CN105513794A - Radio frequency microwave laminated ceramic capacitor and preparation method thereof - Google Patents
Radio frequency microwave laminated ceramic capacitor and preparation method thereof Download PDFInfo
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000000843 powder Substances 0.000 claims abstract description 33
- 238000005245 sintering Methods 0.000 claims abstract description 32
- 229910052709 silver Inorganic materials 0.000 claims abstract description 29
- 239000004332 silver Substances 0.000 claims abstract description 29
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000012046 mixed solvent Substances 0.000 claims abstract description 13
- 239000002270 dispersing agent Substances 0.000 claims abstract description 12
- 239000004014 plasticizer Substances 0.000 claims abstract description 12
- 239000002002 slurry Substances 0.000 claims abstract description 12
- 238000007639 printing Methods 0.000 claims abstract description 6
- 238000010304 firing Methods 0.000 claims abstract description 3
- 229910052573 porcelain Inorganic materials 0.000 claims description 40
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 27
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical group CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 16
- 239000011230 binding agent Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- 238000010276 construction Methods 0.000 claims description 10
- 239000013530 defoamer Substances 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 4
- 230000014759 maintenance of location Effects 0.000 claims description 3
- 239000010946 fine silver Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000009766 low-temperature sintering Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 abstract description 3
- 239000002518 antifoaming agent Substances 0.000 abstract 3
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 40
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000007747 plating Methods 0.000 description 7
- 229910010293 ceramic material Inorganic materials 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910001252 Pd alloy Inorganic materials 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- HHNYJWFLIHOXIR-UHFFFAOYSA-N [Ca][Sr][Ti][Zr] Chemical compound [Ca][Sr][Ti][Zr] HHNYJWFLIHOXIR-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000001965 increasing effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
According to a preparation method of a radio frequency microwave laminated ceramic capacitor, materials include ceramic powder, adhesive, dispersing agent, defoaming agent, plasticizer and mixed solvent, wherein the weight ratio of ceramic powder to adhesive is 1:30-55%, the weight ratio of ceramic powder to dispersing agent is 1:0.2-1.2%, the weight ratio of ceramic powder to defoaming agent is 1:0.05-0.1%, and the weight ratio of ceramic powder to plasticizer is 1:0.1-1.5%. After materials are prepared, ceramic film forming, internal electrode printing and overlapping, laminating, cutting, adhesive arraying, sintering, chamfering, end sealing, end firing, electroplating, surface processing and other procedures are conducted. The invention provides a ceramic capacitor preparation method and product which are low in ESR, high in Q value, low in sintering temperature, low in manufacturing cost and environmentally friendly. Ceramic slurry formed by mixing ceramic powder, adhesive, dispersing agent, defoaming agent, plasticizer and mixed solvent according to a certain proportion can be subjected to low-temperature sintering forming together with inner electrode silver; in the whole sintering process, ceramic bodies and inner electrode silver are similar in thermal expansion coefficient, and it can be ensured that the sintered product can not crack.
Description
Technical field
The present invention relates to ceramic capacitor and preparation method thereof, be specifically related to a kind of frequency microwave ceramic capacitor and preparation method thereof.
Background technology
Frequency microwave multi-layer ceramic capacitor is more and more extensive in the application in high frequency field, be one of important foundation element be applied in the e-machine of microwave frequency band, the miniaturization of all electronic equipments such as communication, navigation, radar, electronic countermeasures in equipping modern weapons, lightweight, progress that is integrated and high reliability play vital effect.In portable mobile phone, automobile telephone, microwave base station, cordless telephone, telstar receiver etc., just playing increasing effect simultaneously.
Domestic and international frequency microwave multi-layer ceramic capacitor main mining height temperature 1250-1350 DEG C or middle temperature 1000-1200 DEG C of sintering at present, the silver palladium alloy using palladium-containing metal amount higher is interior electrode, and material is very high with sintering cost.In addition, capacitor arrangement adopts the mode that electrode is transversely arranged, ESR is comparatively large, can not play maximum advantage in circuit.
