CN105430911A - Manufacturing method for 8-shaped hole of printed circuit board - Google Patents
Manufacturing method for 8-shaped hole of printed circuit board Download PDFInfo
- Publication number
- CN105430911A CN105430911A CN201510826025.1A CN201510826025A CN105430911A CN 105430911 A CN105430911 A CN 105430911A CN 201510826025 A CN201510826025 A CN 201510826025A CN 105430911 A CN105430911 A CN 105430911A
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- Prior art keywords
- hole
- center
- diameter
- circle
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
The present invention provides a manufacturing method for a 8-shaped hole of a printed circuit board. The method is characterized by adopting the following steps of: a, firstly, determining a circle center D1 of a fourth hole (2) of the 8-shaped hole and a circle center D2 of a fifth hole (3) of the 8-shaped hole on a circuit board (1) according to a design requirement; b, using the circle center D1 as the center, machining a first hole (4) with a diameter of d2 by means of a drill pin with the diameter of d2, using the circle center D2 as the center, and machining a second hole (6) with a diameter of d3 by means of a drill pin with the diameter of d3; c, machining an intersecting third hole (5) by using a circle center D3 as the center; and d, after completing the above a, b, c three steps, respectively drilling out the fourth hole (2) and the fifth hole (3) of the 8-shaped hole by means of drill bits with diameters of d and d1 by using the circle centers D1 and D2 as the center. The method overcomes the defect that burrs are remained in a conventional manufacturing method; and manual repair does not need to be carried out, so that the cost is reduced, and production efficiency and product quality are improved.
Description
Technical field
The invention belongs to the processing method of printed wiring board, particularly a kind of processing method of printed circuit board 8 word hole.
Background technology
The crossing hole (8 word hole) of printed circuit board in the course of processing owing to there being crossing position, by the restriction of boring processing or Milling Machining, certain burr can be formed, after this type of aperture crosses copper facing operation in the position of intersecting, burr can thicker change large, components and parts assembling is formed and hinders.General is all carry out manual repairing to spur location before copper facing operation or after copper facing operation.Its flow process has following two kinds: one, select suitable drill point according to the size intersecting hole in wiring board, the crossing hole adopting the mode of once holing to get out in the position in crossing hole the to meet size → wiring board with crossing hole is carried out manual repairing, removes the burr that the intersects hole site → wiring board with crossing hole repaired is proceeded to lower copper facing or line pattern making.Two, suitable drill point is selected according to the size intersecting hole in wiring board, copper facing → the wiring board with crossing hole complete for copper facing is carried out manual repairing is carried out in the crossing hole adopting the mode of once holing to get out in the position in crossing hole to meet size → by the wiring board with crossing hole, removes the burr that the intersects hole site → wiring board repaired is carried out line pattern making.
There is following defect in above-mentioned this way:
1, intersecting the burr of hole site, to carry out craft repairing cost of labor higher, and inefficiency, the production cycle is long;
If 2 manually place under repair before copper facing, because burr is more elongated, not easily find under visual, easily cause and Lou repair;
If 3 the laggard row manual repair of copper facing operation, burr is comparatively thick comparatively hard, repairs difficulty, and easily causes copper facing damage in hole, repairs weak effect, scraps and have a big risk;
4, the burr root after copper facing is difficult to remove, and the size in hole (8 word hole) is intersected in impact, causes assembling difficulty, affects product quality.
Summary of the invention
The object of the invention is to overcome above-mentioned technical deficiency, provide a kind of employing repeatedly to hole, the 8 word hole impulse-free robustness that Drilling operation is completed, without the processing method in the printed circuit board 8 word hole of manual repair.
