CN105505276A - Low-temperature-resistant hot-melt adhesive for optical fiber cable - Google Patents
Low-temperature-resistant hot-melt adhesive for optical fiber cable Download PDFInfo
- Publication number
- CN105505276A CN105505276A CN201511015468.9A CN201511015468A CN105505276A CN 105505276 A CN105505276 A CN 105505276A CN 201511015468 A CN201511015468 A CN 201511015468A CN 105505276 A CN105505276 A CN 105505276A
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- China
- Prior art keywords
- melt adhesive
- parts
- hot melt
- low
- thermoplastic elastomer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a low-temperature-resistant hot-melt adhesive for an optical fiber cable. The low-temperature-resistant hot-melt adhesive is prepared from following components in parts by weight: 40-60 parts of polyester hot melt adhesive, 5-10 parts of polyamide resin, 20-30 parts of polyamide organic silicon thermoplastic elastomer, 0.5-0.8 part of antioxidant 164 and 1-2 parts of aid, wherein the aid is nano-scale talc powder or nano-scale bentonite. The polyester hot melt adhesive is modified by the polyamide resin, the polyamide organic silicon thermoplastic elastomer and the nano-scale talc powder or the bentonite together; the polyamide organic silicon thermoplastic elastomer has high tensile strength, high low-temperature impact resistance, high tear resistance and high chemical resistance; the nano-scale talc powder or the bentonite has high thixotropic behavior and chemical stability; the polyamide organic silicon thermoplastic elastomer and the nano-scale talc powder or the bentonite are added by a proper amount, and facilitate and coordinate with each other, so that effective modification of the polyester hot melt adhesive is realized, and the low temperature toughness of the polyester hot melt adhesive can be improved remarkably.
Description
Technical field
The present invention relates to a kind of low-temperature resistant hot melt glue for optical fiber cable, belong to technical field of macromolecule adhesive.
Background technology
In fiber optics industry, optical cable forms the cable heart with the optical fiber of some amount according to certain mode, and outer wrap has internal protective cover, strengthens the mode such as composite bed and outer jointing jacket, to realize the communication link of optical signal transmission.Hot melt adhesive has handling ease, cohesiveness is strong, feature with low cost, be widely used in industrial production at present, hot melt adhesive is also for optical cable, in cable, be mainly used in the adhesive joins technique strengthening composite bed, play the good result of water-blocking moistureproof, optic cable, cable requires very high to the water preventing ability of seam lap and tensile strength, therefore the hot melt adhesive of high strength must be used, in addition, in environment for use, require that the hot melt adhesive used still has good Bonding strength at low temperatures, and current hot melt adhesive can not meet low temperature resistant performance, its low-temperature flexibility is poor, there is deficiency easy to crack.
Summary of the invention
The object of the invention is to solve the deficiencies in the prior art, a kind of low-temperature resistant hot melt glue for optical fiber cable and preparation method thereof is provided.
The technical solution adopted for the present invention to solve the technical problems is:
For the low-temperature resistant hot melt glue of optical fiber cable, described low-temperature resistant hot melt glue is processed by the component of following weight part: polyester hot-melt adhesive 40-60 part, polyamide resin 5-10 part, Polyamide organic silicon thermoplastic elastomer 20-30 part, oxidation inhibitor 1640.5-0.8 part, auxiliary agent 1-2 part, described auxiliary agent is nano level talcum powder or nano level wilkinite, and the preparation method of described low-temperature resistant hot melt glue carries out as follows:
(1) by the oxidation inhibitor of formula ratio and auxiliary agent evenly for subsequent use in high-speed mixer and mixing;
(2) polyester hot-melt adhesive of formula ratio, polyamide resin and Polyamide organic silicon thermoplastic elastomer are added in the material that step (1) mixes and mix further, then join in screw extruder pelletizer, melt blending is extruded;
(3) mixture extruded is through cooling, granulation, and the pellet that granulation obtains removes moisture through vacuum-drying.
Described modified poly ester hot melt adhesive is processed by the component of following weight part: polyester hot-melt adhesive 50 parts, polyamide resin 8 parts, Polyamide organic silicon thermoplastic elastomer 25 parts, 1640.6 parts, oxidation inhibitor, auxiliary agent 1.5 parts.
For a preparation method for the low-temperature resistant hot melt glue of optical fiber cable, the preparation method of described low-temperature resistant hot melt glue carries out as follows:
(1) oxidation inhibitor of formula ratio and auxiliary agent are pre-mixed evenly for subsequent use in high mixer;
(2) polyester hot-melt adhesive of formula ratio, polyamide resin and Polyamide organic silicon thermoplastic elastomer are added in the material that step (1) mixes and mix further, then join in screw extruder pelletizer, melt blending is extruded;
(3) mixture extruded is through cooling, granulation, and the pellet that granulation obtains removes moisture through vacuum-drying.
The Polyamide organic silicon thermoplastic elastomer structural formula that the present invention uses is
In formula, p is 35, q be 40, n is 32, prepares by the preparation method disclosed in Chinese invention patent (patent No.: ZL201310628391.7).