Because the sintering of current ceramic body needs very high temperature, therefore need using resistant to elevated temperatures palladium metal or silver palladium alloy as interior electrode, and high temperature sintering needs the energy that consumes large, and interior electrode needs to use precious metal palladium, therefore, the cost of electrode is also high.
If adopt silver to carry out low-temperature sintering as interior electrode, then need the porcelain slurry after preparing burden also low-temperature sintering to be shaped, and need the similar thermal expansion coefficient of the thermal coefficient of expansion of ceramic body and interior electrode silver, to guarantee to there will not be cracking in whole sintering process.Can therefore adopt silver to carry out low-temperature sintering as interior electrode, key exists: for the batching of sintered ceramic body and the ratio of batching.
Find that following patent and the present invention have similarity by domestic retrieval:
Application number is 201310487950.7, name is called " microwave ceramic material, multilayer ceramic capacitor and prepare the method for this capacitor ", and this invention relates to capacitor area, a kind of microwave ceramic material is provided, adopt the multilayer ceramic capacitor that this microwave ceramic material makes, and the preparation method of this capacitor, described pottery comprises pre-burning powder A and B, and the mol ratio of A and B is 0.95 ~ 0.05; Wherein: the formula of A is counted in mass ratio: CaCO325 ~ 40; Nd2O320 ~ 40; TiO230 ~ 40; B formula is counted in mass ratio: Mg (CO3) 4Mg (OH) 25H2O70 ~ 80; ZnO1 ~ 5; TiO215 ~ 25; Dielectric layer in described capacitor adopts this microwave ceramic material to be made; By optimizing the formula of microwave ceramic material, ceramic material is sintered with Ag/Pd at 800-1000 DEG C, and serviceability temperature scope is-55 ~ 125 DEG C, DIELECTRIC CONSTANT ε=15 ~ 20; Dielectric loss tan δ≤5 × 10-4, insulation resistance IR >=10G, DC breakdown voltage >=10kV/mm, temperature coefficient (0 ± 30) ppm/ DEG C.
Application number is 201410068730.5, name is called a kind of chip multilayer ceramic capacitor of high-frequency and high-Q-value of the disclosure of the invention of " preparation method of the multilayer ceramic capacitor medium of wide operating temperature range ", it starches preparation by porcelain, medium diaphragm makes, double exposure, briquet is dry, lamination, cutting, binder removal, burn till, chamfering, end-blocking, burn end, the operation preparations such as plating, in described double exposure in electrode and dielectric layer operation, inner electrode is nickel, in described termination procedure, termination electrode material is copper Cu, in the preparation of porcelain slurry, porcelain used is zirconium titanium strontium calcium Ca-Sr-Ti-Zr system porcelain, the average particle degree of zirconium titanium strontium calcium Ca-Sr-Ti-Zr system's porcelain be 0.3 ~ 0.5 μm spherical or like spherical, when stating electrode and dielectric layer in double exposure, interior electrode adopts the arrangement of upside-down mounting double exposure, and the chip multilayer ceramic capacitor of making has superior high-frequency and high-Q electric property, and can reduce production cost greatly.
Although be all the patent of ceramic capacitor and preparation method thereof aspect in foregoing invention, be not be interior electrode with silver, and ratio between the batching of ceramic body and various batching is all different.Be learn claims of the invention of 201310487950.7 from application number: be silver palladium alloy by electrode in the inner, therefore temperature of its sintering is very high, and the cost of ceramic capacitor can be made to improve.Therefore how to reduce the temperature of sintering and prepare the cost of ceramic capacitor, also needing further research.
