CN105430927A - Printed circuit board electroless palladium plating method and device - Google Patents
Printed circuit board electroless palladium plating method and device Download PDFInfo
- Publication number
- CN105430927A CN105430927A CN201511017869.8A CN201511017869A CN105430927A CN 105430927 A CN105430927 A CN 105430927A CN 201511017869 A CN201511017869 A CN 201511017869A CN 105430927 A CN105430927 A CN 105430927A
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- Prior art keywords
- circuit board
- magazine
- plating
- cutter
- choking
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Abstract
The invention discloses a printed circuit board electroless palladium plating method and a device, which belongs to the field of electroplating technology. The device comprises a film covering mechanism for covering the lower surface of the circuit board with a breathable cloth; the downstream of the film covering mechanism is provided with a conveying belt for conveying a steel formwork; the tail end of the conveying belt is provided with a film rolling mechanism for stripping the breathable cloth on the steel formwork; a working table is arranged between the film covering mechanism and the film rolling mechanism; a feed box is arranged on the working table; the feed box is internally provided with a baffle; the baffle divides the feed box into a paste storage cavity and an impurity storage cavity; the baffle is provided with a scraper arranged vertically; a choking knife is arranged on the feed box inside the impurity storage cavity; one side, close to the choking knife, of the feed box is provided with an applying device for applying vaseline to the surface of the circuit board; and the downstream of the film rolling mechanism is provided with a turning manipulator, and the downstream of the turning manipulator is provided with an electroless plating device. The method and the device of the invention solve the technical problem of how to uniformly and quickly press solder paste in a die hole of the circuit board and then automatically executing electroless plating, and can be widely applied to an electronic industry.
Description
Technical field
The present invention relates to electroplating technology field, particularly relate to a kind of method and apparatus of printed circuit board chemical palladium-plating.
Background technology
In MEMS (MicroElectro-MechanicalSystem, MEMS (micro electro mechanical system)) encapsulation field, the application of printed circuit board account for very large proportion, and its maximum hidden danger-" black pad " problem has perplexed industry for a long time.For thoroughly solving this problem; be developed novel ENEPIG printed circuit board; the improvement that this substrate surface protection technique is the most outstanding adds chemical plating Pd layer between Electroless Plating Ni layer and leaching Au layer; it blocks the contact of nickel coating and gold leaching solution in chemical plating Au process; avoid the golden processing procedure of leaching to the oxidation of nickel dam, thus solve puzzlement industry " black pad " problem for many years.Concerning this new technology of ENEPIG printed circuit board surface protection; chemical plating Pd is the technique of most critical; the selection of its technological parameter can make a significant impact the quality of this new type of substrate and production efficiency; and affecting the many factors of ENEPIG printed circuit board chemical plating Pd, each factor has impact again each other.
The manufacture craft of current printed circuit board is: be first pressed into by tin cream in the nib of the upper surface of circuit board, and then reverse circuit plate, implement chemical plating process at circuit board lower surface, as shown in Figure 1, the upper surface press-in of circuit board a has tin cream b to the structure chart of the circuit board after chemical plating, the lower surface of circuit board a is coated with coat of metal c, although processing step is few, traditional handicraft printed circuit board, needs a large amount of manual operations, efficiency is low, and manufacturing cost is high.
Therefore, how to be pressed into evenly and rapidly in the nib of circuit board by tin cream, then automatically to implement chemical plating, to improve the make efficiency of printed circuit board, reduce its manufacturing cost, be a great problem of puzzlement those skilled in the art always.
Therefore, for the method and apparatus of a kind of new chemical nickel porpezite coating of exploitation, change traditional version, not only there is urgent researching value, also have good economic benefit and commercial Application potentiality, this is the power place that is accomplished of the present invention and basis just.
Summary of the invention
In order to overcome the defect of above-mentioned pointed prior art, the present inventor, to this has been further investigation, after having paid a large amount of creative work, thus completes the present invention.
