CN105455847A - Mini B ultrasound machine based on high-sensitivity ultrasonic probe - Google Patents
Mini B ultrasound machine based on high-sensitivity ultrasonic probe Download PDFInfo
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- CN105455847A CN105455847A CN201511023448.6A CN201511023448A CN105455847A CN 105455847 A CN105455847 A CN 105455847A CN 201511023448 A CN201511023448 A CN 201511023448A CN 105455847 A CN105455847 A CN 105455847A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4427—Device being portable or laptop-like
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/52—Devices using data or image processing specially adapted for diagnosis using ultrasonic, sonic or infrasonic waves
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Abstract
The invention discloses a mini B ultrasound machine based on a high-sensitivity ultrasonic probe. The mini B ultrasound machine comprises a B ultrasound host and the high-sensitivity ultrasonic probe. The B ultrasound host comprises a master control unit, an input module, a display module, a power supply module, a pulse amplifier, a reception amplification circuit, a synthesis circuit and an analog/digital converter. The first output end of the master control unit is connected with the input end of the ultrasonic probe through the pulse amplifier. The second output end of the master control unit is connected with the input end of the display module. The output end of the ultrasonic probe sequentially passes through the reception amplification circuit, the synthesis circuit and the analog/digital converter and is then connected with the first input end of the master control unit. The output end of the power supply module is connected with the second input end of the master control unit. The output end of the input module is connected with the third input end of the master control unit. The mini B ultrasound machine is compact in structure, external hardware circuits are simple, the design complexity and the hardware debugging difficulty are low, high precision is achieved, and the mini B ultrasound machine can be widely applied to the industry of mini B ultrasound machines.
Description
Technical field
The present invention relates to B ultrasonic instrument field, particularly relate to a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe.
Background technology
B ultrasonic machine is the image subject utilizing hyperacoustic physical characteristic to carry out Diagnosis and Treat, is called ultrasound medicine.Its clinical application range is extensive, has become indispensable diagnostic method in current clinical medicine at present.At present, except regular medication place, the portable medical such as field, first aid place, also very high to the demand of B ultrasonic machine, in order to meet the application requirement in these places, B ultrasonic machine is just towards mini miniaturization.Now commercially, the shaped article that mini B ultrasonic owner wants is that Siemens and GE company produce, this two company adopts phased array transducer technology to realize the miniaturization of popping one's head in, but, due to the weakness that phased array probe is intrinsic, B ultrasonic machine detectivity, the degree of depth and definition are all had a greatly reduced quality, there is a big difference compared with traditional electronics convex array probe B ultrasonic machine, cause mini B ultrasonic cannot realize detecting accurately, have impact on it and apply.
Summary of the invention
In order to solve above-mentioned technical problem, the object of this invention is to provide a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe, comprise B ultrasonic main frame and highly sensitive ultrasonic probe, described B ultrasonic main frame comprises main control unit, input module, display module, power module, pulse amplifier, receive amplifying circuit, combiner circuit and analog-digital converter, first outfan of described main control unit is connected with the input of ultrasonic probe by pulse amplifier, second outfan of described main control unit is connected with the input of display module, the outfan of described ultrasonic probe is successively by receiving amplifying circuit, combiner circuit is connected with the first input end of main control unit with after analog-digital converter, the outfan of described power module is connected with the second input of main control unit, the outfan of described input module is connected with the 3rd input of main control unit.
Further, described main control unit comprises control module, pulse generator, digital bea mforming device, frame correlation module, frame deposits Read Controller, binormal model module and dma controller, first outfan of described control module is connected with the input of ultrasonic probe by after pulse generator and pulse amplifier successively, the outfan of the input termination analog-digital converter of described digital bea mforming device, the outfan of described digital bea mforming device is successively by frame correlation module, frame is deposited Read Controller and is connected with the first input end of control module with after dma controller, described binormal model module is deposited Read Controller with frame and is connected.
Further, described main control unit adopts altera corp EP3C16 series of programmable logical device.
