CN105553504A - Isolated transceiver module and manufacturing method thereof - Google Patents
Isolated transceiver module and manufacturing method thereof Download PDFInfo
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- CN105553504A CN105553504A CN201610027210.9A CN201610027210A CN105553504A CN 105553504 A CN105553504 A CN 105553504A CN 201610027210 A CN201610027210 A CN 201610027210A CN 105553504 A CN105553504 A CN 105553504A
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- 238000002955 isolation Methods 0.000 claims description 239
- 239000000758 substrate Substances 0.000 claims description 18
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- 239000000565 sealant Substances 0.000 claims description 4
- 238000004891 communication Methods 0.000 abstract description 31
- 238000004804 winding Methods 0.000 description 24
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- 230000001070 adhesive effect Effects 0.000 description 2
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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Abstract
The invention discloses an isolated transceiver module and a manufacturing method thereof. The transceiver module comprises an isolated power source, at least two transceiver chips, isolated chips as many as the transceiver chips, a packaging shell and pins in a preset number. Seen from the structure of the transceiver module, the transceiver module comprises at least two transceiver chips which can provide at least two communication interfaces in the same type or different types; the transceiver module provides a driving voltage for the at least two transceiver chips and the isolated chips as many as the transceiver chips by utilizing the isolated power source, so that the volume of the transceiver module is reduced, and the volume of a control system which is established by utilizing the transceiver module is further reduced; furthermore, the whole transceiver module is only fixed for one time when the transceiver module is utilized to establish the control system, so that the establishing efficiency of the control system is increased.
Description
Technical Field
The invention relates to the technical field of communication technology and automation, in particular to an isolation transceiver module and a manufacturing method thereof.
Background
The field bus is widely applied to the fields of communication, vehicle engineering, mechanical automation and the like, and the transceiver module applied to the field bus in the prior art mainly comprises a Controller Area Network (CAN) transceiver module, an RS-485 transceiver module, an RS-422 transceiver module and an RS-232 transceiver module; the CAN transceiver module is mainly applied to the fields of automobile computer control systems, embedded industrial control local area networks and the like; the RS-232 transceiver module is mainly applied to computer control communication; the RS-485 transceiver module can realize the communication transmission of a plurality of communication objects by a single computer.
However, with the continuous improvement of technology, a plurality of communication interfaces of the same type or different types are often required to be adopted in one control system, and this is usually done by arranging the required number and types of transceiver modules in parallel in the control system, which results in a large volume of the control system; and separate fixing operation for each transceiver module is required, which reduces the construction efficiency of the control system.
Disclosure of Invention
The invention provides an isolated transceiver module to solve the problems that a control system constructed by a CAN transceiver module, an RS-485 transceiver module, an RS-422 transceiver module and an RS-232 transceiver module in the prior art is low in efficiency and large in size.
In order to achieve the purpose, the invention provides the following technical scheme:
an isolated transceiver module, the transceiver module comprising: the device comprises an isolation power supply, at least two transceiver chips, isolation chips with the same number as the transceiver chips, a packaging shell and pins with the preset number; wherein,
the isolation power supply is electrically connected with the transceiver chip and the isolation chip and is used for performing power supply isolation on signals received by the isolation power supply and providing driving voltage for the isolation chip and the transceiver chip;
the transceiver chip is used for receiving the isolation signal sent by the isolation chip, sending the isolation signal to the outside and sending the received first external signal to the isolation chip;
the isolation chip is electrically connected with the corresponding transceiver chip and is used for isolating a second external signal received by the isolation chip and sending the second external signal to the transceiver chip, and isolating a signal sent to the isolation chip by the transceiver chip and sending the signal to the outside;
the packaging shell is used for packaging the isolated power supply, at least two transceiver chips and the isolated chips with the same number as the transceiver chips together;
one end of the pins with the preset number is respectively and electrically connected with the isolation power supply, the at least two transceiver chips and the isolation chips with the same number as the transceiver chips, and the other end of the pins penetrates through the packaging shell to serve as a reserved end of the transceiver module.
Preferably, each transceiver chip is one of a CAN transceiver chip, an RS-485 transceiver chip, an RS-232 transceiver chip and an RS-422 transceiver chip.
Preferably, the number of the transceiver chips is 2;
the 2 transceiver chips are respectively a CAN transceiver chip and an RS-485 transceiver chip.
Preferably, the number of the transceiver chips is 2;
the 2 transceiver chips are CAN transceiver chips.
Preferably, the number of the transceiver chips is 3;
the 3 transceiver chips are respectively a CAN transceiver chip, an RS-485 transceiver chip and an RS-232 transceiver chip.
Preferably, the number of the transceiver chips is 4;
the 4 transceiver chips are RS-485 transceiver chips.
Preferably, the isolated power supply is an isolated DC-DC power supply or an isolated AC-DC power supply.
Preferably, the isolated DC-DC power supply comprises an oscillating transformer unit and a rectifier unit; wherein,
the oscillation voltage transformation unit is used for carrying out voltage conversion and isolation on the received signal to obtain an isolated alternating current driving signal;
the rectifying unit is used for converting the isolated alternating current driving signals into direct current power supply voltage and providing driving voltage for the isolation chips and the transceiver chips.
Preferably, the isolated DC-DC power supply comprises an oscillating transformer unit and a number of rectifier units equal to the number of the transceiver chips; wherein,
the oscillation voltage transformation unit is used for performing voltage conversion and isolation on signals received by the oscillation voltage transformation unit to obtain alternating current driving signals with the same number as that of the transceiver chips, and the alternating current driving signals are isolated from each other;
the rectifying units are used for converting the mutually isolated alternating current driving signals into mutually isolated direct current power supply voltages and providing mutually isolated driving voltages for the plurality of isolation chips and the plurality of transceiver chips.
