CN105430929B - A kind of production method of the thick copper PCB in part - Google Patents
A kind of production method of the thick copper PCB in part Download PDFInfo
- Publication number
- CN105430929B CN105430929B CN201510811568.6A CN201510811568A CN105430929B CN 105430929 B CN105430929 B CN 105430929B CN 201510811568 A CN201510811568 A CN 201510811568A CN 105430929 B CN105430929 B CN 105430929B
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- China
- Prior art keywords
- dry film
- thick copper
- region
- circuit board
- copper
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
Abstract
The present invention relates to technical field of PCB board more particularly to the production methods of the thick copper PCB in part a kind of, include the following steps：A, preparation process；B, a dry film step is pasted：The region for not needing to plate thick copper on circuit boards is labelled to few two layers one time dry film and exposes, develops, and exposes the region that need to plate thick copper；C, thick copper step is plated in part；D, a dry film step is taken off；E, secondary dry film step is pasted；F, lead etching step；G, take off secondary dry film step, the present invention can effectively avoid folder film phenomenon, can according to pad pasting number number, Local Copper thickness can be accomplished to 2oz-3oz, it is even thicker, can effectively solve the problems, such as that Local Copper thickness is difficult to produce greatly with other area differentiations；And manufacture craft is simple, can realize that thick copper is plated in part well without especially controlling, can be used for the production of bulk article, basically will not produce and scrap, so that product yield is high, improve product quality.
Description
Technical field：
The present invention relates to technical field of PCB board more particularly to the production methods of the thick copper PCB in part a kind of.
Background technique：
The design of existing circuit board develops using increasingly becoming to becoming privileged, and the place on line table copper of some circuit boards is wanted
Ask inconsistent, the copper plate at some positions require it is thicker than other positions, but production technology in the prior art be can only control it is whole
Face copper is thick consistent, is difficult to meet local location special list copper requirement.Currently, copper PCB thick for production part, especially difference of height
More than the PCB of 2oz (ounce), since the copper thickness in part thick copper region is restricted, manufacture craft is all more complicated, manufacture difficulty
It is high.The main production defect of such PCB is：1. the method and process long flow path of difference of height copper thickness PCB is made, in order to reach part
The other places of copper thickness rate are thick, need to be repeated as many times plating, pad pasting, move back the processes such as film, etching, and process is complicated, are also easy to produce defect and scrap,
Yields is low.2. difference of height region easily causes secondary pad pasting loosely, product quality is influenced.
Summary of the invention：
One kind is provided the purpose of the present invention is to the shortcomings of the prior art can reduce manufacture difficulty, simplification
Process, the production method for improving processing efficiency, the thick copper PCB in part for improving yields.
To achieve the goals above, the technical solution adopted by the present invention is that：
A kind of production method of the thick copper PCB in part, includes the following steps：
A, preparation process：Circuit board is etched, is formed with electroplate lead wire, the circuit wait do the thick copper in part
Plate；
B, a dry film step is pasted：The region for not needing to plate thick copper on circuit boards is labelled to few two layers one time dry film and exposes
Light, development expose the region that need to plate thick copper；
C, thick copper step is plated in part：Circuit board is carried out to plate thick Copper treatment, circuit board is made to need to plate the copper facing in thick copper region
Layer, which is thickeied to required thickness, forms part plating thick copper layer；
D, a dry film step is taken off：By the institute on circuit board, once dry film fades away；
E, secondary dry film step is pasted：The region in addition to electroplate lead wire region is pasted one layer of secondary dry film and is exposed on circuit boards
Light, development expose electroplate lead wire region；
F, lead etching step：The circuit board overetch line for exposing electroplate lead wire region is etched, will be electroplated
Lead etches away；
G, secondary dry film step is taken off：Secondary dry film on circuit board is faded away.
The step B is specially：
B1, it does not need to plate region patch dry film of first layer of thick copper on circuit boards and exposes, develops, exposing need to plate thickness
The region of copper；
The more one layer of dry film of B2, a dry film appearance face paste on circuit boards simultaneously exposes, develops, and thickness need to be plated by only exposing
The region of copper.
Preferably, repeating more times of step B2 in the step B to required thickness.
The thickness that dry film of multilayer is superimposed in the step C is greater than or equal to the thickness of part plating thick copper layer.
The circuit board is two-sided or multilayer circuit board.
