CN105451527A - Conductive foam and preparation method thereof - Google Patents
Conductive foam and preparation method thereof Download PDFInfo
- Publication number
- CN105451527A CN105451527A CN201410305103.9A CN201410305103A CN105451527A CN 105451527 A CN105451527 A CN 105451527A CN 201410305103 A CN201410305103 A CN 201410305103A CN 105451527 A CN105451527 A CN 105451527A
- Authority
- CN
- China
- Prior art keywords
- conductive
- foam
- metal powder
- sponge
- foaming sponge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides conductive foam and a preparation method thereof. The conductive foam comprises conductive foaming sponge, conductive fiber cloth attached to the surface of the conductive foaming sponge, and a conductive rubber composition. The conductive foaming sponge comprises foaming sponge, a metallic copper layer, and a metallic nickel layer, wherein the metallic copper layer and the metallic nickel layer are deposited on the surface of a foaming sponge fiber. The conductive rubber composition is filled in holes of the conductive foaming sponge and in the conductive fiber cloth. The conductive rubber composition comprises silica gel, first metal powder, second metal powder, and third metal powder. Compared with conventional conductive foaming sponge, the internal holes of the conductive foaming sponge are filled with the conductive flexible rubber composition, and the rubber composition contains metal powder with different particle sizes, thereby improving the elasticity and contact effect of the foaming sponge under the condition that the conducting performances and shielding effect of the conductive foaming sponge are not affected, and enabling the conductive foaming sponge to have functions of sealing, damping, buffering, and noise reduction.
Description
Technical field
The invention belongs to technical field of electromagnetic shielding, particularly relate to a kind of conducting foam and preparation method thereof.
Background technology
High-tech electric equipment products, if mobile phone, computer and television set are while bringing facility and enjoyment, the problem that electromagnetic radiation produces is also day by day serious.Electromagnetic radiation has been acknowledged as the fourth-largest public hazards after air pollution, water pollution, noise pollution.Through medical evidence, electromagnetic radiation can produce three kinds of effects to biology: thermal effect, nonthermal effect and accumulative effect, and these effects can produce harm in various degree to each organ of human body, tissue and system.For the injury reduced and avoid electromagnetic radiation to cause human body, the demand of electromagnetic shielding material is increasing.
Electromagnetic shielding material can raising signal, be transfer of data more accurate and interference-free while, electromagnetic radiation also can be avoided the harm of human body.The main method of shield technology adopts various shielding material effectively to intercept and loss.Current application more typical shielding material mainly contains fillibility shielding material, membrane shield material, conduction high polymer shielding material, nano-EMI material.Nickel system shielding material is current most widely used metal filled property shielding material, has the advantages such as electric conductivity is excellent, moderate; The carbon system non-metallic filler shielding material advantage that quality is light because having, price is low is also widely used, and the deficiency of its electric conductivity relative mistake improves by some method of modifying; Composite filled type shielding material then obtains applying more and more widely because having good combination property; Conduction high polymer shielding material has that conductivity is high, quality is light, corrosion-resistant, low cost and other advantages, its dissolubility and processability can be made to be improved by modification; Nano combined shielding material has the advantages such as absorption band is wide, multi-functional, quality is light, thickness is thin; Multilayer screen structural material is optimized in configuration aspects relative to single-layer shield structural material, and the relative single-layer shield structural material of its shielding properties improves a lot.
Wherein, conducting foam is by the conductive fibre fabric with conductivity and anticorrosive property, the PU foam of liner low compression force and forming, and the product finally obtained has good elasticity and splendid shielding properties.Conductive fibre fabric is covered with by Polyester fiber surface the weaving metallic fibers that copper and mickel metal surface forms to form, fiber bottom is the copper of high conductivity, top layer is anti-oxidation erosion-resisting nickel metal, and the combination of copper and mickel provides splendid conductivity and shield effectiveness.Conducting foam can obtain good shield effectiveness in the frequency range of 100KHz to 1GHz.
Conducting foam has the advantages that compressibility is good, flexibility is good, can guarantee that there is good conducting contact area, and there is high cost performance, up-to-date at present, also be most widely used shielding material, be specially adapted to capacity and the limited occasion of clossing pressure, can extensive use and electronic cabinet, casing, indoor cabinet, industrial equipment, notebook computer and mobile communication equipment etc.But conducting foam common in the market still exists some defects, be difficult to restore to the original state after as poor in elasticity, compression, sealing can not be met, reduce pressure the function such as noise reduction.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is to provide a kind of conducting foam and preparation method thereof, and this conducting foam elasticity is better.
The invention provides a kind of conducting foam, comprising: conductive foaming sponge, the conductive fibre fabric fitting in conductive foaming sponge surface and conductive rubber composition; Described conductive foaming sponge comprises foam sponge, the metal copper layer being deposited on foam sponge fiber surface successively and metal nickel dam; The hole that described conductive rubber composition is filled in conductive foaming sponge is interior with in conductive fibre fabric; Described conductive rubber composition comprises: the second metal powder of the Silica hydrogel of 100 weight portions, the first metal powder of 100 ~ 200 weight portions, 200 ~ 400 weight portions and the 3rd metal powder of 300 ~ 600 weight portions; The particle diameter of described first metal powder is 0.1 ~ 0.3 μm; The particle diameter of described second metal powder is 0.5 ~ 0.8 μm; The particle diameter of described 3rd metal powder is 3 ~ 10 μm.
Preferably, described first metal powder, the second metal powder and the 3rd metal powder are selected from one or more in silver powder, copper powder, nickel powder, yellow gold, silver-nickel and corronil independently of one another.