Summary of the invention
The technical problem to be solved in the present invention is: adopt in ESR, Q value, sintering temperature, manufacturing cost and operation in environmental protection batching etc. for current ceramic capacitor and be difficult to accomplish to take into account, and a kind of low ESR is provided, high q-factor, the ceramic capacitor preparation method of sintering temperature and low, low manufacturing cost and operation environmental protection and product.
Pin is with the problems referred to above, and the technical scheme that the present invention proposes is: a kind of preparation method of frequency microwave multi-layer ceramic capacitor, has following operation:
A. prepare burden, batching comprises porcelain powder, adhesive, dispersant, defoamer, plasticizer and mixed solvent, wherein the weight ratio of porcelain powder and adhesive is 1:30%-55%, the weight ratio of porcelain powder and dispersant is 1:0.2%-1.2%, the weight ratio of porcelain powder and defoamer is 1:0.05%-0.1%, and the weight ratio of porcelain powder and plasticizer is 1:0.1%-1.5%;
B. electrode and lamination in printing, interior electrode is the printing of fine silver slurry, and interior electrode arranges with the direction perpendicular to external electrode;
C. binder removal, during binder removal, temperature is 220 DEG C-380 DEG C, and the time of binder removal is 42-64 hour;
D. sinter, sintering temperature is 860 DEG C-930 DEG C, and sintering circuit is divided into binder removal stage, temperature rise period, holding stage and temperature-fall period;
E. burn end, firing termination temperature is 580 DEG C-720 DEG C, and the belt speed of burning end is 1.0-1.6 minute/10cm;
F. surface treatment, adopt gold as the external welding layer of capacitor in surface treatment procedure, the gold-plated time is 30-90 minute, and electric current is 10-30A.
Further, in operation a, the granularity of porcelain powder is the spheroid of 0.42-0.95 μm, and mixed solvent is n-butyl acetate and ethanol is the mixture of 1-4:1 by weight.
Further, in operation d, the heating rate in binder removal stage is 80 DEG C-180 DEG C/h, and the heating rate of temperature rise period is 170 DEG C-220 DEG C/h, and the temperature retention time of holding stage is 1.5-6 hour.
Further, in operation d temperature-fall period adopt be automatically be filled with cooled compressed air to descent of temperature.
A kind of frequency microwave multi-layer ceramic capacitor, comprise ceramic body, interior electrode and external electrode, the two ends of ceramic body are external electrode, and interior electrode is between the external electrode at two ends; The interior electrode of ceramic capacitor is silver, has crossed silver layer, nickel dam and layer gold successively from inside to outside in external electrode; The interior electrode of ceramic capacitor is laminated construction, and the orientation of interior electrode is vertical with external electrode.
Further, the laminated construction of ceramic capacitor is: interior electrode is vertical individual layer cascaded structure, and adopts not Heterogeneous Permutation between every layer.
Further, the laminated construction of ceramic capacitor is: interior electrode is vertical double-deck cascaded structure, and adopts not Heterogeneous Permutation between every layer.
Further, the laminated construction of ceramic capacitor is: interior electrode is vertical individual layer cascaded structure, and adopts relative arrangement between every layer.
Further, the laminated construction of ceramic capacitor is: the interior electrode of both sides adopts individual layer arranged opposite, and middle interior electrode adopts bilayer not Heterogeneous Permutation.
Advantage of the present invention is:
1. the porcelain slurry allowing porcelain powder, adhesive, dispersant, defoamer, plasticizer and mixed solvent prepare burden by a certain percentage to be mixed into can carry out low-temperature sintering shaping with interior electrode silver, and the similar thermal expansion coefficient of ceramic body and interior electrode silver in whole sintering process, can guarantee that the product after sintering can not ftracture.
2. in, the orientation of electrode is vertical with external electrode vertical, make the present invention have low ESR and high q-factor, and interior electrode adopts silver, and the outermost layer of external electrode be golden, reduce further ESR.
3. in, electrode only adopts silver, does not use precious metal palladium, while the material cost reducing ceramic capacitor, also reduces the temperature of sintering, thus reduces the cost of sintering.
