CN105555113A

CN105555113A - Shielding cover structure

Info

Publication number: CN105555113A
Application number: CN201610069785.7A
Authority: CN
Inventors: 张海军
Original assignee: Shenzhen Sunway Communication Co Ltd
Current assignee: Shenzhen Sunway Communication Co Ltd
Priority date: 2016-02-01
Filing date: 2016-02-01
Publication date: 2016-05-04
Anticipated expiration: 2036-02-01
Also published as: CN105555113B

Abstract

The invention discloses a shielding cover structure. The shielding cover structure comprises a shielding cover rack and also comprises a flexible printed circuit (FPC), wherein the FPC is bonded with the shielding cover rack by a conductive adhesive layer. With the adoption of the FPC as a shielding cover, metal wiring inside the FPC can achieve a shielding effect, an insulation effect can be achieved by an insulation layer of the shielding cover structure, and the weight of the shielding cover can be greatly reduced; moreover, the FPC is relatively small in volume, the space of other components cannot be compressed; the FPC and the shielding cover rack are bonded by the conducive adhesive layer, the fabrication process is simple, the requirement for a fabrication device is reduced, and the fabrication cost is saved; meanwhile, the FPC is made of a flexible material, the shielding of a space curved-surface product can be achieved; and moreover, heat can be effectively dissipated, the temperature of the whole machine is reduced, and a favorable environment is provided for the running of the whole machine.

Description

Shielding case structure

Technical field

The present invention relates to shielding device field, particularly relate to a kind of shielding case structure.

Background technology

Current scheme is the mode that radome support adds radome cover combination, and as shown in Figure 1, radome shelf 1 and shielding cover cap 2 all adopt metal stamping to complete, and at radome shelf or cover at radome and go out convex closure 3, fastens on other one.But the program has following shortcoming:

A, shielding cover cap need punching press to complete, and material require certain thickness ensures its intensity;

B, diel and board require high, and the management and control of product plane degree is more difficult, and fraction defective is high;

Repeat easy disassembling after c, assembling and produce closure deformation etc., easily produce that shield effectiveness reduces, lid comes off and it is rear be out of shape and the problems such as short circuit that cause interfered by other elements;

D, radome entirety are heavier, increase the space that complete machine weight have compressed other components and parts simultaneously;

E, heat dispersion are poor, easily cause complete machine temperature high;

The equipment cost of f, input is high.

Be in the Chinese patent open file of CN104768358A at publication number, disclose a kind of radome, as shown in Figure 2, comprise support 4 and cover body, the top of described support 4 is provided with hole 6; Described cover body is provided with body 5 and is arranged on the hook body 7 at body 5 edge, and described hook body 7 extends out and matches with described hole 6 shape and position bottom cover body.The problem that when although the program can solve dismounting, lid is easily cashed, but still there are other shortcomings above-mentioned.

Summary of the invention

Technical problem to be solved by this invention is: provide a kind of shielding case structure, when not reducing shield effectiveness, reduces manufacture difficulty, reduces weight and the size of radome, cost-saving.

In order to solve the problems of the technologies described above, the technical solution used in the present invention is: a kind of shielding case structure, comprises radome shelf, also comprises a FPC, and described FPC is bonding with described radome shelf by conductive adhesive layer.

Beneficial effect of the present invention is: by adopting FPC as screening cover, the metal line of FPC inside can reach shield effectiveness, and its insulating barrier then can realize insulation effect, greatly can alleviate the weight of screening cover, and FPC small volume, the space of other components and parts can not be compressed; By the bonding FPC of conductive adhesive layer and radome shelf, manufacture craft is simple, reduces the requirement to making apparatus, has saved cost of manufacture; Simultaneously FPC is flexible material, can the shielding of implementation space curved face product, and can effectively dispel the heat, and reduce complete machine temperature, the operation for complete machine provides good environment.

