在所述水平轴的每侧上包括：
第一凸起分段；
第二凸起分段；以及
第一非凸起分段，部署在第一凸起分段和第二凸起分段之间；以及
多个电子封装，多个电子封装中的每个被耦接到所述多个导体焊盘中的一个导体焊盘的第一接触区域和所述多个导体焊盘中的一个相邻导体焊盘的第二接触区域。
13.根据权利要求12所述的柔性电路，其中多个导体焊盘中的导体焊盘的至少一个的第一非凸起分段是凹陷分段。
14.根据权利要求12所述的柔性电路，其中多个导体焊盘中的导体焊盘的至少一个的第一凸起分段在距水平轴的距离H1处具有第一凸起分段最外边沿，其中该导体焊盘的第二凸起分段在距水平轴的距离H2处限定周界边沿的最外边沿，并且其中距离H2大于距离H1。
15.根据权利要求12所述的柔性电路，其中多个导体焊盘中的导体焊盘的至少一个的第一接触区域和第一凸起分段在该导体焊盘的接近端部处，并且第一凸起分段以角度θ1在远离第一接触区域的方向上延伸，其中θ1是正的角度。
16.根据权利要求12所述的柔性电路，其中多个导体焊盘中的导体焊盘的至少一个的第二凸起分段以角度θ2在远离水平轴的方向上从第一非凸起分段向上延伸，其中θ2在0度和45度之间，包括0度和45度。
17.根据权利要求12所述的柔性电路，其中多个导体焊盘中的导体焊盘的至少一个包括第三凸起分段和部署在第二凸起分段和第三凸起分段之间的第二非凸起分段。
18.根据权利要求17所述的柔性电路，其中第二凸起分段在距水平轴的距离H2处限定周界边沿的最外边沿，其中第三凸起分段在距水平轴的距离H3处具有第三凸起分段最外边沿，并且其中距离H2大于距离H3。
19.根据权利要求17所述的柔性电路，其中多个导体焊盘中的导体焊盘的至少一个包括第四凸起分段以及部署在第三凸起分段和第四凸起分段之间的第三非凸起分段。
20.根据权利要求19所述的柔性电路，其中第二凸起分段在距水平轴的距离H2处限定周界边沿的最外边沿，其中第四凸起分段在距水平轴的距离距离H4处具有第四凸起分段最外边沿，并且其中距离H2大于距离H4。
21.根据权利要求19所述的柔性电路，其中第四凸起分段以角度θ3朝向第二接触区域向下延伸，其中θ3在0度和45度之间，包括0度和45度。
22.一种构造柔性电路以促进柔性电路的卷对卷制造的方法，所述方法包括：
在柔性衬底上提供多个导体焊盘，导体焊盘的每个包括：
第一接触区域；
第二接触区域；以及
主体部分，被配置为在第一接触区域和第二接触区域之间建立导电路径，其中所述多个导体焊盘中的所述导体焊盘的至少一个的所述第一接触区域和所述第二接触区域被该导体焊盘的水平轴横贯，或者相对于该导体焊盘的水平轴被垂直地彼此间隔开；主体部分包括具有周界边沿的导电材料，周界边沿在所述水平轴的每侧上包括：
第一凸起分段；
第二凸起分段；以及
第一非凸起分段，部署在第一凸起分段和第二凸起分段之间；以及
将多个电子封装耦接到多个导体焊盘，多个电子封装的每个被耦接至所述多个导体焊盘中的一个导体焊盘的第一接触区域以及所述多个导体焊盘中的一个相邻导体焊盘的第二接触区域。
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