4. adopt n-butyl acetate to replace toluene in mixed solvent, and adopt the mode of cyanide-free plating time gold-plated, make safety and environmental protection in operation of the present invention.
5. in, the stacked arrangement mode of electrode is flexible and changeable, makes single ceramic capacitor can have the characteristics such as multiple different withstand voltage properties, capacity, ESR and high Q, thus makes ceramic capacitor can be applicable to more field.
Accompanying drawing explanation
Fig. 1 is longitudinal cross-sectional schematic of embodiment one;
Fig. 2 is longitudinal cross-sectional schematic of embodiment two;
Fig. 3 is longitudinal cross-sectional schematic of embodiment three;
Fig. 4 is longitudinal cross-sectional schematic of embodiment four;
Fig. 5 is longitudinal cross-sectional schematic of embodiment five;
In figure: 1 layer gold, 2 nickel dams, 3 silver layers, 4 ceramic bodies, electrode in 5.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the description of one step is done to the present invention:
Embodiment one
As shown in Figure 1, the two ends of ceramic capacitor are the external electrode of metal, and centre is ceramic body 4, and the interior electrode 5 of sheet is silver, and interior electrode 5 is embedded in ceramic body 4.External electrode divides three layers: internal layer is silver layer 3, skin is layer gold 1, and centre is nickel dam 2.Interior electrode 5 vertically arranges, and three layers of external electrode is all horizontal, and the orientation of interior electrode 5 is vertical with external electrode.Interior electrode 5 is vertical double-deck cascaded structure, and adopts not Heterogeneous Permutation between every layer.
Wherein can reduce the ESR of ceramic capacitor by vertical with external electrode for the orientation of interior electrode 5 and put forward high q-factor, adopt silver as interior electrode 5, gold can reduce ESR further as the outermost layer of external electrode.Silver, as interior electrode 5, can reduce costs as interior electrode 5 relative to current silver palladium alloy, and uses nickel as interior electrode 5 relative to current, and silver is not easily oxidized.
In addition, because silver point is lower, therefore when silver is as interior electrode 5, can not under too high prerequisite in the temperature of sintering, porcelain well can be starched thermal sintering by requirement on the one hand, require on the other hand ceramic body 4 in the process of whole sintering thermal coefficient of expansion can with the similar thermal expansion coefficient of interior electrode 5 silver medal, to guarantee that the product after sintering can not ftracture.
Operation in the present invention comprises: batching, ceramic membrane are shaping, the interior operation such as electrode 5 and superposition, lamination, cutting, binder removal, sintering, chamfering, end-blocking, burning end, plating, surface treatment of printing.In the present embodiment: batching comprises porcelain powder, adhesive, dispersant, defoamer, plasticizer and mixed solvent, wherein the weight ratio of porcelain powder and adhesive is 1:30%-55%, the weight ratio of porcelain powder and dispersant is 1:0.2%-1.2%, the weight ratio of porcelain powder and defoamer is 1:0.05%-0.1%, and the weight ratio of porcelain powder and plasticizer is 1:0.1%-1.5%.Mixed solvent is n-butyl acetate and ethanol, and the weight ratio of n-butyl acetate and ethanol is the mixture of 1-4:1.
Porcelain powder is MZST base porcelain powder, and the granularity of MZST base porcelain powder is the orbicule of 0.42-0.95 μm or nearly orbicule.In binder removal operation, temperature is 220 DEG C-380 DEG C, and the time is 42-64 hour.Sintering temperature is 860 DEG C-930 DEG C, and the whole process of sintering circuit is divided into binder removal stage, temperature rise period, holding stage and temperature-fall period.Wherein the heating rate in binder removal stage is 80 DEG C-180 DEG C/h, and the heating rate of temperature rise period is 170 DEG C-220 DEG C/h, and the temperature retention time of holding stage is 1.5-6 hour.And temperature-fall period employing is automatically be filled with cooled compressed air to descent of temperature.