The beneficial effects of the invention are that：The present invention includes the following steps：A, preparation process：Place is etched to circuit board
Reason is formed with electroplate lead wire, the circuit board wait do the thick copper in part；B, a dry film step is pasted：It does not need to plate on circuit boards
The region of thick copper is labelled to few two layers one time dry film and exposes, develops, and exposes the region that need to plate thick copper；C, thick copper step is plated in part：
Circuit board is carried out to plate thick Copper treatment, the copper plate thickening for making circuit board need to plate thick copper region forms local plating to required thickness
Thick copper layer；D, a dry film step is taken off；E, secondary dry film step is pasted；F, lead etching step；G, secondary dry film step, this hair are taken off
The bright requirement according to product to Local Copper thickness carries out twice or above pad pasting, exposure and imaging to product, makes thick copper region week
The thickness of the dry film superposition on side is equal to or higher than the thickness of the thick copper in part, is then electroplated again, and folder film can be effectively avoided
Phenomenon, can according to pad pasting number number, Local Copper thickness can be accomplished to 2oz-3oz, it is even thicker, can effectively solve Local Copper thickness
It is difficult to the problem produced greatly with other area differentiations；And manufacture craft is simple, can realization office well without especially control
Thick copper is plated in portion, can be used for the production of bulk article, basically will not produce and scrap, so that product yield is high, improves product quality.
Detailed description of the invention：
Fig. 1 is production method flow chart of the invention.
Fig. 2 is the structural schematic diagram that circuit board of the present invention is prepared after step.
Fig. 3 is that circuit board of the present invention pastes the structural schematic diagram after a dry film.
Fig. 4 is that circuit board of the present invention locally plates the structural schematic diagram after thick copper.
Fig. 5 is that circuit board of the present invention takes off the structural schematic diagram after a dry film.
Fig. 6 is that circuit board of the present invention pastes the structural schematic diagram after secondary dry film.
Fig. 7 is the structural schematic diagram after circuit board leads etching of the present invention.
Fig. 8 is that circuit board of the present invention takes off the structural schematic diagram after secondary dry film.
Specific embodiment：
With reference to the accompanying drawing and preferred embodiment the invention will be further described, as shown in Fig. 1~8, a kind of part is thick
The production method of copper PCB, includes the following steps：
A, preparation process：Circuit board 1 is etched, is formed with electroplate lead wire, the circuit wait do the thick copper in part
Plate 1；Circuit board 1 is two-sided or multilayer circuit board；
B, 2 step of dry film is pasted：The region 11 for not needing to plate thick copper on the circuit card 1 is labelled to few two layers one time dry film 2
And expose, develop, expose the region 11 that need to plate thick copper；Specially：
B1, the region 11 for not needing to plate thick copper on the circuit card 1 paste dry film 2 of first layer and expose, develop, and exposing needs
Plate the region 11 of thick copper；
The more one layer of dry film 2 of B2,2 appearance face paste of a dry film on the circuit card 1 simultaneously exposes, develops, and only exposing needs
Plate the region 11 of thick copper；
Repeat step B2 more times to required thickness, repeating step B2 can be improved the plating copper thickness of the thick copper in part
The upper limit.The number of plies for pasting a dry film 2 is determined by Local Copper thickness, such as the other region thickness 2oz of product demand Local Copper thickness rate, then can be used
2 layers are pasted with a thickness of a dry film 2 of 2mil, then the thickness of dry film being superimposed theoretically has reached 3oz, so that it may realize the thick copper in part
2oz。
C, thick copper step is plated in part：Circuit board 1 is carried out to plate thick Copper treatment, circuit board 1 is made to need to plate the plating in thick copper region
Layers of copper, which is thickeied to required thickness, forms part plating thick copper layer 3；It is thick that the thickness of dry film 2 of multilayer superposition is greater than or equal to part plating
The thickness of layers of copper 3；
D, 2 step of dry film is taken off：By the institute on circuit board 1, once dry film 2 fades away；
E, secondary 4 step of dry film is pasted：One layer of secondary dry film is pasted in the region in addition to electroplate lead wire region 12 on the circuit card 1
It 4 and exposes, develop, expose electroplate lead wire region 12；
F, lead etching step：The 1 overetch line of circuit board for exposing electroplate lead wire region 12 is etched, it will be electric
Plating lead etches away；
G, secondary 4 step of dry film is taken off：Secondary dry film 4 on circuit board 1 is faded away.
Requirement of the present invention according to product to Local Copper thickness carries out twice or above pad pasting, exposure and imaging to product,
The thickness for being superimposed a dry film 2 of thick copper area peripheral edge is equal to or higher than the thickness of the thick copper in part, is then electroplated again, energy
Effectively avoid folder film phenomenon, can according to pad pasting number number, Local Copper thickness can be accomplished to 2oz-3oz, it is even thicker, can be effective
Solve the problems, such as that Local Copper thickness is difficult to produce greatly with other area differentiations；And manufacture craft is simple, it is not necessary that especially control can
It realizes that thick copper is plated in part well, can be used for the production of bulk article, basically will not produce and scrap, so that product yield is high,
Improve product quality.In addition each pad pasting can guarantee to carry out in the plane, and pad pasting is secured, improve yields, improve product product
Matter.
