CN105517323A - Load conductor pattern laminated plate for printed circuit board - Google Patents
Load conductor pattern laminated plate for printed circuit board Download PDFInfo
- Publication number
- CN105517323A CN105517323A CN201510862349.0A CN201510862349A CN105517323A CN 105517323 A CN105517323 A CN 105517323A CN 201510862349 A CN201510862349 A CN 201510862349A CN 105517323 A CN105517323 A CN 105517323A
- Authority
- CN
- China
- Prior art keywords
- metal
- coat
- circuit board
- printed circuit
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 89
- 239000002184 metal Substances 0.000 claims abstract description 88
- 239000004744 fabric Substances 0.000 claims abstract description 75
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910000978 Pb alloy Inorganic materials 0.000 claims abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010931 gold Substances 0.000 claims abstract description 13
- 229910052737 gold Inorganic materials 0.000 claims abstract description 13
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- 239000001307 helium Substances 0.000 claims abstract description 8
- 229910052734 helium Inorganic materials 0.000 claims abstract description 8
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims abstract description 8
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229920000800 acrylic rubber Polymers 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 2
- 239000011247 coating layer Substances 0.000 abstract 7
- 239000010410 layer Substances 0.000 abstract 5
- 239000007789 gas Substances 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/21—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/263—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acids; Salts or esters thereof
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/55—Epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a load conductor pattern laminated plate for a printed circuit board, and the laminated plate comprises a first metal coating layer which contains 35-40% of copper and 20-25% of gold, wherein the remaining part is lead alloy, and the thickness of the first metal coating layer is from 5 microns to 6 microns; and a second metal coating layer which contains 40-50% of copper and 5-25% of silver, wherein the remaining part is tin alloy, and the thickness of the second metal coating layer is from 6 microns to 8 microns. The second metal coating layer is located at an innermost side, and the first metal coating layer is located at an outermost side. The laminated plate also comprises a fabric base layer which is located at the central part of the printed circuit board, and the second metal coating layer covers the fabric base layer. The fabric base layer is made of fabrics soaked with a resin composition. The fabric base layer has a double-layer cavity structure, and comprises an upper fabric surface and a lower fabric surface, wherein there is a gap of 2-3 microns between the upper fabric surface and the lower fabric surface, and the gap is filled with helium gas. The laminated plate is good in insulating performance and elasticity and facilitates the installation of the conductor.
Description
Technical field
The present invention relates to printed-board technology field.More particularly, the present invention relates to a kind of laminated plate of load conductor pattern of printed circuit board (PCB)
Background technology
Printed circuit board (PCB), also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development has the history of more than 100 year; Its design mainly layout design; Adopt the major advantage of circuit board to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.
In recent years, as at intelligent hand, the printed circuit board (PCB) that a large amount of electronic equipment such as panel computer adopts, printed circuit board (PCB) is formed by arranging conductive pattern on metal-clad plate, wherein the important component part metal-clad plate of printed circuit board (PCB) is normally soaked to permeate by resin combination and forms prepreg in fabric substrate, formed by stacked metal forming manufacture on the prepreg formed, in order to printed circuit board (PCB) upper conductor pattern fits tightly with metal-clad plate better, the etching performance of metal-clad structure, the installation of sublayer structure in metal-clad plate, it is particularly important that the connection reliability of insulating properties and each sublayer structure becomes.
Summary of the invention
An object of the present invention is to solve at least the problems referred to above or defect, and the advantage will illustrated after at least one is provided.
A further object of the invention is to provide a kind of laminated plate with the load conductor pattern of the printed circuit board (PCB) of better etching performance, and the surface of its outermost metal coating is sprayed with tin layers, avoids copper face to be easily oxidized, and improves the solderability of circuit board.
A further object of the invention is to provide a kind of laminated plate with the load conductor pattern of the printed circuit board (PCB) of better insulation property, because fabric has double-layer cavity structure, it comprises fabric face and lower fabric face, there is between two fabric faces the space of 2 ~ 3 μm, helium is filled in described space, both while ensureing insulating properties, also there is certain elasticity, can plating operation be facilitated.