Specifically, technical problem to be solved by this invention is: the method and apparatus providing a kind of printed circuit board chemical palladium-plating, how to be pressed into evenly and rapidly in the nib of circuit board by tin cream, then automatically to implement the technical problem of chemical plating to solve.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of method providing printed circuit board chemical palladium-plating, and the method for described printed circuit board chemical palladium-plating comprises the following steps: the lower surface of circuit board is covered with breathable cloth by (1), (2) circuit board is positioned on workbench, described workbench is provided with a breach suitable with circuit board shape, described workbench is provided with a magazine, the bottom of described magazine is uncovered, a dividing plate is provided with in described magazine, described magazine is divided into storage cream chamber and the assorted chamber of storage by described dividing plate, described dividing plate is provided with the vertical scraper arranged, described scraper is arranged towards one end bending of described workbench, the overbending direction of described scraper deviates from described storage cream chamber, described magazine is positioned at described storage chamber of mixing and is provided with cutter of choking, the described one end bending setting of cutter towards described workbench of choking, the overbending direction of described cutter of choking is towards described storage cream chamber, tin cream is added in described storage cream chamber, described magazine is moved to the other end from one end of circuit board, tin cream is pressed in the nib of circuit board by described scraper, air in nib is discharged from breathable cloth, tin cream is full of nib, tin cream unnecessary for circuit board upper surface is collected in described storage and mixes in chamber by described cutter of choking, (3) vaseline is smeared at the upper surface of circuit board, (4) breathable cloth of circuit board lower surface is peeled off, (5) reverse circuit plate, and circuit board is moved to be equipped with in the electroplating bath of chemical plating fluid, plated surface chemical deposit on circuit boards.
For solving the problems of the technologies described above, technical scheme of the present invention is: the equipment providing a kind of printed circuit board chemical palladium-plating, the equipment of described printed circuit board chemical palladium-plating comprises the film-covering mechanism lower surface of circuit board being covered with breathable cloth, the downstream of described film-covering mechanism is provided with the conveyer belt of transporting circuit board, the tail end of described conveyer belt is provided with the Juan Mo mechanism of being peeled off by the described breathable cloth on circuit board, a workbench is provided with between described film-covering mechanism and Juan Mo mechanism, described conveyer belt is through described workbench, described workbench is provided with a breach suitable with circuit board shape, described workbench is provided with a magazine, the bottom of described magazine is uncovered, a dividing plate is provided with in described magazine, described magazine is divided into storage cream chamber and the assorted chamber of storage by described dividing plate, described dividing plate is provided with the vertical scraper arranged, described scraper is arranged towards one end bending of described workbench, the overbending direction of described scraper deviates from described storage cream chamber, described magazine is positioned at described storage chamber of mixing and is provided with cutter of choking, the described one end bending setting of cutter towards described workbench of choking, the overbending direction of described cutter of choking is towards described storage cream chamber, described magazine near described in the choke side of cutter be provided with application device for smearing vaseline at circuit board surface, the downstream of described Juan Mo mechanism is provided with turning manipulator, and the downstream of described turning manipulator is provided with electroless plating device.
In the equipment of described printed circuit board chemical palladium-plating of the present invention, as the preferred technical scheme of one, in described storage cream chamber, be provided with electrothermal tube.
In the equipment of described printed circuit board chemical palladium-plating of the present invention, as the preferred technical scheme of one, described dividing plate is provided with the first chute, described scraper is vertically slidably mounted in described first chute, described dividing plate is installed with the first back-up block, described first back-up block is threaded the first adjustment screw, is provided with the first Compress Spring between the end of described first adjustment screw and described scraper; Described magazine is provided with the second chute, described cutter of choking vertically is slidably mounted in described second chute, described magazine is installed with the second back-up block, described second back-up block is threaded the second adjustment screw, and end and described the choking between cutter of described second adjustment screw are provided with the second Compress Spring.
In the equipment of described printed circuit board chemical palladium-plating of the present invention, as the preferred technical scheme of one, described magazine is provided with the first cleaning blade, described first cleaning blade and described cutter of choking are oppositely arranged.
In the equipment of described printed circuit board chemical palladium-plating of the present invention, as the preferred technical scheme of one, the periphery of described workbench is provided with protruding flange.
In the equipment of described printed circuit board chemical palladium-plating of the present invention, as the preferred technical scheme of one, described film-covering mechanism comprises cloth supply roller and the first guiding roller, and described first guiding roller is corresponding with the lower surface of circuit board, and described cloth supply roller is positioned at the below of described first guiding roller; Described Juan Mo mechanism comprises cloth-gathering roller and the second guiding roller, and described second guiding roller is corresponding with the lower surface of circuit board, and described cloth-gathering roller is positioned at the below of described second guiding roller.
