CN105514117B - Flexible base board production method - Google Patents
Flexible base board production method Download PDFInfo
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- CN105514117B CN105514117B CN201510974648.3A CN201510974648A CN105514117B CN 105514117 B CN105514117 B CN 105514117B CN 201510974648 A CN201510974648 A CN 201510974648A CN 105514117 B CN105514117 B CN 105514117B
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- base board
- mother substrate
- flexible base
- flexible
- strip
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 230000008602 contraction Effects 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 17
- 230000008020 evaporation Effects 0.000 claims abstract description 7
- 238000001704 evaporation Methods 0.000 claims abstract description 7
- 230000008569 process Effects 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 23
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention discloses a kind of flexible base board production methods, the flexible base board production method includes: according to the setting pixel density of the flexible base board under tensional state, and the flexible base board needs obtained under contraction state are stretched to drawing force required for the flexible base board under tensional state；Flexible mother substrate under contraction state is provided, the flexible mother substrate cut under contraction state will be in into strips according to preset shape；Strip flexibility mother substrate is stretched according to the drawing force of acquisition using screen-tensioning machine, and the strip flexibility mother substrate after a plurality of stretching is fitted on frame；Evaporation process is carried out to the strip flexibility mother substrate after stretching a plurality of on frame；Every flexible mother substrate in strip flexibility mother substrate after stretching a plurality of on frame is cut, single flexible substrate is formed.Flexible base board production method of the invention can be improved yield and the accuracy of manufacture.
Description
Technical field
The present invention relates to field of display technology, in particular to a kind of flexible base board production method.
Background technique
Flexible display apparatus refers to the bending deformed display device of display panel comprising flexible organic electro-luminescence is aobvious
The multiple types such as showing device (OLED), flexible electrophoretic display apparatus (EPD), flexible liquid crystal device (LCD).As a new generation
Display device, because it has many advantages, such as thin and light, high contrast, quick response, wide viewing angle, high brightness, full color, therefore in hand
Machine, personal digital assistant (PDA), digital camera, car-mounted display, laptop, wall hung television and military field etc. have
Very extensive application prospect.
Flexible display apparatus uses flexible base board, and the substrate of flexible base board is made of flexible flexible material,
To keep flexible display apparatus flexible.In the prior art, flexible base board production method is usually to use the system of non-flexible substrate
Technique is made, i.e., is attached to flexible base board using special jig when making flexible base board on the glass substrate of hardness, then,
Drive circuit layer and display layer etc. are made on flexible base board, then conventional steaming is carried out to the flexible base board attached on the glass substrate
After the completion of encapsulation, flexible base board is separated with the glass substrate of hardness for plating, encapsulation.In existing flexible base board production side
In method, during flexible base board is separated with glass substrate, easily generation flexible base board (including thereon drive circuit layer or
Display layer) damage the problem of, reduced so as to cause the yield of flexible base board, and the flexible base board of above-mentioned production method manufacture
The precision of pel spacing is not also high, be unable to satisfy PPI (Pixels Per Inch, the number of pixels that per inch is possessed, also known as
For pixel density) requirement.
Summary of the invention
The present invention provides a kind of flexible base board production method, can be improved yield and can be improved the accuracy of manufacture.
The technical solution is as follows:
The embodiment of the invention provides a kind of flexible base board production methods comprising: according to soft under tensional state
Property substrate setting pixel density, obtain the flexible base board needs under the contraction state be stretched to it is soft under tensional state
Drawing force required for property substrate；Flexible mother substrate under contraction state is provided, will be in contraction-like according to preset shape
Flexible mother substrate cut under state is into strips；Strip flexibility mother substrate is drawn according to the drawing force of acquisition using screen-tensioning machine
It stretches, and the strip flexibility mother substrate after a plurality of stretching is fitted on frame；To the strip flexible mother after stretching a plurality of on frame
Substrate carries out evaporation process；Every flexible mother substrate in strip flexibility mother substrate after stretching a plurality of on frame is cut
It cuts, forms single flexible substrate.