In order to realize, according to these objects of the present invention and other advantage, the invention provides a kind of laminated plate of load conductor pattern of printed circuit board (PCB), comprising:
First coat of metal, its be containing copper 35 ~ 40%, gold 20 ~ 25%, all the other be the alloy of lead, and the thickness of described first coat of metal is 5 ~ 6 μm;
Second coat of metal, its be containing copper 40 ~ 50%, silver 5 ~ 25%, all the other are the alloy of tin, and the thickness of described second coat of metal is 6 ~ 8 μm;
Wherein, described second coat of metal is positioned at inner side, and described first coat of metal is positioned at outermost;
Wherein, also comprise fabric, it is positioned at the middle part of described printed circuit board (PCB), and described second coat of metal covers in described fabric;
Described fabric is form immersed with the fabric of resin combination, and described fabric has double-layer cavity structure, and it comprises fabric face and lower fabric face, has the space of 2 ~ 3 μm, be filled with helium in space between two fabric faces.
Preferably, wherein, the thickness of described upper fabric face is 1.5 ~ 2 μm, and the thickness of lower fabric face is 2.5 ~ 3 μm;
Wherein, second coat of metal is 3 μm near the thickness of coating of upper fabric face, and the thickness of coating near lower fabric face is 2 μm.
Preferably, wherein, also comprise the 3rd coat of metal, its be containing copper 45 ~ 55%, gold 5 ~ 10%, all the other be the alloy of lead, and the thickness of described 3rd coat of metal is 6 ~ 8 μm, and described 3rd coat of metal covers on described second metal coating surface.
Preferably, wherein, described first coat of metal, its be containing copper 36 ~ 38%, tin 21 ~ 23%, all the other be the alloy of lead, and the thickness of described first coat of metal is 5 ~ 6 μm.
Preferably, wherein, described second coat of metal, its be containing copper 42 ~ 48%, silver 10 ~ 20%, all the other are the alloy of tin, and the thickness of described first coat of metal is 8 ~ 12 μm.
Preferably, wherein, described first coat of metal, its be containing copper 37%, tin 22%, all the other be the alloy of lead, and the thickness of described first coat of metal is 6 μm.
Preferably, wherein, described second coat of metal, its be containing copper 45%, silver 15%, all the other are the alloy of tin, and the thickness of described first coat of metal is 10 μm.
Preferably, wherein, described 3rd coat of metal, its be containing copper 48 ~ 52%, gold 6 ~ 8%, all the other be the alloy of lead, and the thickness of described 3rd coat of metal is 6 ~ 8 μm, and described 3rd coat of metal covers on described second metal coating surface.
Preferably, wherein, described 3rd coat of metal, its be containing copper 50%, gold 7%, all the other be the alloy of lead, and the thickness of described 3rd coat of metal is 6 μm, and described 3rd coat of metal covers on described second metal coating surface.
Preferably, wherein, described resin combination is epoxy resin and the acrylic rubber with naphthalene type skeleton.
The present invention at least comprises following beneficial effect:
1, spray tin has been carried out on its surface of metal level that the laminated plate of the load conductor pattern of printed circuit board (PCB) provided by the invention is arranged, avoid copper face to be easily oxidized to cause being not easy tin, improve the solderability of the metal-clad of circuit board by layer on surface of metal spray tin;
2, the laminated plate of the load conductor pattern of printed circuit board (PCB) provided by the invention, because fabric has double-layer cavity structure, improves the insulation property between the metallic plate of described fabric both sides;
3, the laminated plate of the load conductor pattern of printed circuit board (PCB) provided by the invention, owing to forming different thickness of coating in fabric both sides on both sides, to facilitate the semiconductor original paper selecting to install different performance;
4, the laminated plate of the load conductor pattern of printed circuit board (PCB) provided by the invention, because fabric comprises upper fabric face and lower fabric face, there is between two fabric faces the space of 2 ~ 3 μm, helium is filled with in space, while guarantee insulating properties, also there is certain elasticity, can plating operation be facilitated;
5, the laminated plate of the load conductor pattern of printed circuit board (PCB) provided by the invention, because fabric is form immersed with the fabric of resin combination, containing the epoxy resin with naphthalene type skeleton in described resin combination, can improve the thermal endurance of printed circuit board (PCB).