Preferably, the diaphragm covered with described conductive fibre fabric surface is also comprised.
Preferably, described diaphragm is PETG diaphragm, polyimides diaphragm or Merlon diaphragm.
Preferably, described conductive fibre fabric is obtained by breathe freely grid cloth plated metal layers of copper and metal nickel dam.
Present invention also offers a kind of preparation method of conducting foam, comprising:
The conductive foaming sponge being fitted with conductive fibre fabric is soaked in conductive rubber composition, vacuumizes, then curing molding, obtain conducting foam; Described conductive foaming sponge comprises foam sponge, the metal copper layer being deposited on foam sponge fiber surface successively and metal nickel dam; Described conductive fibre fabric fits in conductive foaming sponge surface; Described conductive rubber composition comprises: the second metal powder of the Silica hydrogel of 100 weight portions, the first metal powder of 100 ~ 200 weight portions, 200 ~ 400 weight portions and the 3rd metal powder of 300 ~ 600 weight portions; The particle diameter of described first metal powder is 0.1 ~ 0.3 μm; The particle diameter of described second metal powder is 0.5 ~ 0.8 μm; The particle diameter of described 3rd metal powder is 3 ~ 10 μm.
Preferably, also comprise:
After vacuumizing, covered with protective film, then curing molding; Described diaphragm is covered in the one side that conductive fibre fabric does not contact with conductive foaming sponge.
Preferably, the conductive foaming sponge being fitted with conductive fibre fabric described in is prepared according to following steps:
S1) by the ventilative grid cloth laminating in the surface of foam sponge, the foam of fitting is obtained;
S2) foam of described laminating is placed in after catalysis slurries carry out padding, bake, obtains the foam after sensitization; Described catalysis slurries comprise aqueous polyurethane and/or acrylate, palladium salt and surfactant;
S3) foam after described sensitization is soaked in formalin, the foam after being strengthened;
S4) foam after described strengthening is put into chemical bronze plating liquid to soak, obtain the foam of copper metallization;
S5) foam of described copper metallization is carried out electronickelling, obtain the conductive foaming sponge being fitted with conductive fibre fabric.
Preferably, vacuumize described in and make vacuum degree≤-0.09MPa.
Preferably, the temperature of described curing molding is 80 DEG C ~ 130 DEG C.
The invention provides a kind of conducting foam and preparation method thereof, this conducting foam comprises: conductive foaming sponge, the conductive fibre fabric fitting in conductive foaming sponge surface and conductive rubber composition; Described conductive foaming sponge comprises foam sponge, the metal copper layer being deposited on foam sponge fiber surface successively and metal nickel dam; The hole that described conductive rubber composition is filled in conductive foaming sponge is interior with in conductive fibre fabric; Described conductive rubber composition comprises: the second metal powder of the Silica hydrogel of 100 weight portions, the first metal powder of 100 ~ 200 weight portions, 200 ~ 400 weight portions and the 3rd metal powder of 300 ~ 600 weight portions; The particle diameter of described first metal powder is 0.1 ~ 0.3 μm; The particle diameter of described second metal powder is 0.5 ~ 0.8 μm; The particle diameter of described 3rd metal powder is 3 ~ 10 μm.Compared with existing conducting foam, conducting foam of the present invention is filled with the soft rubber composition of conduction in conductive foaming sponge inner void, and in rubber composition, comprise the metal powder of different-grain diameter, thus make conducting foam under the prerequisite not reducing electric conductivity and shield effectiveness, the elasticity that improve foam with contact effect, also make conducting foam possess the functions such as sealing, damping, buffering and noise reduction simultaneously.
Experimental result shows, the compressive deformation that the present invention prepares conducting foam can reach 88%, and rebound degree can reach 99%.
Accompanying drawing explanation
Fig. 1 is the surface texture photo being fitted with the conductive foaming sponge of conductive fibre fabric prepared by the embodiment of the present invention 1;
Fig. 2 is the surface texture photo being fitted with the conductive foaming sponge of conductive fibre fabric prepared by the embodiment of the present invention 1;
Fig. 3 is the internal structure photo being fitted with the conductive foaming sponge of conductive fibre fabric prepared by the embodiment of the present invention 1;
Fig. 4 is the internal structure photo being fitted with the conductive foaming sponge of conductive fibre fabric prepared by the embodiment of the present invention 1;
Fig. 5 is the internal structure photo being fitted with the conductive foaming sponge of conductive fibre fabric prepared by the embodiment of the present invention 1.
Embodiment
The invention provides a kind of conducting foam, comprising: conductive foaming sponge, the conductive fibre fabric fitting in conductive foaming sponge surface and conductive rubber composition; Described conductive foaming sponge comprises foam sponge, the metal copper layer being deposited on foam sponge fiber surface successively and metal nickel dam; With in conductive fibre fabric in the cavity that described conductive rubber composition is filled in conductive foaming sponge; Described conductive rubber composition comprises: the second metal powder of the Silica hydrogel of 100 weight portions, the first metal powder of 100 ~ 200 weight portions, 200 ~ 400 weight portions and the 3rd metal powder of 300 ~ 600 weight portions; The particle diameter of described first metal powder is 0.1 ~ 0.3 μm; The particle diameter of described second metal powder is 0.5 ~ 0.8 μm; The particle diameter of described 3rd metal powder is 3 ~ 10 μm.