Accompanying drawing explanation

Fig. 1 is the shielding case structure exploded perspective view of prior art one;

Fig. 2 is the shielding case structure schematic diagram of prior art two;

Fig. 3 is the structural blast schematic diagram of a kind of shielding case structure of the present invention;

Fig. 4 is the overall structure schematic diagram of a kind of shielding case structure of the present invention;

Fig. 5 is the FPC of the embodiment of the present invention one and the structural representation one of conductive adhesive layer;

Fig. 6 is the FPC of the embodiment of the present invention one and the structural representation two of conductive adhesive layer;

Fig. 7 is the FPC of the embodiment of the present invention one and the structural representation three of conductive adhesive layer;

Fig. 8 is the FPC of the embodiment of the present invention two and the structural representation of conductive adhesive layer.

Label declaration:

1, radome shelf; 2, cover cap is shielded; 3, convex closure; 4, support; 5, body; 6, hole; 7, body is hooked; 8, FPC; 9, conductive adhesive layer;

81, the first polyimide layer; 82, the first adhesive linkage; 83, metal level; 84, the second polyimide layer; 85, the second adhesive linkage; 86, the first insulating barrier; 87, the second insulating barrier.

Embodiment

By describing technology contents of the present invention in detail, realized object and effect, accompanying drawing is coordinated to be explained in detail below in conjunction with execution mode.

The design of most critical of the present invention is: by adopting FPC as screening cover, and bonding with radome shelf by conductive adhesive layer, alleviates the weight of radome, reduces manufacture difficulty, cost-saving.

Refer to Fig. 3, a kind of shielding case structure, comprise radome shelf, also comprise a FPC, described FPC is bonding with described radome shelf by conductive adhesive layer.

From foregoing description, beneficial effect of the present invention is: by adopting FPC as screening cover, significantly reduce weight and the size of screening cover while realizing shield effectiveness; Manufacture craft is simple, reduces the requirement to making apparatus, has saved cost of manufacture.

Further, described FPC comprises the first polyimide layer, the first adhesive linkage and metal level, and the one side of described metal level is bonding with described first polyimide layer by described first adhesive linkage.

Further, described metal level is copper.

Seen from the above description, metal level can realize shield effectiveness, polyimide high temperature-resistant and insulation property are high, can guard metal layer, thus ensures shield effectiveness.

Further, the area of described metal level is more than 60% of described first polyimide layer area.

Seen from the above description, ensure shield effectiveness further, and the area of metal level is larger, shield effectiveness is better.

Further, described FPC also comprises the second polyimide layer and the second adhesive linkage, and the another side of described metal level is bonding with described second polyimide layer by described second adhesive linkage.

Seen from the above description, protect metal level further, thus further ensure shield effectiveness.

Further, described FPC also comprises the first insulating barrier, and described first insulating barrier covers described first polyimide layer.

Further, described FPC also comprises the second insulating barrier, and described second insulating barrier covers described second polyimide layer.

Further, described first insulating barrier and the second insulating barrier are dielectric ink.

Seen from the above description, by covering insulating barrier, insulating properties is further enhanced.

Further, the thickness of described FPC is 0.05-0.15mm.

Seen from the above description, substantially reduce the thickness of screening cover, alleviate overall weight and size.

Embodiment one

Please refer to Fig. 3, embodiments of the invention one are: a kind of shielding case structure, can be applicable to the electromagnetic shielding of electric equipment, chips on circuit boards, comprise radome shelf 1, also comprise a FPC8, described FPC8 is bonding with described radome shelf 1 by conductive adhesive layer 9, can form closed cavity when radome is located on chip, thus playing the function of shielding, overall structure is as shown in Figure 4.

As shown in Figure 5, described FPC8 comprises the first polyimide layer 81, first adhesive linkage 82 and metal level 83, and the one side of described metal level 83 is bonding with described first polyimide layer 81 by described first adhesive linkage 82.Preferably, the area of described metal level 83 is more than 60% of described first polyimide layer 81 area, to ensure shield effectiveness.In present embodiment, be bonded to described radome shelf 1 using metal level 83 one side as bonding plane.Preferably, described metal level 83 is copper, can certainly be aluminium or other alloy materials.

Alternatively, as shown in Figure 6, described FPC8 also comprises the first insulating barrier 86, and described first insulating barrier 86 covers described first polyimide layer 81.Alternatively, the area of described first insulating barrier 86 is more than or equal to the area of described first polyimide layer 81.