Further, described ultrasonic probe comprises connection-peg, wire, housing, ultrasonic-frequency power supply module and ultrasonic transducer, described connection-peg is connected with B ultrasonic main frame, described ultrasonic-frequency power supply module installation is in housing, described ultrasonic transducer is arranged on the end of housing, and described connection-peg is by wire and ultrasonic-frequency power supply model calling; Described ultrasonic transducer comprises metal shell, conductive pole, piezoelectric patches and high-temperature electric conduction glue-line, piezoelectricity chamber is provided with in described metal shell, described high-temperature electric conduction glue-line, piezoelectric patches and conductive pole are arranged in piezoelectricity chamber successively, described piezoelectricity intracavity is filled with sound-absorbing material, and described ultrasonic-frequency power supply module is electrically connected with piezoelectric patches after connecting conductive pole by wire.
Further, the wire connection cavity coaxial with piezoelectricity chamber is also provided with in described metal shell, described ultrasonic transducer also comprises buffering patch panel and installs back-up ring, be fixed in wire connection cavity by buffering patch panel after described installation back-up ring is connected with the inner thread of wire connection cavity, described buffering patch panel is connected with wire and conductive pole respectively.
Further, described buffering patch panel adopts double face copper.
Further, described piezoelectric patches adopts relaxor ferroelectric monocrystal material to make.
Further, described sound-absorbing material adopts the S2116 high resiliency electron pouring sealant of two component.
Further, described housing is provided with silica gel sheath, described wire stretches into enclosure interior and ultrasonic-frequency power supply model calling through after silica gel sheath.
Further, be also provided with magnet ring in described housing, described magnet ring is set on the wire of connection connection-peg and ultrasonic-frequency power supply module.
The invention has the beneficial effects as follows: a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe of the present invention, comprise B ultrasonic main frame and highly sensitive ultrasonic probe, described B ultrasonic main frame comprises main control unit, input module, display module, power module, pulse amplifier, receive amplifying circuit, combiner circuit and analog-digital converter, first outfan of described main control unit is connected with the input of ultrasonic probe by pulse amplifier, second outfan of described main control unit is connected with the input of display module, the outfan of described ultrasonic probe is successively by receiving amplifying circuit, combiner circuit is connected with the first input end of main control unit with after analog-digital converter, the outfan of described power module is connected with the second input of main control unit, the outfan of described input module is connected with the 3rd input of main control unit.This B ultrasonic machine compact conformation, peripheral hardware circuit is simple, design complexities and hardware debug difficulty low, and adopt highly sensitive ultrasonic probe, there is degree of precision, the small form factor requirements of B ultrasonic machine can be met.
In addition, this ultrasonic probe volume is little, lightweight, be easy to carry, and ultrasonic transducer adopts piezoelectric patches, it has higher sensitivity, therefore, under onesize, sensitivity, the investigation depth of this ultrasonic probe are better than phased array probe all greatly, and have higher sensitivity, investigation depth is darker, there is degree of precision, the small form factor requirements of B ultrasonic machine can be met.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described.
Fig. 1 is the electronic block diagrams of a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe of the present invention;
Fig. 2 is the electronic block diagrams of the specific embodiment of a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe of the present invention;
Fig. 3 is the front view of a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe of the present invention;
Fig. 4 is the cross-sectional view of the A-A part in Fig. 1;
Fig. 5 is the cross-sectional view of the ultrasonic transducer of the ultrasonic probe of a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe of the present invention.
Detailed description of the invention
With reference to Fig. 1, the invention provides a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe, comprise B ultrasonic main frame and highly sensitive ultrasonic probe, described B ultrasonic main frame comprises main control unit, input module, display module, power module, pulse amplifier, receive amplifying circuit, combiner circuit and analog-digital converter, first outfan of described main control unit is connected with the input of ultrasonic probe by pulse amplifier, second outfan of described main control unit is connected with the input of display module, the outfan of described ultrasonic probe is successively by receiving amplifying circuit, combiner circuit is connected with the first input end of main control unit with after analog-digital converter, the outfan of described power module is connected with the second input of main control unit, the outfan of described input module is connected with the 3rd input of main control unit.
Be further used as preferred embodiment, with reference to Fig. 2, described main control unit comprises control module, pulse generator, digital bea mforming device, frame correlation module, frame deposits Read Controller, binormal model module and dma controller, first outfan of described control module is connected with the input of ultrasonic probe by after pulse generator and pulse amplifier successively, the outfan of the input termination analog-digital converter of described digital bea mforming device, the outfan of described digital bea mforming device is successively by frame correlation module, frame is deposited Read Controller and is connected with the first input end of control module with after dma controller, described binormal model module is deposited Read Controller with frame and is connected.
