CN105472876A - Mobile terminal, flexible printed circuit and manufacturing method therefor - Google Patents
Mobile terminal, flexible printed circuit and manufacturing method therefor Download PDFInfo
- Publication number
- CN105472876A CN105472876A CN201511028576.XA CN201511028576A CN105472876A CN 105472876 A CN105472876 A CN 105472876A CN 201511028576 A CN201511028576 A CN 201511028576A CN 105472876 A CN105472876 A CN 105472876A
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- China
- Prior art keywords
- conducting wire
- live width
- wiring area
- spaced
- conducting
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
Abstract
The invention provides a flexible printed circuit. The flexible printed circuit comprises a flexible substrate and a conducive layer arranged on the flexible substrate, wherein the flexible substrate comprises two side edges that are arranged in opposite, and a first wiring region, a second wiring region and a third wiring region that are arranged between the two side edges; the second wiring region and the third wiring region are arranged adjacent to the two side edges respectively; the first wiring region is arranged between the second wiring region and the third wiring region; the conductive layer comprises a first conductive circuit, a second conductive circuit and a third conductive circuit; the first conductive circuit is arranged in the first wiring region; the second conductive circuit and the third conductive circuit are arranged in the second wiring region and the third wiring region respectively; and the width of the first conductive circuit is less than that of the second conductive circuit and the third conductive circuit. In addition, the invention also provides a mobile terminal and a manufacturing method for the flexible printed circuit. The flexible printed circuit can prevent the first conductive wire with the relatively narrow width from being cracked.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of mobile terminal, flexible PCB and manufacture method thereof.
Background technology
Flexible PCB (FlexiblePrintedCircuit, FPC) be the printed circuit board (PCB) made with flexible insulating substrate, it has many rigid printed circuit board (PrintedCircuitboard, PCB) advantage do not possessed, such as FPC can free bend, winding, folding, can require to arrange arbitrarily according to space layout, thus reach components and parts and assemble the integration be connected with wire.Owing to there is above-mentioned advantage, make to adopt FPC effectively can reduce the volume of electronic product, increase the flexibility of circuit layout, meet the needs of electronic product to high density, miniaturization, highly reliable future development.At present, FPC is widely used in the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, personal digital assistant (PersonalDigitalAssistant, PDA), digital camera or product.
FPC, producing, in assembling and the process that uses, may be subject to extraneous pulling force effect, or and other devices of periphery between produces and rubs, thus the conducting wire on destruction FPC.Such as, conducting wire is caused rupture because being subject to extraneous pulling force effect, or because making the problems such as conducting wire loose contact rubbed with peripheral devices more.
as Fig. 1shown in, the conducting wire on FPC generally includes thicker power supply cabling and thinner signal lead.In the prior art, normally first signal lead close or identical for signal type laid, then reserved between holding wire blank space lays power supply cabling.But, due to signal lead, comparatively power supply cabling is thinner usually, if be laid in outside thicker power supply cabling, makes thinner signal lead when PFC is subject to external tensile force or bending occurs, easily because of stressed excessive and rupture, thus impact uses stability and the reliability of the product of FPC.
Summary of the invention
In view of the above-mentioned problems in the prior art, the invention provides a kind of flexible PCB, by power supply cabling wider for live width being laid in the edge of flexible PCB, signal lead narrower for live width is laid in the centre position of flexible PCB, thus can effectively prevent signal lead because rupturing by External Force Acting, to promote the reliability of flexible PCB.
Separately, the present invention also provides a kind of manufacture method of flexible PCB.
Separately, the present invention also provides a kind of mobile terminal applying described flexible PCB.
A kind of flexible PCB, comprises flexible base, board and is arranged at the conductive layer on described flexible base, board; Described flexible base, board comprises two articles of sides being oppositely arranged and the first wiring area between two articles of sides, the second wiring area and the 3rd wiring area, described second wiring area and the 3rd wiring area are disposed adjacent with two articles of described sides respectively, and described first wiring area is arranged between described second wiring area and the 3rd wiring area; Described conductive layer comprises the first conducting wire, the second conducting wire and the 3rd conducting wire, described first conducting wire is arranged at described first wiring area, and described second conducting wire and the 3rd conducting wire are arranged at described second wiring area and the 3rd wiring area respectively; And the live width of described first conducting wire is less than the live width of described second conducting wire and the 3rd conducting wire.
Wherein, many spaced first conducting wires are provided with in described first wiring area, be provided with many articles of spaced second conducting wires and/or the 3rd conducting wire in described second wiring area, in described 3rd wiring area, be provided with many articles of spaced second conducting wires and/or the 3rd conducting wire.