Temperature when burning end is 580 DEG C-720 DEG C, and the belt speed of burning movement during end is 1.0-1.6 minute/10cm.During plating external electrode, innermost layer silver coating 3, intermediate layer is nickel coating 2, outermost layer Gold plated Layer 1.Wherein, the gold-plated time is 30-90 minute, and electric current is 10-30A, and employing is the mode that cyanide-free is electroplated.Adopt the positive butyl ester of acid acid to replace current toluene in mixed solvent, and time gold-plated, adopt cyanide-free plating to replace current cyanide plating, make safety and environmental protection in the operation of the present embodiment.
In the burden process of the present embodiment porcelain slurry batching and consumption as shown in table 1:
Table 1: porcelain slurry batching and consumption in burden process
| Tested number | Porcelain powder: adhesive % | Porcelain powder: dispersant % | Porcelain powder: defoamer % | Porcelain powder: plasticizer % | Solvent |
| 1 | 35 | 0.5 | 0.06 | 0.3 | In right amount |
| 2 | 42 | 0.7 | 0.08 | 0.9 | In right amount |
| 3 | 52 | 1.0 | 0.10 | 1.3 | In right amount |
The ratio of the solvent of the present embodiment and as shown in table 2 on the impact of parameters:
Table 2: the formulation selection of solvent
| N-butyl acetate and ethanol weight ratio | 3:1 | 2:1 | 1:1 | 0.5:1 |
| Porcelain slurry viscosity CPS | 586 | 521 | 365 | 499 |
| Casting films outward appearance | A small amount of conglomeration | Good | Good | Generally |
The various performance parameters of the porcelain slurry adopting the batching of different amounts to make in the present embodiment is as shown in table 3:
Table 3: the performance parameter of porcelain slurry tape casting diaphragm
In general, the density of prolonging diaphragm in table 3 is larger, and the intensity of prolonging diaphragm is larger, but is not that the intensity of prolonging diaphragm is the bigger the better.But should select according to the degree of approximation of the thermal coefficient of expansion of ceramic body 4 after sintering and the thermal coefficient of expansion of interior electrode 5 silver medal.
Because the thermal coefficient of expansion of ceramic body 4 has close associating with the density of prolonging diaphragm, usually by prolonging the selection of diaphragm density to determine the thermal coefficient of expansion of ceramic body 4.And prolong diaphragm density and then have close associate with the n-butyl acetate in table 2 with ethanol weight ratio with the consumption of preparing burden in table 1.Can find out that from table 1 and table 3 tested number is the proportioning that the proportioning of No. 3 is better than other 2 experiments number.
The basic parameter of the frequency microwave multi-layer ceramic capacitor produced by above-mentioned operation is as shown in table 4 and table 5:
Table 4: frequency microwave multi-layer ceramic capacitor basic parameter
Table 5: frequency microwave multi-layer ceramic capacitor microwave property
In sum, the frequency microwave multi-layer ceramic capacitor tool adopting the preparation method of the present embodiment to produce has the following advantages:
1. the porcelain slurry allowing porcelain powder, adhesive, dispersant, defoamer, plasticizer and mixed solvent prepare burden by a certain percentage to be mixed into can carry out low-temperature sintering shaping with interior electrode 5 silver medal, and ceramic body 4 and the similar thermal expansion coefficient of interior electrode 5 silver medal in whole sintering process, can guarantee that the product after sintering can not ftracture.
2. in, the orientation of electrode 5 is vertical with external electrode vertical, make the present invention have low ESR and high q-factor, and interior electrode 5 adopts silver, and the outermost layer of external electrode is gold, reduce further ESR.
3. in, electrode 5 only adopts silver, does not use precious metal palladium, while the material cost reducing ceramic capacitor, also reduces the temperature of sintering, thus reduces the cost of sintering.