A method of making a transceiver module, comprising:
providing a substrate;
fixing an isolation power supply, at least two transceiver chips and isolation chips with the same number as the transceiver chips on the substrate, wherein the isolation power supply is electrically connected with the transceiver chips and the isolation chips and is used for isolating signals received by the isolation power supply and providing driving voltage for the isolation chips and the transceiver chips; the transceiver chip is used for receiving the isolation signal sent by the isolation chip, sending the isolation signal to the outside and sending the received first external signal to the isolation chip; the isolation chip is electrically connected with the corresponding transceiver chip and is used for isolating a second external signal received by the isolation chip and sending the second external signal to the transceiver chip, and isolating a signal sent to the isolation chip by the transceiver chip and sending the signal to the outside;
inserting pins with a preset number on the substrate, wherein one ends of the pins with the preset number are respectively electrically connected with the isolation power supply, the at least two transceiver chips and the isolation chips with the same number as the transceiver chips, and the other ends of the pins with the preset number are used as reserved ends of the transceiver module;
and packaging the isolation power supply, the at least two transceiver chips, the isolation chips with the same number as the transceiver chips and the pins with the preset number, wherein the reserved ends of the pins with the preset number penetrate through the packaging shell to the outside of the packaging shell.
Preferably, the manufacturing method further comprises:
and pouring sealant into gaps between the packaging shell and the isolation power supply, the at least two transceiver chips and the isolation chips with the same number as the transceiver chips.
Preferably, one end of each of the pins with the preset number is electrically connected to the isolation power supply, and the other end of each of the pins serving as the reserved end of the transceiver module includes:
one ends of the pins with the preset number are electrically connected with the power input end of the isolation power supply, the first grounding end, the second grounding end and the power output end of the isolation power supply, and the other ends of the pins are used as reserved ends of the transceiver module.
Preferably, one end of each of the pins with the preset number is electrically connected to the isolation power supply, and the other end of each of the pins serving as the reserved end of the transceiver module includes:
one end of the pins with the preset number is electrically connected with the power input end of the isolation power supply, the first grounding end and the second grounding end, and the other end of the pins is used as a reserved end of the transceiver module.
It can be seen from the foregoing embodiments that the embodiments of the present invention provide an isolated transceiver module and a method for manufacturing the same; the transceiver module comprises an isolation power supply, at least two transceiver chips, isolation chips with the same number as the transceiver chips, a packaging shell and pins with the preset number. As can be seen from the structure of the transceiver module, the transceiver module comprises at least two transceiver chips, at least two communication interfaces of the same type or different types can be provided, and the transceiver module provides driving voltages for the at least two transceiver chips and the isolation chips with the same number as the transceiver chips by using an isolation power supply, so that the volume of the transceiver module is reduced, and further, the volume of a control system constructed by using the transceiver module is reduced; furthermore, when the control system is constructed by using the transceiver module, the transceiver module is integrally fixed at one time, so that the construction efficiency of the control system is improved.
Generally speaking, for an electronic device, the more complex the signal operation inside the electronic device is, the lower the stability of the electronic device is, and the transceiver module only needs to perform the operations of isolating, receiving and transmitting the received signal, and does not need to perform the complex operation processing on the received signal, so that the transceiver module does not need to introduce a single chip microcomputer or other processing devices to perform the complex operation, and therefore, the transceiver module has high working stability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic connection diagram of an isolated power supply of an isolated transceiver module, at least two transceiver chips, and the same number of isolation chips as the transceiver chips according to an embodiment of the present invention;
FIG. 2 is a circuit diagram of an isolated DC-DC power supply according to one embodiment of the present invention;
fig. 3 is a flowchart of a method for manufacturing an isolated transceiver module according to an embodiment of the present invention;
fig. 4 is a flowchart of a method for manufacturing an isolated transceiver module according to a preferred embodiment of the present invention.
Detailed Description
As described in the background, when a plurality of communication interfaces of the same type or different types are required in a control system in the prior art, the required number and types of transceiver modules are generally arranged in parallel in the control system, which results in a bulky and inefficient construction of the control system.
In view of this, an embodiment of the present invention provides an isolated transceiver module, including: the device comprises an isolation power supply, at least two transceiver chips, isolation chips with the same number as the transceiver chips, a packaging shell and pins with the preset number; wherein,
the isolation power supply is electrically connected with the transceiver chip and the isolation chip and is used for performing power supply isolation on signals received by the isolation power supply and providing driving voltage for the isolation chip and the transceiver chip;
the transceiver chip is used for receiving the isolation signal sent by the isolation chip, sending the isolation signal to the outside and sending the received first external signal to the isolation chip;
the isolation chip is electrically connected with the corresponding transceiver chip and is used for isolating a second external signal received by the isolation chip and sending the second external signal to the transceiver chip, and isolating a signal sent to the isolation chip by the transceiver chip and sending the signal to the outside;
the packaging shell is used for packaging the isolated power supply, at least two transceiver chips and the isolated chips with the same number as the transceiver chips together;
one end of the pins with the preset number is respectively and electrically connected with the isolation power supply, the at least two transceiver chips and the isolation chips with the same number as the transceiver chips, and the other end of the pins penetrates through the packaging shell to serve as a reserved end of the transceiver module.
