CN105469175A - Semiconductor process scheme management system and method - Google Patents
Semiconductor process scheme management system and method Download PDFInfo
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- CN105469175A CN105469175A CN201410446971.9A CN201410446971A CN105469175A CN 105469175 A CN105469175 A CN 105469175A CN 201410446971 A CN201410446971 A CN 201410446971A CN 105469175 A CN105469175 A CN 105469175A
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Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor process scheme management system and a semiconductor process scheme management method. The semiconductor process scheme management system comprises an acquisition module, a processing module, a storage module, an editing module, a verification module and a sign-off module, wherein the acquisition module is used for acquiring original process data files of semiconductor processing equipment; the processing module is used for analyzing the original process data files of different semiconductor processing equipment into process data files in a same format; the storage module is used for storing the process data files; the editing module is used for setting parameters in the process data files and/or parameter upper and lower limits; the verification module is used for checking whether the process data files to be used is verified or not and/or checking whether the parameters of the process data files are within a parameter upper and lower limit range; and the sign-off module is used for signing off and validating any modification of the editing module. The system and the method which manage the semiconductor process schemes effectively are provided by the invention, the system and the method can manage the process schemes of overall fab equipment rapidly and systematically, and avoids product quality problems of scrapping caused by the adoption of unverified process schemes.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, be specifically related to a kind of semiconductor technology project management system and method.
Background technology
In semiconductor fabrication, the process program (Recipe) of equipment is one group of instruction of one group of decision device technique (Process), comprise the setting of correlation parameter, also comprise the relevant information of process program itself simultaneously, the editor (Editor) of such as process program, last modification time etc.Due to production technology and process and complexity thereof, each equipment is because of process variations, and process program is numerous and set different; And homotype equipment is in order to reduce process deviation (ProcessVariation), the setting between same process scheme is needed again to match each other (Matching).Due to apparatus and process scheme parameter (Parameter) setting and change all very crucial, its result directly affects the quality of wafer (Wafer), thus any change of process program all need can effectively management and control.
In prior art, systematized management be there is no for the setting of the design parameter of apparatus and process scheme and relevant change, need the relevant information of slip-stick artist's manual maintenance management technique scheme, need to drop into very large manpower and the effect that can not obtain for this reason; The process program simultaneously changed often just is used without checking, affects product quality and product rejection, causes very large economic loss.
Summary of the invention
The object of the invention is to, a kind of semiconductor technology project management system is provided, solves above technical matters;
The present invention also aims to, a kind of method of managing semiconductor process program is provided, solves above technical matters.
Technical matters solved by the invention can realize by the following technical solutions:
A kind of semiconductor technology project management system, wherein, comprising:
Acquisition module, for obtaining the original process data file of semiconductor processing equipment;
Processing module, is connected with described acquisition module, for the original process data file of different semiconductor processing equipment being resolved to the process date file of same form;
Memory module, is connected with described processing module, for storing described process date file;
Correction verification module, is connected with described memory module, for checking the process date file that will use whether through checking and/or check that the parameter of described process date file is whether within parameter bound scope;
Editor module, is connected with described memory module, for changing the parameter in described process date file and/or parameter bound;
Sign-off module, is connected with described editor module, makes it come into force for carrying out sign-off to arbitrary change of described editor module.
Preferably, described processing module comprises multiple parsing module, respectively the different original process document format datas of corresponding different semiconductor processing equipment.
Preferably, described editor module comprises a mark generation module, and described mark generation module is according to generating a change record to the change of parameter and/or parameter bound each time, and described sign-off module carries out sign-off to described change record makes it come into force.
Preferably, after described sign-off module receives the confirmation instruction, corresponding described change record sign-off is come into force.
Preferably, also comprise a comparison module, be connected to described memory module, for comparing the technique of same processing type, the parameter of the process date file on different semiconductor processing equipment.
Preferably, described process date file adopts extend markup language form to store.
