CN105459255B - A kind of method of ceramic body drilling - Google Patents
A kind of method of ceramic body drilling Download PDFInfo
- Publication number
- CN105459255B CN105459255B CN201510805840.XA CN201510805840A CN105459255B CN 105459255 B CN105459255 B CN 105459255B CN 201510805840 A CN201510805840 A CN 201510805840A CN 105459255 B CN105459255 B CN 105459255B
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- China
- Prior art keywords
- ceramic body
- conductive
- template
- ceramic
- drilling
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
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- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention provides a kind of method of ceramic body drilling, including ceramic powder is carried out into tabletting, then the ceramic body pressed is positioned in conductive template, and stood in acetum, with conductive plate placement in parallel, and lead to direct current between the plate of conductive plate two, that is, complete the drilling to ceramic body.The present invention to ceramic body when drilling without any Mechanical Contact, it at utmost ensure that the intensity of ceramic body, it is ceramic body not by any Mechanical Contact it is an object of the invention to provide one kind, so as to the boring method of mechanical damage avoided, suitable for the production of the diversified product of small-scale, pore morphology.
Description
Technical field
The present invention relates to a kind of method of ceramic body drilling.
Background technology
Ceramic material has the advantages that intensity is high, hardness is big, while also has the defects of toughness is relatively low, therefore irregular shape
The shaping of the ceramic material of shape, carried out before ceramic post sintering, i.e., shape restriction is carried out to ceramic body, wherein just
Include the bore process to ceramics.
The approach for doing through hole on ceramic body at present generally has two kinds：Template is molded or machining.Template shaping
Method is applied to the preparation of large-scale ceramic, but because template cost is high, consumption is big, for it is small-scale, shape is more
The production of change is more unfavorable；The method of machining is suitable for flexible and changeable shape need, but in machining
Simultaneously, it is difficult to avoid the occurrence of the damage brought due to Mechanical Contact to ceramic body, reduce the mechanical property of ceramics.
The content of the invention
The present invention is improved above mentioned problem, i.e., the technical problem to be solved in the present invention is that existing ceramic body bores
Hole easily causes ceramic damage using Mechanical Contact.
Specific embodiments of the present invention are：A kind of method of ceramic body drilling, it is characterised in that including following step
Suddenly：
（1）Ceramic powder is subjected to tabletting, then the ceramic body pressed is positioned in a conductive template, the conduction
Template is provided with through hole；
（2）An area identical conductive plate, the conduction are correspondingly arranged on above conductive template bottom and ceramic body
Plate is placed in parallel with conductive template；
（3）And ceramic body, conductive template and conductive plate are placed in acetum；Lead to direct current between two plates, complete
Drilling to ceramic body.
Further, the step（1）Tabletting is carried out after adding a small amount of binding agent to ceramic powder, the binding agent of addition
Dosage is 0.3-3wt%.
Further, the conductive template and conductive plate are that material is graphite or with aluminium, iron, titanium, one in platinum element
The single metal or composition metal of individual or multiple formation.
Further, the conductive template thickness is 0.1-0.5mm, and the through-hole aperture is 0.5-3mm.
Further, the plate thickness is 0.1-2mm.
Further, step（3）The solubility of middle acetum is 0.4-4mol/l, and time of repose is 0.5-3 hours.
Further, step（3）Middle DC voltage is 30-300V, and the time is 0.5-10 minutes.
Compared with prior art, the invention has the advantages that：
(1) the inventive method when being drilled on ceramic body to base substrate without any Mechanical Contact, therefore machinery will not be caused
Damage, influence the final mechanical property of ceramics.
(2) present invention can by acetic acid solubility, clear size of opening and apply voltage to regulate and control hole diameter size.
(3) the inventive method can arbitrarily change the position in drilled hole by changing the position of through hole, and the same time bores
The quantity in hole is almost without limitation.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention.
Embodiment
The present invention will be further described in detail with reference to the accompanying drawings and detailed description.
It is well mixed as shown in figure 1,10g alumina powders are added into 0.1g polyvinyl alcohol as after binding agent, Ran Houjin
Row compression molding, it is 10mm that the length of side, which is made, the thickness 2mm square base substrate 100 of aluminium oxide ceramics.Then the aluminum oxide pressed is made pottery
The square base substrate 100 of porcelain is positioned in conductive template 200, and the present embodiment uses stainless steel material as conductive template 200, in conduction
The holes drilled through 210 of template 200, the aperture of through hole 210 are 2mm.In conductive template 200, conductive template thickness is 0.4mm bottom
One area same metal conductive plate 300 is set, the thickness of metallic conduction plate 300 is 2mm, and in metallic conduction plate 300
Corresponding surface is provided with and be arranged in parallel with metallic conduction plate 300 and 400 placement in parallel of area identical graphite cake.Then by base
Body is statically placed in 2mol/L acetum after about 1 hour, 150V direct current is led between two plates 6 minutes, that is, is completed to ceramics
The drilling of base substrate.