Correspondingly, the embodiment of the invention also provides a manufacturing method of the transceiver module, which comprises the following steps:
providing a substrate;
fixing an isolation power supply, at least two transceiver chips and isolation chips with the same number as the transceiver chips on the substrate, wherein the isolation power supply is electrically connected with the transceiver chips and the isolation chips and is used for isolating signals received by the isolation power supply and providing driving voltage for the isolation chips and the transceiver chips; the transceiver chip is used for receiving the isolation signal sent by the isolation chip, sending the isolation signal to the outside and sending the received first external signal to the isolation chip; the isolation chip is electrically connected with the corresponding transceiver chip and is used for isolating a second external signal received by the isolation chip and sending the second external signal to the transceiver chip, and isolating a signal sent to the isolation chip by the transceiver chip and sending the signal to the outside;
inserting pins with a preset number on the substrate, wherein one ends of the pins with the preset number are respectively electrically connected with the isolation power supply, the at least two transceiver chips and the isolation chips with the same number as the transceiver chips, and the other ends of the pins with the preset number are used as reserved ends of the transceiver module;
and packaging the isolation power supply, the at least two transceiver chips, the isolation chips with the same number as the transceiver chips and the pins with the preset number, wherein the reserved ends of the pins with the preset number penetrate through the packaging shell to the outside of the packaging shell.
It can be seen from the above technical solutions that the embodiments of the present invention provide an isolated transceiver module and a method for manufacturing the same; the transceiver module comprises an isolation power supply, at least two transceiver chips, isolation chips with the same number as the transceiver chips, a packaging shell and pins with the preset number. As can be seen from the structure of the transceiver module, the transceiver module comprises at least two transceiver chips, at least two communication interfaces of the same type or different types can be provided, and the transceiver module provides driving voltages for the at least two transceiver chips and the isolation chips with the same number as the transceiver chips by using an isolation power supply, so that the volume of the transceiver module is reduced, and further, the volume of a control system constructed by using the transceiver module is reduced; furthermore, when the control system is constructed by using the transceiver module, the transceiver module is integrally fixed at one time, so that the construction efficiency of the control system is improved.
Generally speaking, for an electronic device, the more complex the signal operation inside the electronic device is, the lower the stability of the electronic device is, and the transceiver module only needs to perform the operations of isolating, receiving and transmitting the received signal, and does not need to perform the complex operation processing on the received signal, so that the transceiver module does not need to introduce a single chip microcomputer or other processing devices to perform the complex operation, and therefore, the transceiver module has high working stability.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides an isolated transceiver module, where the transceiver module includes: the device comprises an isolation power supply, at least two transceiver chips, isolation chips with the same number as the transceiver chips, a packaging shell and pins with the preset number; wherein,
the isolation power supply is electrically connected with the transceiver chip and the isolation chip and is used for performing power supply isolation on signals received by the isolation power supply and providing driving voltage for the isolation chip and the transceiver chip;
the transceiver chip is used for receiving the isolation signal sent by the isolation chip, sending the isolation signal to the outside and sending the received first external signal to the isolation chip;
the isolation chip is electrically connected with the corresponding transceiver chip and is used for isolating a second external signal received by the isolation chip and sending the second external signal to the transceiver chip, and isolating a signal sent to the isolation chip by the transceiver chip and sending the signal to the outside;
the packaging shell is used for packaging the isolated power supply, at least two transceiver chips and the isolated chips with the same number as the transceiver chips together;
one end of the pins with the preset number is respectively and electrically connected with the isolation power supply, the at least two transceiver chips and the isolation chips with the same number as the transceiver chips, and the other end of the pins penetrates through the packaging shell to serve as a reserved end of the transceiver module.
On the basis of the above embodiments, in a preferred embodiment of the present invention, each transceiver chip is one of a CAN transceiver chip, an RS-485 transceiver chip, an RS-232 transceiver chip, and an RS-422 transceiver chip.
Fig. 1 is a schematic diagram illustrating a connection relationship between an isolation power supply 100, at least two transceiver chips 300, and the same number of isolation chips 200 as the transceiver chips 300 in a transceiver module according to an embodiment of the present invention. As shown in fig. 1, in the embodiment of the present invention, a power input terminal of the isolation power supply 100 is electrically connected to a voltage input terminal Vin, receives a voltage driving signal output by the voltage input terminal Vin, and starts to operate after receiving the voltage driving signal. Since the isolation chip 200 is composed of two isolated parts, each part can normally work only when a power supply is input, and two isolated power supplies are required to be input in order to achieve the isolation effect, a first power input end of the isolation chip 200 is electrically connected with the voltage input end Vin, a second power input end of the isolation chip 200 is electrically connected with the output end VO of the isolation power supply 100, so that the isolation chip starts to work after receiving a voltage driving signal output by the voltage input end Vin and a driving voltage output by the power output end VO of the isolation power supply 100 at the same time; the power input end of the transceiver chip 300 is electrically connected to the power output end VO of the isolated power supply 100 corresponding thereto, and is configured to receive a driving voltage output by the power output end VO of the isolated power supply 100 as a working trigger signal.
In addition, the signal output end of the isolation chip 200 is electrically connected to the signal input end of the transceiver chip 300 corresponding thereto, and the signal input end of the isolation chip 200 is electrically connected to the signal output end of the transceiver chip 300, and serves as a signal isolation path of the transceiver module, so as to isolate a second external signal received by the isolation chip 200 from a signal sent by the transceiver chip 300 to the isolation chip 200 corresponding thereto; the RXD1 and the TXD1 are reserved connection terminals of the first isolated chip 200, wherein the RXD1 represents a data transmitting terminal, and the TXD1 represents a data receiving terminal; l1 and H1 are reserved connection terminals of the first transceiver chip 300, wherein L1 represents a first signal transmission terminal, and H1 represents a second signal transmission terminal; similarly, RXDn and TXDn are reserved connection ends of the nth isolation chip 200, wherein RXDn represents a data sending end, and TXDn represents a data receiving end; ln and Hn are reserved connection ends of the nth transceiver chip 300, wherein Ln represents a first signal transmission end, Hn represents a second signal transmission end, and n is more than or equal to 2; vin represents a first power input terminal of the isolation power supply 100, a power input terminal of the n isolation chips 200; GND represents the first ground terminals of the isolated power supply 100 and the n isolated chips 200; g1 represents the second ground of the isolated power supply 100, the first isolated chip 200 and the first transceiver chip 300; gn represents a second ground terminal of the isolated power supply 100, the nth isolation chip 200, and the nth transceiver chip 300; VO1, VOn represents the power supply output of the isolated power supply 100.