Accompanying drawing explanation
Fig. 1 is the structural representation of the cross section of the laminated plate of the load conductor pattern of printed circuit board (PCB) in one embodiment of the present of invention;
Fig. 2 is the upper fabric face of the metal-clad board structure of printed circuit board (PCB) in one embodiment of the present of invention and the structural representation of lower fabric face.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail, can implement according to this with reference to specification word to make those skilled in the art.
Fig. 1 and Fig. 2 shows the laminated plate of the load conductor pattern of printed circuit board (PCB) provided by the invention, specifically comprises:
First coat of metal 4, its be containing copper 35 ~ 40%, gold 20 ~ 25%, all the other be the alloy of lead, and the thickness of described first coat of metal 4 is 5 ~ 6 μm;
Second coat of metal 2, its be containing copper 40 ~ 50%, silver 5 ~ 25%, all the other are the alloy of tin, and the thickness of described second coat of metal 2 is 6 ~ 8 μm;
Wherein, described second coat of metal 2 is positioned at inner side, and described first coat of metal 4 is positioned at outermost;
Wherein, also comprise fabric 1, it is positioned at the middle part of described printed circuit board (PCB), and described second coat of metal 2 covers in described fabric;
Described fabric 1 is form immersed with the fabric of resin combination, and described fabric 1 has double-layer cavity structure, and it comprises the space between fabric face and lower fabric face 100, two fabric faces with 2 ~ 3 μm, is filled with helium in space.
Double-layer cavity structure is wherein set, in space, fills helium, while guarantee insulating properties, also there is certain elasticity, can plating operation be facilitated.
Wherein in a kind of embodiment, for fabric, be not particularly limited, as long as the material that the substantially orthogonal mode of the warp thread such with such as plain weave and weft yarn is made into, the material be such as made up of inorfil can be used, as the material of glass cloth etc. and so on, or the material be made up of organic fiber, the such as material of aromatic polyamides cloth etc. and so on, the thickness of fabric preferably 210 ~ 300 μm.
In an embodiment wherein, the thickness of described upper fabric face is 1.5 ~ 2 μm, and the thickness of lower fabric face is 2.5 ~ 3 μm;
Wherein, second coat of metal 2 is 3 μm near the thickness of coating of upper fabric face, and the thickness of coating near lower fabric face is 2 μm.Different thickness of coating is formed, to facilitate the semiconductor original paper selecting to install different performance on both sides.Such as, the stagger angle of semiconductor original paper may be made up of different metal or alloy material, and alloy material that so just can be different according to it, selects different installed surfaces.
In another kind of embodiment, also comprise the 3rd coat of metal 3, its for containing copper 45 ~ 55%, gold 5 ~ 10%, all the other be the alloy of lead, and the thickness of described 3rd coat of metal 3 is 6 ~ 8 μm, and described 3rd coat of metal 3 covers described second coat of metal 2 on the surface.
Wherein, described 3rd coat of metal 3, preferably containing copper 48 ~ 52%, gold 6 ~ 8%, all the other be the alloy of lead, and the thickness of described 3rd coat of metal 3 is 6 ~ 8 μm; More preferably containing copper 50%, gold 7%, all the other be the alloy of lead, and the thickness of described 3rd coat of metal 3 is 6 μm.
In another kind of embodiment, described first coat of metal 4 is preferably containing copper 36 ~ 38%, tin 21 ~ 23%, all the other be the alloy of lead, and the thickness of described first coat of metal 4 is 5 ~ 6 μm; More preferably containing copper 37%, tin 22%, all the other be the alloy of lead, and the thickness of described first coat of metal 4 is 6 μm.
