CN105532828A - Pumpkin crispy cakes and preparing method thereof - Google Patents
Pumpkin crispy cakes and preparing method thereof Download PDFInfo
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- CN105532828A CN105532828A CN201610084679.6A CN201610084679A CN105532828A CN 105532828 A CN105532828 A CN 105532828A CN 201610084679 A CN201610084679 A CN 201610084679A CN 105532828 A CN105532828 A CN 105532828A
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- pumpkin
- short
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- cakes
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- A—HUMAN NECESSITIES
- A21—BAKING; EDIBLE DOUGHS
- A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
- A21D2/00—Treatment of flour or dough by adding materials thereto before or during baking
- A21D2/08—Treatment of flour or dough by adding materials thereto before or during baking by adding organic substances
- A21D2/36—Vegetable material
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- Food Science & Technology (AREA)
- Preparation Of Fruits And Vegetables (AREA)
- Seeds, Soups, And Other Foods (AREA)
Abstract
The invention discloses pumpkin crispy cakes and a preparing method thereof. The pumpkin crispy cakes are prepared from oil skin, short and pumpkin stuffing. The pumpkin stuff is prepared from pumpkin, sugar, edible oil, non-glutinous flour and salt. The oil skin is prepared from low-gluten flour, high-gluten flour, edible oil, sugar and water. The short is prepared from low-gluten flour and edible oil. The skin of the pumpkin crispy cakes is crispy and thin, the pumpkin stuff is crystal clear and chewy, the taste is pure and distinctive, and the pumpkin crispy cakes taste crispy and delicious. The preparing method is simple, and operation is convenient.
Description
Technical field
The invention belongs to food cake field, relate to a kind of pumpkin crisp short cakes with sesame and preparation method thereof.
Background technology
All kinds of cooked wheaten food cake is of a great variety in the market, more particularly has the typical local food of local characteristic to be more and more subject to liking of people, but some crisps short cakes with sesame that market is sold, be of rude workmanship, the sense of filling interest is not good, lacks characteristic.
Summary of the invention
The object of the present invention is to provide a kind of pumpkin crisp short cakes with sesame and preparation method thereof.
The technical solution adopted in the present invention is:
A kind of pumpkin crisp short cakes with sesame, be made up of the outermost layer of skin, short and pumpkin filling, pumpkin filling is made up of following parts by weight of component: 90 ~ 100 parts, pumpkin, sugar 10 ~ 25 parts, edible oil 1 ~ 3 part, step on 1 ~ 3 part, flour, salt 0.02 ~ 0.04 part; The outermost layer of skin is made up of following parts by weight of component: weak strength flour 30 ~ 50 parts, high-strength flour 50 ~ 70 parts, lard 10 ~ 25 parts, sugar 5 ~ 15 parts, 45 ~ 65 parts, water; Short is made up of following parts by weight of component: weak strength flour 90 ~ 100 parts, lard 50 ~ 70 parts.
The preparation method of above-mentioned a kind of pumpkin crisp short cakes with sesame, comprises the following steps:
1) make pumpkin filling: pumpkin is dug silk, blanching, water squeezing, add granulated sugar and stir-fry, then add successively and step on the frying together of flour, oil generation, salt, off the pot, cooling, obtains pumpkin filling;
2) raw material of the outermost layer of skin, short mixed respectively and knead;
3) outermost layer of skin and short mixing are rolled and made short skin;
4) slabbing is rolled in the segmentation of short skin, pumpkin filling is put into short skin and is bundled into raw pie;
5) raw pie is put into the roasting training of baking box, obtain pumpkin crisp short cakes with sesame.
Preferably, roasting Pei Wendu 170 ~ 190 DEG C.
Preferably, roasting training time 20 ~ 25min.
Preferably, before baking box put into by raw pie, coat egg yolk liquid on the surface at raw pie.
The invention has the beneficial effects as follows:
The cake skin crisp-fried of pumpkin crisp short cakes with sesame of the present invention is frivolous, and pumpkin filling is glittering and translucent, and band flexible, good taste, characteristic, delicious and crisp of tasting is weak good to eat.Preparation method of the present invention is simple, easy to operate.
Specific embodiment
Below in conjunction with specific embodiment, the present invention is further illustrated, but do not limit to so.