It should be noted that the power output end of the isolation power supply 100 may be led out to the outside of the package housing through the pin to supply power to other devices or apparatuses, or may not be led out, and only provides driving voltage for the n isolation chips 200 and the n transceiver chips 300; similarly, the isolation power supply 100, the n isolation chips 200, and the n transceiver chips 300 may be led out to the outside of the package through the pins, and connected to other communication port protection devices, such as a Transient Voltage Suppressor (TVS), to provide a leakage path for interference such as static electricity and surge. The present invention is not limited to this, and is determined by the actual situation.
It should be further noted that, in an embodiment of the present invention, the isolation chip 200 is an optical coupling isolation chip; in other embodiments of the present invention, the isolation chip 200 is an electromagnetic isolation chip or a capacitive isolation chip, and the specific composition and the internal structure of the isolation chip 200 are not limited in the present invention, which is determined according to the actual situation.
On the basis of the above embodiments, in an embodiment of the present invention, the transceiver module further includes a potting adhesive, and the potting adhesive is used to fill gaps between the package housing and the isolated power supply 100, the n isolation chips 200, and the n transceiver chips 300, so as to enhance stability between the package housing and the isolated power supply 100, the n isolation chips 200, and the n transceiver chips 300, so that the transceiver module has advantages of moisture resistance and shock resistance.
On the basis of the above embodiment, in another embodiment of the present invention, the number of the transceiver chips 300 is 2;
the 2 transceiver chips 300 are respectively a CAN transceiver chip and an RS-485 transceiver chip.
In this embodiment, the transceiver module has both a CAN communication interface and an RS-485 communication interface, and CAN simultaneously implement transmission of a CAN communication protocol and an RS-485 communication protocol.
On the basis of the above embodiment, in yet another embodiment of the present invention, the number of the transceiver chips 300 is 2;
the 2 transceiver chips 300 are CAN transceiver chips.
In this embodiment, the transceiver module has two CAN transceiver interfaces, which CAN implement two-way CAN communication; in one embodiment of the present invention, the 2 transceiver chips 300 are an RS-485 transceiver chip 300 and an RS-232 transceiver chip 300, respectively. In this embodiment, the transceiver module has both an RS-232 communication interface and an RS-485 communication interface, and can simultaneously implement transmission of the RS-232 communication protocol and the RS-485 communication protocol.
On the basis of the above embodiment, in a preferred embodiment of the present invention, the number of the transceiver chips 300 is 3;
the 3 transceiver chips 300 are respectively a CAN transceiver chip, an RS-485 transceiver chip and an RS-232 transceiver chip.
In this embodiment, the transceiver module has a CAN communication interface, an RS-232 communication interface, and an RS-485 communication interface at the same time, and CAN simultaneously implement transmission of a CAN communication protocol, an RS-232 communication protocol, and an RS-485 communication protocol.
On the basis of the above embodiment, in a preferred embodiment of the present invention, the number of the transceiver chips 300 is 4;
the 4 transceiver chips 300 are RS-485 transceiver chips.
It should be noted that, in this embodiment, the transceiver chip has 4 RS-485 transceiver interfaces, and can implement 4 paths of RS-485 communication. However, in another embodiment of the present invention, the number of the transceiver chips 300 is 3, and the 3 transceiver chips 300 are CAN transceiver chips; in another embodiment of the present invention, the number of the transceiver chips 300 is 4, and the 4 transceiver chips 300 are a CAN transceiver chip, an RS-232 transceiver chip, an RS-485 transceiver chip, and an RS-422 transceiver chip; the number and specific types of the transceiver chips 300 included in the transceiver module are not limited in the present invention, and are determined according to actual situations.
It should be further noted that, in the transceiver module provided in the embodiment of the present invention, one isolation power supply 100 is used to provide driving voltages for at least two transceiver chips 300 and the isolation chips 200 with the same number as the transceiver chips 300, so as to reduce the volume of the transceiver module, and further reduce the volume of a control system constructed by using the transceiver module; furthermore, when the control system is constructed by using the transceiver module, the transceiver module is integrally fixed at one time, so that the construction efficiency of the control system is improved. Generally speaking, for an electronic device, the more complex the signal operation inside the electronic device is, the lower the stability of the electronic device is, and the transceiver module only needs to perform the operations of isolating, receiving and transmitting the received signal, and does not need to perform the complex operation processing on the received signal, so that the transceiver module does not need to introduce a single chip microcomputer or other processing devices to perform the complex operation, and therefore, the transceiver module has high working stability.
On the basis of the above embodiments, in one embodiment of the present invention, the isolated power supply 100 is an isolated DC-DC power supply or an isolated AC-DC power supply. The specific form of the isolated power supply 100 is not limited in the present invention, and is determined according to the actual situation.
On the basis of the above embodiments, in a specific embodiment of the present invention, the isolated DC-DC power supply includes an oscillating transforming unit and a rectifying unit; wherein,
the oscillation voltage transformation unit is used for carrying out voltage conversion and isolation on the received signal to obtain an isolated alternating current driving signal;
the rectifying unit is configured to convert the isolated ac driving signal into a dc power voltage, and provide a driving voltage for the plurality of isolation chips 200 and the plurality of transceiver chips 300.