Wherein, described foam sponge is foam sponge well known to those skilled in the art, there is no special restriction, is preferably the foam sponge being main component with polyester or polyethers in the present invention.With the foam sponge that polyester or polyethers are main component, there is high resiliency.Described foam sponge is by fibrous.
Described conductive foaming sponge comprises foam sponge, the metal copper layer being deposited on foam sponge fiber surface successively and metal nickel dam; According to the present invention, the surface of described metal nickel dam preferably also comprises resin protective layer; Described resin protective layer is resin protective layer well known to those skilled in the art, there is no special restriction.
Described conductive fibre fabric fits in conductive foaming sponge surface, and it is conductive fibre fabric well known to those skilled in the art, there is no special restriction, and preferably it is obtained by breathe freely grid cloth plated metal layers of copper and metal nickel dam in the present invention; According to the present invention, the surface of described metal nickel dam preferably also comprises resin protective layer; Described resin protective layer is resin protective layer well known to those skilled in the art, there is no special restriction.
The hole that described conductive rubber composition is filled in conductive foaming sponge is interior with in conductive fibre fabric, and described conductive rubber composition comprises: the second metal powder of the Silica hydrogel of 100 weight portions, the first metal powder of 100 ~ 200 weight portions, 200 ~ 400 weight portions and the 3rd metal powder of 300 ~ 600 weight portions; The particle diameter of described first metal powder is 0.1 ~ 0.3 μm; The particle diameter of described second metal powder is 0.5 ~ 0.8 μm; The particle diameter of described 3rd metal powder is 3 ~ 10 μm.Wherein, described Silica hydrogel is Silica hydrogel well known to those skilled in the art, there is no special restriction, is preferably silicon sulfide gel in the present invention; Described first metal powder is preferably 120 ~ 180 weight portions, is more preferably 150 ~ 180 weight portions; Described second metal powder is preferably 240 ~ 360 weight portions, is more preferably 260 ~ 320 weight portions; The particle diameter of described second metal powder is preferably 0.6 ~ 0.8 μm; Described 3rd metal powder is preferably 350 ~ 550 weight portions, is more preferably 380 ~ 550 weight portions, then is preferably 440 ~ 550 weight portions; The particle diameter of described 3rd metal powder is preferably 5 ~ 10 μm, is more preferably 8 ~ 10 μm; Described first metal powder, the second metal powder and the 3rd metal powder be preferably in silver powder, copper powder, nickel powder, yellow gold, silver-nickel and corronil independently of one another one or more, be more preferably in silver powder, copper powder and nickel powder one or more.
According to the present invention, described conducting foam preferably also comprises the diaphragm covered with described conductive fibre fabric surface; Described diaphragm is covered in the one side that conductive fibre fabric does not contact with conductive foaming sponge; Described diaphragm is diaphragm well known to those skilled in the art; there is no special restriction, in the present invention, be preferably PETG diaphragm (PET), polyimides diaphragm (PI) or Merlon diaphragm (PC).
Conducting foam of the present invention is filled with the soft rubber composition of conduction in conductive foaming sponge inner void, and in rubber composition, comprise the metal powder of different-grain diameter, thus make conducting foam under the prerequisite not reducing electric conductivity and shield effectiveness, the elasticity that improve foam with contact effect, also make conducting foam possess the functions such as sealing, damping, buffering and noise reduction simultaneously.
Present invention also offers a kind of preparation method of above-mentioned conducting foam, comprising: the conductive foaming sponge being fitted with conductive fibre fabric is soaked in conductive rubber composition, vacuumizes, then curing molding, obtain conducting foam; Described conductive foaming sponge comprises foam sponge, the metal copper layer being deposited on foam sponge fiber surface successively and metal nickel dam; Described foam sponge is by fibrous; Described conductive fibre fabric fits in conductive foaming sponge surface; Described conductive rubber composition comprises: the second metal powder of the Silica hydrogel of 100 weight portions, the first metal powder of 100 ~ 200 weight portions, 200 ~ 400 weight portions and the 3rd metal powder of 300 ~ 600 weight portions; The particle diameter of described first metal powder is 0.1 ~ 0.3 μm; The particle diameter of described second metal powder is 0.5 ~ 0.8 μm; The particle diameter of described 3rd metal powder is 3 ~ 10 μm.
Wherein, the restriction that the present invention is not special to the source of all raw materials, for commercially available.
The described conductive foaming sponge being fitted with conductive fibre fabric is preferably prepared in accordance with the following methods: S1) by the ventilative grid cloth laminating in the surface of foam sponge, obtain the foam of fitting; S2) foam of described laminating is placed in after catalysis slurries carry out padding, bake, obtains the foam after sensitization; Described catalysis slurries comprise aqueous polyurethane and/or acrylate, palladium salt and surfactant; S3) foam after described sensitization is soaked in formalin, the foam after being strengthened; S4) foam after described strengthening is put into chemical bronze plating liquid to soak, obtain the foam of copper metallization; S5) carry out electronickelling on the foam surface of described copper metallization, obtain the conductive foaming sponge being fitted with conductive fibre fabric.
By the ventilative grid cloth laminating in the surface of foam sponge, obtain the foam of fitting.Wherein said foam sponge is same as above, does not repeat them here.The thickness of the foam of described laminating is preferably 0.5 ~ 10mm, more has preferably 0.5 ~ 5mm, then is preferably 1 ~ 3mm.