In the equipment of described printed circuit board chemical palladium-plating of the present invention, as the preferred technical scheme of one, described application device comprises smears box, described box of smearing is built with vaseline, described smear box near described in choke cutter side box body on the second cleaning blade is installed, the described box body smearing box opposite side is provided with painting brush, and described painting brush bending is arranged, and the overbending direction of described painting brush end is consistent with the overbending direction of described scraper.
In the equipment of described printed circuit board chemical palladium-plating of the present invention, as the preferred technical scheme of one, described turning manipulator comprises back shaft, described back shaft is rotatablely equipped with the swing arm of reciprocally swinging, described swing arm is rotatablely equipped with the crawl bar driven by air motor, the end of described crawl bar is provided with negative pressure sucker.
In the equipment of described printed circuit board chemical palladium-plating of the present invention, as the preferred technical scheme of one, described electroless plating device comprises electroplating bath, described electroplating bath is built with chemical plating fluid, a carrier driven by power set is rotatablely equipped with in described electroplating bath, described carrier is obliquely installed and described chemical plating fluid is stretched in one end of described carrier, and the other end exceeds described chemical plating fluid, on described carrier annular array have some shelve circuit board shelve groove.
After have employed technique scheme, the invention has the beneficial effects as follows:
(1) because the lower surface of circuit board is provided with breathable cloth, only ventilative and do not make tin cream spill, the air in nib is discharged from breathable cloth, make tin cream can Fast Filling in nib, thus improve the preparation efficiency of circuit board; Again owing to having smeared vaseline at the upper surface of circuit board, when avoiding plating, upper surface is polluted by chemical plating fluid, it also avoid upper surface and is plated, thus possessed the condition of automatic enforcement chemical plating, and then improve the production efficiency of circuit board.
(2) because magazine is provided with scraper and cutter of choking, according to the magazine direction of motion on the table, the movement of scraper is that the movement of cutter of choking is stubble of choking along stubble, and such scraper can be implemented to scrape action to tin cream, to ensure that tin cream is fully pressed in the nib of circuit board, cutter of choking then has been choked omission at the unnecessary tin cream of circuit board surface, be stored in assorted chamber, both improve the press-in efficiency of tin cream, turn avoid the waste of tin cream material, save consumptive material.
(3) because scraper is vertically slidably installed on dividing plate, scraper arranges the first sleeve, first Compress Spring is arranged in the first sleeve, to stablize the first Compress Spring, when preventing from regulating pressure, the first Compress Spring rocks and causes pressure instability, can adjust separately the pressure of scraper to circuit board upper surface like this by the first adjustment screw, and scraper can be made to lean upper surface at circuit board all the time, rise and fall along with the fluctuating of circuit board, ensure that tin cream is pressed into nib fast.
(4) because cutter of choking vertically is slidably mounted on magazine, second sleeve is set choking on cutter, second Compress Spring is arranged in the second sleeve, to stablize the second Compress Spring, when preventing from regulating pressure, the second Compress Spring rocks and causes pressure instability, can adjust separately the pressure of cutter to circuit board upper surface of choking like this by the second adjustment screw, and the cutter that can make to choke leans the upper surface at circuit board all the time, rise and fall along with the fluctuating of circuit board, ensure that the collection that unnecessary tin cream is residual.
(5) owing to being provided with cloth supply roller and cloth-gathering roller, the yardage roll of breathable cloth is launched by cloth supply roller, overlay on the lower surface of circuit board, batched by cloth-gathering roller and pack up, the lower surface of breathable cloth by circuit board is peeled off, and then improve the efficiency of construction of breathable cloth, thus further increase paste solder printing efficiency.
(6) owing to being rotatablely equipped with a carrier driven by power set in electroplating bath, carrier is obliquely installed, circuit board is shelved on carrier, constantly rotated by carrier, constantly in electroplating bath, implement chemical plating, achieve continuous seepage, and then improve the production efficiency of circuit board.
Accompanying drawing explanation
Fig. 1 is the structural representation of circuit board after printing;
Fig. 2 is the structural representation of the embodiment of the present invention two;
Fig. 3 is magazine and the structural representation smearing box in the embodiment of the present invention two;
Fig. 4 is the structural representation of film-covering mechanism and Juan Mo mechanism in the embodiment of the present invention two;
Fig. 5 is the structural representation of turning manipulator in the embodiment of the present invention two;
Fig. 6 is the structural representation of electroless plating device in the embodiment of the present invention two;
Wherein, in Fig. 1 to Fig. 6, each number designation refers to following concrete meaning, element and/or parts respectively.