In another kind of embodiment, described second coat of metal 2 is preferably containing copper 42 ~ 48%, silver 10 ~ 20%, all the other are the alloy of tin, and the thickness of described first coat of metal 4 is 8 ~ 12 μm; More preferably containing copper 45%, silver 15%, all the other are the alloy of tin, and the thickness of described first coat of metal 4 is 10 μm.
In another kind of embodiment, described resin combination is epoxy resin and the acrylic rubber with naphthalene type skeleton.Further, this mode is a kind of explanation of preferred embodiments, but is not limited thereto.When implementing of the present invention, different enforcement aspects can be selected according to the performance difference of user's demand fabric.
Wherein, the epoxy resin with naphthalene type skeleton also can be able to be multiple for one, can be the epoxy resin with naphthalene type skeleton and the composition of epoxy resin without naphthalene type skeleton, also can for the independent combination with the epoxy resin of naphthalene type skeleton, but, wherein, must at least one be the epoxy resin with naphthalene type skeleton, to improve the thermal endurance of the laminated plate of the load conductor pattern of printed circuit board (PCB), such as printed circuit board (PCB) is arranged on the thermal endurance in electronic product, or carry out the thermal endurance of scolding tin on circuit boards, increase the useful life of printed circuit board (PCB) and use sensitivity.
Wherein, not there is between carbon atom in the composition of acrylic rubber the unsaturated bond that such as double bond, triple bond are such, equal bonding by singly-bound between carbon atom, avoid that there is unsaturated bond be easily oxidized and make the laminated plate of the load conductor pattern of printed circuit board (PCB) follow the string and become fragile, affect the respective performances of printed circuit board (PCB).
As mentioned above, according to the present invention, because fabric has double-layer cavity structure, improve the insulation property between the metallic plate of described fabric both sides; Fabric comprises fabric face and lower fabric face, has the space of 2 ~ 3 μm between two fabric faces, fills helium in space, while guarantee insulating properties, also has certain elasticity, can facilitate plating operation; Because fabric is form immersed with the fabric of resin combination, containing the epoxy resin with naphthalene type skeleton in described resin combination, the thermal endurance of printed circuit board (PCB) can be improved; Owing to forming different thickness of coating in fabric both sides on both sides, to facilitate the semiconductor original paper selecting to install different performance.
Although embodiment of the present invention are open as above, but it is not restricted to listed in specification and execution mode utilization, it can be applied to various applicable the field of the invention completely, for those skilled in the art, can easily realize other amendment, therefore do not deviating under the universal that claim and equivalency range limit, the present invention is not limited to specific details and illustrates here and the legend described.
Claims (10)
1. a laminated plate for the load conductor pattern of printed circuit board (PCB), is characterized in that, comprising:
First coat of metal, its be containing copper 35 ~ 40%, gold 20 ~ 25%, all the other be the alloy of lead, and the thickness of described first coat of metal is 5 ~ 6 μm;
Second coat of metal, its be containing copper 40 ~ 50%, silver 5 ~ 25%, all the other are the alloy of tin, and the thickness of described second coat of metal is 6 ~ 8 μm;
Wherein, described second coat of metal is positioned at inner side, and described first coat of metal is positioned at outermost;
Wherein, also comprise fabric, it is positioned at the middle part of described printed circuit board (PCB), and described second coat of metal covers in described fabric;
Described fabric is form immersed with the fabric of resin combination, and described fabric has double-layer cavity structure, and it comprises fabric face and lower fabric face, has the space of 2 ~ 3 μm, be filled with helium in space between two fabric faces.
2. the laminated plate of the load conductor pattern of printed circuit board (PCB) as claimed in claim 1, it is characterized in that, the thickness of described upper fabric face is 1.5 ~ 2 μm, and the thickness of lower fabric face is 2.5 ~ 3 μm;
Wherein, second coat of metal is 3 μm near the thickness of coating of upper fabric face, and the thickness of coating near lower fabric face is 2 μm.
