CN105505137B - A kind of PCB cover plate for drilling hole and preparation method thereof - Google Patents
A kind of PCB cover plate for drilling hole and preparation method thereof Download PDFInfo
- Publication number
- CN105505137B CN105505137B CN201610026942.6A CN201610026942A CN105505137B CN 105505137 B CN105505137 B CN 105505137B CN 201610026942 A CN201610026942 A CN 201610026942A CN 105505137 B CN105505137 B CN 105505137B
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- Prior art keywords
- cover plate
- acrylate
- preparation
- drilling hole
- pcb cover
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Biological Depolymerization Polymers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Finishing Walls (AREA)
Abstract
The present invention discloses a kind of PCB cover plate for drilling hole and preparation method thereof, and it includes step：By weight percentage, by epoxy acrylate 30 70%, urethane acrylate 10 40%, polyester acrylate 10 40%, polyether acrylate 4 20%, levelling agent 1.5 3%, light trigger 1 2.5%, put into stirred tank, 2 7h are stirred under the conditions of 40 80 °C, cool to 20 35 °C, UV resins are made；Obtained UV resins are coated uniformly on aluminum flake surface, then LED light solidifies, and coating glue film aluminium flake is made.By cover plate made from the above method of the present invention, the combination of aluminium flake hard material and UV resin soft materials is realized so that enter effectively suppress when boring drill point skidding, improve borehole accuracy, reduce broken needle rate.
Description
Technical field
The present invention relates to PCB cover plate for drilling hole technical fields, more particularly to a kind of PCB cover plate for drilling hole and its preparation side
Method.
Background technology
Existing drilling cover plate uses phenolic board, aluminium flake etc. mostly, and PCB develops towards high density small-bore aspect in recent years,
Because density hole diameter enlargement reduces, hole position precision, hole wall quality, aperture burr, broken needle rate etc. do not reach requirement.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of PCB cover plate for drilling hole and its preparation
Method, it is intended to solve existing PCB cover plate for drilling hole hole position precision, hole wall quality, aperture burr, broken needle rate etc. do not reach will
The problem of asking.
Technical scheme is as follows：
A kind of preparation method of PCB cover plate for drilling hole, wherein, including step：
A, by weight percentage, by epoxy acrylate 30-70%, urethane acrylate 10-40%, polyester acrylic
Ester 10-40%, polyether acrylate 4-20%, levelling agent 1.5-3%, light trigger 1-2.5%, put into stirred tank, at 40-80 °C
Under the conditions of stir 2-7h, cool to 20-35 °C, UV resins be made；
B, obtained UV resins are coated uniformly on aluminum flake surface, then LED light solidifies, and coating glue film aluminium flake is made.
The preparation method of described PCB cover plate for drilling hole, wherein, in step A, by weight percentage, by propylene oxide
Acid esters 44.5%, urethane acrylate 30%, polyester acrylate 15%, polyether acrylate 5%, levelling agent 3%, light trigger
2.5%, put into stirred tank, stir 4h under the conditions of 60 °C, cool to 25 °C, UV resins are made.
The preparation method of described PCB cover plate for drilling hole, wherein, in step A, by weight percentage, by propylene oxide
Acid esters 54.5%, urethane acrylate 26%, polyester acrylate 10%, polyether acrylate 4%, levelling agent 3%, light trigger
2.5%, put into stirred tank, stir 3h under the conditions of 70 °C, cool to 25 °C, UV resins are made.
The preparation method of described PCB cover plate for drilling hole, wherein, in step B, the thickness of the aluminium flake is 0.08-
0.16mm。
The preparation method of described PCB cover plate for drilling hole, wherein, in step B, the thickness of the aluminium flake is 0.1-
0.16mm。
The preparation method of described PCB cover plate for drilling hole, wherein, in step B, in coating glue film aluminium flake, the thickness of coating glue film
For 10-120 μm.
The preparation method of described PCB cover plate for drilling hole, wherein, in step B, in coating glue film aluminium flake, the thickness of coating glue film
For 30-60 μm.