In figure: a, circuit board, b, tin cream, c, coating, 1, film-covering mechanism, 101, cloth supply roller, 102, first guiding roller, 2, conveyer belt, 3, magazine, 301, dividing plate, 302, storage cream chamber, 303, the assorted chamber of storage, 4, circuit board, 401, nib, 5, workbench, 6, Juan Mo mechanism, 601, cloth-gathering roller, 602, second guiding roller, 7, turning manipulator, 701, back shaft, 702, swing arm, 703, air motor, 704, capture bar, 705, negative pressure sucker, 8, electroless plating device, 801, electroplating bath, 802, carrier, 803, shelve groove, 804, return flow line, 9, scraper, 10, to choke cutter, 11, first cleaning blade, 12, electrothermal tube, 13, first adjustment screw, 14, first back-up block, 15, first sleeve, 16, first Compress Spring, 17, second adjustment screw, 18, second back-up block, 19, second sleeve, 20, second Compress Spring, 21, rotating shaft, 22, support arm, 23, smear box, 24, painting brush, 25, second cleaning blade, 26, 3rd adjustment screw, 27, 3rd back-up block, 28, 3rd sleeve, 29, 3rd Compress Spring, 30, pressing plate, 31, force application spring, 32, breathable cloth.
Embodiment
Below in conjunction with drawings and Examples, the present invention is further described.But the purposes of these exemplary execution modes and object are only used for exemplifying the present invention, not any type of any restriction is formed to real protection scope of the present invention, more non-protection scope of the present invention is confined to this.
Embodiment one:
The invention provides a kind of method of printed circuit board chemical palladium-plating, comprise the following steps: the lower surface of circuit board is covered with breathable cloth by (1), before covering breathable cloth, need the lower surface of first cleaning circuit plate, then vaseline is smeared at the periphery of circuit board, and breathable cloth is flattened, to increase the combination of breathable cloth and circuit board, the breadth of breathable cloth needs suitable with the surface area of circuit board, the specifications parameter of breathable cloth is in this no limit, as long as meet ventilative and do not make tin cream spill, those skilled in the art can select as required voluntarily, (2) circuit board is positioned on workbench, workbench is provided with a breach suitable with circuit board shape, when circuit board is delivered to gap position, the upper surface of circuit board and the lower surface of workbench are fitted, workbench is provided with a magazine, the bottom of magazine is uncovered, a dividing plate is provided with in magazine, magazine is divided into storage cream chamber and the assorted chamber of storage by dividing plate, dividing plate is provided with the vertical scraper arranged, scraper is arranged towards one end bending of workbench, the overbending direction of scraper deviates from storage cream chamber, magazine is positioned at the assorted chamber of storage and is provided with cutter of choking, choke cutter towards workbench one end bending arrange, choke cutter overbending direction towards storage cream chamber, tin cream is added in storage cream chamber, magazine is moved to the other end from one end of circuit board, tin cream is pressed in the nib of circuit board by scraper, air in nib is discharged from breathable cloth, tin cream is full of nib, tin cream unnecessary for circuit board upper surface is collected in the assorted chamber of storage by cutter of choking, according to the magazine direction of motion on the table, the movement of scraper is along stubble, the movement of cutter of choking is stubble of choking, such scraper can be implemented to scrape action to tin cream, to ensure that tin cream is fully pressed in the nib of circuit board, cutter of choking then has been choked omission at the unnecessary tin cream of circuit board surface, be stored in assorted chamber, (3) vaseline is smeared at the upper surface of circuit board, (4) breathable cloth of circuit board lower surface is peeled off, (5) reverse circuit plate, and circuit board is moved to be equipped with in the electroplating bath 801 of chemical plating fluid, plated surface chemical deposit on circuit boards.