The foregoing is only presently preferred embodiments of the present invention, all equivalent changes done according to scope of the present invention patent with
Modification, it should all belong to the covering scope of the present invention.
Claims (7)
- A kind of 1. method of ceramic body drilling, it is characterised in that comprise the following steps：（1）Ceramic powder is subjected to tabletting, then the ceramic body pressed is positioned in a conductive template, the conductive template It is provided with through hole；（2）Be correspondingly arranged on area identical conductive plate above conductive template bottom and ceramic body, the conductive plate with Conductive template is placed in parallel；（3）And ceramic body, conductive template and conductive plate are placed in acetum；Lead to direct current between two plates, complete to pottery The drilling of porcelain billet body.
- 2. the method for ceramic body drilling according to claim 1, it is characterised in that：The step（1）To ceramic powder Tabletting is carried out after adding a small amount of binding agent, the dosage of the binding agent of addition is 0.3-3wt%.
- 3. the method for ceramic body drilling according to claim 1, it is characterised in that：The conductive template and conductive plate are Material is graphite or the single metal or composition metal that are formed with one or more of aluminium, iron, titanium, platinum element.
- 4. the method for ceramic body drilling according to claim 1, it is characterised in that：The conductive template thickness is 0.1- 0.5mm, the through-hole aperture are 0.5-3mm.
- 5. the method for ceramic body drilling according to claim 1, it is characterised in that：The plate thickness is 0.1- 2mm。
- 6. the method for ceramic body drilling according to claim 1, it is characterised in that：Step（3）Middle acetum it is molten It is 0.5-3 hours to spend for 0.4-4mol/l, time of repose.
- 7. the method for ceramic body drilling according to claim 1, it is characterised in that：Step（3）Middle DC voltage is 30- 300V, time are 0.5-10 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510805840.XA CN105459255B (en) | 2015-11-20 | 2015-11-20 | A kind of method of ceramic body drilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510805840.XA CN105459255B (en) | 2015-11-20 | 2015-11-20 | A kind of method of ceramic body drilling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105459255A CN105459255A (en) | 2016-04-06 |
| CN105459255B true CN105459255B (en) | 2017-11-17 |
Family
ID=55597622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510805840.XA Active CN105459255B (en) | 2015-11-20 | 2015-11-20 | A kind of method of ceramic body drilling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105459255B (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141667A (en) * | 2000-11-01 | 2002-05-17 | Matsushita Electric Ind Co Ltd | Ceramic compound substrate and its manufacturing method |
| JP4112899B2 (en) * | 2002-05-20 | 2008-07-02 | 日本碍子株式会社 | Manufacturing method of honeycomb structure |
| JP2005019538A (en) * | 2003-06-24 | 2005-01-20 | Murata Mfg Co Ltd | Method of manufacturing thin ceramic board |
| JP2005209681A (en) * | 2004-01-20 | 2005-08-04 | Murata Mfg Co Ltd | Conductive paste and manufacturing method for laminated ceramic electronic component |
| JP2005335265A (en) * | 2004-05-28 | 2005-12-08 | Kyocera Corp | Ceramic laminated component and its production method |
| JP4735018B2 (en) * | 2005-04-19 | 2011-07-27 | 株式会社村田製作所 | Multilayer ceramic substrate and manufacturing method thereof |
| WO2011123110A1 (en) * | 2010-03-30 | 2011-10-06 | Daniel Sunho Oh | Method of preparing ceramic/polymer composite scaffolds with bioactive molecules for hard tissue regeneration |
| CN104409172B (en) * | 2014-05-31 | 2017-01-18 | 福州大学 | 3D manufacturing method of latticed conducting array |
| CN104261856B (en) * | 2014-09-25 | 2016-01-27 | 福州大学 | A kind of based on the shaping method preparing cellular alumina ceramic body of electrophoretic deposition |
-
2015
- 2015-11-20 CN CN201510805840.XA patent/CN105459255B/en active Active
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| Publication number | Publication date |
|---|---|
| CN105459255A (en) | 2016-04-06 |
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