The invention has the beneficial effects as follows:
The present invention adopts polyamide resin, Polyamide organic silicon thermoplastic elastomer and nano level talcum powder or wilkinite jointly to carry out modification to polyester hot-melt adhesive, Polyamide organic silicon thermoplastic elastomer tensile strength and low temperature impact strength high, tear strength is good, and chemical resistant properties is good; Nano level talcum powder or wilkinite have good thixotropy, chemical stability, add appropriate Polyamide organic silicon thermoplastic elastomer and nano level talcum powder or wilkinite, the two promotes mutually, synergy, realize high effective and modified to polyester hot-melt adhesive, significantly can improve the low-temperature flexibility of polyester hot-melt adhesive, ageing resistance and peeling resistance, processing characteristics is excellent, and the process for processing for optical fiber cable is effective.
Embodiment
Below by specific embodiment, technical scheme of the present invention is described in further detail.
Reagent of the present invention and raw material are all commercial convenient source except Polyamide organic silicon thermoplastic elastomer, and equipment used is commercial conventional processing units.
Embodiment 1:
For the low-temperature resistant hot melt glue of optical fiber cable, described low-temperature resistant hot melt glue is processed by the component of following weight part: polyester hot-melt adhesive 40 parts, polyamide resin 5 parts, Polyamide organic silicon thermoplastic elastomer 20 parts, 1640.5 parts, oxidation inhibitor, auxiliary agent 1 part, described auxiliary agent is nano level talcum powder, and the preparation method of described low-temperature resistant hot melt glue carries out as follows:
(1) by the oxidation inhibitor of formula ratio and auxiliary agent evenly for subsequent use in high-speed mixer and mixing;
(2) polyester hot-melt adhesive of formula ratio, polyamide resin and Polyamide organic silicon thermoplastic elastomer are added in the material that step (1) mixes and mix further, then join in screw extruder pelletizer, melt blending is extruded;
(3) mixture extruded is through cooling, granulation, and the pellet that granulation obtains removes moisture through vacuum-drying.
Embodiment 2:
For the low-temperature resistant hot melt glue of optical fiber cable, described low-temperature resistant hot melt glue is processed by the component of following weight part: polyester hot-melt adhesive 60 parts, polyamide resin 10 parts, Polyamide organic silicon thermoplastic elastomer 30 parts, 1640.8 parts, oxidation inhibitor, auxiliary agent 2 parts, described auxiliary agent is nano level wilkinite, and the preparation method of described low-temperature resistant hot melt glue carries out as follows:
(1) by the oxidation inhibitor of formula ratio and auxiliary agent evenly for subsequent use in high-speed mixer and mixing;
(2) polyester hot-melt adhesive of formula ratio, polyamide resin and Polyamide organic silicon thermoplastic elastomer are added in the material that step (1) mixes and mix further, then join in screw extruder pelletizer, melt blending is extruded;
(3) mixture extruded is through cooling, granulation, and the pellet that granulation obtains removes moisture through vacuum-drying.
Embodiment 3
For the low-temperature resistant hot melt glue of optical fiber cable, described low-temperature resistant hot melt glue is processed by the component of following weight part: polyester hot-melt adhesive 50 parts, polyamide resin 8 parts, Polyamide organic silicon thermoplastic elastomer 25 parts, 1640.6 parts, oxidation inhibitor, auxiliary agent 1.5 parts, described auxiliary agent is nano level wilkinite, and the preparation method of described low-temperature resistant hot melt glue carries out as follows:
(1) by the oxidation inhibitor of formula ratio and auxiliary agent evenly for subsequent use in high-speed mixer and mixing;
(2) polyester hot-melt adhesive of formula ratio, polyamide resin and Polyamide organic silicon thermoplastic elastomer are added in the material that step (1) mixes and mix further, then join in screw extruder pelletizer, melt blending is extruded;
(3) mixture extruded is through cooling, granulation, and the pellet that granulation obtains removes moisture through vacuum-drying.
Test case:
To the viscosity (mPa.s) of the hot melt adhesive that embodiment 1-3 prepares, softening temperature (DEG C), 25 DEG C of hardness (ShoreA) and hot melt adhesive transparency, the performances such as cold crack temperature (-20 DEG C) and peeling force (N/mm) carry out result test, pin numbers 34 test is used with Bo Lifei dial type LVT type viscometer during its medium viscosity (180 DEG C) test, probe temperature is 150 DEG C. the ring and ball method that softening temperature test meets American Society for testing and materials ASTM standard specifications is tested, the testing method of cold crack temperature is: the steel disc choosing several pieces 25*100mm, hot melt adhesive (temperature 155 DEG C) is coated on one end of test piece, another sheet is overlapping, 20 seconds are pressed with the weight of 3kg, then place after 24 hours and put into-20 DEG C of environment maintenances 2 hours, bend 30 ° of tests, observe glue-line and destroy situation, test result is as follows:
| Embodiment | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Viscosity | 8800 | 9200 | 9500 |
| Softening temperature | 90 | 88 | 95 |
| 25 DEG C of hardness | 82 | 80 | 84 |
| Cold crack temperature 20 DEG C | Glue-line does not ftracture | Glue-line does not ftracture | Glue-line does not ftracture |
| Peeling force | 4.2 | 4.5 | 5.0 |
| Hot melt adhesive transparency | Translucent, light yellow | Translucent, light yellow | Translucent, light yellow |
From test data, the low-temperature resistant hot melt glue excellent property that the present invention prepares, not easy to crack under low temperature environment, in optical cable, cable, strengthen the bonding of composite bed, water-blocking moistureproof is respond well.