Embodiment 1
A kind of pumpkin crisp short cakes with sesame, be made up of the outermost layer of skin, short and pumpkin filling, pumpkin filling is made up of following parts by weight of component: 100 parts, pumpkin, granulated sugar 15 parts, 1 part, soya-bean oil, step on 1 part, flour, salt 0.02 part; The outermost layer of skin is made up of following parts by weight of component: weak strength flour 40 parts, high-strength flour 60 parts, lard 15 parts, granulated sugar 10 parts, 55 parts, water; Short is made up of following parts by weight of component: weak strength flour 100 parts, lard 60 parts.
The preparation method of above-mentioned pumpkin crisp short cakes with sesame, comprises the following steps:
1) make pumpkin filling: pumpkin is dug silk, blanching, water squeezing, add granulated sugar and stir-fry, then add successively and step on the frying together of flour, oil generation, salt, off the pot, cooling, obtains pumpkin filling;
2) raw material of the outermost layer of skin, short mixed respectively and knead;
3) by the outermost layer of skin and short by 2: 3 weight ratio mixing roll and make short skin;
4) slabbing is rolled in the segmentation of short skin, pumpkin filling is put into short skin and be bundled into raw pie (weight ratio of short skin and pumpkin filling is 2: 3), closing in must raw pie after clutching, and the closing in of raw pie is arranged in down in baking tray;
5) brush egg yolk liquid on the surface at raw pie, and sprinkle sesame, make a call to three holes on the surface at raw pie;
6) put raw pie into baking box, 170 ~ 190 DEG C of roasting training 23min, obtain pumpkin crisp short cakes with sesame.
Embodiment 2
A kind of pumpkin crisp short cakes with sesame, be made up of the outermost layer of skin, short and pumpkin filling, pumpkin filling is made up of following parts by weight of component: 95 parts, pumpkin, granulated sugar 10 parts, peanut oil 2 parts, step on 3 parts, flour, salt 0.04 part; The outermost layer of skin is made up of following parts by weight of component: weak strength flour 50 parts, high-strength flour 70 parts, lard 25 parts, granulated sugar 15 parts, 45 parts, water; Short is made up of following parts by weight of component: weak strength flour 90 parts, lard 50 parts.
The preparation method of above-mentioned pumpkin crisp short cakes with sesame, comprises the following steps:
1) make pumpkin filling: pumpkin is dug silk, blanching, water squeezing, add granulated sugar and stir-fry, then add successively and step on the frying together of flour, oil generation, salt, off the pot, cooling, obtains pumpkin filling;
2) raw material of the outermost layer of skin, short mixed respectively and knead;
3) by the outermost layer of skin and short by 2: 3 weight ratio mixing roll and make short skin;
4) slabbing is rolled in the segmentation of short skin, pumpkin filling is put into short skin and be bundled into raw pie (weight ratio of short skin and pumpkin filling is 2: 3), closing in must raw pie after clutching, and the closing in of raw pie is arranged in down in baking tray;
5) brush egg yolk liquid on the surface at raw pie, and sprinkle sesame, make a call to three holes on the surface at raw pie;
6) put raw pie into baking box, 170 ~ 190 DEG C of roasting training 25min, obtain pumpkin crisp short cakes with sesame.
Embodiment 3
A kind of pumpkin crisp short cakes with sesame, be made up of the outermost layer of skin, short and pumpkin filling, pumpkin filling is made up of following parts by weight of component: 90 parts, pumpkin, granulated sugar 25 parts, 3 parts, soya-bean oil, step on 2 parts, flour, salt 0.03 part; The outermost layer of skin is made up of following parts by weight of component: weak strength flour 30 parts, high-strength flour 50 parts, lard 10 parts, granulated sugar 5 parts, 65 parts, water; Short is made up of following parts by weight of component: weak strength flour 95 parts, lard 70 parts.