Technical solution provided in an embodiment of the present invention has the benefit that
By the setting pixel density according to the flexible base board under tensional state, obtain soft under contraction state
Property substrate needs be stretched to drawing force required for the flexible base board under tensional state；It will be in contraction according to preset shape
Flexible mother substrate cut under state is into strips；Strip flexibility mother substrate is drawn according to the drawing force of acquisition using screen-tensioning machine
It stretches, and the strip flexibility mother substrate after a plurality of stretching is fitted on frame；To the strip flexible mother after stretching a plurality of on frame
Substrate carries out evaporation process；Every flexible mother substrate in strip flexibility mother substrate after stretching a plurality of on frame is cut
It cuts, forming single flexible substrate so as to increase substantially the precision of flexible base board pixel density also can be improved flexible base
The manufacturing yield of plate.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And it can be implemented in accordance with the contents of the specification, and in order to allow above and other objects, features and advantages of the invention can
It is clearer and more comprehensible, it is special below to lift preferred embodiment, and cooperate attached drawing, detailed description are as follows.
Detailed description of the invention
Fig. 1 is the step flow chart of flexible base board production method provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of winding device；
Fig. 3 is the structural schematic diagram of the strip flexibility mother substrate after frame and a plurality of stretching.
Specific embodiment
It is of the invention to reach the technical means and efficacy that predetermined goal of the invention is taken further to illustrate, below in conjunction with
Attached drawing and preferred embodiment, to its specific embodiment of flexible base board production method proposed according to the present invention, structure, feature and
Effect, detailed description is as follows.
For the present invention aforementioned and other technology contents, feature and effect refer to the preferable reality of schema in following cooperation
Applying can clearly be presented in example detailed description.By the explanation of specific embodiment, when predetermined mesh can be reached to the present invention
The technical means and efficacy taken be able to more deeply and it is specific understand, however institute's accompanying drawings are only to provide with reference to and say
It is bright to be used, it is not intended to limit the present invention.
Fig. 1 is the step flow chart of flexible base board production method provided in an embodiment of the present invention.Fig. 2 is the knot of winding device
Structure schematic diagram.Fig. 3 is the structural schematic diagram of the strip flexibility mother substrate after frame and a plurality of stretching.Fig. 1 to Fig. 3 is please referred to, this
The flexible base board production method of embodiment may comprise steps of: step 101-111.
Step 101, it according to the setting pixel density of the flexible base board under tensional state, obtains under contraction state
Flexible base board needs be stretched to drawing force required for the flexible base board under tensional state.
Wherein, flexible base board, that is, flexible base board under contraction state is in the state being not stretched, under tensional state
Flexible base board be flexible base board that flexible base board is fabricated to final use state.Flexible base board under final use state
The display layer being arranged thereon is generally included, display layer includes multiple pixels in array distribution.On pixel density, that is, flexible base board
Spacing between pixel.Flexible base board under contraction state is stretched to the flexible base board that may finally be used to need to use
Certain drawing force is stretched, and the difference of length is amount of tension after stretching and before stretching.The above-mentioned flexibility under tensional state
The parameters such as setting pixel density, the drawing force of needs, the amount of tension of substrate can be by actual experiment or simulated experiment repeatedly
Verifying makes precision and production accuracy to improve it, such as can be stretched through repeated measurement flexible base board from contraction state
Drawing force needed for real use state and obtain the parameters such as drawing force.
Step 103, the flexible mother substrate under contraction state is provided.
It wherein, may include multiple flexible base boards on flexible mother substrate.Preferably, it may also include that in step 103 and be in
Setting driving layer and display layer etc. in the substrate of flexible mother substrate under contraction state, preferably, driving can also will be set
The flexible mother substrate of layer and display layer rolls, and specifically, can also will set the flexible mother substrate of driving layer and display layer
It is rolled on a winding device 20 (as shown in Figure 2), can prevent dust etc. from polluting to flexible mother substrate.
Step 105, the flexible mother substrate cut under contraction state will be in into strips according to preset shape.
Wherein it is possible to according to the size of preset shape by the flexible mother substrate cut wound in step 103 into strips 31 (such as
Shown in Fig. 3), so that a flexible mother substrate forms the flexible mother substrate 31 of a plurality of strip, and on every flexible mother substrate 31
It may include multiple flexible base boards.It can be cut using laser or cutter etc. when cutting, laser cutting method is by laser
Be set to the top of the flexible mother substrate under the contraction state, laser can irradiate laser beam, be accurately cut into meet it is pre-
The strip flexibility mother substrate 31 of setting shape.