4. adopt n-butyl acetate to replace toluene in mixed solvent, and adopt the mode of cyanide-free plating time gold-plated, make safety and environmental protection in operation of the present invention.
5. in, the stacked arrangement mode of electrode 5 is flexible and changeable, makes single ceramic capacitor can have the characteristics such as multiple different withstand voltage properties, capacity, ESR and high Q, thus makes ceramic capacitor can be applicable to more field.
Embodiment two
As shown in Figure 2, be with the difference of embodiment one: interior electrode 5 is that the mode of individual layer arranges.Its advantage is compared with embodiment one: cost is low.Be applicable to require in not bery high operating mode ESR.
Embodiment three
As shown in Figure 3, be with the difference of embodiment one: double-deck interior electrode 5 is 4 sections at the hop count that vertical direction is divided.The hop count divided in vertical direction due to it has more one section than embodiment one, and therefore its withstand voltage properties is better.
Embodiment four
As shown in Figure 4, be with the difference of embodiment one: interior electrode 5 is that vertical mono-layer fashion arranges, and adopts relative arrangement between every layer.Described arrangement relatively refers to: in every one deck of top, electrode 5 has one deck and its electrode 5 in same vertical line direction in below.And electrode 5 all thickeies in every layer in the present embodiment, its advantage is compared with embodiment one: be suitable for frequency high.
Embodiment five
As shown in Figure 5, in the present embodiment, the interior electrode 5 of both sides adopts individual layer arranged opposite, and middle interior electrode 5 adopts bilayer not Heterogeneous Permutation.The present embodiment be a kind of in conjunction with the embodiments one and embodiment four one in electrode 5 mix arrangement.
Obviously, under the prerequisite not departing from principle of the present invention, the some improvement made or modification all should be considered as protection scope of the present invention.
Claims (9)
1. a preparation method for frequency microwave multi-layer ceramic capacitor, is characterized in that, in operation:
A. prepare burden, batching comprises porcelain powder, adhesive, dispersant, defoamer, plasticizer and mixed solvent, wherein the weight ratio of porcelain powder and adhesive is 1:30%-55%, the weight ratio of porcelain powder and dispersant is 1:0.2%-1.2%, the weight ratio of porcelain powder and defoamer is 1:0.05%-0.1%, and the weight ratio of porcelain powder and plasticizer is 1:0.1%-1.5%;
B. electrode and lamination in printing, interior electrode (5) is the printing of fine silver slurry, and interior electrode (5) arranges with the direction perpendicular to external electrode;
C. binder removal, during binder removal, temperature is 220 DEG C-380 DEG C, and the time of binder removal is 42-64 hour;
D. sinter, sintering temperature is 860 DEG C-930 DEG C, and sintering circuit is divided into binder removal stage, temperature rise period, holding stage and temperature-fall period;
E. burn end, firing termination temperature is 580 DEG C-720 DEG C, and the belt speed of burning end is 1.0-1.6 minute/10cm;
F. surface treatment, adopt gold as the external welding layer of capacitor in surface treatment procedure, the gold-plated time is 30-90 minute, and electric current is 10-30A.
2. the preparation method of a kind of frequency microwave multi-layer ceramic capacitor according to claim 1, is characterized in that, in operation a, the granularity of porcelain powder is the spheroid of 0.42-0.95 μm, and mixed solvent is n-butyl acetate and ethanol is the mixture of 1-4:1 by weight.
3. the preparation method of a kind of frequency microwave multi-layer ceramic capacitor according to claim 1, it is characterized in that, in operation d, the heating rate in binder removal stage is 80 DEG C-180 DEG C/h, the heating rate of temperature rise period is 170 DEG C-220 DEG C/h, and the temperature retention time of holding stage is 1.5-6 hour.