Preferably, also comprise a parameter specification file, the corresponding parameter specification file of each process date file, the positional information of each parameter of described parameter specification file record in process date file, parameter name and/or parameter bound, described memory module stores described parameter specification file.
Preferably, also comprise a display module, described display module is connected with described memory module, in order to described process date file is presented to user with tree structure.
Preferably, described memory module is arranged in a server, and described processing module is arranged in semiconductor processing equipment and/or user terminal, and described semiconductor processing equipment and/or user terminal carry out communication by messaging bus and described server.
The present invention also provides a kind of method of managing semiconductor process program, wherein, comprising:
Step 1, obtains the original process data file of semiconductor processing equipment;
Step 2, resolves to the process date file of same form by original process data file;
Step 3, stores described process date file.
Preferably, also comprise step 4, the parameter in described process date file and/or parameter bound are set.
Preferably, also comprise step 5, check the process date file that will use whether through checking and/or check that the parameter of described process date file is whether within parameter bound scope.
Beneficial effect: owing to adopting above technical scheme, the system and method that the present invention designs a kind of effective managing semiconductor process program manages the process program of whole wafer plant with rapid system, realize:
1) before wafer batch processed (LotProcess) can the real-time inspection process program that will use whether through checking and parameter in parameter bound (SPEC) scope, avoid the process program be not verified caused product quality problem by using or scrap;
2) the effectively setting parameter of management and control process program and change thereof, prevents maloperation from causing product quality problem or scrapping;
3) slip-stick artist convenient and swiftly can check apparatus parameter setting, compares setting between homotype apparatus and process scheme to provide work efficiency.
Accompanying drawing explanation
Fig. 1 is system architecture schematic diagram of the present invention;
Fig. 2 is that the modularization of apparatus and process data file of the present invention resolves schematic diagram;
Fig. 3 is that process date file of the present invention represents schematic diagram;
Fig. 4 is the schematic diagram of file layout in the memory module corresponding with the process date file of Fig. 3;
Fig. 5 is the automatic Verification of process program parameter before wafer batch processed of the present invention;
Fig. 6 is that the process date file parameter of homotype equipment of the present invention compares schematic diagram;
Fig. 7 is the change log file schematic diagram that apparatus and process data file parameter of the present invention and/or parameter bound are changed.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of protection of the invention.
It should be noted that, when not conflicting, the embodiment in the present invention and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
With reference to Fig. 1, the invention provides a kind of semiconductor technology project management system, wherein, comprising:
Acquisition module, for obtaining the original process data file of semiconductor processing equipment;
Processing module, is connected with acquisition module, for the original process data file of different semiconductor processing equipment being resolved to the process date file of same form;
Memory module, is connected with processing module, for storing process date file;
Editor module, is connected with memory module, for setting the parameter in process date file and/or parameter bound;
Correction verification module, is connected with memory module, for checking the process date file that will use whether through checking and/or check that the parameter of process date file is whether within parameter bound scope;
Sign-off module, is connected with editor module, makes it come into force for carrying out sign-off to arbitrary change of editor module.
Semiconductor technology scheme belongs to the IP (IntellectualProperty of different vendor, intellecture property), also because of the difference of manufacturer, the process program structure of different model equipment is different, readable poor, the original process Data Analysis of distinct device is the process date file of same form by the present invention, user is facilitated to identify and setup parameter and/or parameter bound (SPEC), simultaneously, sign-off module is set, makes any change of user all need the checking of correlated quality supervision department and sign-off just can come into force.Systematized management is realized for the setting of the design parameter of process date file and relevant change, realizes the process data that quick effective system manages whole wafer plant technique.
As a further improvement on the present invention, processing module comprises multiple parsing module, respectively the different original process document format datas of corresponding different semiconductor processing equipment.The present invention goes out different parsing modules according to distinct device type design, and each parsing module can be resolved a kind of process program of type equipment and is centrally stored in memory module.