Wherein, described first conducting wire is signal lead, and described second conducting wire and the 3rd conducting wire are power supply cabling.
Wherein, the live width of described first conducting wire is 0.075mm, and the live width of described second conducting wire is 0.8mm, and the live width of described 3rd conducting wire is 0.5mm; The live width of described second conducting wire and the 3rd conducting wire is 0.5mm; Or the live width of described second conducting wire and the 3rd conducting wire is 0.8mm.
A kind of flexible PCB, comprises flexible base, board and is arranged at the conductive layer on described flexible base, board; Described flexible base, board comprises two sides be oppositely arranged; Described conductive layer comprises along spaced first conducting wire of bearing of trend of described side, the second conducting wire and the 3rd conducting wire; Described second conducting wire and described 3rd conducting wire are disposed adjacent with two articles of described sides respectively, and described first conducting wire is arranged between described second conducting wire and described 3rd conducting wire; The live width of described first conducting wire is less than the live width of described second conducting wire and the 3rd conducting wire.
Wherein, described conductive layer comprises many articles of spaced first conducting wires, many articles of spaced second conducting wires and many articles of spaced 3rd conducting wires; Many spaced second conducting wire is disposed adjacent with a side in two described sides; Many articles spaced 3rd conducting wire is disposed adjacent with another article of side in two articles of described sides; Many articles spaced first conducting wire is arranged between many articles of spaced second conducting wires and many articles of spaced 3rd conducting wires.
Wherein, described first conducting wire is signal lead, and described second conducting wire and the 3rd conducting wire are power supply cabling.
Wherein, the live width of described first conducting wire is 0.075mm; The live width of described second conducting wire is 0.8mm, and the live width of described 3rd conducting wire is 0.5mm; Or the live width of described second conducting wire and the 3rd conducting wire is 0.5mm; Or the live width of described second conducting wire and the 3rd conducting wire is 0.8mm.
A manufacture method for flexible PCB, comprising:
There is provided flexible base, board, described flexible base, board comprises two sides be oppositely arranged;
Described flexible base, board forms conductive layer, and form the first conducting wire on described conductive layer, described first conducting wire along described side bearing of trend and be disposed adjacent with the center line of described flexible base, board;
Described conductive layer is formed the second conducting wire and the 3rd conducting wire respectively, and described second conducting wire and the 3rd conducting wire are formed at the both sides of described first conducting wire respectively, and are disposed adjacent with two described sides respectively; Wherein, the live width of described first conducting wire is less than the live width of described second conducting wire and the 3rd conducting wire.
Wherein, the live width of described first conducting wire is 0.075mm; The live width of described second conducting wire is 0.8mm, and the live width of described 3rd conducting wire is 0.5mm; Or the live width of described second conducting wire and the 3rd conducting wire is 0.5mm; Or the live width of described second conducting wire and the 3rd conducting wire is 0.8mm.
A kind of mobile terminal, comprise flexible PCB, described flexible PCB comprises flexible base, board and is arranged at the conductive layer on described flexible base, board; Described flexible base, board comprises two articles of sides being oppositely arranged and the first wiring area between two articles of sides, the second wiring area and the 3rd wiring area, described second wiring area and the 3rd wiring area are disposed adjacent with two articles of described sides respectively, and described first wiring area is arranged between described second wiring area and the 3rd wiring area; Described conductive layer comprises the first conducting wire, the second conducting wire and the 3rd conducting wire, described first conducting wire is arranged at described first wiring area, and described second conducting wire and the 3rd conducting wire are arranged at described second wiring area and the 3rd wiring area respectively; And the live width of described first conducting wire is less than the live width of described second conducting wire and the 3rd conducting wire.
A kind of mobile terminal, comprise flexible PCB, described flexible PCB comprises flexible base, board and is arranged at the conductive layer on described flexible base, board; Described flexible base, board comprises two sides be oppositely arranged; Described conductive layer comprises along spaced first conducting wire of bearing of trend of described side, the second conducting wire and the 3rd conducting wire; Described second conducting wire and described 3rd conducting wire are disposed adjacent with two articles of described sides respectively, and described first conducting wire is arranged between described second conducting wire and described 3rd conducting wire; The live width of described first conducting wire is less than the live width of described second conducting wire and the 3rd conducting wire.