The method that technical solution problem of the present invention adopts is: a kind of processing method of printed circuit board 8 word hole, is characterized in that taking following steps:
A. first on wiring board 1, the center of circle D1 in 8 holes, word the hole four and center of circle D2 in hole five is determined according to designing requirement;
B. centered by the D1 of the center of circle, process with the drill point that diameter is d2 the hole one that a diameter is d2, centered by the D2 of the center of circle, process with the drill point that diameter is d3 the hole two that a diameter is d3; D2=d-0.05mm, in formula, d is the diameter of Kong Si; D3=d1-0.05mm, in formula, d1 is the diameter in hole five;
C. intersect interval in hole one and hole two and determine crossing hole three center of circle D3, centered by the D3 of the center of circle, a crossing hole three is processed with the drill point that diameter is d3, the diameter intersecting hole three is d4, d4=L+0.1 ~ 0.15mm, in formula, L is the width of Kong Si and hole five cross-shaped portion the widest part, intersects the center of circle D3 in hole five in the center of L width;
D., after step completes at above-mentioned a, b, c tri-, 8 hole, word hole four and holes five are being got out with bit diameter d and d1 respectively with the center of circle D1, D2.
The invention has the beneficial effects as follows: this invention solves Conventional processing methods and remains veining defect; Without manual repair, reduce cost, improve production efficiency and product quality.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, illustrate with embodiment.
Fig. 1 is the front view of the processing method in printed circuit board 8 word hole.
In figure: 1-wiring board; 2-hole four; 3-hole five; 4-hole one; 5-intersects hole three; 6-hole two.
Embodiment
Embodiment, with reference to accompanying drawing, a kind of processing method of printed circuit board 8 word hole, is characterized in that taking following steps:
A. first on wiring board 1, the center of circle D1 in 8 holes, word the hole four and center of circle D2 in hole 53 is determined according to designing requirement;
B. centered by the D1 of the center of circle, process with the drill point that diameter is d2 the hole 1 that a diameter is d2, centered by the D2 of the center of circle, process with the drill point that diameter is d3 the hole 26 that a diameter is d3; D2=d-0.05mm, in formula, d is the diameter in hole 42; D3=d1-0.05mm, in formula, d1 is the diameter in hole 53;
C. between hole 1 and intersection, hole 26, crossing hole 35 center of circle D3 is determined, centered by the D3 of the center of circle, a crossing hole 35 is processed with the drill point that diameter is d3, the diameter intersecting hole 35 is d4, d4=L+0.125mm, in formula, L is the width of hole 42 and hole 53 cross-shaped portion the widest part, intersects the center of circle D3 in hole 53 in the center of L width;
D., after step completes at above-mentioned a, b, c tri-, 8 hole, word hole 42 and holes 53 are being got out with bit diameter d and d1 respectively with the center of circle D1, D2.
The method program is simple, without manual repair, both improves production efficiency, and in turn saves labour cost, good product quality.
Claims (1)
1. the processing method in printed circuit board 8 word hole, is characterized in that taking following steps:
A. first on wiring board (1), the center of circle D1 in 8 holes, word the hole four and center of circle D2 in hole five (3) is determined according to designing requirement;
B. centered by the D1 of the center of circle, process with the drill point that diameter is d2 the hole one (4) that a diameter is d2, centered by the D2 of the center of circle, process with the drill point that diameter is d3 the hole two (6) that a diameter is d3; D2=d-0.05mm, in formula, d is the diameter of Kong Si (2); D3=d1-0.05mm, in formula, d1 is the diameter in hole five (3);