According to the present invention, the foam of described laminating preferably first cleans, and except dust and foreign material, is then placed in catalysis slurries after carrying out padding, baking, obtains the foam after sensitization.Described catalysis slurries comprise aqueous polyurethane and/or acrylate, palladium salt and surfactant; Described palladium salt is preferably palladium bichloride and/or palladium; Described surfactant is surfactant well known to those skilled in the art, there is no special restriction; The described temperature baked is preferably 100 DEG C ~ 200 DEG C, is more preferably 120 DEG C ~ 180 DEG C; The described time baked is preferably 10 ~ 20min.After baking, very thin metal catalytic layer can be formed on foam surface.
Foam after described sensitization is soaked in formalin, the foam after being strengthened.Foam surface layer structure can be strengthened by this step.Wherein, described formalin is preferably the formalin that concentration is 35% ~ 45%.
Foam after described strengthening is put into chemical bronze plating liquid soak, preferably soak 10 ~ 20min, obtain the foam of copper metallization.Wherein, described chemical bronze plating liquid is chemical bronze plating liquid well known to those skilled in the art, there is no special restriction, preferably chemical bronze plating liquid is obtained in accordance with the following methods: by 5 ~ 100g/L copper sulphate in the present invention, 10 ~ 50g/L sodium tartrate, 10 ~ 50g/L ethylenediamine tetra-acetic acid, 2 ~ 20g/L alkaline agent, 10 ~ 30g/L concentration is 37% ~ 40% formaldehyde, 0 ~ 10g/L nickel chloride, 2 ~ 100mg/L copper stabilizer, 1 ~ 15mg/L potassium cyanide mixes with 0 ~ 10g/L bleeding agent, stir under 40 DEG C ~ 70 DEG C conditions, adjusted to ph is 10 ~ 13, obtain chemical bronze plating liquid, wherein said alkaline agent has NaOH and/or sodium carbonate in whirlpool, described copper stabilizer is preferably α, α '-2 bipyridine and/or 2-mercaptobenzothiazole.
The foam of described copper metallization is carried out electronickelling, described electronickelling preferably adopts sulfur-bearing nickel anode, carbon nickel anode or contains oxygen nickel anode, then with following raw material preparation nickel plating solution: 100 ~ 500g/L nickel salt, ammonium nickel sulfate or nickel sulfamic acid, the agent of 7 ~ 20g/L anode activation, 25 ~ 40g/L buffer, 30 ~ 50g/L magnesium sulfate and 0.01 ~ 2g/L anti-pinhole agent; By above-mentioned raw materials at temperature 10 DEG C ~ 66 DEG C, cathode current 0.5 ~ 5A/dm
2under environment, adjust ph is 3 ~ 6, adds water and is made into the nickel plating solution that total concentration is 5% ~ 40%, within the scope of 10 DEG C ~ 50 DEG C, carry out electronickelling; Described nickel salt is preferably nickelous sulfate and/or nickel chloride; Described anode activation agent is preferably sodium chloride and/or nickel chloride; Described buffer is boric acid and/or ammonium chloride; Described anti-pinhole agent is preferably hydrogen peroxide and/or dodecyl sodium sulfate.
After the present invention, preferred coated with resins coating adhesive after electronickelling, dry, dry after obtain being fitted with the conductive foaming sponge of conductive fibre fabric; Described resin coating rubber forms resin protective layer, and it is preferably PU or PE coating adhesive.
Be soaked in conductive rubber composition by the conductive foaming sponge being fitted with conductive fibre fabric, wherein, described conductive rubber composition is same as above, does not repeat them here.
Preferably conductive rubber composition is prepared in accordance with the following methods: the first metal powder of the Silica hydrogel of 100 weight portions, 100 ~ 200 weight portions, the second metal powder of 200 ~ 400 weight portions are mixed with the 3rd metal powder of 300 ~ 600 weight portions in the present invention, preferred mixing 30 ~ 300min, is more preferably 45 ~ 100min; Described mixing is preferably carried out under the condition of inert gas shielding; According to the present invention, the order of described mixing is preferably: mixed with the first metal powder of 100 ~ 200 weight portions by the Silica hydrogel of 100 weight portions, preferred mixing 10 ~ 100min, be more preferably 15min, then add the second metal powder and mix, preferably mix 10 ~ 100min, be more preferably 15min, finally add the 3rd metal powder to mix, preferably mix 10 ~ 100min, be more preferably 15min.
The conductive foaming sponge being fitted with conductive fibre fabric is soaked in conductive rubber composition, vacuumizes, preferably make vacuum degree≤-0.09MPa.Under pressure, conductive rubber composition will infiltrate in each hole of foam.
According to the present invention, after vacuumizing, preferred covered with protective film, then curing molding, obtain conducting foam; Described diaphragm is covered in the one side that conductive fibre fabric does not contact with conductive foaming sponge.Wherein, described diaphragm is same as above, does not repeat them here; The temperature of described curing molding is preferably 80 DEG C ~ 130 DEG C, is more preferably 100 DEG C ~ 120 DEG C.
Experimental result shows, the compressive deformation that the present invention prepares conducting foam can reach 88%, and rebound degree can reach 99%.
In order to further illustrate the present invention, below in conjunction with embodiment, a kind of conducting foam provided by the invention and preparation method thereof is described in detail.
Reagent used in following examples is commercially available.
Embodiment 1
Foam sponge with PU master is cut into sheet by 1.1, the ventilative grid cloth laminating in outside of every sheet sponge, and the foam thickness of laminating is 0.5mm; Clean, remove dust and foreign material; Then place it in catalysis slurries and pad, bake 15min, obtain the foam after sensitization at temperature 150 DEG C, JFC is formulated by palladium bichloride, aqueous polyurethane matching surface activating agent for described catalysis slurries.