4. the preparation method of a kind of frequency microwave multi-layer ceramic capacitor according to claim 1, is characterized in that, what in operation d, temperature-fall period adopted is automatically be filled with cooled compressed air to descent of temperature.
5. the frequency microwave multi-layer ceramic capacitor manufactured by preparation method described in claim 1, comprise ceramic body (4), interior electrode (5) and external electrode, the two ends of ceramic body (4) are external electrode, interior electrode (5) is between the external electrode at two ends, it is characterized in that, the interior electrode (5) of ceramic capacitor is silver, has crossed silver layer (3), nickel dam (2) and layer gold (1) in external electrode from inside to outside successively; The interior electrode (5) of ceramic capacitor is laminated construction, and the orientation of interior electrode (5) is vertical with external electrode.
6. frequency microwave multi-layer ceramic capacitor according to claim 5, is characterized in that, the laminated construction of ceramic capacitor is: interior electrode (5) is vertical individual layer cascaded structure, and adopts not Heterogeneous Permutation between every layer.
7. frequency microwave multi-layer ceramic capacitor according to claim 5, is characterized in that, the laminated construction of ceramic capacitor is: interior electrode (5) is vertical double-deck cascaded structure, and adopts not Heterogeneous Permutation between every layer.
8. frequency microwave multi-layer ceramic capacitor according to claim 5, is characterized in that, the laminated construction of ceramic capacitor is: interior electrode (5) is vertical individual layer cascaded structure, and adopts relative arrangement between every layer.
9. frequency microwave multi-layer ceramic capacitor according to claim 5, is characterized in that, the laminated construction of ceramic capacitor is: the interior electrode (5) of both sides adopts individual layer arranged opposite, and middle interior electrode (5) adopts bilayer not Heterogeneous Permutation.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108074739A (en) * | 2017-12-28 | 2018-05-25 | 山东迪电子科技有限公司 | Vertical patch capacitor and its manufacture craft |
| CN108164270A (en) * | 2017-12-14 | 2018-06-15 | 深圳顺络电子股份有限公司 | A kind of method for improving component porcelain body densified sintering product |
| CN108281283A (en) * | 2017-12-28 | 2018-07-13 | 山东迪电子科技有限公司 | The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor |
| CN108461293A (en) * | 2018-04-09 | 2018-08-28 | 广东风华高新科技股份有限公司 | A kind of manufacturing method of ceramic capacitor |
| CN113488335A (en) * | 2021-06-15 | 2021-10-08 | 潮州三环（集团）股份有限公司 | Method for manufacturing multilayer ceramic capacitor |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002313666A (en) * | 2001-04-18 | 2002-10-25 | Murata Mfg Co Ltd | Method of manufacturing laminated ceramic electronic component |
| JP2003178623A (en) * | 2001-10-05 | 2003-06-27 | Murata Mfg Co Ltd | Conductive paste, manufacturing method of laminated ceramic electronic component, and laminated ceramic electronic component |
| CN1634800A (en) * | 2003-12-30 | 2005-07-06 | 广东风华高新科技集团有限公司 | Super low temperature sintered ceramic medium materials, manufacturing method thereof and capacitor made therefrom |
| CN1837145A (en) * | 2006-04-25 | 2006-09-27 | 清华大学 | Low-temperature sintered and temperature-stable multilayer ceramic capacitor dielectric materials |
| TW201003691A (en) * | 2008-07-01 | 2010-01-16 | Holy Stone Entpr Co Ltd | Fabrication method of multifunctional laminated ceramic capacitor |