Step 107, strip flexibility mother substrate is stretched according to the drawing force of acquisition using screen-tensioning machine, and by a plurality of drawing
Strip flexibility mother substrate after stretching is fitted on frame.
Wherein, may include: when screen-tensioning machine stretches strip flexibility mother substrate by strip flexibility mother substrate with throw the net
Machine connection, screen-tensioning machine stretch strip flexible mother substrate, the pixel on flexible mother substrate are adjusted by the deformation of flexible mother substrate
Density, i.e., the spacing between each pixel, can be adjusted to predeterminated position for pixel each on flexible mother substrate, to reach setting
Pixel density.Strip flexibility mother substrate after a plurality of stretching can will be with by silica gel or epoxy resin when being fitted on frame
Fitting, it is preferable that the strip flexibility mother substrate after a plurality of stretching can also be welded on frame 32 by ultrasonic wave, so will
Strip flexibility mother substrate 31 and frame 32 are also very convenient when separating.The material of frame can be the materials such as stainless steel.This step
In by applying drawing force on strip flexibility mother substrate 31 so as to adjust the position of each pixel, can increase substantially
The precision of the pixel density (PPI) of flexible base board, by verifying repeatedly, the embodiment of the present invention can be by the flexible base board after stretching
The precision of pel spacing (TP) be increased within ± 10 μm from existing ± 20 μm.
Step 109, the strip flexibility mother substrate after stretching a plurality of on frame is carried out the subsequent technique such as being deposited.
Wherein, it can be clamped when be deposited etc. subsequent technique to the strip flexibility mother substrate 31 after stretching a plurality of on frame
Frame, to carry out evaporation process to the strip flexibility mother substrate 31 after a plurality of stretching on frame, due to can be set on frame
Strip flexibility mother substrate 31 after a plurality of stretching, to improve vapor deposition efficiency, and can be carried out being deposited by clamping frame
Technique, it is easy to operate.Before being deposited in this step further include: the strip flexibility mother substrate 31 on frame after a plurality of stretching
Upper setting luminescent layer, electrode etc..It preferably, further include (example above strip flexibility mother substrate 31 on frame after a plurality of stretching
Such as above luminescent layer, electrode) protective layer is formed, so impurity etc. can be prevented to the wound of drive circuit layer and display layer
Evil.
Step 111, every flexible mother substrate in the strip flexibility mother substrate after stretching a plurality of on frame is cut,
To form single flexible substrate.
In this step, because having multiple flexible base boards on every flexible mother substrate, therefore every flexible mother substrate can be divided
Multiple flexible base boards are segmented into, every flexible mother substrate are cut along the edge of each flexible base board, so that being formed can individually throw
Enter the flexible base board used, after completing above-mentioned technique, thus completes the manufacture of flexible base board.It can also be adopted when cutting
It is cut with laser or cutter etc., laser cutting method is the top that laser is set to every flexible mother substrate, and laser can
Laser beam is irradiated, to be accurately cut into each flexible base board.After the completion of finally cutting in this step, frame 32 can also be again
Recycling use is carried out, to greatly save cost.
In conclusion flexible base board production method provided in this embodiment, by according to the flexibility under tensional state
The setting pixel density of substrate, the flexible base board needs obtained under contraction state are stretched to the flexibility under tensional state
Drawing force required for substrate；The flexible mother substrate cut under contraction state will be in into strips according to preset shape；Using
Net machine stretches strip flexibility mother substrate according to the drawing force of acquisition, and the strip flexibility mother substrate after a plurality of stretching is pasted
It closes on frame；Evaporation process is carried out to the strip flexibility mother substrate after stretching a plurality of on frame；After stretching a plurality of on frame
Strip flexibility mother substrate in every flexible mother substrate cut, single flexible substrate is formed, so as to significantly mention
The precision of high flexibility substrate pixel density, also can be improved the manufacturing yield of flexible base board.
The flexible mother substrate for setting driving layer and display layer can also be rolled on a winding device, dust can be prevented
It is polluted Deng to flexible mother substrate.Strip flexibility mother substrate after a plurality of stretching can also be arranged on frame is deposited etc.
Subsequent technique operates also very convenient to improve manufacture efficiency.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, though
So the present invention has been disclosed as a preferred embodiment, and however, it is not intended to limit the invention, any technology people for being familiar with this profession
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above make a little change or modification
It is right according to the technical essence of the invention for the equivalent embodiment of equivalent variations, but without departing from the technical solutions of the present invention
Any simple modification, equivalent change and modification made by above embodiments, all of which are still within the scope of the technical scheme of the invention.