With reference to shown in Fig. 2, parsing module (RecipeInterpreter) exports the process date file (FormattedRecipeBody) of consolidation form after resolving according to the apparatus and process data layout (EQPRecipeFormat) of input and the process data main body (Recipebody) of ASCII character or binary format.Be convenient to reading and the management of process date file parameter.Preferably, process date file adopts extend markup language (XML, ExtensibleMarkupLanguage) form to store.
As a kind of preferred embodiment, parsing module can be integrated in equipment automatization processing disposal system (EAP, EquipmentAutomationProgramming), each parsing module and a kind of device server integrated, carry out communication with equipment.
As a kind of preferred embodiment, memory module is arranged in a server, and processing module is arranged in semiconductor processing equipment and/or user terminal, and semiconductor processing equipment and/or user terminal carry out communication by messaging bus and server.Memory module can be a database.
As a further improvement on the present invention, with reference to Fig. 3, also comprise a display module, display module is connected with memory module, and process date file is presented to user with tree structure.Because the process data of equipment is resolved to universal architecture by parsing module, user interface (UI) conveniently can represent the correlation parameter information of process date file according to tree structure, as process data step mark (StepId), parameter name, pre-set parameter, process data amendment date etc.User can facilitate browsing apparatus process data and correlation parameter on a user interface, the process data that equipment can be verified by user uploads in system by user interface, and process data is stored in memory module with the form of XML file, process data file layout is in a storage module shown in Figure 4.
As a further improvement on the present invention, also comprise a parameter specification file, the corresponding parameter specification file of each process date file, the positional information of each parameter of parameter specification file record in process date file, parameter name and/or parameter limit value, memory module stored parameter specification file.Parameter specification file is stored in memory module by the form same with process date file.
As a further improvement on the present invention, with reference to Fig. 6, also comprise a comparison module, be connected to memory module, for comparing the technique of same processing type, the parameter of the process date file on different semiconductor processing equipment.The parameter corresponding to homotype equipment compares.Particularly setting parameter limit value, realizes the parameter comparing function that homotype equipment is corresponding, to reduce process deviation, the apparatus and process data of same device type is matched each other, to increase work efficiency.User can by the process data of the convenient and swift browsing apparatus of the present invention and the setting parameter checking equipment; And the setting of comparing between homotype apparatus and process data is to increase work efficiency.
One is embodiment preferably, and user can query facility process date file be uploaded to memory module; User calls editor module setup parameter bound (SPEC) and the parameter bound of setting is submitted to ECN (EngineeringChangeNotice, engineering change notice book) system, can come into force after the approval of sign-off module sign-off.
As a further improvement on the present invention, with reference to Fig. 7, processing module also comprises a mark generation module, mark generation module is according to recording change generation one change of parameter and/or parameter bound or claim to pass label application (Ticket) each time, pass to sign and apply for coming into force after sign-off module sign-off, after sign-off module receives the confirmation instruction, corresponding change record sign-off is come into force.
Passing and signing application is for changing the file recorded to setting parameter, any change for the parameter of process date file all generates a biography label application, pass label application to need can come into force through the approval of related personnel's sign-off, due to apparatus and process data file setting parameter and change all very crucial, its result directly affects the wafer quality of technique, so any change of process date file all need can effectively management and control, can prevent the random change of parameter limit value or maloperation from causing product quality problem or scrapping.
The present invention also provides a kind of method of managing semiconductor process program, wherein, comprising:
Step 1, obtains the original process data file of semiconductor processing equipment;
Step 2, resolves to the process date file of same form by original process data file;
Step 3, stores process date file.
As a further improvement on the present invention, also comprise step 4, the parameter in process date file and/or parameter bound are set.
As a further improvement on the present invention, also comprise step 5, check the process date file that will use whether through checking and/or check that the parameter of process date file is whether within parameter bound scope.
A kind of specific embodiment, with reference to Fig. 5,
Wafer batch (Lot) arrives equipment;
Acquisition module, as EAP, obtains process data from equipment: acquisition module in real time from the process date file that equipment query will use, and is submitted to correction verification module resolved to the process date file of XML format by parsing module after and verified; Correction verification module can be included in a Process data management system, if the process date file that will use is verified, then checks parameter by correction verification module.
When detected parameters, if parameter corresponding to process date file is all within parameter limit value, then allow wafer batch access arrangement, until wafer batch processes terminates; Otherwise refusal wafer batch is processed.
The present invention is before wafer batch access arrangement (equipment TrackIn), the parameter of the process date file of the equipment that correction verification module real-time inspection will use can be called whether through verifying and within parameter limit value (SPEC), avoiding not having authenticated process date file caused product quality problem by using or scrap.
The foregoing is only preferred embodiment of the present invention; not thereby embodiments of the present invention and protection domain is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilizations instructions of the present invention and diagramatic content and apparent change obtain in protection scope of the present invention.
Claims (12)
1. a semiconductor technology project management system, is characterized in that, comprising:
Acquisition module, for obtaining the original process data file of semiconductor processing equipment;
Processing module, is connected with described acquisition module, for the original process data file of different semiconductor processing equipment being resolved to the process date file of same form;
Memory module, is connected with described processing module, for storing described process date file;
Correction verification module, is connected with described memory module, for checking the process date file that will use whether through checking and/or check that the parameter of described process date file is whether within parameter bound scope;
Editor module, is connected with described memory module, for changing the parameter in described process date file and/or parameter bound;
Sign-off module, is connected with editor module, makes it come into force for carrying out sign-off to arbitrary change of described editor module.
2. a kind of semiconductor technology project management system according to claim 1, it is characterized in that, described processing module comprises multiple parsing module, respectively the different original process document format datas of corresponding different semiconductor processing equipment.
3. a kind of semiconductor technology project management system according to claim 1, it is characterized in that, described editor module also comprises a mark generation module, and described mark generation module is according to generating a change record to the change of parameter and/or parameter bound each time.
4. a kind of semiconductor technology project management system according to claim 3, is characterized in that, after described sign-off module receives the confirmation instruction, corresponding described change record sign-off is come into force.
5. a kind of semiconductor technology project management system according to claim 1, it is characterized in that, also comprise a comparison module, be connected to described memory module, for comparing the technique of same processing type, the parameter of the process date file on different semiconductor processing equipment.
6. a kind of semiconductor technology project management system according to claim 1, is characterized in that, described process date file adopts extend markup language form to store.
7. a kind of semiconductor technology project management system according to claim 1, it is characterized in that, also comprise a parameter specification file, the corresponding parameter specification file of each process date file, the positional information of each parameter of described parameter specification file record in process date file, parameter name and/or parameter bound, described memory module stores described parameter specification file.
8. a kind of semiconductor technology project management system according to claim 1, it is characterized in that, also comprise a display module, described display module is connected with described memory module, in order to described process date file is presented to user with tree structure.
9. a kind of semiconductor technology project management system according to claim 1, it is characterized in that, described memory module is arranged in a server, described processing module is arranged in semiconductor processing equipment and/or user terminal, and described semiconductor processing equipment and/or user terminal carry out communication by messaging bus and described server.
10. a method for managing semiconductor process program, is characterized in that, comprising:
Step 1, obtains the original process data file of semiconductor processing equipment;
Step 2, resolves to the process date file of same form by original process data file;
Step 3, stores described process date file.
The method of 11. a kind of managing semiconductor process programs according to claim 10, is characterized in that, also comprise step 4, set the parameter in described process date file and/or parameter bound.
The method of 12. a kind of managing semiconductor process programs according to claim 10, it is characterized in that, also comprise step 5, check the process date file that will use whether through checking and/or check that the parameter of described process date file is whether within parameter bound scope.
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| CN201410446971.9A CN105469175A (en) | 2014-09-03 | 2014-09-03 | Semiconductor process scheme management system and method |
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