In sum, according to technique scheme, described flexible PCB is by being arranged between the second wider conducting wire of described live width and the 3rd conducting wire by the first narrower for live width conducting wire, the inner side of the second wider conducting wire of live width and the 3rd conducting wire is laid in by the first conducting wire that live width is narrower, thus can effectively prevent described flexible PCB in production, in the process of assembling and use, the problem easily ruptured in the first conducting wire causing live width narrower because being subject to External Force Acting, promote reliability and the stability of described flexible PCB.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to use to required in embodiment or description of the prior art below
accompanying drawingbe briefly described, apparently, in the following describes
accompanying drawingonly some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, can also according to these
accompanying drawingobtain other
accompanying drawing.
fig. 1it is the structural representation of flexible PCB in prior art
figure;
fig. 2it is the structural representation of the flexible PCB that the embodiment of the present invention provides
figure;
fig. 3it is another structural representation of the flexible PCB that the embodiment of the present invention provides
figure;
fig. 4it is the flow process of the manufacture method of the flexible PCB that the embodiment of the present invention provides
figure.
Embodiment
Below in conjunction with in the embodiment of the present invention
accompanying drawing, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
For ease of describe, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms describe
as in figurethe relation of a shown element or feature and another (a bit) element or feature.Be appreciated that, when an element or layer be called as another element or layer " on ", " being connected to " or " being couple to " another element or layer time, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or intervening elements or layer can be there is.
Being appreciated that terminology used here is only to describe specific embodiment, not really wanting to limit the present invention.When here using, clearly state unless context separately has, otherwise singulative " " and " being somebody's turn to do " are also intended to comprise plural form.Further, when using in this manual, term " comprises " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but does not get rid of other features one or more, entirety, step, element, assembly and/or its existence of combining or increase.
Refer to
fig. 2, first embodiment of the invention provides a kind of flexible PCB 10, and it comprises flexible base, board 11 and conductive layer 13.Described flexible base, board 11 comprises two articles of sides 1101 being oppositely arranged and the first wiring area 113, wiring area 111, second between two articles of sides 1101 and the 3rd wiring area 115.In an embodiment of the present invention, according to the type of wiring on flexible base, board 11, different wiring area can be divided into, and the wiring area marked off is arranged along the bearing of trend of described side 1101,
as Fig. 2in the first wiring area 113, wiring area 111, second of being shown in broken lines and the 3rd wiring area 115.Be specially, described second wiring area 113 and the 3rd wiring area 115 respectively side 1101 described with two articles are disposed adjacent, namely described second wiring area 113 and described 3rd wiring area 115 are relatively arranged on the both sides of described flexible base, board 11, described first wiring area 111 is arranged between described second wiring area 113 and the 3rd wiring area 115, and described first wiring area 113, wiring area 111, second and the 3rd wiring area 115 are all arranged along the bearing of trend of described side 1101.
Described conductive layer 13 is arranged on described flexible base, board 11, comprises spaced first conducting wire 133, conducting wire 131, second of bearing of trend along described side 1101 and the 3rd conducting wire 135.Wherein, described first conducting wire 131 is arranged at described first wiring area 111, described second conducting wire 133 is arranged at described second wiring area 113 and/or the 3rd wiring area 115, and described 3rd conducting wire 135 is arranged at described second wiring area 113 and/or the 3rd wiring area 115.In an embodiment of the present invention, described first conducting wire 131 has the first live width, and described second conducting wire 133 and the 3rd conducting wire 135 have the second live width, and described first live width is less than described second live width.
Be appreciated that, many spaced first conducting wires 131 are provided with in described first wiring area 111, be provided with many articles of spaced second conducting wires 133 and/or the 3rd conducting wire 135 in described second wiring area 113, in described 3rd wiring area 115, be provided with many articles of spaced second conducting wires 133 and/or the 3rd conducting wire 135.Be specially: in described first wiring area 111, be provided with many spaced first conducting wires 131, be provided with many spaced second conducting wires 133 in described second wiring area 113, in described 3rd wiring area 115, be provided with many articles of spaced 3rd conducting wires 135; Or, many spaced first conducting wires 131 are provided with in described first wiring area 111, be provided with many articles of spaced 3rd conducting wires 135 in described second wiring area 113, in described 3rd wiring area 115, be provided with many articles of spaced second conducting wires 133; Again or, many spaced first conducting wires 131 are provided with in described first wiring area 111, be provided with many articles of spaced second conducting wires 133 and the 3rd conducting wire 135 in described second wiring area 113, in described 3rd wiring area 115, be provided with many articles of spaced second conducting wires 133 and the 3rd conducting wire 135.