1.2 the foam after the sensitization obtained in 1.1 put into concentration be 40% formalin soak, the foam after being strengthened.
1.3 electroless coppers: preparation chemical bronze plating liquid, be formaldehyde, 5g/L nickel chloride, the 50mg/L α of 38% by 50g/L copper sulphate, 30g/L sodium tartrate, 30g/L ethylenediamine tetra-acetic acid, 10g/L NaOH, 20g/L concentration, α '-2 bipyridine, 8mg/L potassium cyanide and 5g/LJFC mix and blend at 55 DEG C, adjusted to ph is 12, obtains chemical bronze plating liquid; Foam after the strengthening obtained in 1.2 is put into chemical bronze plating liquid and soaks 15min, obtain the foam of copper metallization.
1.4 electronickellings: adopt sulfur-bearing nickel anode, then with following raw material preparation nickel plating solution: 300g/L nickelous sulfate, 13g/L sodium chloride, 32g/L boric acid, 40g/L magnesium sulfate and 1g/L hydrogen peroxide; By above-mentioned raw materials at temperature 38 DEG C, cathode current 3A/dm
2under environment, adjust ph is 4, adds water and is made into the nickel plating solution that total concentration is 22%, within the scope of 30 DEG C to 1.3 in the foam of copper metallization that obtains carry out electronickelling, then dip-coating PU coating adhesive, after drying, drying, obtains the conductive foaming sponge being fitted with conductive fibre fabric.
1.5 preparation conductive rubber compositions: the Silica hydrogel (KE-1051J of Japan XINYUE) of 100 weight portions is mixed 15min with the metal nickel powder (particle diameter 0.3 μm) of 162 weight portions under the condition of nitrogen protection; then the silver powder (particle diameter 0.8 μm) adding 288 weight portions continues to mix 15min under the condition of nitrogen protection; the copper powder (particle diameter 10 μm) finally adding 450 weight portions continues to mix 15min under the condition of nitrogen protection; nitrogen is discharged, obtains conductive rubber composition.
The conductive foaming sponge being fitted with conductive fibre fabric obtained in 1.4 is put into closed container by 1.6 together with the conductive rubber composition obtained in 1.5; the conductive foaming sponge being fitted with conductive fibre fabric is made to be fully immersed in conductive rubber composition; taken away the air in container by vacuum pump; it is made to reach negative pressure (≤-0.09MPa); conductive rubber composition will infiltrate in each hole of foam under pressure; take out foam; cover PU diaphragm up and down; be positioned in baking box; curing molding under 120 DEG C of conditions, obtains conducting foam.
Utilize microscope to be that the conductive foaming sponge being fitted with conductive fibre fabric obtained in 1.4 is analyzed, obtain its structure photo, wherein Fig. 1 and Fig. 2 is the surface texture photo of the conductive foaming sponge being fitted with conductive fibre fabric; Fig. 3, Fig. 4 and Fig. 5 are the internal structure photo of the conductive foaming sponge being fitted with conductive fibre fabric.
The performance of the conducting foam obtained in 1.6 is tested, obtains the results are shown in Table 1.
Embodiment 2
Foam sponge with PU master is cut into sheet by 2.1, the ventilative grid cloth laminating in outside of every sheet sponge, and the foam thickness of laminating is 3mm; Clean, remove dust and foreign material; Then place it in catalysis slurries and pad, bake 15min, obtain the foam after sensitization at temperature 150 DEG C, JFC is formulated by palladium bichloride, aqueous polyurethane matching surface activating agent for described catalysis slurries.
2.2 the foam after the sensitization obtained in 2.1 put into concentration be 40% formalin soak, the foam after being strengthened.
2.3 electroless coppers: preparation chemical bronze plating liquid, be formaldehyde, 5g/L nickel chloride, the 50mg/L α of 38% by 50g/L copper sulphate, 30g/L sodium tartrate, 30g/L ethylenediamine tetra-acetic acid, 10g/L NaOH, 20g/L concentration, α '-2 bipyridine, 8mg/L potassium cyanide and 5g/LJFC mix and blend at 55 DEG C, adjusted to ph is 12, obtains chemical bronze plating liquid; Foam after the strengthening obtained in 2.2 is put into chemical bronze plating liquid and soaks 15min, obtain the foam of copper metallization.
2.4 electronickellings: adopt sulfur-bearing nickel anode, then with following raw material preparation nickel plating solution: 300g/L nickelous sulfate, 13g/L sodium chloride, 32g/L boric acid, 40g/L magnesium sulfate and 1g/L hydrogen peroxide; By above-mentioned raw materials at temperature 38 DEG C, cathode current 3A/dm
2under environment, adjust ph is 4, adds water and is made into the nickel plating solution that total concentration is 22%, within the scope of 30 DEG C to 2.3 in the foam of copper metallization that obtains carry out electronickelling, then dip-coating PU coating adhesive, after drying, drying, obtains the conductive foaming sponge being fitted with conductive fibre fabric.
2.5 preparation conductive rubber compositions: the Silica hydrogel (KE-1051J of Japan XINYUE) of 100 weight portions is mixed 15min with the silver powder (particle diameter 0.2 μm) of 180 weight portions under the condition of nitrogen protection; then the copper powder (particle diameter 0.5 μm) adding 300 weight portions continues to mix 15min under the condition of nitrogen protection; the metal nickel powder (particle diameter 8 μm) finally adding 460 weight portions continues to mix 15min under the condition of nitrogen protection; nitrogen is discharged, obtains conductive rubber composition.