Embodiment two:
As Fig. 2 and Fig. 3 jointly shown in, present invention also offers a kind of equipment of printed circuit board chemical palladium-plating, comprise the film-covering mechanism 1 lower surface of circuit board 4 being covered with breathable cloth 32, before covering breathable cloth 32, need the lower surface of first cleaning circuit plate 4, then vaseline is smeared at the periphery of circuit board 4, the breadth of breathable cloth 32 needs suitable with the surface area of circuit board 4, the specifications parameter of breathable cloth 32 is in this no limit, as long as meet ventilative and do not make tin cream spill, those skilled in the art can select as required voluntarily, the downstream of film-covering mechanism 1 is provided with the conveyer belt 2 of transporting circuit board 4, the tail end of conveyer belt 2 is provided with the Juan Mo mechanism 6 of being peeled off by the breathable cloth 32 on circuit board 4, a workbench 5 is provided with between film-covering mechanism 1 and Juan Mo mechanism 6, conveyer belt 2 is through workbench 5, workbench 5 is provided with a breach suitable with circuit board 4 shape, when circuit board 4 is delivered to gap position, the upper surface of circuit board 4 and the lower surface of workbench 5 are fitted, workbench 5 is provided with a magazine 3, the bottom of magazine 3 is uncovered, a dividing plate 301 is provided with in magazine 3, magazine 3 is divided into storage cream chamber 302 and the assorted chamber 303 of storage by dividing plate 301, storage is loaded with tin cream in cream chamber 302, dividing plate 301 is provided with the vertical scraper 9 arranged, scraper 9 is arranged towards one end bending of workbench 5, the overbending direction of scraper 9 deviates from storage cream chamber 302, magazine 3 is positioned at the assorted chamber 303 of storage and is provided with cutter 10 of choking, choke cutter 10 towards workbench 5 one end bending arrange, choke cutter 10 overbending direction towards storage cream chamber 302, according to the direction of motion of magazine 3 on workbench 5, the movement of scraper 9 is along stubble, the movement of cutter 10 of choking is stubble of choking, such scraper 9 can be implemented to scrape action to tin cream, to ensure that tin cream is fully pressed in the nib 401 of circuit board 4, cutter 10 of choking then has been choked omission at the unnecessary tin cream on circuit board 4 surface, be stored in assorted chamber 303, magazine 3 is provided with for the application device at circuit board 4 surface smear vaseline near the side of cutter 10 of choking, the downstream of Juan Mo mechanism 6 is provided with turning manipulator 7, and the downstream of turning manipulator 7 is provided with electroless plating device 8.
In order to ensure magazine 3 storage cream chamber 302 in the mobility of tin cream, storage is provided with electrothermal tube 12 in cream chamber 302, electrothermal tube 12 is adjusted to suitable temperature, both can so that scraper 9 be pressed into nib 401, tin cream is not made again to stick in the surface of scraper 9, at this, scraper 9 uses macromolecular material to make usually, such as polytetrafluoroethylene or nylon etc.
Dividing plate 301 is provided with the first chute, scraper 9 is vertically slidably mounted in the first chute, dividing plate 301 is installed with the first back-up block 14, first back-up block 14 is threaded the first adjustment screw 13, the first Compress Spring 16 is provided with between the end of the first adjustment screw 13 and scraper 9, scraper 9 arranges the first sleeve 15, first Compress Spring 16 is arranged in the first sleeve 15, to stablize the first Compress Spring 16, when preventing from regulating pressure, the first Compress Spring 16 rocks and causes pressure instability, the pressure of scraper 9 pairs of circuit board 4 upper surfaces can be adjusted separately like this by the first adjustment screw 13, and scraper 9 can be made to lean upper surface at circuit board 4 all the time, rise and fall along with the fluctuating of circuit board 4, ensure that tin cream is pressed into nib 401 fast.
Magazine 3 is provided with the second chute, cutter 10 of choking vertically is slidably mounted in the second chute, magazine 3 is installed with the second back-up block 18, second back-up block 18 is threaded the second adjustment screw 17, the end of the second adjustment screw 17 and choke between cutter 10 and be provided with the second Compress Spring 20, second sleeve 19 is set choking on cutter 10, second Compress Spring 20 is arranged in the second sleeve 19, to stablize the second Compress Spring 20, when preventing from regulating pressure, the second Compress Spring 20 rocks and causes pressure instability, the pressure of cutter 10 pairs of circuit board 4 upper surfaces of choking can be adjusted separately like this by the second adjustment screw 17, and the cutter 10 that can make to choke leans the upper surface at circuit board 4 all the time, rise and fall along with the fluctuating of circuit board 4, ensure that the collection that unnecessary tin cream is residual.
Magazine 3 is provided with the first cleaning blade 11, first cleaning blade 11 is oppositely arranged with cutter 10 of choking, and is arranged on another side of magazine 3, when magazine 3 moves, first workbench 5 surface and circuit board 4 upper surface swipe one time by the first cleaning blade 11, infiltrate in tin cream to have avoided foreign material.
The periphery of workbench 5 is provided with protruding flange, avoids the tin cream omitted on workbench 5 to flow out, is convenient to the collection of residual tin cream.