In the present embodiment, described first conducting wire 131 is signal lead, and described second conducting wire 133 and the 3rd conducting wire 135 are power supply cabling.The live width of described first conducting wire 131 and described first live width can be 0.075mm, and the live width of described second conducting wire 133 is 0.8mm, and the live width of described 3rd conducting wire 135 is 0.5mm.Be appreciated that the live width of described second conducting wire 133 can also for 0.5mm, the live width of described 3rd conducting wire 135 can also be 0.8mm; Namely the live width of described second conducting wire 133 and the 3rd conducting wire 135 is 0.5mm; Or the live width of described second conducting wire 133 and the 3rd conducting wire 135 is 0.8mm.Namely described second live width is 0.8mm or 0.5mm.
Refer to
fig. 3, second embodiment of the invention provides a kind of flexible PCB 20, and it comprises flexible base, board 21 and conductive layer 23.Described flexible base, board 21 comprises two sides 2101 be oppositely arranged.Described conductive layer 23 is arranged on described flexible base, board 21, comprises spaced first conducting wire 233, conducting wire 231, second of bearing of trend along described side 2101 and the 3rd conducting wire 235.Described second conducting wire 233 and described 3rd conducting wire 235 respectively side 2101 described with two articles are disposed adjacent, namely this second conducting wire 233 is arranged at the edge of the relative both sides of described flexible base, board 21 respectively with the 3rd conducting wire 235, and described first conducting wire 231 is arranged between described second conducting wire 233 and described 3rd conducting wire 235.Described first conducting wire 231 has the first live width, and described second conducting wire 233 and the 3rd conducting wire 235 have the second live width, and described first live width is less than described second live width.
Be appreciated that described conductive layer 23 can comprise many articles of spaced first conducting wires 231, many articles of spaced second conducting wires 233 and many articles of spaced 3rd conducting wires 235.Many spaced second conducting wire 233 is disposed adjacent with a side in two described sides 2101, and namely many spaced second conducting wires 233 side integrally in side 2101 described with two is disposed adjacent; Many articles spaced 3rd conducting wire 235 is disposed adjacent with another article of side in two articles of described sides 2101, and namely many articles of spaced 3rd conducting wires 235 another article of side integrally in side 2101 described with two articles is disposed adjacent; Many articles described spaced first conducting wire 231 is arranged between many articles of described spaced second conducting wires 233 and the 3rd conducting wire 235, namely many articles of described spaced first conducting wires 231 be integrally arranged at described between many articles of spaced second conducting wires 233 integrally and described many articles of spaced 3rd conducting wires 235 integrally.
In the present embodiment, described first conducting wire 231 is signal lead, and described second conducting wire 233 and the 3rd conducting wire 235 are power supply cabling.The live width of described first conducting wire 231 and described first live width can be 0.075mm, and the live width of described second conducting wire 233 is 0.8mm, and the live width of described 3rd conducting wire 235 is 0.5mm.Be appreciated that the live width of described second conducting wire 233 can also for 0.5mm, the live width of described 3rd conducting wire 235 can also be 0.8mm; Namely the live width of described second conducting wire 233 and the 3rd conducting wire 235 is 0.5mm; Or the live width of described second conducting wire 233 and the 3rd conducting wire 235 is 0.8mm.Namely described second live width is 0.8mm or 0.5mm.
Refer to
fig. 4, third embodiment of the invention provides a kind of manufacture method of flexible PCB, and for the manufacture of the flexible PCB as described in first embodiment of the invention or the second embodiment, described manufacture method at least comprises the steps:
Step S301: flexible base, board is provided, described flexible base, board comprises two sides be oppositely arranged;
Alternatively, described flexible base, board also comprises the first wiring area between two articles of sides, the second wiring area and the 3rd wiring area, described second wiring area and the 3rd wiring area are disposed adjacent with two articles of described sides respectively, described first wiring area is arranged between described second wiring area and the 3rd wiring area, and described first wiring area, the second wiring area and the 3rd wiring area are all arranged along the bearing of trend of described side.The material of described flexible base, board can be polyimides, and polyimides has excellent pliability and good dimensional stability, and operating temperature range is wider, has outstanding fire resistance, and its electrical property is under soldering conditions influenced hardly.Polyester is polyalcohol and polyacid polycondensation and the polymer general name obtained, and it mainly refers to polyethylene terephthalate, can also comprise polybutylene terephthalate and polyarylate.