Alternatively, as shown in Figure 7, described FPC8 also comprises the second insulating barrier 87, and described second insulating barrier 87 covers the another side of described metal level 83.Alternatively, the area of described second insulating barrier 87 is identical with the area of the first insulating barrier 86.

Alternatively, described first insulating barrier 86 and the second insulating barrier 87 are dielectric ink.Described first insulating barrier 86 and the second insulating barrier 87 can be arranged according to product needed.

The thickness of described FPC8 is 0.05-0.15mm.

Described radome can be difformity, such as rule or irregularly shaped, can need setting according to the shape etc. of chip, therefore except the shielding of planar products can be realized, and also can the shielding of implementation space curved face product.

The shielding case structure of the present embodiment, by adopting FPC as screening cover, can alleviate the overall weight of radome greatly, reduce the overall dimensions of radome, and FPC is thinner flexible material, can effectively dispel the heat, reduce complete machine temperature, the operation for complete machine provides good environment; Meanwhile, without the need to special punching press, save equipment cost, and manufacture craft is simple, production efficiency is high.When changing after needs keep in repair chip, directly connect lower FPC layer, because flexible FPC has good toughness, therefore, it is also reusable, and relatively independent metal level has better repeatability and insulation property.

Embodiment two

Please refer to Fig. 8, embodiments of the invention two are the improvement of embodiment one, and something in common is not repeated.

Described FPC8 also comprises the second polyimide layer 84 and the second adhesive linkage 85, and the another side of described metal level 83 is bonding with described second polyimide layer 84 by described second adhesive linkage 85.Alternatively, the area of described second polyimide layer 84 is identical with the area of described first polyimide layer 81.

Alternatively, described FPC8 also comprises the second insulating barrier 87, and described second insulating barrier 87 covers described second polyimide layer 84.Alternatively, the area of described second insulating barrier 87 is identical with the area of the first insulating barrier 86.

The present embodiment, by being also provided with polyimides at the another side of metal level, protects metal level further, metal level is not easily corroded or is destroyed, ensure that shield effectiveness.

In sum, a kind of shielding case structure provided by the invention, by adopting FPC as screening cover, the metal line of FPC inside can reach shield effectiveness, and its insulating barrier then can realize insulation effect, greatly can alleviate the weight of screening cover, and FPC small volume, the space of other components and parts can not be compressed; By the bonding FPC of conductive adhesive layer and radome shelf, manufacture craft is simple, reduces the requirement to making apparatus, has saved cost of manufacture; Simultaneously FPC is flexible material, can the shielding of implementation space curved face product, and can effectively dispel the heat, and reduce complete machine temperature, the operation for complete machine provides good environment.

The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalents utilizing specification of the present invention and accompanying drawing content to do, or be directly or indirectly used in relevant technical field, be all in like manner included in scope of patent protection of the present invention.

Claims

1. a shielding case structure, comprises radome shelf, it is characterized in that, also comprises a FPC, and described FPC is bonding with described radome shelf by conductive adhesive layer.

2. shielding case structure according to claim 1, is characterized in that, described FPC comprises the first polyimide layer, the first adhesive linkage and metal level, and the one side of described metal level is bonding with described first polyimide layer by described first adhesive linkage.

3. shielding case structure according to claim 2, is characterized in that, described metal level is copper.

4. the shielding case structure according to Claims 2 or 3, is characterized in that, the area of described metal level is more than 60% of described first polyimide layer area.

5. shielding case structure according to claim 1, is characterized in that, described FPC also comprises the second polyimide layer and the second adhesive linkage, and the another side of described metal level is bonding with described second polyimide layer by described second adhesive linkage.

6. shielding case structure according to claim 2, is characterized in that, described FPC also comprises the first insulating barrier, and described first insulating barrier covers described first polyimide layer.

7. shielding case structure according to claim 6, is characterized in that, described FPC also comprises the second insulating barrier, and described second insulating barrier covers described second polyimide layer.

8. shielding case structure according to claim 7, is characterized in that, described first insulating barrier and the second insulating barrier are dielectric ink.

9. the shielding case structure according to any one of claim 1-3, is characterized in that, the thickness of described FPC is 0.05-0.15mm.