Application device comprises smears box 23, smear box 23 built with vaseline, smearing box 23 on the box body of cutter side of choking is provided with the second cleaning blade 25, the box body smearing box 23 opposite side is provided with painting brush 24, painting brush 24 bends and arranges, and the overbending direction of painting brush 24 end is consistent with the overbending direction of scraper.Smear box 23 and be provided with the 3rd chute, painting brush 24 is vertically slidably mounted in the 3rd chute, smear on box 23 and be installed with the 3rd back-up block 27, 3rd back-up block 27 is threaded the 3rd adjustment screw 26, the 3rd Compress Spring 29 is provided with between the end of the 3rd adjustment screw 26 and painting brush 24, painting brush 24 arranges the 3rd sleeve 28, 3rd Compress Spring 29 is arranged in the 3rd sleeve 28, to stablize the 3rd Compress Spring 29, when preventing from regulating pressure, the 3rd Compress Spring 29 rocks and causes pressure instability, the pressure of painting brush 24 pairs of circuit board upper surfaces can be adjusted separately like this by the 3rd adjustment screw 26, and painting brush 24 can be made to keep fixed interval (FI) with the upper surface of circuit board all the time, rise and fall along with the fluctuating of circuit board, ensure that the thickness of vaseline coating is even.In order to ensure the upper surface of vaseline uniform application at circuit board, be slidably fitted with a pressing plate 30 smearing in box 23, be provided with force application spring 31 between pressing plate 30 and the top of smearing box 23, under the effect of force application spring 31, pressing plate 30 is pressed on the vaseline in box all the time, to vaseline one normal pressure.
As shown in Figure 4, film-covering mechanism 1 comprises cloth supply roller 101 and the first guiding roller 102, first guiding roller 102 is corresponding with the lower surface of circuit board 4, cloth supply roller 101 is positioned at the below of the first guiding roller 102, Juan Mo mechanism 6 comprises cloth-gathering roller 601 and the second guiding roller 602, second guiding roller 602 is corresponding with the lower surface of circuit board 4, cloth-gathering roller 601 is positioned at the below of the second guiding roller 602, cloth supply roller 101, first guiding roller 102 and the second guiding roller 602 are driven voller, power is not set, cloth-gathering roller 601 is then driven by buncher, the yardage roll of breathable cloth 32 is launched by cloth supply roller 101, overlay on the lower surface of circuit board 4, batched by cloth-gathering roller 601 and pack up, the lower surface of breathable cloth 32 by circuit board 4 is peeled off.
As shown in Figure 5, turning manipulator 7 comprises back shaft 701, back shaft 701 is rotatablely equipped with the swing arm 702 of reciprocally swinging, swing arm 702 is rotatablely equipped with the crawl bar 704 driven by air motor 703, the end capturing bar 704 is provided with negative pressure sucker 705, the edge of negative pressure sucker 705 absorbing circuit plate, by circuit board strip from conveyer belt 2, air motor 703 rotates simultaneously, is overturn by circuit board, is positioned on the electroless plating device 8 in downstream.
As shown in Figure 6, electroless plating device 8 comprises electroplating bath 801, electroplating bath 801 is built with chemical plating fluid, a carrier driven by power set 802 is rotatablely equipped with in electroplating bath 801, these power set use motor-operated gear-wheel gear-ring structure usually, and those skilled in the art also can select other structures, and carrier 802 is obliquely installed and chemical plating fluid is stretched in one end of carrier 802, the other end exceeds chemical plating fluid, on carrier 802 annular array have some shelve circuit board shelve groove 803; Adjacent two shelve between groove 803 and are equipped with return flow line 804, when carrier 802 support the circuit board plated turn to higher one end time, unnecessary chemical plating fluid can be back in electroplating bath 801, in order to improve the quality of chemical plating, supersonic generator is provided with (not shown in electroplating bath 801, supersonic generator is existing equipment, can commercially buy), noise is produced by supersonic generator, with this, sensitiveness that system changes noise is reduced to the selection of controllable factor horizontal combination, thus reduce the fluctuation of systematic function.
If coating has multilayer, then need to set gradually multiple electroless plating device, in this citing that differs.
Should be appreciated that the purposes of these embodiments is only not intended to for illustration of the present invention limit the scope of the invention.In addition; also should understand; after having read technology contents of the present invention, those skilled in the art can make various change, amendment and/or modification to the present invention, and these all equivalent form of values fall within the protection range that the application's appended claims limits equally.