The conductive foaming sponge being fitted with conductive fibre fabric obtained in 2.4 is put into closed container by 2.6 together with the conductive rubber composition obtained in 2.5; the conductive foaming sponge being fitted with conductive fibre fabric is made to be fully immersed in conductive rubber composition; taken away the air in container by vacuum pump; it is made to reach negative pressure (≤-0.09MPa); conductive rubber composition will infiltrate in each hole of foam under pressure; take out foam; cover PU diaphragm up and down; be positioned in baking box; curing molding under 100 DEG C of conditions, obtains conducting foam.
The performance of the conducting foam obtained in 2.6 is tested, obtains the results are shown in Table 1.
Embodiment 3
Foam sponge with PU master is cut into sheet by 3.1, the ventilative grid cloth laminating in outside of every sheet sponge, and the foam thickness of laminating is 1mm; Clean, remove dust and foreign material; Then place it in catalysis slurries and pad, bake 15min, obtain the foam after sensitization at temperature 150 DEG C, JFC is formulated by palladium bichloride, aqueous polyurethane matching surface activating agent for described catalysis slurries.
3.2 the foam after the sensitization obtained in 3.1 put into concentration be 40% formalin soak, the foam after being strengthened.
3.3 electroless coppers: preparation chemical bronze plating liquid, be formaldehyde, 5g/L nickel chloride, the 50mg/L α of 38% by 50g/L copper sulphate, 30g/L sodium tartrate, 30g/L ethylenediamine tetra-acetic acid, 10g/L NaOH, 20g/L concentration, α '-2 bipyridine, 8mg/L potassium cyanide and 5g/LJFC mix and blend at 55 DEG C, adjusted to ph is 12, obtains chemical bronze plating liquid; Foam after the strengthening obtained in 3.2 is put into chemical bronze plating liquid and soaks 15min, obtain the foam of copper metallization.
3.4 electronickellings: adopt sulfur-bearing nickel anode, then with following raw material preparation nickel plating solution: 300g/L nickelous sulfate, 13g/L sodium chloride, 32g/L boric acid, 40g/L magnesium sulfate and 1g/L hydrogen peroxide; By above-mentioned raw materials at temperature 38 DEG C, cathode current 3A/dm
2under environment, adjust ph is 4, adds water and is made into the nickel plating solution that total concentration is 22%, within the scope of 30 DEG C to 3.3 in the foam of copper metallization that obtains carry out electronickelling, then dip-coating PU coating adhesive, after drying, drying, obtains the conductive foaming sponge being fitted with conductive fibre fabric.
3.5 preparation conductive rubber compositions: the Silica hydrogel (KE-1051J of Japan XINYUE) of 100 weight portions is mixed 15min with the metallic nickel silver powder (particle diameter 0.1 μm) of 200 weight portions under the condition of nitrogen protection; then the metal nickel powder (particle diameter 0.6 μm) adding 320 weight portions continues to mix 15min under the condition of nitrogen protection; the metal nickel powder (particle diameter 10 μm) finally adding 550 weight portions continues to mix 15min under the condition of nitrogen protection; nitrogen is discharged, obtains conductive rubber composition.
The conductive foaming sponge being fitted with conductive fibre fabric obtained in 3.4 is put into closed container by 3.6 together with the conductive rubber composition obtained in 3.5; the conductive foaming sponge being fitted with conductive fibre fabric is made to be fully immersed in conductive rubber composition; taken away the air in container by vacuum pump; it is made to reach negative pressure (≤-0.09MPa); conductive rubber composition will infiltrate in each hole of foam under pressure; take out foam; cover PU diaphragm up and down; be positioned in baking box; curing molding under 100 DEG C of conditions, obtains conducting foam.
The performance of the conducting foam obtained in 3.6 is tested, obtains the results are shown in Table 1.
Comparative example 1
Foam sponge with PU master is cut into sheet by 1.1, the ventilative grid cloth laminating in outside of every sheet sponge, and the foam thickness of laminating is 1mm; Clean, remove dust and foreign material; Then place it in catalysis slurries and pad, bake 15min, obtain the foam after sensitization at temperature 150 DEG C, JFC is formulated by palladium bichloride, aqueous polyurethane matching surface activating agent for described catalysis slurries.
1.2 the foam after the sensitization obtained in 1.1 put into concentration be 40% formalin soak, the foam after being strengthened.
1.3 electroless coppers: preparation chemical bronze plating liquid, be formaldehyde, 5g/L nickel chloride, the 50mg/L α of 38% by 50g/L copper sulphate, 30g/L sodium tartrate, 30g/L ethylenediamine tetra-acetic acid, 10g/L NaOH, 20g/L concentration, α '-2 bipyridine, 8mg/L potassium cyanide and 5g/LJFC mix and blend at 55 DEG C, adjusted to ph is 12, obtains chemical bronze plating liquid; Foam after the strengthening obtained in 1.2 is put into chemical bronze plating liquid and soaks 15min, obtain the foam of copper metallization.
1.4 electronickellings: adopt sulfur-bearing nickel anode, then with following raw material preparation nickel plating solution: 300g/L nickelous sulfate, 13g/L sodium chloride, 32g/L boric acid, 40g/L magnesium sulfate and 1g/L hydrogen peroxide; By above-mentioned raw materials at temperature 38 DEG C, cathode current 3A/dm
2under environment, adjust ph is 4, adds water and is made into the nickel plating solution that total concentration is 22%, within the scope of 30 DEG C to 1.3 in the foam of copper metallization that obtains carry out electronickelling, then dip-coating PU coating adhesive, after drying, drying, obtain conducting foam.