Certainly, the above is only presently preferred embodiments of the present invention, therefore all according to structure described in present patent application range
It makes, the equivalent change or modification that feature and principle are done, is included in the scope of the patent application of the present invention.
Claims (3)
1. a kind of production method of the thick copper PCB in part, which is characterized in that include the following steps：
A, preparation process：Circuit board is etched, is formed with electroplate lead wire, the circuit board wait do the thick copper in part；
B, a dry film step is pasted：The region for not needing to plate thick copper on circuit boards is labelled to few two layers one time dry film and exposes, shows
Shadow exposes the region that need to plate thick copper；
Wherein, step B is specially：
B1, it does not need to plate region patch dry film of first layer of thick copper on circuit boards and exposes, develops, exposing need to plate thick copper
Region；
The more one layer of dry film of B2, a dry film appearance face paste on circuit boards simultaneously exposes, develops, and thick copper need to be plated by only exposing
Region；
B3, repeat more times of step B2 to required thickness；
C, thick copper step is plated in part：Circuit board is carried out to plate thick Copper treatment, the copper plate for making circuit board need to plate thick copper region adds
It is thick to form part plating thick copper layer to required thickness；
D, a dry film step is taken off：By the institute on circuit board, once dry film fades away；
E, secondary dry film step is pasted：On circuit boards region in addition to electroplate lead wire region paste one layer of secondary dry film and expose,
Electroplate lead wire region is exposed in development；
F, lead etching step：The circuit board overetch line for exposing electroplate lead wire region is etched, by electroplate lead wire
It etches away；
G, secondary dry film step is taken off：Secondary dry film on circuit board is faded away.
2. the production method of the thick copper PCB in part according to claim 1 a kind of, it is characterised in that：Multilayer in the step C
The thickness of dry film superposition is greater than or equal to the thickness of part plating thick copper layer.
3. the production method of the thick copper PCB in part according to claim 1 a kind of, it is characterised in that：The circuit board is double
Face or multilayer circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510811568.6A CN105430929B (en) | 2015-11-19 | 2015-11-19 | A kind of production method of the thick copper PCB in part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510811568.6A CN105430929B (en) | 2015-11-19 | 2015-11-19 | A kind of production method of the thick copper PCB in part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105430929A CN105430929A (en) | 2016-03-23 |
| CN105430929B true CN105430929B (en) | 2018-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510811568.6A Active CN105430929B (en) | 2015-11-19 | 2015-11-19 | A kind of production method of the thick copper PCB in part |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105744735A (en) * | 2016-04-26 | 2016-07-06 | 广东欧珀移动通信有限公司 | Electronic equipment, printed circuit board and preparation method of printed circuit board |
| CN106304668B (en) * | 2016-10-31 | 2019-03-05 | 广州市安旭特电子有限公司 | A kind of production method using enhanced semi-additive process production printed wiring board |
| CN107148153A (en) * | 2017-06-29 | 2017-09-08 | 珠海杰赛科技有限公司 | The preparation method and device of a kind of printed circuit board |
| CN110996540B (en) * | 2019-12-31 | 2022-02-08 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN112654178B (en) * | 2020-11-09 | 2022-04-29 | 广东科翔电子科技股份有限公司 | Process method of embedded pad type rigid-flex printed circuit board |
| CN113141726B (en) * | 2021-03-17 | 2022-06-17 | 东莞联桥电子有限公司 | Manufacturing method of circuit board with locally thickened plating layer |
| CN113316318A (en) * | 2021-06-08 | 2021-08-27 | 珠海中京元盛电子科技有限公司 | Electroplating type stepped welding disc PCB and manufacturing technology |
| CN113473738B (en) * | 2021-07-02 | 2022-12-20 | 深圳市新宇腾跃电子有限公司 | Local copper plating method for FPC (flexible printed circuit) with power line |
| CN114916144B (en) * | 2022-05-31 | 2024-02-20 | 景旺电子科技(龙川)有限公司 | Flexible circuit board with heat dissipation area and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1675968A (en) * | 2002-08-22 | 2005-09-28 | 捷时雅株式会社 | Method for forming bump on electrode pad with use of double-layered film |
| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| CN102523689A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Method for manufacturing circuit board with high copper thickness |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58191490A (en) * | 1982-05-04 | 1983-11-08 | 日本電信電話株式会社 | Method of forming resist pattern |
-
2015
- 2015-11-19 CN CN201510811568.6A patent/CN105430929B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1675968A (en) * | 2002-08-22 | 2005-09-28 | 捷时雅株式会社 | Method for forming bump on electrode pad with use of double-layered film |
| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| CN102523689A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Method for manufacturing circuit board with high copper thickness |
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| Publication number | Publication date |
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| CN105430929A (en) | 2016-03-23 |
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