Claims (10)
1. a method for printed circuit board chemical palladium-plating, is characterized in that, comprises the following steps: the lower surface of circuit board is covered with breathable cloth by (1), (2) circuit board is positioned on workbench, described workbench is provided with a breach suitable with circuit board shape, described workbench is provided with a magazine, the bottom of described magazine is uncovered, a dividing plate is provided with in described magazine, described magazine is divided into storage cream chamber and the assorted chamber of storage by described dividing plate, described dividing plate is provided with the vertical scraper arranged, described scraper is arranged towards one end bending of described workbench, the overbending direction of described scraper deviates from described storage cream chamber, described magazine is positioned at described storage chamber of mixing and is provided with cutter of choking, the described one end bending setting of cutter towards described workbench of choking, the overbending direction of described cutter of choking is towards described storage cream chamber, tin cream is added in described storage cream chamber, described magazine is moved to the other end from one end of circuit board, tin cream is pressed in the nib of circuit board by described scraper, air in nib is discharged from breathable cloth, tin cream is full of nib, tin cream unnecessary for circuit board upper surface is collected in described storage and mixes in chamber by described cutter of choking, (3) vaseline is smeared at the upper surface of circuit board, (4) breathable cloth of circuit board lower surface is peeled off, (5) reverse circuit plate, and circuit board is moved to be equipped with in the electroplating bath of chemical plating fluid, plated surface chemical deposit on circuit boards.
2. the equipment of a printed circuit board chemical palladium-plating, it is characterized in that: comprise the film-covering mechanism lower surface of circuit board being covered with breathable cloth, the downstream of described film-covering mechanism is provided with the conveyer belt of transporting circuit board, the tail end of described conveyer belt is provided with the Juan Mo mechanism of being peeled off by the described breathable cloth on circuit board, a workbench is provided with between described film-covering mechanism and Juan Mo mechanism, described conveyer belt is through described workbench, described workbench is provided with a breach suitable with circuit board shape, described workbench is provided with a magazine, the bottom of described magazine is uncovered, a dividing plate is provided with in described magazine, described magazine is divided into storage cream chamber and the assorted chamber of storage by described dividing plate, described dividing plate is provided with the vertical scraper arranged, described scraper is arranged towards one end bending of described workbench, the overbending direction of described scraper deviates from described storage cream chamber, described magazine is positioned at described storage chamber of mixing and is provided with cutter of choking, the described one end bending setting of cutter towards described workbench of choking, the overbending direction of described cutter of choking is towards described storage cream chamber, described magazine near described in the choke side of cutter be provided with application device for smearing vaseline at circuit board surface, the downstream of described Juan Mo mechanism is provided with turning manipulator, and the downstream of described turning manipulator is provided with electroless plating device.
3. the equipment of printed circuit board chemical palladium-plating as claimed in claim 2, is characterized in that: be provided with electrothermal tube in described storage cream chamber.
4. the equipment of printed circuit board chemical palladium-plating as claimed in claim 2, it is characterized in that: described dividing plate is provided with the first chute, described scraper is vertically slidably mounted in described first chute, described dividing plate is installed with the first back-up block, described first back-up block is threaded the first adjustment screw, is provided with the first Compress Spring between the end of described first adjustment screw and described scraper; Described magazine is provided with the second chute, described cutter of choking vertically is slidably mounted in described second chute, described magazine is installed with the second back-up block, described second back-up block is threaded the second adjustment screw, and end and described the choking between cutter of described second adjustment screw are provided with the second Compress Spring.
5. the equipment of printed circuit board chemical palladium-plating as claimed in claim 2, is characterized in that: described magazine is provided with the first cleaning blade, and described first cleaning blade and described cutter of choking are oppositely arranged.
6. the equipment of printed circuit board chemical palladium-plating as claimed in claim 2, is characterized in that: the periphery of described workbench is provided with protruding flange.
7. the equipment of the printed circuit board chemical palladium-plating as described in any one of claim 2 to 6 claim, it is characterized in that: described film-covering mechanism comprises cloth supply roller and the first guiding roller, described first guiding roller is corresponding with the lower surface of circuit board, and described cloth supply roller is positioned at the below of described first guiding roller; Described Juan Mo mechanism comprises cloth-gathering roller and the second guiding roller, and described second guiding roller is corresponding with the lower surface of circuit board, and described cloth-gathering roller is positioned at the below of described second guiding roller.
