CN105517395A - Spiral type self-adaptive encapsulation device with high temperature and high pressure resistance function - Google Patents
Spiral type self-adaptive encapsulation device with high temperature and high pressure resistance function Download PDFInfo
- Publication number
- CN105517395A CN105517395A CN201510852630.6A CN201510852630A CN105517395A CN 105517395 A CN105517395 A CN 105517395A CN 201510852630 A CN201510852630 A CN 201510852630A CN 105517395 A CN105517395 A CN 105517395A
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- China
- Prior art keywords
- encapsulation
- high temperature
- circular
- cover plate
- packaging system
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
Abstract
The invention discloses a spiral type self-adaptive encapsulation device with a high temperature and high pressure resistance function. The encapsulation device comprises an encapsulation shell body, an encapsulation cover plate and a stress bearing plate; one end of the encapsulation shell body is closed, and the other end of the encapsulation shell body is an open circular shell; the inner bottom surface of the circular shell is provided with a circular groove; a limiting stage which is of a symmetric structure relative to the diameter of the circular shell is radially machined at the inner circumferential surface of the circular shell according to the shape of an assembled chip; a circular ring supporting stage which extends radially is arranged at the inner circumferential surface of the circular shell; the outer periphery of the encapsulation shell body is provided with screw threads; one end surface of the encapsulation cover plate is provided with an annular protruding edge; the section of the protruding edge is a triangle; the other end of the encapsulation cover plate protrudes outwards so as to form a theta-degree conical surface; the stress bearing plate is a circular plate; and the outer diameter of the circular plate is equal to the inner diameter of the supporting stage of the encapsulation shell body. The spiral type self-adaptive encapsulation device is a device which can be applied to encapsulation by using the structure itself in a cylindrical space. With the device of the invention adopted, requirements for encapsulation sleeve components under different work conditions can be satisfied.
Description
Technical field
The invention belongs to mechanical manufacturing field, be specifically related to a kind of spiral self adaptation packaging system with high temperature high voltage resistant.
Background technology
Focus development Marine oil and gas resource is proposed in national energy strategy, deep-sea oil gas development of resources equipment troop of China has welcome the good opportunity that develops on an unprecedented scale, as the important member of deep-sea oil gas development of resources equipment troop, oil pipe and auxiliary equipment thereof carry the mission critical of On The Oil And Gas Transportation.And take electronic tag as a series of electronic devices and components of representative, what carry the life cycle management of underground equipment and deep-sea exploring equipment administers and maintains mission, no matter in underground work or at deep ocean work, it inevitably, be faced with extremely harsh requirement and extremely severe operating mode, operating environment has the feature of high pressure (50Mpa ~ 100Mpa), high temperature (60 DEG C ~ 180 DEG C), sour weakness, vibration, thus needs one badly and has high temperature resistant withstand voltage shock reducing type energy-absorbing package assembling.
Normally, withstand voltage encapsulating structure mostly adopts screw thread pair to coordinate and rubber seal carries out sealing, pressure-bearing.Screw thread pair needs the profuse tooth number of turning in processing technology, sealing position needs the tooth number extremely grown, to reaching the sealing effectiveness of expection, thisly be designed with following shortcoming: occupy the confined space, slacken the intensity of pressure-resistance structure, simultaneously in the liquid with severe corrosive, threaded engagement is extremely easily corroded inefficacy, cannot realize adverse circumstances lower seal and pressure-bearing.Meanwhile, usual scheme need configure age inhibiting high quality seal circle to realizing sealing, but the useful life of rubber seal is extremely limited, and the measured sealing ring of matter need from Italy, the external import such as Japan, cycle is long, price, be difficult to satisfy the demands in Financial cost, thus for advancing high temperature, high pressure, under severe corrosive environment, bear the industrial-scale application of the operating mode lower package body of vibration, spy develops one and has high temperature resistant withstand voltage shock reducing type energy-absorbing package assembling, do Mechanics Simulation, high-temperature test, high voltage test, vibration test, pass through verification experimental verification.
Summary of the invention
In view of this, the invention provides a kind of spiral self adaptation packaging system with high temperature high voltage resistant, can apply in cylindrical space, utilize structure to carry out the device encapsulated, solve the requirement for encapsulation external member under different applying working condition.
Realize specific embodiment of the invention scheme as follows:
One has the spiral self adaptation packaging system of high temperature high voltage resistant, and it is characterized in that, this packaging system comprises: encapsulating housing, encapsulation cover plate and bearing plate;
The material of described encapsulating housing is engineering plastics, described housing is that one end is closed, the round shell that the other end is open, circle shell inner bottom surface is provided with a round recessed, circle shell inner peripheral surface assemble the profile radial direction processing one of chip to justify the limiting stand of shell diameter symmetry according to institute, stretches an arch brace platform on circle shell inner peripheral surface radial direction edge; The periphery of encapsulating housing is provided with screw thread;
One end face of described encapsulation cover plate has a convex annular edge, and the cross section of described convex edge is triangle, and after its other end evagination, angulation is the taper seat of θ;
Described bearing plate is a circular slab, and the outside diameter of described circular slab is equal with the brace table interior diameter of described encapsulating housing;
Die bonding is on the bottom surface of described encapsulating housing, bearing plate is placed on chip, the convex edge of described encapsulation cover plate is sleeved on the open end of described encapsulating housing, convex edge contacts with supporting bable tops, after being welded with supporting bable tops convex edge by ultrasonic bonding, the open end of encapsulating housing is sealed by encapsulation cover plate.
Further, the angle ranging from: 0< θ <10 °.
Further, described screw thread is fine thread.
Further, described engineering plastics are the plastics containing 30% glass.
Further, a pair is processed in cornerwise mounting groove at the outer bottom of described round casing.
Further, described triangle is base is 0.5mm and the isosceles triangle highly for 0.6mm.
Beneficial effect:
(1) the present invention design described encapsulation cover plate and pressing plate to internal electronic component produce support, protective effect;
(2) the externally threaded design of encapsulating housing, conveniently can screw in, screw out, and conveniently carries out dismounting in application scenario;
(3) tapering has certain point compression functions; Translating incremental in gradient is the screw thread feeding (engagement) of circumferencial direction.
(4) selected special engineering plastics material has high temperature resistant (for a long time can be resistance to 260 DEG C), corrosion-resistant, hydrolysis, self lubricity are good, wear-resistant, high strength, high accuracy, fire-retardant, radioresistance, insulating properties stable, the easy outstanding advantages such as processing and dimensionally stable.
Accompanying drawing explanation
Fig. 1 is encapsulating housing figure.
Fig. 2 is encapsulation cover plate figure.
Fig. 3 is the A-A cutaway view of encapsulation cover plate view.
Fig. 4 is a kind of assembling exploded view with the spiral self adaptation packaging system of high temperature high voltage resistant.
Wherein, 1-encapsulating housing, 2-bearing plate, 3-encapsulation cover plate, 4-chip, 5-brace table, 6-limiting stand, 7-circular groove, 8-screw thread.
Embodiment
To develop simultaneously embodiment below in conjunction with accompanying drawing, describe the present invention.
The invention provides one and have the spiral self adaptation packaging system of high temperature high voltage resistant, this device applies in the cylindrical space around back shaft/pipe, utilize pressure to carry out the fastener accommodated.
Described one has the spiral self adaptation packaging system of high temperature high voltage resistant, and this packaging system comprises: encapsulating housing 1, encapsulation cover plate 2 and bearing plate 3;
As shown in Figure 1, the material of described encapsulating housing 1 is engineering plastics, described housing is that one end is closed, the round shell that the other end is open, circle shell inner bottom surface is provided with a round recessed 7, circle shell inner peripheral surface assemble the profile radial direction processing one of chip to justify the limiting stand 5 of shell diameter symmetry according to institute, stretches an arch brace platform 6 on circle shell inner peripheral surface radial direction edge; Process a pair in cornerwise mounting groove at the outer bottom of described round casing, prevent local pressure excessive causing from caving in, the cavity minimum range of the bottom surface distance packaged body in mounting groove must be greater than this material minimum withstand voltage one-tenth-value thickness 1/10 at this pressure; Suitable increase height, for the deformation of bearing plate pressurized leaves space, leaves space for the deformation of pressure resistant type material simultaneously.; Encapsulating housing 1 periphery is screw thread 8, for fixing.
As shown in Figures 2 and 3, an end face of described encapsulation cover plate 2 has a convex annular edge, and the cross section of described convex edge is triangle, and after its other end evagination, angulation is the taper seat of θ; Described triangle is base is 0.5mm and the isosceles triangle highly for 0.6mm.While cover sheet thickness is enough to bear external pressure, larger caving in can not be had, first can not by pressure break, liquid is caused to be pressed into cavity, second can not cave in, cave in and cause inner electronic devices and components pressure-bearing impaired, and under high pressure cover plate is bound to have certain caving in, cone angle can only in the degree of to a certain degree less depression.
Introduce bearing plate structure in design, be specially and have certain thickness metallic plate, described bearing plate 3 is a circular slab, and the outside diameter of described circular slab is equal with brace table 6 interior diameter of described encapsulating housing; Its bearing capacity is far longer than packaging body material, (what adopt in reality is stainless steel, and thickness is 1 ㎜), but its profile be designed to comparatively similar from cavity cross-section can be all passable for different circles or rectangle, polygon; Consider from mach advantage, circular technique is simple, and has larger adaptability; Coning angle design is at 0< θ <10 °.Still certain tapering is retained, for first accepts the structure of vibration, pressure.
As shown in Figure 4, chip 4 is bonded on the bottom surface of described encapsulating housing 1, bearing plate 3 is placed on chip 4, the convex edge of described encapsulation cover plate 2 is sleeved on the open end of described encapsulating housing 1, convex edge contacts with brace table 6, after convex edge and brace table 6 being welded by ultrasonic bonding, the open end of encapsulating housing 1 is sealed by encapsulation cover plate 2.
Described screw thread is fine thread; Screw thread is thicker, its screw strength is larger, but tooth number is few, and after engagement, self-locking performance is poor, thus adopt good materials processing fine thread better, its wall thickness of place the thinnest between screw thread inner distance cavity inner wall in the design must be greater than the minimum withstand voltage one-tenth-value thickness 1/10 of this material under this pressure field.
Electrical type chip 4 and encapsulating: be the structure that vibration, pressure are accepted in the 3rd road; Test experience and improve as follows: in horizontal direction, electrical type chip 4 flank installs energy-absorbing rib additional, is symmetrically arranged 2, realizes the protection in electrical type chip 4 horizontal plane; On vertical direction, increase the degree of depth of bottom protector, area increased, realizes the room to all electrical type chips 4, installs glue additional, realize the safekeeping to chip 4 in the process of assembling; Separately, increase the space of the vertical direction of electrical type chip 4, increase the groove depth of electrical type chip 4 sinking, for the deformation of bearing plate 3 pressurized leaves short transverse space, encapsulating during assembling, reach vibration damping object;
Encapsulating: put glue respectively in central authorities, chip groove, corner, with electrical type chip 4 compacting, realizes protecting electrical type chip 4, amount must control can not too much, overflow, if overflow on the upside of bearing plate 3, can solder side be polluted, affect weld strength; Electrical type chip 4 upper point glue, central point glue, stress point in central authorities, pressure-bearing, vibration damping;
Sealing wire: product energy accumulating district is on supporting bable tops (i.e. solder side), and the cross section of sealing wire is triangle;
The technical requirement of ultrasonic bonding is as follows:
On vertical direction: the tolerance of cover plate circumference and base circumference is 0 ~ 0.02mm, the depth of weld 2.00 ~ 2.05mm; Axiality requires high, does not produce lateral compression and causes the flowing of melted material bias, affect welding effect; Surfacing, welding is burnt;
In horizontal direction: sideshake coordinates, and monolateral fit tolerance is 0.02 ~ 0.05mm (2 ~ 5 DEG C);
In sum, these are only preferred embodiment of the present invention, be not intended to limit protection scope of the present invention.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. have the spiral self adaptation packaging system of high temperature high voltage resistant, it is characterized in that, this packaging system comprises: encapsulating housing (1), encapsulation cover plate (2) and bearing plate (3);