Be further used as preferred embodiment, described main control unit adopts altera corp EP3C16 series of programmable logical device.
Be further used as preferred embodiment, with reference to Fig. 3, Fig. 4 and Fig. 5, described ultrasonic probe comprises connection-peg 1, wire 2, housing 5, ultrasonic-frequency power supply module 6 and ultrasonic transducer 8, described connection-peg 1 is connected with B ultrasonic main frame, described ultrasonic-frequency power supply module 6 is arranged in housing 5, described ultrasonic transducer 8 is arranged on the end of housing 5, and described connection-peg 1 is connected with ultrasonic-frequency power supply module 6 by wire 2; Described ultrasonic transducer 8 comprises metal shell 81, conductive pole 83, piezoelectric patches 84 and high-temperature electric conduction glue-line 85, piezoelectricity chamber 82 is provided with in described metal shell 81, described high-temperature electric conduction glue-line 85, piezoelectric patches 84 and conductive pole 83 are arranged in piezoelectricity chamber 82 successively, be filled with sound-absorbing material 86 in described piezoelectricity chamber 82, described ultrasonic-frequency power supply module 6 is electrically connected with piezoelectric patches 84 after connecting conductive pole 83 by wire 2.In Fig. 3, Reference numeral 9 represents the radiating surface of ultrasonic transducer 8.
Be further used as preferred embodiment, the wire connection cavity 89 coaxial with piezoelectricity chamber 82 is also provided with in described metal shell 81, described ultrasonic transducer 8 also comprises buffering patch panel 87 and installs back-up ring 88, be fixed in wire connection cavity 89 by buffering patch panel 87 after described installation back-up ring 88 is connected with the inner thread of wire connection cavity 89, described buffering patch panel 87 is connected with wire 2 and conductive pole 83 respectively.
Be further used as preferred embodiment, described buffering patch panel 87 adopts double face copper.
Be further used as preferred embodiment, described piezoelectric patches 84 adopts relaxor ferroelectric monocrystal material to make.
Be further used as preferred embodiment, described sound-absorbing material 86 adopts the S2116 high resiliency electron pouring sealant of two component.
Be further used as preferred embodiment, described housing 5 is provided with silica gel sheath 3, described wire 2 is connected with ultrasonic-frequency power supply module 6 through stretching into housing 5 inside after silica gel sheath 3.
Be further used as preferred embodiment, be also provided with magnet ring 4 in described housing 5, described magnet ring 4 is set in and connects connection-peg 1 with on the wire 2 of ultrasonic-frequency power supply module 6.
Be further used as preferred embodiment, also comprise the upper cover 7 being arranged on housing 5 end, described ultrasonic transducer 8 is threaded with upper cover 7, and ultrasonic transducer 8 is arranged on the end of housing 5 by upper cover 7.
Below in conjunction with specific embodiment, the present invention is elaborated.
See figures.1.and.2, a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe, comprise B ultrasonic main frame and highly sensitive ultrasonic probe, B ultrasonic main frame comprises main control unit, input module, display module, power module, pulse amplifier, receive amplifying circuit, combiner circuit and analog-digital converter, first outfan of main control unit is connected with the input of ultrasonic probe by pulse amplifier, second outfan of main control unit is connected with the input of display module, the outfan of ultrasonic probe is successively by receiving amplifying circuit, combiner circuit is connected with the first input end of main control unit with after analog-digital converter, the outfan of power module is connected with the second input of main control unit, the outfan of input module is connected with the 3rd input of main control unit.
Concrete, main control unit comprises control module, pulse generator, digital bea mforming device, frame correlation module, frame deposits Read Controller, binormal model module and dma controller, first outfan of control module is connected with the input of ultrasonic probe by after pulse generator and pulse amplifier successively, the outfan of the input termination analog-digital converter of digital bea mforming device, the outfan of digital bea mforming device is successively by frame correlation module, frame is deposited Read Controller and is connected with the first input end of control module with after dma controller, binormal model module and frame are deposited Read Controller and are connected, second outfan of control module is connected with the input of display module, the outfan of power module is connected with the second input of control module, the outfan of input module is connected with the 3rd input of control module.