Step S302: form conductive layer on described flexible base, board, and form the first conducting wire on described conductive layer, described first conducting wire along described side bearing of trend and be disposed adjacent with the center line of described flexible base, board;
Wherein, described first conducting wire is signal lead, and the live width of described first conducting wire can be 0.075mm.Alternatively, described flexible PCB can comprise many spaced described first conducting wires.Alternatively, many spaced first conducting wires can be arranged at the first wiring area of described flexible base, board.Wherein, described conductive layer is formed by covering Copper Foil on described flexible base, board, described Copper Foil can be rolled copper foil or electrolytic copper foil, wherein rolled copper foil has the characteristics such as good ductility, repeated deflection, compared to rolled copper foil, electrolytic copper foil is then have the advantage that manufacturing cost is lower, be conducive to fine-line making.In addition, the Copper Foil of different-thickness can be covered according to demands such as the suppleness of described flexible PCB, bending property and current capacities.
Step S303: form the second conducting wire and the 3rd conducting wire on described conductive layer respectively, described second conducting wire and the 3rd conducting wire are formed at the both sides of described first conducting wire respectively, and are disposed adjacent with two described sides respectively;
Wherein, described second conducting wire and the 3rd conducting wire are power supply cabling, and the live width of described second conducting wire is 0.8mm, and the live width of described 3rd conducting wire is 0.5mm.Be appreciated that the live width of described second conducting wire can also for 0.5mm, the live width of described 3rd conducting wire can also be 0.8mm; Namely the live width of described second conducting wire and the 3rd conducting wire is 0.5mm; Or the live width of described second conducting wire and the 3rd conducting wire is 0.8mm.In an optional embodiment, described flexible PCB can comprise many articles of spaced described second conducting wires and the 3rd conducting wire, and many described spaced second conducting wires are disposed adjacent with a side in two described sides; Many articles described spaced 3rd conducting wire is disposed adjacent with another article of side in two articles of described sides.Alternatively, many articles of described spaced second conducting wires and many articles of spaced 3rd conducting wires can be arranged at the second wiring area and the 3rd wiring area of described flexible base, board respectively.
Fourth embodiment of the invention provides a kind of mobile terminal, comprises the flexible PCB as described in first embodiment of the invention or the second embodiment.Wherein, described mobile terminal can be but be not limited to mobile phone, panel computer, intelligent watch, motion bracelet etc.
In sum, at mobile terminal of the present invention, in the embodiment of flexible PCB and manufacture method thereof, described flexible PCB is by being arranged between the second wider conducting wire of live width and the 3rd conducting wire by the first narrower for live width conducting wire, the inner side of the second wider conducting wire of live width and the 3rd conducting wire is laid in by the first conducting wire that live width is narrower, thus can effectively prevent described flexible PCB in production, in the process of assembling and use, the problem easily ruptured in the first conducting wire causing live width narrower because being subject to External Force Acting, and then promote reliability and the stability of described flexible PCB.
Above disclosedly be only preferred embodiment of the present invention, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are done, still belong to the scope that invention is contained.
Claims (10)
1. a flexible PCB, comprises flexible base, board, it is characterized in that, described flexible PCB also comprises the conductive layer be arranged on described flexible base, board; Described flexible base, board comprises two articles of sides being oppositely arranged and the first wiring area between two articles of sides, the second wiring area and the 3rd wiring area, described second wiring area and the 3rd wiring area are disposed adjacent with two articles of described sides respectively, and described first wiring area is arranged between described second wiring area and the 3rd wiring area; Described conductive layer comprises the first conducting wire, the second conducting wire and the 3rd conducting wire, described first conducting wire is arranged at described first wiring area, and described second conducting wire and the 3rd conducting wire are arranged at described second wiring area and the 3rd wiring area respectively; And the live width of described first conducting wire is less than the live width of described second conducting wire and the 3rd conducting wire.
2. flexible PCB as claimed in claim 1, it is characterized in that, many spaced first conducting wires are provided with in described first wiring area, be provided with many articles of spaced second conducting wires and/or the 3rd conducting wire in described second wiring area, in described 3rd wiring area, be provided with many articles of spaced second conducting wires and/or the 3rd conducting wire.
3. flexible PCB as claimed in claim 1 or 2, it is characterized in that, described first conducting wire is signal lead, and described second conducting wire and the 3rd conducting wire are power supply cabling.
4. flexible PCB as claimed in claim 1 or 2, it is characterized in that, the live width of described first conducting wire is 0.075mm, and the live width of described second conducting wire is 0.8mm, and the live width of described 3rd conducting wire is 0.5mm; The live width of described second conducting wire and the 3rd conducting wire is 0.5mm; Or the live width of described second conducting wire and the 3rd conducting wire is 0.8mm.