Fig. 2 is a circuit diagram of an isolated DC-DC power supply according to an embodiment of the present invention, and as shown in fig. 2, the isolated DC-DC power supply is a royer circuit. Wherein the oscillation transforming unit includes: the circuit comprises a first capacitor C1, a second capacitor C3, a starting resistor R1, a first transistor Tr1, a second transistor Tr2 and a toroidal core transformer, wherein the toroidal core transformer comprises a first winding T1-1 and a second winding T1-2. Specifically, two ends of the first capacitor C1 are respectively used as a voltage input terminal Vin and a first ground terminal GND of the isolated DC-DC power supply, and the second capacitor C3 is connected in series with the starting resistor R1 and is connected in parallel with the first capacitor C1; emitters of the first transistor Tr1 and the second transistor Tr2 are commonly connected to the first ground GND; the collectors of the first transistor Tr1 and the second transistor Tr2 are respectively connected with two ends of a primary winding of the first winding T1-1, and the middle tap of the primary winding of the first winding T1-1 is connected with the voltage input terminal Vin; bases of a first transistor Tr1 and a second transistor Tr2 are respectively connected with two ends of the second winding T1-2, and a middle tap of the second winding T1-2 is connected with a connecting node of the starting resistor R1 and the second capacitor C3; the secondary winding of the first winding T1-1 is electrically connected to the rectifying unit.
The rectifying unit includes: a first diode D1, a second diode D2, and a third capacitor C2. Specifically, two ends of the third capacitor C2 are used as a second ground terminal G and a voltage output terminal VO of the isolated DC-DC power supply; cathodes of the first diode D1 and the second diode D2 are commonly connected to a voltage output end VO, anodes of the first diode D1 and the second diode D2 are respectively connected to two ends of a secondary winding of the first winding T1-1, and a center tap of the secondary winding of the first winding T1-1 is connected to the second ground end G.
In this embodiment, the operation principle of the isolated DC-DC power supply is briefly described as follows, when the isolated DC-DC power supply is connected to the power supply, a bias voltage is applied to the first transistor Tr1 and the second transistor Tr2 through the starting resistor R1, and the transistors with low threshold voltages are turned on first due to the non-uniformity of the threshold voltages of the first transistor Tr1 and the second transistor Tr 2. Assuming that the first transistor Tr1 is first turned on, the power voltage is applied to the primary winding of the first winding T1-1, the first transistor Tr1 is fully turned on by the induced voltage of the second winding T1-2, and the second transistor Tr2 is fully turned off. As the current flowing through the first transistor Tr1 increases, the first winding T1-1 is saturated, the second winding T1-2 induces a reverse voltage, so that the first transistor Tr1 is turned off and the second transistor Tr2 is turned on. The above process is repeated to form an oscillating voltage, the voltage conversion and isolation are completed through the first winding T1-1, an isolated ac driving signal is obtained, and the driving voltage is provided for the n isolation chips 200 and the n transceiver chips 300 after rectification through the first diode D1 and the second diode D2.
In this embodiment, the power output terminal VO of the isolation power supply 100 is electrically connected to the second power input terminals of the n isolation chips 200 of the transceiver module, and is electrically connected to the power input terminals of the n transceiver chips 300, that is, VO1 … … VOn is the same output terminal. Similarly, the second ground G of the isolated power supply 100 is electrically connected to the second grounds of the n isolated chips 200 and the n transceiver chips 300 of the transceiver module, i.e., G1 … … Gn is the same ground.
On the basis of the above embodiments, in a preferred embodiment of the present invention, the isolated DC-DC power supply includes an oscillating transformer unit and the same number of rectifier units as the transceiver chips 300; wherein,
the oscillation transformation unit is used for performing voltage conversion and isolation on the received signals to obtain alternating current driving signals with the same number as that of the transceiver chips 300, and the alternating current driving signals are isolated from each other;
the same number of rectifying units as the transceiver chips 300 are configured to convert the mutually isolated ac driving signals into mutually isolated dc power voltages, and provide mutually isolated driving voltages for the plurality of isolation chips 200 and the plurality of transceiver chips 300.
It should be noted that, in this embodiment, the circuit type of the isolated DC-DC power supply is still a roeyer circuit. Unlike the isolated DC-DC power supply described in the previous embodiment, the first winding T1-1 includes the same number of secondary windings as the transceiver chips 300, each secondary winding being connected to a rectifying unit. The advantage of this setting is that the drive voltages output by the isolated DC-DC power supply to the n isolation chips 200 and the n transceiver chips 300 are isolated from each other, so as to ensure normal communication between communication nodes at different potentials, and the problems of communication abnormality and node damage caused by potential inconsistency between nodes do not need to be considered, thereby enhancing the anti-interference capability of the transceiver module.
It should be further noted that, in this embodiment, the power output terminal of the isolation power supply 100 includes VO1 … … VOn, which is electrically connected to the second power input terminals of the n isolation chips 200 of the transceiver module, respectively, and is electrically connected to the power input terminals of the n transceiver chips 300, that is, VO1 … … VOn is n separate output terminals. Similarly, the second ground G1 … … Gn of the isolated power supply 100 is electrically connected to the second grounds of the n isolated chips 200 and the n transceiver chips 300 of the transceiver module, respectively, i.e., G1 … … Gn is n separate grounds.
On the basis of the above embodiment, in another preferred embodiment of the present invention, the oscillating transformer unit completes the functions of performing voltage conversion and isolation on the signals received by the oscillating transformer unit by the same number of transformers as the number of the transceiver chips 300, and acquiring the same number of ac driving signals as the number of the transceiver chips 300. The output winding of each transformer is connected with one of the rectifying units.
The same number of rectifying units as the transceiver chips 300 are configured to convert the mutually isolated ac driving signals into mutually isolated dc power voltages, and provide mutually isolated driving voltages for the plurality of isolation chips 200 and the plurality of transceiver chips 300.
In this embodiment, the oscillation transforming unit of the isolated DC-DC power supply adopts the same number of transformers as the transceiver chips 300 to complete the voltage conversion and isolation of the received signals, and thus obtains the same number of ac driving signals as the transceiver chips 300. The isolation of the driving voltages output by the isolation DC-DC power supply can be realized, and when one transformer fails, the normal operation of other transformers is not influenced, so that the working stability of the isolation DC-DC power supply is improved, and the working stability of the transceiver module is further improved.