In the present embodiment, main control unit adopts altera corp EP3C16 series of programmable logical device (FPGA), and combiner circuit adopts 8 16 path analoging switch MT8816, and analog-digital converter adopts eight passage AD9273A/D changers.Design pulse generator exports 16 road pulse signals and control signal to the pulse amplifier of eight passage HDL6V5584, goes to drive ultrasonic probe after high voltage amplifier; Ultrasonic probe is launched ultrasonic signal and is received the ultrasonic signal returned and brilliantly amplified by the reception amplifying circuit on 16 tunnels, then enters 8 16 path analoging switch MT8816 and carries out synthesizing 8 tunnels; 8 road signals are converted to digital signal by eight passage AD9273A/D changers again and enter FPGA main control unit, and main control unit carries out signal processing again, first, adopt digital bea mforming device to carry out variable aperture, dynamic filter, logarithmic compression, Wave beam forming etc.The present embodiment digital bea mforming device comprises multiple part composition such as high-speed gear module, high-speed adder module, Dual-PortRAM buffer, buffer address maker module, Single-PortRAM cache module, dynamic aperture, apodization data storage, storage address look-up table, storage address maker module, focus data memorizer, storage address look-up table, storage address maker module; Complete the functions such as Real-time and Dynamic aperture, Real-time and Dynamic apodization, omnidistance dynamic focusing continuously.This digital bea mforming device supports the convex battle array of 3.5M, 6.5M intracavity and 7.5M linear array probe, can automatically identify different probes, adopt corresponding dynamic aperture, apodization data and focus data, meets the designing requirement of different probe.Digital bea mforming device carries out time delay to different channel signal, and the signal homophase of same point is added, and the echo-signal of multiple passage is carried out to the windowing in spatial domain, similar matched filtering, can improve the signal to noise ratio of signal simultaneously.Then frame correlation module is adopted to do the relevant pretreatment of a frame to the ultrasonic signal after synthesis, the smoothing processing namely between picture frame with frame on corresponding pixel gray level.Because the noise be superimposed upon on image is irrelevant and has the random noise of zero-mean, if the meansigma methods of getting some frames is under the same conditions to replace former figure, then noise intensity can be weakened.In frame correlated process, FPGA wants the reading of control data, process and storage.In the real-time in order to meet video display, this acquisition system adopts binormal model module, adopts the ping-pong mechanism of binormal model structure, realizes read-write interlocking control by FPGA.Video data after frame relevant treatment is complete alternately write frame deposits A and frame deposits B, frame deposit Read Controller according to back-end processing speed read frame deposit in data, be sent to dma controller, dma controller is opened DMA passage and is carried out data transmission.When FPGA realizes Read-write Catrol, in order to avoid depositing into row read-write operation to a frame simultaneously, needing, read-write mutual exclusion lock is set and carries out memory state switching.
The present invention adopts FPGA PLD, for different ultrasonic video signals, as long as slightly make an amendment control logic in FPGA, just can realize signals collecting; The peripheral hardware circuit of FPGA is simple, thus in hardware designs, greatly can reduce the complexity of hardware designs, and the debugging of the sequential logic of FPGA can on software the Realization of Simulation, thus reduce hardware debug difficulty.
Ultrasonic probe comprises connection-peg 1, wire 2, housing 5, ultrasonic-frequency power supply module 6 and ultrasonic transducer 8, ultrasonic-frequency power supply module 6 is arranged in housing 5, connection-peg 1 is connected with B ultrasonic main frame, ultrasonic transducer 8 is arranged on the end of housing 5, and connection-peg 1 is connected with ultrasonic-frequency power supply module 6 by wire 2; Ultrasonic transducer 8 comprises metal shell 81, conductive pole 83, piezoelectric patches 84 and high-temperature electric conduction glue-line 85, piezoelectricity chamber 82 is provided with in metal shell 81, high-temperature electric conduction glue-line 85, piezoelectric patches 84 and conductive pole 83 are arranged in piezoelectricity chamber 82 successively, be filled with the sound-absorbing material 86 of coated piezoelectric patches 84 in piezoelectricity chamber 82, ultrasonic-frequency power supply module 6 is electrically connected with piezoelectric patches 84 after connecting conductive pole 83 by wire 2.Connection-peg 1 is for being connected with B ultrasonic machine host.
