CN105549550B - 激光直接成像数据转移方法及装置 - Google Patents
激光直接成像数据转移方法及装置 Download PDFInfo
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- CN105549550B CN105549550B CN201510860765.7A CN201510860765A CN105549550B CN 105549550 B CN105549550 B CN 105549550B CN 201510860765 A CN201510860765 A CN 201510860765A CN 105549550 B CN105549550 B CN 105549550B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000003384 imaging method Methods 0.000 title claims description 76
- 238000012546 transfer Methods 0.000 claims description 13
- 238000000605 extraction Methods 0.000 claims description 5
- 230000008439 repair process Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 3
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- 238000013459 approach Methods 0.000 description 1
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- 238000012790 confirmation Methods 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
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- 238000012795 verification Methods 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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Abstract
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CN201510860765.7A CN105549550B (zh) | 2015-11-30 | 2015-11-30 | 激光直接成像数据转移方法及装置 |
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CN201510860765.7A CN105549550B (zh) | 2015-11-30 | 2015-11-30 | 激光直接成像数据转移方法及装置 |
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CN105549550A CN105549550A (zh) | 2016-05-04 |
CN105549550B true CN105549550B (zh) | 2018-02-02 |
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CN112286009B (zh) * | 2020-09-28 | 2021-06-01 | 江苏迪盛智能科技有限公司 | 一种激光直写成像修正方法、装置、设备及存储介质 |
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EP1130473A2 (en) * | 2000-02-22 | 2001-09-05 | Barco Graphics | A system, method and article of manufacture for direct image processing of printed circuit boards |
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KR20110043898A (ko) * | 2009-10-22 | 2011-04-28 | 주식회사 심텍 | 극미세 회로를 갖는 인쇄회로기판 제조 방법 |
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CN102262358A (zh) * | 2011-04-13 | 2011-11-30 | 合肥芯硕半导体有限公司 | 一种内层板双面对位装置和方法 |
TW201228503A (en) * | 2010-12-22 | 2012-07-01 | Samsung Electro Mech | Method of manufacturing printed circuit board using photosensitive insulator |
CN102573308A (zh) * | 2012-01-12 | 2012-07-11 | 合肥芯硕半导体有限公司 | 印刷电路板图形拼接误差的修正方法 |
CN103028842A (zh) * | 2012-12-28 | 2013-04-10 | 苏州德龙激光股份有限公司 | 激光直接成像加工装置及其方法 |
CN203076787U (zh) * | 2012-12-28 | 2013-07-24 | 苏州德龙激光股份有限公司 | 激光直接成像加工装置 |
CN103298264A (zh) * | 2012-03-02 | 2013-09-11 | 深圳市大族激光科技股份有限公司 | 一种高精度的旋转装置 |
CN103559344A (zh) * | 2013-10-30 | 2014-02-05 | 苏州微影光电科技有限公司 | 一种用于激光直接成像的版图预处理方法 |
CN104080275A (zh) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | 一种阶梯线路板的制作方法 |
CN104185373A (zh) * | 2013-05-27 | 2014-12-03 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板底片 |
CN204440009U (zh) * | 2014-12-29 | 2015-07-01 | 长兴(广州)光电材料有限公司 | 一种用于检验激光直接成像干膜品质的曝光机 |
CN105093856A (zh) * | 2015-09-09 | 2015-11-25 | 合肥芯碁微电子装备有限公司 | 一种激光直接成像设备成像位置误差的检测方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6674564B2 (en) * | 2001-06-15 | 2004-01-06 | Maniabarco, Inc. | System, method and article of manufacture for a beam splitting acousto-optical modulator |
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2015
- 2015-11-30 CN CN201510860765.7A patent/CN105549550B/zh active Active
Patent Citations (16)
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---|---|---|---|---|
EP1130473A2 (en) * | 2000-02-22 | 2001-09-05 | Barco Graphics | A system, method and article of manufacture for direct image processing of printed circuit boards |
CN1658052A (zh) * | 2004-02-13 | 2005-08-24 | 株式会社半导体能源研究所 | 半导体器件及其制备方法,液晶电视系统,和el电视系统 |
KR100922203B1 (ko) * | 2008-04-28 | 2009-10-20 | 주식회사 프로텍 | 레이저 디렉트 이미징 시스템용 상하부 노광 엔진의위치정렬방법 및 장치 |
KR20110043898A (ko) * | 2009-10-22 | 2011-04-28 | 주식회사 심텍 | 극미세 회로를 갖는 인쇄회로기판 제조 방법 |
CN201821580U (zh) * | 2010-09-30 | 2011-05-04 | 北大方正集团有限公司 | 电路板底片管理系统及底片信息处理设备 |
TW201228503A (en) * | 2010-12-22 | 2012-07-01 | Samsung Electro Mech | Method of manufacturing printed circuit board using photosensitive insulator |
CN102262358A (zh) * | 2011-04-13 | 2011-11-30 | 合肥芯硕半导体有限公司 | 一种内层板双面对位装置和方法 |
CN102573308A (zh) * | 2012-01-12 | 2012-07-11 | 合肥芯硕半导体有限公司 | 印刷电路板图形拼接误差的修正方法 |
CN103298264A (zh) * | 2012-03-02 | 2013-09-11 | 深圳市大族激光科技股份有限公司 | 一种高精度的旋转装置 |
CN103028842A (zh) * | 2012-12-28 | 2013-04-10 | 苏州德龙激光股份有限公司 | 激光直接成像加工装置及其方法 |
CN203076787U (zh) * | 2012-12-28 | 2013-07-24 | 苏州德龙激光股份有限公司 | 激光直接成像加工装置 |
CN104185373A (zh) * | 2013-05-27 | 2014-12-03 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板底片 |
CN103559344A (zh) * | 2013-10-30 | 2014-02-05 | 苏州微影光电科技有限公司 | 一种用于激光直接成像的版图预处理方法 |
CN104080275A (zh) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | 一种阶梯线路板的制作方法 |
CN204440009U (zh) * | 2014-12-29 | 2015-07-01 | 长兴(广州)光电材料有限公司 | 一种用于检验激光直接成像干膜品质的曝光机 |
CN105093856A (zh) * | 2015-09-09 | 2015-11-25 | 合肥芯碁微电子装备有限公司 | 一种激光直接成像设备成像位置误差的检测方法 |
Non-Patent Citations (4)
Title |
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国内激光直接成像(LDI)技术;张国龙,马 迪;《印制电路信息》;20110831(第8期);全文 * |
基于LDI的PCB光刻系统关键技术研究;陈静秋;《中国博士学位论文全文数据库》;20150730;全文 * |
提升P C B 性能的激光直接成像技术;胡志勇;《印制电路信息》;20080331(第8期);全文 * |
激光直接成像技术1传统的图像转移工艺面临着的挑战;林金堵;《印制电路信息》;20011015(第10期);全文 * |
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Effective date of registration: 20220713 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: Floor 9, founder building, No. 298, Chengfu Road, Haidian District, Beijing 100871 Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. |