CN105431953A - 基于固态荧光材料的嵌入式白光led封装结构及其制作方法 - Google Patents

基于固态荧光材料的嵌入式白光led封装结构及其制作方法 Download PDF

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CN105431953A
CN105431953A CN201480000543.1A CN201480000543A CN105431953A CN 105431953 A CN105431953 A CN 105431953A CN 201480000543 A CN201480000543 A CN 201480000543A CN 105431953 A CN105431953 A CN 105431953A
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fluorescent material
solid
yag
blue light
state fluorescent
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CN105431953B (zh
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梁月山
曹顿华
马可军
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KUNSHAN KAIWEI ELECTRONIC Co.,Ltd.
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Shanghai Fudi Lighting Electronic Co ltd
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)

Abstract

本发明公开了基于固态荧光材料的嵌入式白光LED封装结构，包括蓝光芯片和Ce:YAG固态荧光材料，Ce:YAG固态荧光材料上设有与蓝光芯片相匹配的凹槽，蓝光芯片嵌入凹槽内。本发明的大功率蓝光芯片直接嵌入贴合于固态荧光材料的凹槽内，利用透镜原理将芯片发出的蓝光和固态荧光材料转化发出的黄绿光并予以混合，得到白光。该基于固态荧光材料的嵌入式白光LED封装结构工艺简单、成本低；具有高荧光效率，蓝光不泄露；可以直接通过固态荧光材料散热，散热性能好；节能环保并且大幅提高LED照明设备的使用寿命。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN201480000543.1A 2014-06-05 2014-06-05 基于固态荧光材料的嵌入式白光led封装结构及其制作方法 Active CN105431953B (zh)

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CN106746687A (zh) * 2017-01-25 2017-05-31 上海应用技术大学 一种采用丝网印刷法制备led封装用荧光玻璃片的方法
CN112266239A (zh) * 2020-10-19 2021-01-26 徐州凹凸光电科技有限公司 一种白光led/ld用高热稳定性高显色指数荧光陶瓷及其制备方法

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CN106298754B (zh) * 2016-09-30 2019-09-06 鸿利智汇集团股份有限公司 一种csp灯珠的制作方法及csp灯珠
CN112599509A (zh) * 2020-11-09 2021-04-02 新沂市锡沂高新材料产业技术研究院有限公司 一种高亮度、色温可调的固态照明光源
CN112537953B (zh) * 2020-12-16 2022-03-08 中国科学院上海硅酸盐研究所 一种复合荧光陶瓷及其制备方法

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* Cited by examiner, † Cited by third party
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CN106746687A (zh) * 2017-01-25 2017-05-31 上海应用技术大学 一种采用丝网印刷法制备led封装用荧光玻璃片的方法
CN106746687B (zh) * 2017-01-25 2019-10-01 上海应用技术大学 一种采用丝网印刷法制备led封装用荧光玻璃片的方法
CN112266239A (zh) * 2020-10-19 2021-01-26 徐州凹凸光电科技有限公司 一种白光led/ld用高热稳定性高显色指数荧光陶瓷及其制备方法
CN112266239B (zh) * 2020-10-19 2022-11-25 徐州凹凸光电科技有限公司 一种白光led/ld用高热稳定性高显色指数荧光陶瓷及其制备方法

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US9537058B2 (en) 2017-01-03
WO2015184618A1 (zh) 2015-12-10
CN105431953B (zh) 2018-03-16
US20160268482A1 (en) 2016-09-15

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