Piezoelectricity chamber 82 is closing cylinder, and in its projecting surface and Fig. 3, the face of Reference numeral 9 is as acoustic irradiation face.As shown in Figure 3, when piezoelectric patches 84 is installed, its front and high-temperature electric conduction glue-line 85 compact siro spinning technology, the back side is connected with conductive pole 83 and the sound-absorbing material 86 be filled is coated.Piezoelectric patches 84 has higher sensitivity, adopts the ultrasonic probe that the ultrasonic transducer 8 of this structure is made, and under onesize, its sensitivity, investigation depth are better than phased array probe all greatly, have degree of precision, can meet the small form factor requirements of B ultrasonic machine.
In the present embodiment, metal shell 81 is boss cylinder, be divided into upper and lower two parts, except the piezoelectricity chamber 82 of lower part, the wire connection cavity 89 coaxial with piezoelectricity chamber 82 is also provided with in metal shell 81, ultrasonic transducer 8 also comprises buffering patch panel 87 and installs back-up ring 88, and install after back-up ring 88 is connected with the inner thread of wire connection cavity 89 and be fixed in wire connection cavity 89 by buffering patch panel 87, buffering patch panel 87 is connected with wire 2 and conductive pole 83 respectively.Install back-up ring 88 and adopt standard connector, for fixing buffering patch panel 87, its external diameter coordinates with the inner thread of wire connection cavity 89.
In the present embodiment, buffering patch panel 87 adopts thickness to be the double face copper of 1mm, and double face copper is mated with conductive pole 83, and is provided with the welding position for welding lead 2.Buffering patch panel 87 and conductive pole 83 form the buffer connecting rods between piezoelectric patches 84 and wire 2, and protection piezoelectric patches 84 is not by the impact of the welding stress of wire 2.
Sound-absorbing material 86 adopts the S2116 high resiliency electron pouring sealant of two component, there is during embedding good mobility, there is after solidification good sound absorbing capabilities, sound-absorbing material 86 for absorbing and suppress the reversal of vibrations ripple of piezoelectric patches, to obtain pure mono-pulse transmission waveform.
High-temperature electric conduction glue-line 85 is the acoustic couplants for two kinds of different interfaces (piezoelectric patches 84 and metal shell 81), fixes piezoelectric patches 84 by bonding method.In the present embodiment, high-temperature electric conduction glue-line 85 preferably adopts the material of DB5015 to make, and this material is that electric conductivity is very superior by epoxy resin, argentum powder and firming agent formulated no-solvent type conducting resinl.
In the present embodiment, piezoelectric patches 84 adopts relaxor ferroelectric monocrystal (Pb (Mgl/3NbZ/3) 03-PbTIO3) material to make.The outstanding piezoelectric property that Pb (Mgl/3NbZ/3) 03-PbTIO3 material has, highly sensitive, it is the once breathtaking breakthrough in the 50 years history in ferroelectric field, cause the revolution of a material for ultrasonic transducer and device, the piezoelectric patches 84 of traditional ceramics PzT as ultrasonic transducer 8 is replaced with this monocrystalline, substantially increase the sensitivity of piezoelectric patches 84, therefore the ultrasonic probe of this ultrasonic transducer 8 is adopted, its sensitivity significantly improves, its image resolution ratio and bandwidth improve greatly, thus lay a good foundation for ultrasonic transducer miniaturization.
This ultrasonic probe volume is little, lightweight, be convenient to hand-held, center probe frequency 3.5MHZ, the degree of depth detected is deep, 190mm can be reached, be particularly suitable for detecting liver, kidney, abdominal part, detect the probe that the degree of depth can only reach 160mm compared to existing technology, this ultrasonic probe investigation depth is comparatively superior.In addition, this ultrasonic probe image resolution ratio improves, and can reach horizontal 2mm, longitudinal 1mm, this probe blind area can reach 3mm, and the similar probe of intermediate-resolution horizontal 5mm, longitudinal 2mm and the general 8mm in blind area, substantially increases precision compared to existing technology.