The performance of the conducting foam obtained in 1.4 is tested, obtains the results are shown in Table 1.
Table 1 conducting foam the performance test results
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. a conducting foam, is characterized in that, comprising: conductive foaming sponge, the conductive fibre fabric fitting in conductive foaming sponge surface and conductive rubber composition; Described conductive foaming sponge comprises foam sponge, the metal copper layer being deposited on foam sponge fiber surface successively and metal nickel dam; The hole that described conductive rubber composition is filled in conductive foaming sponge is interior with in conductive fibre fabric; Described conductive rubber composition comprises: the second metal powder of the Silica hydrogel of 100 weight portions, the first metal powder of 100 ~ 200 weight portions, 200 ~ 400 weight portions and the 3rd metal powder of 300 ~ 600 weight portions; The particle diameter of described first metal powder is 0.1 ~ 0.3 μm; The particle diameter of described second metal powder is 0.5 ~ 0.8 μm; The particle diameter of described 3rd metal powder is 3 ~ 10 μm.
2. conducting foam according to claim 1, is characterized in that, described first metal powder, the second metal powder and the 3rd metal powder be selected from silver powder, copper powder, nickel powder, yellow gold, silver-nickel and corronil independently of one another one or more.
3. conducting foam according to claim 1, is characterized in that, also comprises the diaphragm covered with described conductive fibre fabric surface.
4. conducting foam according to claim 3, is characterized in that, described diaphragm is PETG diaphragm, polyimides diaphragm or Merlon diaphragm.
5. conductive sponge according to claim 1, is characterized in that, described conductive fibre fabric is obtained by breathe freely grid cloth plated metal layers of copper and metal nickel dam.
6. a preparation method for conducting foam, is characterized in that, comprising:
The conductive foaming sponge being fitted with conductive fibre fabric is soaked in conductive rubber composition, vacuumizes, then curing molding, obtain conducting foam; Described conductive foaming sponge comprises foam sponge, the metal copper layer being deposited on foam sponge fiber surface successively and metal nickel dam; Described conductive fibre fabric fits in conductive foaming sponge surface; Described conductive rubber composition comprises: the second metal powder of the Silica hydrogel of 100 weight portions, the first metal powder of 100 ~ 200 weight portions, 200 ~ 400 weight portions and the 3rd metal powder of 300 ~ 600 weight portions; The particle diameter of described first metal powder is 0.1 ~ 0.3 μm; The particle diameter of described second metal powder is 0.5 ~ 0.8 μm; The particle diameter of described 3rd metal powder is 3 ~ 10 μm.
7. preparation method according to claim 6, is characterized in that, also comprises:
After vacuumizing, covered with protective film, then curing molding; Described diaphragm is covered in the one side that conductive fibre fabric does not contact with conductive foaming sponge.
8. preparation method according to claim 6, is characterized in that, described in be fitted with conductive fibre fabric conductive foaming sponge be prepared according to following steps:
S1) by the ventilative grid cloth laminating in the surface of foam sponge, the foam of fitting is obtained;
S2) foam of described laminating is placed in after catalysis slurries carry out padding, bake, obtains the foam after sensitization; Described catalysis slurries comprise aqueous polyurethane and/or acrylate, palladium salt and surfactant;
S3) foam after described sensitization is soaked in formalin, the foam after being strengthened;
S4) foam after described strengthening is put into chemical bronze plating liquid to soak, obtain the foam of copper metallization;
S5) foam of described copper metallization is carried out electronickelling, obtain the conductive foaming sponge being fitted with conductive fibre fabric.
9. preparation method according to claim 6, is characterized in that, described in vacuumize and make vacuum degree≤-0.09MPa.
10. preparation method according to claim 6, is characterized in that, the temperature of described curing molding is 80 DEG C ~ 130 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410305103.9A CN105451527B (en) | 2014-06-30 | 2014-06-30 | A kind of conducting foam and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410305103.9A CN105451527B (en) | 2014-06-30 | 2014-06-30 | A kind of conducting foam and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105451527A true CN105451527A (en) | 2016-03-30 |
| CN105451527B CN105451527B (en) | 2018-07-31 |
Family
ID=55561171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410305103.9A Active CN105451527B (en) | 2014-06-30 | 2014-06-30 | A kind of conducting foam and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105451527B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106987020A (en) * | 2017-04-21 | 2017-07-28 | 唐林元 | A kind of preparation method of shielding conducting foam |
| CN108463100A (en) * | 2018-04-04 | 2018-08-28 | 宁国市千洪电子有限公司 | A kind of high resiliency conducting foam |
| CN111417295A (en) * | 2020-03-06 | 2020-07-14 | 南昌欧菲生物识别技术有限公司 | Conductive foam, ultrasonic fingerprint module, display screen assembly and electronic equipment |
| CN114889269A (en) * | 2022-04-28 | 2022-08-12 | 深圳市津田电子有限公司 | Ultrathin conductive foam and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200927493A (en) * | 2007-12-31 | 2009-07-01 | 3M Innovative Properties Co | Electromagnetic shielding mat and method of filling gap in electromagnetic shielding system |