A kind of PCB cover plate for drilling hole, wherein, it is prepared by the preparation method of use as above any described PCB cover plate for drilling hole
Form.
Beneficial effect：The present invention realizes aluminium flake hard material by the UV resins in aluminum flake surface one layer of soft of coating
Material and the combinations of UV resin soft materials, enter hole position precision when boring so as to effectively increase drill point, improve hole wall quality, reduction
Hole Wall Roughness, peak in hell is reduced, reduce broken needle rate.
Embodiment
The present invention provides a kind of PCB cover plate for drilling hole and preparation method thereof, to make the purpose of the present invention, technical scheme and effect
Fruit is clearer, clear and definite, and the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only
Only to explain the present invention, it is not intended to limit the present invention.
The present invention provides a kind of preparation method of PCB cover plate for drilling hole, and it includes step：
A, by weight percentage, by epoxy acrylate 30-70%, urethane acrylate 10-40%, polyester acrylic
Ester 10-40%, polyether acrylate 4-20%, levelling agent 1.5-3%, light trigger 1-2.5%, put into stirred tank, at 40-80 °C
Under the conditions of stir 2-7h, cool to 20-35 °C, UV resins be made；
B, obtained UV resins are coated uniformly on aluminum flake surface, then LED light solidifies, and coating glue film aluminium flake is made.
Existing simple aluminium flake and phenolic board make cover plate, and because its case hardness is big, drill point enters cover plate moment when boring and skidded,
So as to influence borehole accuracy, or even broken needle.The present invention realizes aluminium flake by the UV resins in aluminum flake surface one layer of soft of coating
The combination of hard material and UV resin soft materials, so that drill point enters effectively to suppress when boring drill point skidding, improve hole position essence
Degree, lift drill point drilling efficiency；Drill point is protected, lifts the drill point life-span；Hole wall quality is improved, reduces Hole Wall Roughness；Reduce disconnected
Pin rate, reduce burr in hell.
Preferably, in step B, the thickness of the aluminium flake is 0.08-0.16mm.It is highly preferred that the thickness of the aluminium flake is
0.1-0.16mm, further to improve the performance of PCB cover plate for drilling hole.
Preferably, in step B, in coating glue film aluminium flake, the thickness of coating glue film is 10-120 μm.It is highly preferred that coating glue film
Thickness is 30-60 μm, further to improve the performance of PCB cover plate for drilling hole.
Based on the above method, the present invention provides a kind of PCB cover plate for drilling hole, and it uses as above any described PCB drillings
It is prepared with the preparation method of cover plate.Aluminium flake hard is realized by PCB cover plate for drilling hole made from the above method of the present invention
The combination of material and UV resin soft materials so that enter effectively to suppress when boring drill point skidding, improve borehole accuracy, reduce broken needle
Rate.
With specific embodiment, the present invention is described in detail below.
Embodiment 1
By epoxy acrylate 44.5%, urethane acrylate 30%, polyester acrylate 15%, polyether acrylate 5%,
Levelling agent 3%, light trigger 2.5%, put into stirred tank and stir 4h under 60 °C, cool to 25 °C, UV resins are made.
Take 0.1mm aluminium flakes to be placed on platform, obtained UV resins are coated uniformly on aluminum flake surface with spreader, then
LED light solidifies, and 30um thickness coating glue film aluminium flakes are made, specification 1030, take 1030 coating glue film aluminium flakes to be drilled with 0.1mm blank aluminium flakes
Contrast test, it as a result see the table below 1：Hole position precision CPK=2.722, Hole Wall Roughness 7.6, ailhead 1.1, peak 10, drill point twines silk
Nothing, broken needle without.
Embodiment 2
By epoxy acrylate 54.5%, urethane acrylate 26%, polyester acrylate 10%, polyether acrylate 4%,
Levelling agent 3%, light trigger 2.5%, put into stirred tank, stir 3h under 70 °C, cool to 25 °C, UV resins are made.
Take 0.1mm aluminium flakes to be placed on platform, obtained UV resins are evenly applied to aluminum flake surface with spreader, then
LED light solidifies, and applies UV resins again on the coating glue film coated and 50um thickness coating glue film aluminium flakes are made, specification 1050, take 1050 gluings
Aluminium flake is cooked drilling contrast test with 0.1mm blank aluminium flakes, as a result see the table below 1：Hole position precision CPK=2.885, Hole Wall Roughness
7.5, ailhead 1.1, peak 12, drill point twines silk nothing, broken needle without.
Embodiment 3
By epoxy acrylate 65.5%, urethane acrylate 10%, polyester acrylate 10%, polyether acrylate
10%, levelling agent 2.5%, light trigger 2%, put into stirred tank, stir 4h under 50 °C, cool to 25 °C, UV trees are made
Fat.
Take 0.14mm aluminium flakes to be placed on platform, obtained UV resins are evenly applied to aluminum flake surface with spreader, then
LED light solidifies, and 40um thickness coating glue film aluminium flakes are made, specification 1440, take 1440 coating glue film aluminium flakes to be bored with 0.14mm blank aluminium flakes
Hole contrast test, as a result see the table below 1：Hole position precision CPK=3.630, Hole Wall Roughness 5.6, ailhead 1.2, peak 8, drill point twines silk
Nothing, broken needle without.
Embodiment 4
By epoxy acrylate 65%, urethane acrylate 10.5%, polyester acrylate 10%, polyether acrylate
10%, levelling agent 2.5%, light trigger 2%, put into stirred tank, stir 4h under 60 °C, cool to 25 °C, UV trees are made
Fat.
Take 0.14mm aluminium flakes to be placed on platform, obtained UV resins are evenly applied to aluminum flake surface with spreader, then
LED light solidifies, and applies UV resins again on the coating glue film coated, and LED light, which solidifies, is made 60um thickness coating glue film aluminium flakes, specification 1460,
Take 1460 gluing aluminium flakes to do drilling contrast test with 0.14mm blank aluminium flakes, as a result see the table below 1：Hole position precision CPK=3.875, hole
Wall roughness 5.0, ailhead 1.0, peak 9, drill point twine silk nothing, broken needle without.
Table 1
Above-described embodiment 1 ~ 4 shows, compared with existing simple aluminium flake makees cover plate, PCB cover plate for drilling hole of the invention, passes through
The UV resins of one layer of soft are coated in aluminum flake surface, drill point is effectively increased and enters hole position precision when boring, improve hole wall quality,
Hole Wall Roughness is reduced, reduces peak in hell, reduces broken needle rate.
In summary, a kind of PCB cover plate for drilling hole of the invention and preparation method thereof, the present invention in aluminum flake surface by applying
The UV resins of one layer of soft are covered, realize the combination of aluminium flake hard material and UV resin soft materials, so that drill point enters to bore
Shi Youxiao suppresses drill point and skidded, and improves hole position precision, lifts drill point drilling efficiency；Drill point is protected, lifts the drill point life-span；Improve hole
Wall quality, reduce Hole Wall Roughness；Broken needle rate is reduced, reduces burr in hell.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (8)
1. a kind of preparation method of PCB cover plate for drilling hole, it is characterised in that including step：
A, by weight percentage, by epoxy acrylate 30-70%, urethane acrylate 10-40%, polyester acrylate
10-40%, polyether acrylate 4-20%, levelling agent 1.5-3%, light trigger 1-2.5%, put into stirred tank, in 40-80 °C of bar
2-7h is stirred under part, is cooled to 20-35 °C, UV resins are made；
B, obtained UV resins are coated uniformly on aluminum flake surface, then LED light solidifies, and coating glue film aluminium flake is made；
The combination of aluminium flake hard material and UV resin soft materials so that enter effectively to suppress when boring drill point skidding, improve drilling essence
Degree, reduce broken needle rate.
2. the preparation method of PCB cover plate for drilling hole according to claim 1, it is characterised in that in step A, by weight hundred
Point than meter, by epoxy acrylate 44.5%, urethane acrylate 30%, polyester acrylate 15%, polyether acrylate 5%,
Levelling agent 3%, light trigger 2.5%, put into stirred tank, stir 4h under the conditions of 60 °C, cool to 25 °C, UV trees are made
Fat.
3. the preparation method of PCB cover plate for drilling hole according to claim 1, it is characterised in that in step A, by weight hundred
Point than meter, by epoxy acrylate 54.5%, urethane acrylate 26%, polyester acrylate 10%, polyether acrylate 4%,
Levelling agent 3%, light trigger 2.5%, put into stirred tank, stir 3h under the conditions of 70 °C, cool to 25 °C, UV trees are made
Fat.
4. the preparation method of PCB cover plate for drilling hole according to claim 1, it is characterised in that in step B, the aluminium flake
Thickness be 0.08-0.16mm.
5. the preparation method of PCB cover plate for drilling hole according to claim 4, it is characterised in that in step B, the aluminium flake
Thickness be 0.1-0.16mm.
6. the preparation method of PCB cover plate for drilling hole according to claim 1, it is characterised in that in step B, coating glue film aluminium
In piece, the thickness of coating glue film is 10-120 μm.
7. the preparation method of PCB cover plate for drilling hole according to claim 6, it is characterised in that in step B, coating glue film aluminium
In piece, the thickness of coating glue film is 30-60 μm.
8. a kind of PCB cover plate for drilling hole, it is characterised in that using such as the PCB cover plate for drilling hole as described in claim 1 ~ 7 is any
Preparation method is prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610026942.6A CN105505137B (en) | 2016-01-13 | 2016-01-13 | A kind of PCB cover plate for drilling hole and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610026942.6A CN105505137B (en) | 2016-01-13 | 2016-01-13 | A kind of PCB cover plate for drilling hole and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105505137A CN105505137A (en) | 2016-04-20 |
| CN105505137B true CN105505137B (en) | 2017-12-29 |
Family
ID=55713454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610026942.6A Active CN105505137B (en) | 2016-01-13 | 2016-01-13 | A kind of PCB cover plate for drilling hole and preparation method thereof |
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| Country | Link |
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| CN (1) | CN105505137B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109760133A (en) * | 2019-01-29 | 2019-05-17 | 深圳市柳鑫实业股份有限公司 | A kind of cover board and the preparation method and application thereof |
| CN112888162B (en) * | 2021-01-12 | 2024-02-06 | 深圳市宏宇辉科技有限公司 | Double-sided composite aluminum sheet |
| CN113583583A (en) * | 2021-07-30 | 2021-11-02 | 深圳市宏宇辉科技有限公司 | Composite coating aluminum sheet and preparation method and application thereof |
| CN114773942B (en) * | 2022-04-02 | 2023-06-23 | 广东希贵光固化材料有限公司 | LED curing coating |
| CN115160882B (en) * | 2022-06-17 | 2023-04-07 | 广东希贵光固化材料有限公司 | UV coating for HPE cover plate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102585691B (en) * | 2012-02-13 | 2014-06-11 | 长沙市原鹏化工科技有限公司 | Ultraviolet-cured hydrophilic coating composition and preparation method thereof |
| CN202911235U (en) * | 2012-11-27 | 2013-05-01 | 崔国平 | Special coated aluminum plate for printed circuit board drilling |
| CN103421459B (en) * | 2013-09-04 | 2015-12-09 | 北京海斯迪克新材料有限公司 | A kind of UV of applicable thin film coatings technique solidifies conformal coating |
| CN204222320U (en) * | 2014-07-10 | 2015-03-25 | 碁达科技股份有限公司 | Boring guidance sheet |
| CN204505411U (en) * | 2015-03-03 | 2015-07-29 | 唐渊渊 | A kind of Drilling operation cover plate |
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- 2016-01-13 CN CN201610026942.6A patent/CN105505137B/en active Active
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| CN105505137A (en) | 2016-04-20 |
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Address after: 265300 Economic Development Zone, Fushan District, Yantai City, Shandong Province Patentee after: Yantai Liuxin New Material Technology Co.,Ltd. Address before: 265300 Zhongqiao Economic Development Zone, Qixia City, Yantai City, Shandong Province Patentee before: Yantai Liuxin New Material Technology Co.,Ltd. |