| JP2012001424A (en) * | 2010-05-17 | 2012-01-05 | Murata Mfg Co Ltd | Ceramic slurry, method for manufacturing ceramic slurry, and method for manufacturing ceramic green sheet with carrier film and laminated ceramic electronic part |
| CN103000369A (en) * | 2012-12-11 | 2013-03-27 | 北京元六鸿远电子技术有限公司 | Method for preparing high voltage-resisting chip type ceramic capacitor |
| TWI394736B (en) * | 2008-07-11 | 2013-05-01 | Walsin Technology Corp | Low temperature co-firing process and product of laminated ceramic element without adding hydrogen |
| CN103578764A (en) * | 2013-11-01 | 2014-02-12 | 吴浩 | Method for improving Q value of ceramic capacitor |
| CN104261817A (en) * | 2014-09-18 | 2015-01-07 | 中国人民大学 | CaCu3Ti4O12 system multilayer ceramic capacitor and preparation method thereof |
-
2016
- 2016-01-26 CN CN201610050110.8A patent/CN105513794A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002313666A (en) * | 2001-04-18 | 2002-10-25 | Murata Mfg Co Ltd | Method of manufacturing laminated ceramic electronic component |
| JP2003178623A (en) * | 2001-10-05 | 2003-06-27 | Murata Mfg Co Ltd | Conductive paste, manufacturing method of laminated ceramic electronic component, and laminated ceramic electronic component |
| CN1238860C (en) * | 2001-10-05 | 2006-01-25 | 株式会社村田制作所 | Conducting paste, laminated ceramic electronic device mfg. method and laminated ceramic electronic device |
| CN1634800A (en) * | 2003-12-30 | 2005-07-06 | 广东风华高新科技集团有限公司 | Super low temperature sintered ceramic medium materials, manufacturing method thereof and capacitor made therefrom |
| CN1837145A (en) * | 2006-04-25 | 2006-09-27 | 清华大学 | Low-temperature sintered and temperature-stable multilayer ceramic capacitor dielectric materials |
| TW201003691A (en) * | 2008-07-01 | 2010-01-16 | Holy Stone Entpr Co Ltd | Fabrication method of multifunctional laminated ceramic capacitor |
| TWI394736B (en) * | 2008-07-11 | 2013-05-01 | Walsin Technology Corp | Low temperature co-firing process and product of laminated ceramic element without adding hydrogen |
| JP2012001424A (en) * | 2010-05-17 | 2012-01-05 | Murata Mfg Co Ltd | Ceramic slurry, method for manufacturing ceramic slurry, and method for manufacturing ceramic green sheet with carrier film and laminated ceramic electronic part |
| CN103000369A (en) * | 2012-12-11 | 2013-03-27 | 北京元六鸿远电子技术有限公司 | Method for preparing high voltage-resisting chip type ceramic capacitor |
| CN103578764A (en) * | 2013-11-01 | 2014-02-12 | 吴浩 | Method for improving Q value of ceramic capacitor |
| CN104261817A (en) * | 2014-09-18 | 2015-01-07 | 中国人民大学 | CaCu3Ti4O12 system multilayer ceramic capacitor and preparation method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108164270A (en) * | 2017-12-14 | 2018-06-15 | 深圳顺络电子股份有限公司 | A kind of method for improving component porcelain body densified sintering product |
| CN108074739A (en) * | 2017-12-28 | 2018-05-25 | 山东迪电子科技有限公司 | Vertical patch capacitor and its manufacture craft |
| CN108281283A (en) * | 2017-12-28 | 2018-07-13 | 山东迪电子科技有限公司 | The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor |
| CN108074739B (en) * | 2017-12-28 | 2023-07-07 | 山东芯诺电子科技股份有限公司 | Vertical patch capacitor and manufacturing process thereof |
| CN108461293A (en) * | 2018-04-09 | 2018-08-28 | 广东风华高新科技股份有限公司 | A kind of manufacturing method of ceramic capacitor |
| CN113488335A (en) * | 2021-06-15 | 2021-10-08 | 潮州三环（集团）股份有限公司 | Method for manufacturing multilayer ceramic capacitor |
| CN113488335B (en) * | 2021-06-15 | 2022-07-26 | 潮州三环（集团）股份有限公司 | Method for manufacturing multilayer ceramic capacitor |
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