| KR20090123776A (en) * | 2008-05-28 | 2009-12-02 | (주)성우신소재 | Manufacturing method of conductive foam sheet for shielding electromagnetic wave, conductive foam sheet for shielding electromagnetic wave thereby, and electromagnetic shielded gasket including the same |
| CN101885923A (en) * | 2009-05-13 | 2010-11-17 | 鸿富锦精密工业（深圳）有限公司 | Conducting foam and application method thereof |
| CN201752174U (en) * | 2010-05-14 | 2011-02-23 | 周宾 | Conducting froth cotton |
| CN203261631U (en) * | 2013-04-24 | 2013-10-30 | 青岛卓英社科技有限公司 | Weldable conductive foam |
| CN203567288U (en) * | 2013-10-31 | 2014-04-30 | 厦门精码信息技术有限公司 | Conductive foam |
-
2014
- 2014-06-30 CN CN201410305103.9A patent/CN105451527B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200927493A (en) * | 2007-12-31 | 2009-07-01 | 3M Innovative Properties Co | Electromagnetic shielding mat and method of filling gap in electromagnetic shielding system |
| KR20090123776A (en) * | 2008-05-28 | 2009-12-02 | (주)성우신소재 | Manufacturing method of conductive foam sheet for shielding electromagnetic wave, conductive foam sheet for shielding electromagnetic wave thereby, and electromagnetic shielded gasket including the same |
| CN101885923A (en) * | 2009-05-13 | 2010-11-17 | 鸿富锦精密工业（深圳）有限公司 | Conducting foam and application method thereof |
| CN201752174U (en) * | 2010-05-14 | 2011-02-23 | 周宾 | Conducting froth cotton |
| CN203261631U (en) * | 2013-04-24 | 2013-10-30 | 青岛卓英社科技有限公司 | Weldable conductive foam |
| CN203567288U (en) * | 2013-10-31 | 2014-04-30 | 厦门精码信息技术有限公司 | Conductive foam |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106987020A (en) * | 2017-04-21 | 2017-07-28 | 唐林元 | A kind of preparation method of shielding conducting foam |
| CN106987020B (en) * | 2017-04-21 | 2020-06-30 | 盐城匡特新材料科技有限公司 | Preparation method of conductive foam for shielding |
| CN108463100A (en) * | 2018-04-04 | 2018-08-28 | 宁国市千洪电子有限公司 | A kind of high resiliency conducting foam |
| CN108463100B (en) * | 2018-04-04 | 2020-08-04 | 宁国市千洪电子有限公司 | High-elasticity conductive foam |
| CN111417295A (en) * | 2020-03-06 | 2020-07-14 | 南昌欧菲生物识别技术有限公司 | Conductive foam, ultrasonic fingerprint module, display screen assembly and electronic equipment |
| WO2021175101A1 (en) * | 2020-03-06 | 2021-09-10 | 欧菲光集团股份有限公司 | Electrically-conductive foam, ultrasonic fingerprint module, display screen assembly, and electronic apparatus |
| CN114889269A (en) * | 2022-04-28 | 2022-08-12 | 深圳市津田电子有限公司 | Ultrathin conductive foam and preparation method thereof |
| CN114889269B (en) * | 2022-04-28 | 2024-03-15 | 深圳市津田电子有限公司 | Ultrathin conductive foam and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105451527B (en) | 2018-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101431885B (en) | All-directional conductive foam and producing method thereof | |
| CN105451527A (en) | Conductive foam and preparation method thereof | |
| CN106987020B (en) | Preparation method of conductive foam for shielding | |
| CN104448840B (en) | Preparation method of filing type electromagnetic shielding silicon rubber | |
| CN108039235A (en) | One kind inhales ripple flat data line | |
| CN101362390A (en) | Wide band electromagnetic wave-shielded polyethylene compound film containing carbonyl iron powder and preparation method thereof | |
| KR101226773B1 (en) | Conductive thin layer cushion seat with excellent impact absorbing function and electromagnetic waveshielding function and preparation method thereof | |
| CN105225768B (en) | A kind of preparation method of the flexible silver-plated functional particles conducting film of sandwich structure | |
| KR20130078185A (en) | Method for producing conductive non-woven fabric and multi-fuctional electro magnetic interference shield tape using conductive non-woven fabric | |
| CN111408713A (en) | Preparation method of nickel-coated graphite composite powder material with high coating rate | |
| KR101333384B1 (en) | Cushion sheet for protecting touch screen panel and preparation method thereof | |
| CN110684473A (en) | Novel ultrathin conductive foam with high compressibility, high resilience and static resistance and preparation method thereof | |
| KR101054074B1 (en) | Method for producing conductive foam sheet for electromagnetic shielding gasket, thereby conductive foam sheet for electromagnetic shielding gasket, electromagnetic shielding gasket comprising conductive foam sheet | |
| CN102121100A (en) | 'Copper/straw' electromagnetic wave shield composite material and preparation method thereof | |
| CN201623958U (en) | Shielding complex | |
| CN107452433A (en) | A kind of all-directional conductive sponge and preparation method thereof | |
| CN214873252U (en) | Conductive cloth with super-strong shielding effect and plasticity | |
| CN109336412A (en) | A kind of conductive magneto-conductive hollow glass micropearl and preparation method thereof | |
| KR101018633B1 (en) | Electromagnetic interferenceEMI shielding thin gasket with impact-resistance and manufacturing method thereof | |
| CN209151476U (en) | A kind of screening cover conducting foam | |
| CN103665878B (en) | A kind of preparation method of electromagnetic shielding silicone rubber | |
| CN101012553A (en) | Compounded conducting mix and silver coating Fe3O4 powder and method for making same | |
| CN202697146U (en) | Conductive foam | |
| CN108171306A (en) | Intelligent cards | |
| CN201752175U (en) | Electric conduction fabric |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |