CN105529295A - Wafer clamping device - Google Patents
Wafer clamping device Download PDFInfo
- Publication number
- CN105529295A CN105529295A CN201410513082.XA CN201410513082A CN105529295A CN 105529295 A CN105529295 A CN 105529295A CN 201410513082 A CN201410513082 A CN 201410513082A CN 105529295 A CN105529295 A CN 105529295A
- Authority
- CN
- China
- Prior art keywords
- wafer
- clamping device
- hold assembly
- wafer clamping
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer clamping device. Through the wafer clamping device, a wafer can be automatically clamped when a wafer chuck rotates in a high speed, and automatic resetting is realized when the wafer chuck stops rotating in a low speed. The wafer clamping device is characterized by comprising a seat and a clamping part, wherein the seat is provided with a notch, the clamping part is movably mounted at the notch of the seat, and the clamping part under the acting force swings back and forth.
Description
Technical field
The present invention relates to the accessory on a kind of wafer chuck, particularly relate to the device realizing wafer holding function when wafer chuck High Rotation Speed.
Background technology
Wafer chuck is for carrying wafer, and in some technique, wafer chuck needs High Rotation Speed, such as, in wafer cleaning equipment cavity, in order to liquid residual on cleaning wafer, needs wafer card dribbling to move wafer High Rotation Speed.
And if wafer can not be very firm be fixed on chuck, so just easily loosen when High Rotation Speed, cause the parts of wafer and fixing wafer to rub, cause the cut on wafer.
In addition, in other technique, fixing wafer not stably also easily has influence on the implementation result of this technique in High Rotation Speed.
Summary of the invention
Below provide the brief overview of one or more aspect to provide the basic comprehension to these aspects.Detailed the combining of this not all aspect contemplated of general introduction is look at, and both not intended to be pointed out out the scope of key or decisive any or all aspect of elements nor delineate of all aspects.Its unique object is the sequence that some concepts that will provide one or more aspect in simplified form think the more detailed description provided after a while.
The object of the invention is to solve the problem, provide a kind of wafer clamping device, automatically can clamp wafer when wafer chuck High Rotation Speed, and automatically reset when wafer chuck low speed stops.
Technical scheme of the present invention is: present invention is disclosed a kind of wafer clamping device, comprises stand and hold assembly, stand has a breach, and hold assembly is arranged on the indentation, there of stand in mobilizable mode, swing under active force.
According to an embodiment of wafer clamping device of the present invention, a pouring weight is filled in the inside of hold assembly.
According to an embodiment of wafer clamping device of the present invention, the material of this pouring weight is stainless steel.
According to an embodiment of wafer clamping device of the present invention, the material of the shell of hold assembly is plastics.
According to an embodiment of wafer clamping device of the present invention, wafer clamping device is arranged on the edge of wafer chuck, when the rotary speed of wafer chuck is higher than a limit value, hold assembly clamps wafer by centrifugal action, when the rotary speed of wafer chuck is lower than this limit value, hold assembly is resetted by self gravitation effect.
The present invention contrasts prior art following beneficial effect: wafer clamping device of the present invention clamps wafer when chuck High Rotation Speed by centrifugal action, and when chuck low speed stops, this device can be resetted by self gravitation effect again.
Accompanying drawing explanation
Fig. 1 is total view of the preferred embodiment of wafer clamping device of the present invention.
Fig. 2 shows total view of the hold assembly in Fig. 1 embodiment.
Fig. 3 shows the front view of hold assembly.
Fig. 4 shows the cutaway view of hold assembly.
Embodiment
After the detailed description of reading embodiment of the present disclosure in conjunction with the following drawings, above-mentioned feature and advantage of the present invention can be understood better.In the accompanying drawings, each assembly is not necessarily drawn in proportion, and the assembly with similar correlation properties or feature may have identical or close Reference numeral.
Fig. 1 is total view of the preferred embodiment of wafer clamping device of the present invention.Refer to Fig. 1, the wafer clamping device of the present embodiment comprises stand 1 and hold assembly 2, stand 1 has a breach 10, and hold assembly 2 is arranged on breach 10 place of stand in mobilizable mode, swing under active force.