3. the laminated plate of the load conductor pattern of printed circuit board (PCB) as claimed in claim 1, it is characterized in that, also comprise the 3rd coat of metal, its for containing copper 45 ~ 55%, gold 5 ~ 10%, all the other be lead alloy, and the thickness of described 3rd coat of metal is 6 ~ 8 μm, described 3rd coat of metal covers on described second metal coating surface.
4. the laminated plate of the load conductor pattern of printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described first coat of metal, its be containing copper 36 ~ 38%, tin 21 ~ 23%, all the other be the alloy of lead, and the thickness of described first coat of metal is 5 ~ 6 μm.
5. the laminated plate of the load conductor pattern of printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described second coat of metal, its be containing copper 42 ~ 48%, silver 10 ~ 20%, all the other are the alloy of tin, and the thickness of described second coat of metal is 8 ~ 12 μm.
6. the laminated plate of the load conductor pattern of printed circuit board (PCB) as claimed in claim 1, is characterized in that, described first coat of metal, its be containing copper 37%, tin 22%, all the other are the alloy of lead, and the thickness of described first coat of metal is 6 μm.
7. the laminated plate of the load conductor pattern of printed circuit board (PCB) as claimed in claim 1, is characterized in that, described second coat of metal, its be containing copper 45%, silver-colored 15%, all the other are the alloy of tin, and the thickness of described second coat of metal is 10 μm.
8. the laminated plate of the load conductor pattern of printed circuit board (PCB) as claimed in claim 3, it is characterized in that, described 3rd coat of metal, its for containing copper 48 ~ 52%, gold 6 ~ 8%, all the other be lead alloy, and the thickness of described 3rd coat of metal is 6 ~ 8 μm, described 3rd coat of metal covers on described second metal coating surface.
9. the laminated plate of the load conductor pattern of printed circuit board (PCB) as claimed in claim 8, it is characterized in that, described 3rd coat of metal, its for containing copper 50%, gold 7%, all the other be lead alloy, and the thickness of described 3rd coat of metal is 6 μm, described 3rd coat of metal covers on described second metal coating surface.
10. the laminated plate of the load conductor pattern of printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described resin combination is epoxy resin and the acrylic rubber with naphthalene type skeleton.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510862349.0A CN105517323B (en) | 2015-11-30 | 2015-11-30 | The laminated plate of the load conductor pattern of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510862349.0A CN105517323B (en) | 2015-11-30 | 2015-11-30 | The laminated plate of the load conductor pattern of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105517323A true CN105517323A (en) | 2016-04-20 |
| CN105517323B CN105517323B (en) | 2018-09-18 |
Family
ID=55724846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510862349.0A Active CN105517323B (en) | 2015-11-30 | 2015-11-30 | The laminated plate of the load conductor pattern of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105517323B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837624A (en) * | 1995-10-16 | 1998-11-17 | Matsushita Electric Works, Ltd. | Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom |
| WO1999044959A1 (en) * | 1998-03-03 | 1999-09-10 | Ppg Industries Ohio, Inc. | Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
| WO2010113892A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社トクヤマ | Process for producing metallized substrate and metallized substrate |
| CN103167731A (en) * | 2011-12-08 | 2013-06-19 | 祝琼 | Soft board base material without glue and preparation method thereof |
| CN104837622A (en) * | 2012-12-06 | 2015-08-12 | 三菱瓦斯化学株式会社 | Method for producing metal-foil-clad laminate |
-
2015
- 2015-11-30 CN CN201510862349.0A patent/CN105517323B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837624A (en) * | 1995-10-16 | 1998-11-17 | Matsushita Electric Works, Ltd. | Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom |
| WO1999044959A1 (en) * | 1998-03-03 | 1999-09-10 | Ppg Industries Ohio, Inc. | Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
| WO2010113892A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社トクヤマ | Process for producing metallized substrate and metallized substrate |
| CN103167731A (en) * | 2011-12-08 | 2013-06-19 | 祝琼 | Soft board base material without glue and preparation method thereof |
| CN104837622A (en) * | 2012-12-06 | 2015-08-12 | 三菱瓦斯化学株式会社 | Method for producing metal-foil-clad laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105517323B (en) | 2018-09-18 |
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