In the present embodiment, housing 5 is provided with silica gel sheath 3, wire 2 is connected with ultrasonic-frequency power supply module 6 through stretching into housing 5 inside after silica gel sheath 3, also comprise the upper cover 7 being arranged on housing 5 end, ultrasonic transducer 8 is threaded with upper cover 7, and ultrasonic transducer 8 is arranged on the end of housing 5 by upper cover 7.Also be provided with magnet ring 4 in housing 5, magnet ring 4 is set in and connects connection-peg 1 with on the wire 2 of ultrasonic-frequency power supply module 6.
More than that better enforcement of the present invention is illustrated, but the invention is not limited to embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent modification or replacement are all included in the application's claim limited range.
Claims (10)
1. the mini B ultrasonic machine based on high sensitivity ultrasonic probe, it is characterized in that, comprise B ultrasonic main frame and highly sensitive ultrasonic probe, described B ultrasonic main frame comprises main control unit, input module, display module, power module, pulse amplifier, receive amplifying circuit, combiner circuit and analog-digital converter, first outfan of described main control unit is connected with the input of ultrasonic probe by pulse amplifier, second outfan of described main control unit is connected with the input of display module, the outfan of described ultrasonic probe is successively by receiving amplifying circuit, combiner circuit is connected with the first input end of main control unit with after analog-digital converter, the outfan of described power module is connected with the second input of main control unit, the outfan of described input module is connected with the 3rd input of main control unit.
2. a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe according to claim 1, it is characterized in that, described main control unit comprises control module, pulse generator, digital bea mforming device, frame correlation module, frame deposits Read Controller, binormal model module and dma controller, first outfan of described control module is connected with the input of ultrasonic probe by after pulse generator and pulse amplifier successively, the outfan of the input termination analog-digital converter of described digital bea mforming device, the outfan of described digital bea mforming device is successively by frame correlation module, frame is deposited Read Controller and is connected with the first input end of control module with after dma controller, described binormal model module is deposited Read Controller with frame and is connected.
3. a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe according to claim 1, is characterized in that, described main control unit adopts altera corp EP3C16 series of programmable logical device.
4. a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe according to claim 1, it is characterized in that, described ultrasonic probe comprises connection-peg, wire, housing, ultrasonic-frequency power supply module and ultrasonic transducer, described connection-peg is connected with B ultrasonic main frame, described ultrasonic-frequency power supply module installation is in housing, described ultrasonic transducer is arranged on the end of housing, and described connection-peg is by wire and ultrasonic-frequency power supply model calling; Described ultrasonic transducer comprises metal shell, conductive pole, piezoelectric patches and high-temperature electric conduction glue-line, piezoelectricity chamber is provided with in described metal shell, described high-temperature electric conduction glue-line, piezoelectric patches and conductive pole are arranged in piezoelectricity chamber successively, described piezoelectricity intracavity is filled with sound-absorbing material, and described ultrasonic-frequency power supply module is electrically connected with piezoelectric patches after connecting conductive pole by wire.
5. a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe according to claim 4, it is characterized in that, the wire connection cavity coaxial with piezoelectricity chamber is also provided with in described metal shell, described ultrasonic transducer also comprises buffering patch panel and installs back-up ring, be fixed in wire connection cavity by buffering patch panel after described installation back-up ring is connected with the inner thread of wire connection cavity, described buffering patch panel is connected with wire and conductive pole respectively.
6. a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe according to claim 5, is characterized in that, described buffering patch panel adopts double face copper.
7. a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe according to claim 4, is characterized in that, described piezoelectric patches adopts relaxor ferroelectric monocrystal material to make.
8. a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe according to claim 4, is characterized in that, described sound-absorbing material adopts the S2116 high resiliency electron pouring sealant of two component.
9. a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe according to claim 4, is characterized in that, described housing is provided with silica gel sheath, and described wire stretches into enclosure interior and ultrasonic-frequency power supply model calling through after silica gel sheath.
10. a kind of mini B ultrasonic machine based on high sensitivity ultrasonic probe according to claim 4, is characterized in that, be also provided with magnet ring in described housing, and described magnet ring is set on the wire of connection connection-peg and ultrasonic-frequency power supply module.
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| CN106264615A (en) * | 2016-08-03 | 2017-01-04 | 珠海威泓医疗科技有限公司 | The quick somascope of internal hemorrhage |
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