Fig. 2, Fig. 3 and Fig. 4 respectively illustrate total view of hold assembly, front view and cutaway view.Please simultaneously see Fig. 2 to Fig. 4, a pouring weight 22 is as shown in Figure 4 filled in the inside of hold assembly 2, and material is stainless steel.The material density of the shell of hold assembly 2 is lower than the material density of inside stuffing, and such as shell 21 is plastic material (PVT).The design of two-layer material can be that the swing of hold assembly 2 is more effective.
The operation principle of wafer clamping device is: clamping device is arranged on the edge of wafer chuck, when the rotary speed of wafer chuck is higher than a limit value, hold assembly clamps wafer by centrifugal action, when the rotary speed of wafer chuck is lower than this limit value, hold assembly is resetted by self gravitation effect.
Wafer clamping device is equally spaced in the distribution of wafer card plate edge, and quantity can be multiple, is generally even number, preferably 6.
Thering is provided previous description of the present disclosure is for making any person skilled in the art all can make or use the disclosure.To be all apparent for a person skilled in the art to various amendment of the present disclosure, and generic principles as defined herein can be applied to other variants and can not depart from spirit or scope of the present disclosure.Thus, the disclosure not intended to be is defined to example described herein and design, but the widest scope consistent with principle disclosed herein and novel features should be awarded.
Claims (5)
1. a wafer clamping device, comprises stand and hold assembly, it is characterized in that, stand has a breach, and hold assembly is arranged on the indentation, there of stand in mobilizable mode, swing under active force.
2. wafer clamping device according to claim 1, is characterized in that, a pouring weight is filled in the inside of hold assembly.
3. wafer clamping device according to claim 2, is characterized in that, the material of this pouring weight is stainless steel.
4. wafer clamping device according to claim 1, is characterized in that, the material of the shell of hold assembly is plastics.
5. wafer clamping device according to claim 1, it is characterized in that, wafer clamping device is arranged on the edge of wafer chuck, when the rotary speed of wafer chuck is higher than a limit value, hold assembly clamps wafer by centrifugal action, when the rotary speed of wafer chuck is lower than this limit value, hold assembly is resetted by self gravitation effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410513082.XA CN105529295A (en) | 2014-09-29 | 2014-09-29 | Wafer clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410513082.XA CN105529295A (en) | 2014-09-29 | 2014-09-29 | Wafer clamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105529295A true CN105529295A (en) | 2016-04-27 |
Family
ID=55771432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410513082.XA Pending CN105529295A (en) | 2014-09-29 | 2014-09-29 | Wafer clamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105529295A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109967480A (en) * | 2018-12-03 | 2019-07-05 | 杭州众硅电子科技有限公司 | It is a kind of for drying the fastening structure of wafer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007099976A1 (en) * | 2006-02-22 | 2007-09-07 | Ebara Corporation | Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device |
| CN102543818A (en) * | 2012-01-09 | 2012-07-04 | 北京七星华创电子股份有限公司 | Balance wafer clamping device |
| CN102820246A (en) * | 2011-06-09 | 2012-12-12 | 承澔科技股份有限公司 | Component shifting device with floating guiding centralizing mechanism |
-
2014
- 2014-09-29 CN CN201410513082.XA patent/CN105529295A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007099976A1 (en) * | 2006-02-22 | 2007-09-07 | Ebara Corporation | Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device |
| CN102820246A (en) * | 2011-06-09 | 2012-12-12 | 承澔科技股份有限公司 | Component shifting device with floating guiding centralizing mechanism |
| CN102543818A (en) * | 2012-01-09 | 2012-07-04 | 北京七星华创电子股份有限公司 | Balance wafer clamping device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109967480A (en) * | 2018-12-03 | 2019-07-05 | 杭州众硅电子科技有限公司 | It is a kind of for drying the fastening structure of wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 201203 building 4, No. 1690, Cailun Road, free trade zone, Pudong New Area, Shanghai Applicant after: Shengmei semiconductor equipment (Shanghai) Co., Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Cailun Road No. fourth 1690 Applicant before: ACM (SHANGHAI) Inc. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160427 |
|
| RJ01 | Rejection of invention patent application after publication |