C. between hole one (4) and intersection, hole two (6), crossing hole three (5) center of circle D3 is determined, centered by the D3 of the center of circle, a crossing hole three (5) is processed with the drill point that diameter is d3, the diameter intersecting hole three (5) is d4, d4=L+0.1 ~ 0.15mm, in formula, L is the width of Kong Si (2) and hole five (3) cross-shaped portion the widest part, intersects the center of circle D3 in hole five (3) in the center of L width;
D., after step completes at above-mentioned a, b, c tri-, 8 holes, word hole four (2) and hole five (3) is being got out with bit diameter d and d1 respectively with the center of circle D1, D2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510826025.1A CN105430911A (en) | 2015-11-25 | 2015-11-25 | Manufacturing method for 8-shaped hole of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510826025.1A CN105430911A (en) | 2015-11-25 | 2015-11-25 | Manufacturing method for 8-shaped hole of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105430911A true CN105430911A (en) | 2016-03-23 |
Family
ID=55508758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510826025.1A Pending CN105430911A (en) | 2015-11-25 | 2015-11-25 | Manufacturing method for 8-shaped hole of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430911A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455331A (en) * | 2016-11-12 | 2017-02-22 | 广东科翔电子科技有限公司 | Burr preventive forming method for splayed holes of PCB (printed circuit boards) |
| CN106455323A (en) * | 2016-08-31 | 2017-02-22 | 奥士康精密电路（惠州）有限公司 | Printed circuit board splayed hole burring prevention molding method |
| CN110677997A (en) * | 2019-09-25 | 2020-01-10 | 高德（江苏）电子科技有限公司 | Method for improving burrs of round hole and round hole intersection hole |
| CN111629524A (en) * | 2020-07-10 | 2020-09-04 | 全成信电子（深圳）股份有限公司 | Forming method for preventing burrs of splayed intersecting holes of PCB (printed circuit board) |
| CN112074091A (en) * | 2020-09-10 | 2020-12-11 | 黄石星河电路有限公司 | Method for processing 8-shaped hole PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201893988U (en) * | 2010-10-22 | 2011-07-06 | 春焱电子科技（苏州）有限公司 | Printed circuit board (PCB) |
| CN103068161A (en) * | 2011-10-19 | 2013-04-24 | 上海嘉捷通信息科技有限公司 | Manufacturing method of figure 8 shape hole of printed circuit board |
| CN103096622A (en) * | 2011-10-28 | 2013-05-08 | 北大方正集团有限公司 | Drilling method of manufacturing printed circuit board (PCB) and PCB |
-
2015
- 2015-11-25 CN CN201510826025.1A patent/CN105430911A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201893988U (en) * | 2010-10-22 | 2011-07-06 | 春焱电子科技（苏州）有限公司 | Printed circuit board (PCB) |
| CN103068161A (en) * | 2011-10-19 | 2013-04-24 | 上海嘉捷通信息科技有限公司 | Manufacturing method of figure 8 shape hole of printed circuit board |
| CN103096622A (en) * | 2011-10-28 | 2013-05-08 | 北大方正集团有限公司 | Drilling method of manufacturing printed circuit board (PCB) and PCB |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455323A (en) * | 2016-08-31 | 2017-02-22 | 奥士康精密电路（惠州）有限公司 | Printed circuit board splayed hole burring prevention molding method |
| CN106455331A (en) * | 2016-11-12 | 2017-02-22 | 广东科翔电子科技有限公司 | Burr preventive forming method for splayed holes of PCB (printed circuit boards) |
| CN110677997A (en) * | 2019-09-25 | 2020-01-10 | 高德（江苏）电子科技有限公司 | Method for improving burrs of round hole and round hole intersection hole |
| CN110677997B (en) * | 2019-09-25 | 2022-09-09 | 高德(江苏)电子科技股份有限公司 | Method for improving burrs of round hole and round hole intersection hole |
| CN111629524A (en) * | 2020-07-10 | 2020-09-04 | 全成信电子（深圳）股份有限公司 | Forming method for preventing burrs of splayed intersecting holes of PCB (printed circuit board) |
| CN111629524B (en) * | 2020-07-10 | 2021-07-20 | 全成信电子（深圳）股份有限公司 | Forming method for preventing burrs of splayed intersecting holes of PCB (printed circuit board) |
| CN112074091A (en) * | 2020-09-10 | 2020-12-11 | 黄石星河电路有限公司 | Method for processing 8-shaped hole PCB |
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Application publication date: 20160323 |