The material of described encapsulating housing (1) is engineering plastics, described housing is that one end is closed, the round shell that the other end is open, circle shell inner bottom surface is provided with a round recessed (7), circle shell inner peripheral surface assemble the profile radial direction processing one of chip to justify the limiting stand (5) of shell diameter symmetry according to institute, stretches an arch brace platform (6) on circle shell inner peripheral surface radial direction edge; The periphery of encapsulating housing (1) is provided with screw thread (8);
One end face of described encapsulation cover plate (2) has a convex annular edge, and the cross section of described convex edge is triangle, and after its other end evagination, angulation is the taper seat of θ;
Described bearing plate (3) is a circular slab, and the outside diameter of described circular slab is equal with brace table (6) interior diameter of described encapsulating housing;
Chip (4) is bonded on the bottom surface of described encapsulating housing (1), bearing plate (3) is placed on chip (4), the convex edge of described encapsulation cover plate (2) is sleeved on the open end of described encapsulating housing (1), convex edge contacts with brace table (6) face, after being welded with brace table (6) face convex edge by ultrasonic bonding, the open end of encapsulating housing (1) is sealed by encapsulation cover plate (2).
2. one has the spiral self adaptation packaging system of high temperature high voltage resistant as claimed in claim 1, it is characterized in that, the angle ranging from: 0< θ <10 °.
3. one has the spiral self adaptation packaging system of high temperature high voltage resistant as claimed in claim 1, it is characterized in that, described screw thread (8) is fine thread.
4. one has the spiral self adaptation packaging system of high temperature high voltage resistant as claimed in claim 1, it is characterized in that, described engineering plastics are the plastics containing 30% glass.
5. one has the spiral self adaptation packaging system of high temperature high voltage resistant as claimed in claim 1, it is characterized in that, is for a pair cornerwise mounting groove in the outer bottom processing of described round casing.
6. one has the spiral self adaptation packaging system of high temperature high voltage resistant as claimed in claim 1, it is characterized in that, described triangle is base is 0.5mm and the isosceles triangle highly for 0.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510852630.6A CN105517395B (en) | 2015-11-27 | 2015-11-27 | A kind of high-temperature and high-presure resistent spiral adaptive packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510852630.6A CN105517395B (en) | 2015-11-27 | 2015-11-27 | A kind of high-temperature and high-presure resistent spiral adaptive packaging system |
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| Publication Number | Publication Date |
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| CN105517395A true CN105517395A (en) | 2016-04-20 |
| CN105517395B CN105517395B (en) | 2018-05-11 |
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| CN201510852630.6A Expired - Fee Related CN105517395B (en) | 2015-11-27 | 2015-11-27 | A kind of high-temperature and high-presure resistent spiral adaptive packaging system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109743857A (en) * | 2019-01-07 | 2019-05-10 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Antivibration electronic component encapsulating structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103489022A (en) * | 2013-09-17 | 2014-01-01 | 常州君华特种工程塑料制品有限公司 | Polyether-ether-ketone label for drilling operation and manufacturing method thereof |
| EP2717197A1 (en) * | 2011-06-02 | 2014-04-09 | Zhijia Liu | Protection housing for rfid tag |
| CN203909821U (en) * | 2014-05-19 | 2014-10-29 | 刘元开 | A cable electronic label |
-
2015
- 2015-11-27 CN CN201510852630.6A patent/CN105517395B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2717197A1 (en) * | 2011-06-02 | 2014-04-09 | Zhijia Liu | Protection housing for rfid tag |
| CN103489022A (en) * | 2013-09-17 | 2014-01-01 | 常州君华特种工程塑料制品有限公司 | Polyether-ether-ketone label for drilling operation and manufacturing method thereof |
| CN203909821U (en) * | 2014-05-19 | 2014-10-29 | 刘元开 | A cable electronic label |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109743857A (en) * | 2019-01-07 | 2019-05-10 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Antivibration electronic component encapsulating structure |
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| CN105517395B (en) | 2018-05-11 |
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