Above-described embodiment is one of the present invention preferably scheme, not does any pro forma restriction to the present invention, also has other variant and remodeling under the prerequisite not exceeding the technical scheme described in claim.
Claims (3)
1. for the low-temperature resistant hot melt glue of optical fiber cable, it is characterized in that: described low-temperature resistant hot melt glue is processed by the component of following weight part: polyester hot-melt adhesive 40-60 part, polyamide resin 5-10 part, Polyamide organic silicon thermoplastic elastomer 20-30 part, oxidation inhibitor 1640.5-0.8 part, auxiliary agent 1-2 part, described auxiliary agent is nano level talcum powder or nano level wilkinite, and the preparation method of described low-temperature resistant hot melt glue carries out as follows:
(1) by the oxidation inhibitor of formula ratio and auxiliary agent evenly for subsequent use in high-speed mixer and mixing;
(2) polyester hot-melt adhesive of formula ratio, polyamide resin and Polyamide organic silicon thermoplastic elastomer are added in the material that step (1) mixes and mix further, then join in screw extruder pelletizer, melt blending is extruded;
(3) mixture extruded is through cooling, granulation, and the pellet that granulation obtains removes moisture through vacuum-drying.
2. modified poly ester hot melt adhesive according to claim 1, it is characterized in that: described modified poly ester hot melt adhesive is processed by the component of following weight part: polyester hot-melt adhesive 50 parts, polyamide resin 8 parts, Polyamide organic silicon thermoplastic elastomer 25 parts, 1640.6 parts, oxidation inhibitor, auxiliary agent 1.5 parts.
3. a preparation method for the low-temperature resistant hot melt glue for optical fiber cable described in claim 1 or 2, is characterized in that: the preparation method of described low-temperature resistant hot melt glue carries out as follows:
(1) oxidation inhibitor of formula ratio and auxiliary agent are pre-mixed evenly for subsequent use in high mixer;
(2) polyester hot-melt adhesive of formula ratio, polyamide resin and Polyamide organic silicon thermoplastic elastomer are added in the material that step (1) mixes and mix further, then join in screw extruder pelletizer, melt blending is extruded;
(3) mixture extruded is through cooling, granulation, and the pellet that granulation obtains removes moisture through vacuum-drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511015468.9A CN105505276A (en) | 2015-12-31 | 2015-12-31 | Low-temperature-resistant hot-melt adhesive for optical fiber cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511015468.9A CN105505276A (en) | 2015-12-31 | 2015-12-31 | Low-temperature-resistant hot-melt adhesive for optical fiber cable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105505276A true CN105505276A (en) | 2016-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511015468.9A Pending CN105505276A (en) | 2015-12-31 | 2015-12-31 | Low-temperature-resistant hot-melt adhesive for optical fiber cable |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108913079A (en) * | 2018-05-14 | 2018-11-30 | 启东鑫天鼎热熔胶有限公司 | A kind of formula and preparation method thereof of low temperature resistant polyester hot-melt adhesive |
| CN109722200A (en) * | 2018-12-27 | 2019-05-07 | 东莞市澳中电子材料有限公司 | A kind of hot melt adhesive and Hot melt adhesive tape of excellent heat resistance |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103642048A (en) * | 2013-12-02 | 2014-03-19 | 浙江科技学院 | Polyamide organic silicon thermoplastic elastomer and preparation method thereof |
| CN104130737A (en) * | 2013-05-02 | 2014-11-05 | 上海理日化工新材料有限公司 | Polyester-polyamide hot melt adhesive composition and preparation method thereof |
-
2015
- 2015-12-31 CN CN201511015468.9A patent/CN105505276A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104130737A (en) * | 2013-05-02 | 2014-11-05 | 上海理日化工新材料有限公司 | Polyester-polyamide hot melt adhesive composition and preparation method thereof |
| CN103642048A (en) * | 2013-12-02 | 2014-03-19 | 浙江科技学院 | Polyamide organic silicon thermoplastic elastomer and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108913079A (en) * | 2018-05-14 | 2018-11-30 | 启东鑫天鼎热熔胶有限公司 | A kind of formula and preparation method thereof of low temperature resistant polyester hot-melt adhesive |
| CN108913079B (en) * | 2018-05-14 | 2020-12-22 | 启东鑫天鼎热熔胶有限公司 | Formula and preparation method of low-temperature-resistant polyester hot melt adhesive |
| CN109722200A (en) * | 2018-12-27 | 2019-05-07 | 东莞市澳中电子材料有限公司 | A kind of hot melt adhesive and Hot melt adhesive tape of excellent heat resistance |
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Application publication date: 20160420 |
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