The preparation method of above-mentioned pumpkin crisp short cakes with sesame, comprises the following steps:
1) make pumpkin filling: pumpkin is dug silk, blanching, water squeezing, add granulated sugar and stir-fry, then add successively and step on the frying together of flour, oil generation, salt, off the pot, cooling, obtains pumpkin filling;
2) raw material of the outermost layer of skin, short mixed respectively and knead;
3) by the outermost layer of skin and short by 2: 3 weight ratio mixing roll and make short skin;
4) slabbing is rolled in the segmentation of short skin, pumpkin filling is put into short skin and be bundled into raw pie (weight ratio of short skin and pumpkin filling is 2: 3), closing in must raw pie after clutching, and the closing in of raw pie is arranged in down in baking tray;
5) brush egg yolk liquid on the surface at raw pie, and sprinkle sesame, make a call to three holes on the surface at raw pie;
6) put raw pie into baking box, 170 ~ 190 DEG C of roasting training 20min, obtain pumpkin crisp short cakes with sesame.
Claims (5)
1. a pumpkin crisp short cakes with sesame, is made up of the outermost layer of skin, short and pumpkin filling, and the raw material of pumpkin filling is made up of following parts by weight of component: 90 ~ 100 parts, pumpkin, sugar 10 ~ 25 parts, edible oil 1 ~ 3 part, step on 1 ~ 3 part, flour, salt 0.02 ~ 0.04 part; The raw material of the outermost layer of skin is made up of following parts by weight of component: weak strength flour 30 ~ 50 parts, high-strength flour 50 ~ 70 parts, lard 10 ~ 25 parts, sugar 5 ~ 15 parts, 45 ~ 65 parts, water; The raw material of short is made up of following parts by weight of component: weak strength flour 90 ~ 100 parts, lard 50 ~ 70 parts; Its preparation method, comprises the following steps:
1) make pumpkin filling: pumpkin is dug silk, blanching, water squeezing, then add granulated sugar and stir-fry, then add successively and step on the frying together of flour, oil generation, salt, off the pot, cooling, obtains pumpkin filling;
2) raw material of the outermost layer of skin, short mixed respectively and knead;
3) outermost layer of skin and short mixing are rolled and made short skin;
4) slabbing is rolled in the segmentation of short skin, pumpkin filling is put into short skin and is bundled into raw pie;
5) raw pie is put into the roasting training of baking box, obtain pumpkin crisp short cakes with sesame.
2. pumpkin crisp short cakes with sesame according to claim 1, is characterized in that: roasting Pei Wendu 170 ~ 190 DEG C.
3. pumpkin crisp short cakes with sesame according to claim 1, is characterized in that: roasting training time 20 ~ 25min.
4. pumpkin crisp short cakes with sesame according to claim 1, is characterized in that: step 2) outermost layer of skin, short roll make short skin by the weight ratio mixing of 2: 3.
5. pumpkin crisp short cakes with sesame according to claim 1, is characterized in that: step 4) weight ratio of short skin and pumpkin filling is 2: 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610084679.6A CN105532828A (en) | 2016-02-14 | 2016-02-14 | Pumpkin crispy cakes and preparing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610084679.6A CN105532828A (en) | 2016-02-14 | 2016-02-14 | Pumpkin crispy cakes and preparing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN105532828A true CN105532828A (en) | 2016-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610084679.6A Pending CN105532828A (en) | 2016-02-14 | 2016-02-14 | Pumpkin crispy cakes and preparing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106577956A (en) * | 2016-12-30 | 2017-04-26 | 三只松鼠股份有限公司 | Seaweed cake and preparation method thereof |
| CN107136165A (en) * | 2017-06-28 | 2017-09-08 | 福建生物工程职业技术学院 | A kind of enoki mushroom roots powder processing pie and preparation method thereof |
| CN107691582A (en) * | 2017-11-14 | 2018-02-16 | 段双燕 | A kind of fermented bean curd crisp short cakes with sesame and preparation method thereof |
-
2016
- 2016-02-14 CN CN201610084679.6A patent/CN105532828A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106577956A (en) * | 2016-12-30 | 2017-04-26 | 三只松鼠股份有限公司 | Seaweed cake and preparation method thereof |
| CN107136165A (en) * | 2017-06-28 | 2017-09-08 | 福建生物工程职业技术学院 | A kind of enoki mushroom roots powder processing pie and preparation method thereof |
| CN107691582A (en) * | 2017-11-14 | 2018-02-16 | 段双燕 | A kind of fermented bean curd crisp short cakes with sesame and preparation method thereof |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160504 |
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| WD01 | Invention patent application deemed withdrawn after publication |