Claims (9)
1. a kind of flexible base board production method, characterized in that it comprises:
According to the setting pixel density of the flexible base board under tensional state, the flexible base board obtained under contraction state is needed
It is stretched to drawing force required for the flexible base board under tensional state, wherein the flexibility under tensional state
Substrate is the flexible base board that flexible base board is fabricated to final use state；
Flexible mother substrate under contraction state is provided, cuts the flexible mother substrate under contraction state according to preset shape
It is cut into strip；
Strip flexibility mother substrate is stretched according to the drawing force of acquisition using screen-tensioning machine, and the strip after a plurality of stretching is soft
Sexupara substrate is fitted on frame；
Evaporation process is carried out to the strip flexibility mother substrate after a plurality of stretching on the frame；
Every flexible mother substrate in strip flexibility mother substrate after a plurality of stretching on the frame is cut, is formed single
Flexible base board.
2. flexible base board production method according to claim 1, which is characterized in that provide the flexibility under contraction state
Mother substrate, comprising: setting driving layer and display layer in the substrate of the flexible mother substrate under contraction state.
3. flexible base board production method according to claim 2, which is characterized in that further include: will set driving layer and
The flexible mother substrate under contraction state of display layer is rolled on a winding device.
4. flexible base board production method according to claim 1, which is characterized in that carried out when cutting using laser or cutter
Cutting.
5. flexible base board production method according to claim 1, which is characterized in that using screen-tensioning machine according to the stretching of acquisition
Power stretches strip flexibility mother substrate, comprising: connect strip flexible base board with the screen-tensioning machine, the screen-tensioning machine stretches
Strip flexibility mother substrate, by the deformation of strip flexibility mother substrate to adjust the pixel density on strip flexibility mother substrate to setting
Pixel density.
6. flexible base board production method according to claim 1, which is characterized in that by the strip flexible mother after a plurality of stretching
Substrate is fitted on frame, comprising: the strip flexibility mother substrate after a plurality of stretching is welded on the frame by ultrasonic wave.
7. flexible base board production method according to claim 1, which is characterized in that the material of the frame is stainless steel
Material.
8. flexible base board production method according to claim 1, which is characterized in that after a plurality of stretching on the frame
Strip flexibility mother substrate carries out before evaporation process, comprising: is arranged on the strip flexibility mother substrate on frame after a plurality of stretching
Luminescent layer, electrode.
9. flexible base board production method according to claim 8, which is characterized in that further include: a plurality of stretching on frame
Protective layer is formed above strip flexibility mother substrate afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510974648.3A CN105514117B (en) | 2015-12-23 | 2015-12-23 | Flexible base board production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510974648.3A CN105514117B (en) | 2015-12-23 | 2015-12-23 | Flexible base board production method |
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| Publication Number | Publication Date |
|---|---|
| CN105514117A CN105514117A (en) | 2016-04-20 |
| CN105514117B true CN105514117B (en) | 2019-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510974648.3A Active CN105514117B (en) | 2015-12-23 | 2015-12-23 | Flexible base board production method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108898953B (en) * | 2018-07-04 | 2020-12-22 | 京东方科技集团股份有限公司 | Preparation method of flexible display panel, flexible display panel and display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1535087A (en) * | 2003-04-01 | 2004-10-06 | ������������ʽ���� | Display device, electronic machine and diplsy device mfg. method |
| CN104766820A (en) * | 2015-04-27 | 2015-07-08 | 深圳市华星光电技术有限公司 | Flexible display device manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4104902B2 (en) * | 2002-05-21 | 2008-06-18 | シャープ株式会社 | Substrate processing equipment |
| KR20070013134A (en) * | 2005-07-25 | 2007-01-30 | 삼성전자주식회사 | Apparatus and method for manufacturing display device substrate |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1535087A (en) * | 2003-04-01 | 2004-10-06 | ������������ʽ���� | Display device, electronic machine and diplsy device mfg. method |
| CN104766820A (en) * | 2015-04-27 | 2015-07-08 | 深圳市华星光电技术有限公司 | Flexible display device manufacturing method |
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| CN105514117A (en) | 2016-04-20 |
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