5. a flexible PCB, comprises flexible base, board, it is characterized in that, described flexible PCB also comprises the conductive layer be arranged on described flexible base, board; Described flexible base, board comprises two sides be oppositely arranged; Described conductive layer comprises along spaced first conducting wire of bearing of trend of described side, the second conducting wire and the 3rd conducting wire; Described second conducting wire and described 3rd conducting wire are disposed adjacent with two articles of described sides respectively, and described first conducting wire is arranged between described second conducting wire and described 3rd conducting wire; The live width of described first conducting wire is less than the live width of described second conducting wire and the 3rd conducting wire.
6. flexible PCB as claimed in claim 5, it is characterized in that, described conductive layer comprises many articles of spaced first conducting wires, many articles of spaced second conducting wires and many articles of spaced 3rd conducting wires; Many spaced second conducting wire is disposed adjacent with a side in two described sides; Many articles spaced 3rd conducting wire is disposed adjacent with another article of side in two articles of described sides; Many articles spaced first conducting wire is arranged between many articles of spaced second conducting wires and many articles of spaced 3rd conducting wires.
7. the flexible PCB as described in claim 5 or 6, is characterized in that, described first conducting wire is signal lead, and described second conducting wire and the 3rd conducting wire are power supply cabling.
8. the flexible PCB as described in claim 5 or 6, is characterized in that, the live width of described first conducting wire is 0.075mm; The live width of described second conducting wire is 0.8mm, and the live width of described 3rd conducting wire is 0.5mm; Or the live width of described second conducting wire and the 3rd conducting wire is 0.5mm; Or the live width of described second conducting wire and the 3rd conducting wire is 0.8mm.
9. a manufacture method for flexible PCB, is characterized in that, described manufacture method comprises:
There is provided flexible base, board, described flexible base, board comprises two sides be oppositely arranged;
Described flexible base, board forms conductive layer, and form the first conducting wire on described conductive layer, described first conducting wire along described side bearing of trend and be disposed adjacent with the center line of described flexible base, board;
Described conductive layer is formed the second conducting wire and the 3rd conducting wire respectively, and described second conducting wire and the 3rd conducting wire are formed at the both sides of described first conducting wire respectively, and are disposed adjacent with two described sides respectively; Wherein, the live width of described first conducting wire is less than the live width of described second conducting wire and the 3rd conducting wire.
10. a mobile terminal, is characterized in that, described mobile terminal comprises the flexible PCB as described in claim 1-8 any one.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201511028576.XA CN105472876A (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible printed circuit and manufacturing method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201511028576.XA CN105472876A (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible printed circuit and manufacturing method therefor |
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CN105472876A true CN105472876A (en) | 2016-04-06 |
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CN1578586A (en) * | 2003-07-24 | 2005-02-09 | 日本电气株式会社 | Flexible substrate and electronic device |
CN2842988Y (en) * | 2005-11-22 | 2006-11-29 | 比亚迪股份有限公司 | Flexible circuit-board |
CN201238419Y (en) * | 2008-05-13 | 2009-05-13 | 广东生益科技股份有限公司 | Two-sided flexible copper-covered plate |
CN201657484U (en) * | 2010-01-28 | 2010-11-24 | 比亚迪股份有限公司 | Bend-resistant flexible circuit board |
CN204119645U (en) * | 2014-09-28 | 2015-01-21 | 江西鑫力华数码科技有限公司 | There is the flexible circuit board of the anti-jackknifing structure of circuit |
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2015
- 2015-12-29 CN CN201511028576.XA patent/CN105472876A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1578586A (en) * | 2003-07-24 | 2005-02-09 | 日本电气株式会社 | Flexible substrate and electronic device |
CN2842988Y (en) * | 2005-11-22 | 2006-11-29 | 比亚迪股份有限公司 | Flexible circuit-board |
CN201238419Y (en) * | 2008-05-13 | 2009-05-13 | 广东生益科技股份有限公司 | Two-sided flexible copper-covered plate |
CN201657484U (en) * | 2010-01-28 | 2010-11-24 | 比亚迪股份有限公司 | Bend-resistant flexible circuit board |
CN204119645U (en) * | 2014-09-28 | 2015-01-21 | 江西鑫力华数码科技有限公司 | There is the flexible circuit board of the anti-jackknifing structure of circuit |
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