8. the equipment of the printed circuit board chemical palladium-plating as described in any one of claim 2 to 6 claim, it is characterized in that: described application device comprises smears box, described box of smearing is built with vaseline, described smear box near described in choke cutter side box body on the second cleaning blade is installed, the described box body smearing box opposite side is provided with painting brush, described painting brush bending is arranged, and the overbending direction of described painting brush end is consistent with the overbending direction of described scraper.
9. the equipment of the printed circuit board chemical palladium-plating as described in any one of claim 2 to 6 claim, it is characterized in that: described turning manipulator comprises back shaft, described back shaft is rotatablely equipped with the swing arm of reciprocally swinging, described swing arm is rotatablely equipped with the crawl bar driven by air motor, the end of described crawl bar is provided with negative pressure sucker.
10. the equipment of the printed circuit board chemical palladium-plating as described in any one of claim 2 to 6 claim, it is characterized in that: described electroless plating device comprises electroplating bath, described electroplating bath is built with chemical plating fluid, a carrier driven by power set is rotatablely equipped with in described electroplating bath, described carrier is obliquely installed and described chemical plating fluid is stretched in one end of described carrier, the other end exceeds described chemical plating fluid, on described carrier annular array have some shelve circuit board shelve groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511017869.8A CN105430927B (en) | 2015-12-29 | 2015-12-29 | A kind of method and apparatus of printed circuit board chemical palladium-plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511017869.8A CN105430927B (en) | 2015-12-29 | 2015-12-29 | A kind of method and apparatus of printed circuit board chemical palladium-plating |
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| Publication Number | Publication Date |
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| CN105430927A true CN105430927A (en) | 2016-03-23 |
| CN105430927B CN105430927B (en) | 2017-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201511017869.8A Expired - Fee Related CN105430927B (en) | 2015-12-29 | 2015-12-29 | A kind of method and apparatus of printed circuit board chemical palladium-plating |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110841859A (en) * | 2019-11-27 | 2020-02-28 | 佛山市豹王滤芯制造有限公司 | Oil coating and film covering integrated machine for filter |
| CN113260162A (en) * | 2021-04-29 | 2021-08-13 | 邹文华 | Combined printed circuit board conductive paste isolation film stripping device |
| CN115426792A (en) * | 2022-11-03 | 2022-12-02 | 四川宏安兴盛电子科技有限公司 | Circuit board conveying device |
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| CN1744801A (en) * | 2004-09-01 | 2006-03-08 | 日本梅克特隆株式会社 | Electrolytic copper free electroplating method of multi-layer flexible printing substrate |
| US20070104929A1 (en) * | 2005-10-25 | 2007-05-10 | Samsung Electro-Mechanics Co., Ltd. | Method for plating printed circuit board and printed circuit board manufactured therefrom |
| CN103068165A (en) * | 2012-12-20 | 2013-04-24 | 东莞生益电子有限公司 | Printed circuit board (PCB) outer edge plating layer manufacturing technology |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1744801A (en) * | 2004-09-01 | 2006-03-08 | 日本梅克特隆株式会社 | Electrolytic copper free electroplating method of multi-layer flexible printing substrate |
| US20070104929A1 (en) * | 2005-10-25 | 2007-05-10 | Samsung Electro-Mechanics Co., Ltd. | Method for plating printed circuit board and printed circuit board manufactured therefrom |
| CN103068165A (en) * | 2012-12-20 | 2013-04-24 | 东莞生益电子有限公司 | Printed circuit board (PCB) outer edge plating layer manufacturing technology |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110841859A (en) * | 2019-11-27 | 2020-02-28 | 佛山市豹王滤芯制造有限公司 | Oil coating and film covering integrated machine for filter |
| CN113260162A (en) * | 2021-04-29 | 2021-08-13 | 邹文华 | Combined printed circuit board conductive paste isolation film stripping device |
| CN113260162B (en) * | 2021-04-29 | 2023-11-03 | 邹文华 | Combined printed circuit board conductive paste isolation film stripping device |
| CN115426792A (en) * | 2022-11-03 | 2022-12-02 | 四川宏安兴盛电子科技有限公司 | Circuit board conveying device |
| CN115426792B (en) * | 2022-11-03 | 2023-02-21 | 四川宏安兴盛电子科技有限公司 | Circuit board conveying device |
Also Published As
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|---|---|
| CN105430927B (en) | 2017-12-26 |
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