It should be noted that, with reference to the above-mentioned setting method of the isolated DC-DC power supply, the isolated AC-DC power supply can also realize mutual isolation between the output driving voltages. Since the structure of the isolated AC-DC power supply is well known to those skilled in the art, the present invention is not described herein.
Correspondingly, an embodiment of the present invention further provides a method for manufacturing a transceiver module, as shown in fig. 3, including:
s101: a substrate is provided.
It should be noted that the substrate includes, but is not limited to, a printed circuit board and a flexible circuit board. The invention is not limited to the specific type of the substrate, which is determined by the actual situation. Since the manufacturing process of the substrate is well known to those skilled in the art, the present invention is not described herein.
S102: fixing an isolation power supply 100, at least two transceiver chips 300 and isolation chips 200 with the same number as the transceiver chips 300 on the substrate, wherein the isolation power supply 100 is electrically connected with the transceiver chips 300 and the isolation chips 200, and is used for performing power supply isolation on signals received by the isolation power supply 100 and providing driving voltage for the isolation chips 200 and the transceiver chips 300; the transceiver chip 300 is configured to receive an isolation signal sent by the isolation chip 200, send the isolation signal to the outside, and send a received first external signal to the isolation chip 200; the isolation chip 200 is electrically connected to the transceiver chip 300 corresponding thereto, and is configured to isolate the second external signal received by the isolation chip 200 and send the second external signal to the transceiver chip 300, and isolate and send the signal sent by the transceiver chip 300 to the isolation chip 200 to the outside.
On the basis of the above embodiments, in an embodiment of the present invention, the fixing process between the isolated power source 100, the at least two transceiver chips 300, the same number of the isolated chips 200 as the transceiver chips 300, and the substrate is a mounting process.
S103: inserting pins with a preset number on the substrate, wherein one ends of the pins with the preset number are respectively electrically connected with the isolation power supply 100, the at least two transceiver chips 300 and the isolation chips 200 with the same number as the transceiver chips 300, and the other ends are reserved ends of the transceiver modules.
It should be noted that, in an embodiment of the present invention, the predetermined number of pins is 13 pins. In another embodiment of the present invention, the preset number of pins is 9 pins; however, the specific number of the pins is not limited in the present invention, and is determined according to the actual situation.
On the basis of the above embodiment, in another embodiment of the present invention, one end of the preset number of pins is electrically connected to the isolated power supply 100, and the other end of the preset number of pins, which is used as a reserved end of the transceiver module, includes:
s1031: one end of the pins with the preset number is electrically connected with the power input end of the isolation power supply 100, the first grounding end, the second grounding end and the power output end of the isolation power supply, and the other end of the pins is used as a reserved end of the transceiver module.
On the basis of the above embodiment, in another embodiment of the present invention, one end of the preset number of pins is electrically connected to the isolated power supply 100, and the other end of the preset number of pins, which is used as a reserved end of the transceiver module, includes:
s1032: one end of the pins with the preset number is electrically connected with the power input end of the isolation power supply 100, the first grounding end and the second grounding end, and the other end is used as a reserved end of the transceiver module.
S104: and packaging the isolation power supply 100, the at least two transceiver chips 300, the isolation chips 200 with the same number as the transceiver chips 300 and the pins with the preset number, wherein the reserved ends of the pins with the preset number penetrate through the packaging shell to the outside of the packaging shell.
On the basis of the above embodiment, in a preferred embodiment of the present invention, the manufacturing method further includes:
s105: and injecting pouring sealant into gaps among the packaging shell, the isolation power supply 100, the at least two transceiver chips 300 and the isolation chips 200 with the same number as the transceiver chips 300.
It should be noted that the purpose of this step is to enhance the robustness between the package and the isolated power source 100, the n isolated chips 200 and the n transceiver chips 300, so that the transceiver module has the advantages of moisture resistance and shock resistance.
On the basis of the above embodiments, an embodiment of the present invention provides a method for manufacturing a transceiver module, as shown in fig. 4, including:
s201: providing a printed circuit board;
s202: fixing an isolation power supply 100, at least two transceiver chips 300 and isolation chips 200 with the same number as the transceiver chips 300 on the substrate, wherein the isolation power supply 100 is electrically connected with the transceiver chips 300 and the isolation chips 200, and is used for performing power supply isolation on signals received by the isolation power supply 100 and providing driving voltage for the isolation chips 200 and the transceiver chips 300; the transceiver chip 300 is configured to receive an isolation signal sent by the isolation chip 200, send the isolation signal to the outside, and send a received first external signal to the isolation chip 200; the isolation chip 200 is electrically connected to the transceiver chip 300 corresponding thereto, and is configured to isolate a second external signal received by the isolation chip 200 and send the second external signal to the transceiver chip 300, and isolate and send a signal sent by the transceiver chip 300 to the isolation chip 200 to the outside; each transceiver chip 300 is one of a CAN transceiver chip, an RS-485 transceiver chip, an RS-232 transceiver chip and an RS-422 transceiver chip;
s203: inserting the pins with the preset number on the substrate, wherein one ends of the pins with the preset number are respectively electrically connected with at least two transceiver chips 300, the isolation chips 200 with the same number as the transceiver chips 300, the power input end, the first grounding end, the second grounding end and the power output end of the isolation power supply 100, and the other ends are used as reserved ends of the transceiver module;
s204: packaging the isolated power supply 100, the at least two transceiver chips 300, the isolated chips 200 with the same number as the transceiver chips 300 and the pins with the preset number, wherein the reserved ends of the pins with the preset number penetrate through the packaging shell to the outside of the packaging shell;
s205: and injecting pouring sealant into gaps among the packaging shell, the isolation power supply 100, the at least two transceiver chips 300 and the isolation chips 200 with the same number as the transceiver chips 300.
In summary, the embodiments of the present invention provide an isolated transceiver module and a method for manufacturing the same; the transceiver module includes an isolated power supply 100, at least two transceiver chips 300, the same number of isolated chips 200 as the transceiver chips 300, a package, and a predetermined number of pins. As can be seen from the structure of the transceiver module, the transceiver module includes at least two transceiver chips 300, which can provide at least two communication interfaces of the same type or different types, and the transceiver module uses one isolation power supply 100 to provide driving voltages for the at least two transceiver chips 300 and the isolation chips 200 with the same number as the transceiver chips 300, so as to reduce the volume of the transceiver module, and further reduce the volume of a control system constructed by using the transceiver module; furthermore, when the control system is constructed by using the transceiver module, the transceiver module is integrally fixed at one time, so that the construction efficiency of the control system is improved.
Generally speaking, for an electronic device, the more complex the signal operation inside the electronic device is, the lower the stability of the electronic device is, and the transceiver module only needs to perform the operations of isolating, receiving and transmitting the received signal, and does not need to perform the complex operation processing on the received signal, so that the transceiver module does not need to introduce a single chip microcomputer or other processing devices to perform the complex operation, and therefore, the transceiver module has high working stability.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (13)
1. An isolated transceiver module, comprising: the device comprises an isolation power supply, at least two transceiver chips, isolation chips with the same number as the transceiver chips, a packaging shell and pins with the preset number; wherein,
the isolation power supply is electrically connected with the transceiver chip and the isolation chip and is used for performing power supply isolation on signals received by the isolation power supply and providing driving voltage for the isolation chip and the transceiver chip;
the transceiver chip is used for receiving the isolation signal sent by the isolation chip, sending the isolation signal to the outside and sending the received first external signal to the isolation chip;
the isolation chip is electrically connected with the corresponding transceiver chip and is used for isolating a second external signal received by the isolation chip and sending the second external signal to the transceiver chip, and isolating a signal sent to the isolation chip by the transceiver chip and sending the signal to the outside;
the packaging shell is used for packaging the isolated power supply, at least two transceiver chips and the isolated chips with the same number as the transceiver chips together;
one end of the pins with the preset number is respectively and electrically connected with the isolation power supply, the at least two transceiver chips and the isolation chips with the same number as the transceiver chips, and the other end of the pins penetrates through the packaging shell to serve as a reserved end of the transceiver module.
2. The transceiver module of claim 1, wherein each transceiver chip is one of a CAN transceiver chip, an RS-485 transceiver chip, an RS-232 transceiver chip, and an RS-422 transceiver chip.
3. The transceiver module of claim 1, wherein the number of transceiver chips is 2;
the 2 transceiver chips are respectively a CAN transceiver chip and an RS-485 transceiver chip.
4. The transceiver module of claim 1, wherein the number of transceiver chips is 2;
the 2 transceiver chips are CAN transceiver chips.
5. The transceiver module of claim 1, wherein the number of transceiver chips is 3;
the 3 transceiver chips are respectively a CAN transceiver chip, an RS-485 transceiver chip and an RS-232 transceiver chip.
6. The transceiver module of claim 1, wherein the number of transceiver chips is 4;
the 4 transceiver chips are RS-485 transceiver chips.
7. The transceiver module of claim 1, wherein the isolated power supply is an isolated DC-DC power supply or an isolated AC-DC power supply.
8. The transceiver module of claim 7, wherein the isolated DC-DC power supply comprises an oscillating transformer unit and a rectifier unit; wherein,
the oscillation voltage transformation unit is used for carrying out voltage conversion and isolation on the received signal to obtain an isolated alternating current driving signal;
the rectifying unit is used for converting the isolated alternating current driving signals into direct current power supply voltage and providing driving voltage for the isolation chips and the transceiver chips.
9. The transceiver module of claim 7, wherein the isolated DC-DC power supply comprises an oscillating transformer unit and a number of rectifier units equal to the number of the transceiver chips; wherein,
the oscillation voltage transformation unit is used for performing voltage conversion and isolation on signals received by the oscillation voltage transformation unit to obtain alternating current driving signals with the same number as that of the transceiver chips, and the alternating current driving signals are isolated from each other;
the rectifying units are used for converting the mutually isolated alternating current driving signals into mutually isolated direct current power supply voltages and providing mutually isolated driving voltages for the plurality of isolation chips and the plurality of transceiver chips.
10. A method of making a transceiver module, comprising:
providing a substrate;
fixing an isolation power supply, at least two transceiver chips and isolation chips with the same number as the transceiver chips on the substrate, wherein the isolation power supply is electrically connected with the transceiver chips and the isolation chips and is used for isolating signals received by the isolation power supply and providing driving voltage for the isolation chips and the transceiver chips; the transceiver chip is used for receiving the isolation signal sent by the isolation chip, sending the isolation signal to the outside and sending the received first external signal to the isolation chip; the isolation chip is electrically connected with the corresponding transceiver chip and is used for isolating a second external signal received by the isolation chip and sending the second external signal to the transceiver chip, and isolating a signal sent to the isolation chip by the transceiver chip and sending the signal to the outside;
inserting pins with a preset number on the substrate, wherein one ends of the pins with the preset number are respectively electrically connected with the isolation power supply, the at least two transceiver chips and the isolation chips with the same number as the transceiver chips, and the other ends of the pins with the preset number are used as reserved ends of the transceiver module;
and packaging the isolation power supply, the at least two transceiver chips, the isolation chips with the same number as the transceiver chips and the pins with the preset number, wherein the reserved ends of the pins with the preset number penetrate through the packaging shell to the outside of the packaging shell.
11. The method of manufacturing of claim 10, further comprising:
and pouring sealant into gaps between the packaging shell and the isolation power supply, the at least two transceiver chips and the isolation chips with the same number as the transceiver chips.
12. The method of claim 10, wherein one end of the predetermined number of pins is electrically connected to the isolated power supply, and the other end of the pins is used as a reserved end of the transceiver module, and the method further comprises:
one ends of the pins with the preset number are electrically connected with the power input end of the isolation power supply, the first grounding end, the second grounding end and the power output end of the isolation power supply, and the other ends of the pins are used as reserved ends of the transceiver module.
13. The method of claim 10, wherein one end of the predetermined number of pins is electrically connected to the isolated power supply, and the other end of the pins is used as a reserved end of the transceiver module, and the method further comprises:
one end of the pins with the preset number is electrically connected with the power input end of the isolation power supply, the first grounding end and the second grounding end, and the other end of the pins is used as a reserved end of the transceiver module.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106708766A (en) * | 2017-01-17 | 2017-05-24 | 广州致远电子股份有限公司 | Protocol conversion isolated interface module |
| CN109951210A (en) * | 2019-02-28 | 2019-06-28 | 北京中科格励微科技有限公司 | RS-232 transceiver is isolated in a kind of single-chip integration formula entirely |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202841176U (en) * | 2012-08-31 | 2013-03-27 | 广州致远电子股份有限公司 | Embedded isolation RS-485 transceiver module |
| CN103179012A (en) * | 2013-03-05 | 2013-06-26 | 湖南开启时代电子信息技术有限公司 | FlexRay network node adopting iCoupler magnetic isolation protecting measures |
| CN203405491U (en) * | 2013-08-09 | 2014-01-22 | 兰吉尔仪表系统（珠海）有限公司 | Support plate circuit used for electrical energy collection terminal and support plate |
| CN203521836U (en) * | 2013-09-22 | 2014-04-02 | 兰吉尔仪表系统（珠海）有限公司 | Interface transition platelet for electrical energy acquisition terminal |
| CN204046638U (en) * | 2014-08-19 | 2014-12-24 | 成都熊谷加世电器有限公司 | For the CAN communication circuit of welding equipment |
| CN104460466A (en) * | 2014-12-25 | 2015-03-25 | 李钢 | CAN isolating circuit |
| CN204733160U (en) * | 2015-05-29 | 2015-10-28 | 深圳宏伟时代自控有限公司 | A kind of RS485 telecommunication circuit of hyper tape isolation |
| CN105141492A (en) * | 2015-09-29 | 2015-12-09 | 广州致远电子股份有限公司 | CAN transmitting-receiving module and manufacturing method thereof |
| CN205336270U (en) * | 2016-01-15 | 2016-06-22 | 广州致远电子股份有限公司 | Keep apart transceiver module |
-
2016
- 2016-01-15 CN CN201610027210.9A patent/CN105553504A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202841176U (en) * | 2012-08-31 | 2013-03-27 | 广州致远电子股份有限公司 | Embedded isolation RS-485 transceiver module |
| CN103179012A (en) * | 2013-03-05 | 2013-06-26 | 湖南开启时代电子信息技术有限公司 | FlexRay network node adopting iCoupler magnetic isolation protecting measures |
| CN203405491U (en) * | 2013-08-09 | 2014-01-22 | 兰吉尔仪表系统（珠海）有限公司 | Support plate circuit used for electrical energy collection terminal and support plate |
| CN203521836U (en) * | 2013-09-22 | 2014-04-02 | 兰吉尔仪表系统（珠海）有限公司 | Interface transition platelet for electrical energy acquisition terminal |
| CN204046638U (en) * | 2014-08-19 | 2014-12-24 | 成都熊谷加世电器有限公司 | For the CAN communication circuit of welding equipment |
| CN104460466A (en) * | 2014-12-25 | 2015-03-25 | 李钢 | CAN isolating circuit |
| CN204733160U (en) * | 2015-05-29 | 2015-10-28 | 深圳宏伟时代自控有限公司 | A kind of RS485 telecommunication circuit of hyper tape isolation |
| CN105141492A (en) * | 2015-09-29 | 2015-12-09 | 广州致远电子股份有限公司 | CAN transmitting-receiving module and manufacturing method thereof |
| CN205336270U (en) * | 2016-01-15 | 2016-06-22 | 广州致远电子股份有限公司 | Keep apart transceiver module |
Non-Patent Citations (3)
| Title |
|---|
| 广州金升科技有限公司: "广州金升阳科技有限公司双路通用型CAN隔离收发模块TDx02DCAN系列技术手册", 《广州金升阳科技有限公司双路通用型CAN隔离收发模块TDX02DCAN系列技术手册》 * |
| 广州金升阳科技有限公司: "CAN隔离收发模块TD302D232H(3.3V供电)、TD502D232H(5.0V供电)技术手册", 《广州金升阳科技有限公司双路通用型CAN隔离收发模块TD302D232H(3.3V供电)、TD502D232H(5.0V供电)技术手册》 * |
| 广州金升阳科技有限公司: "双路高速RS485隔离收发模块(带配电)TDx12P485H系列技术手册", 《广州金升阳科技有限公司双路高速RS485隔离收发模块(带配电)TDX12P485H系列技术手册》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106708766A (en) * | 2017-01-17 | 2017-05-24 | 广州致远电子股份有限公司 | Protocol conversion isolated interface module |
| CN109951210A (en) * | 2019-02-28 | 2019-06-28 | 北京中科格励微科技有限公司 | RS-232 transceiver is isolated in a kind of single-chip integration formula entirely |
| CN109951210B (en) * | 2019-02-28 | 2020-09-01 | 北京中科格励微科技有限公司 | Monolithic integrated full-isolation RS-232 transceiver |
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Application publication date: 20160504 |