CN103068161B - A kind of manufacture method of printed circuit board 8-shaped hole - Google Patents
A kind of manufacture method of printed circuit board 8-shaped hole Download PDFInfo
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- CN103068161B CN103068161B CN201110317462.2A CN201110317462A CN103068161B CN 103068161 B CN103068161 B CN 103068161B CN 201110317462 A CN201110317462 A CN 201110317462A CN 103068161 B CN103068161 B CN 103068161B
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- hole
- circular hole
- boring
- circuit board
- printed circuit
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
The present invention relates to a kind of manufacture method of printed circuit board 8-shaped hole, 1) subdrilling leads boring; 2) the first circular hole is bored again; 3) the second circular hole is bored again; 4) finally bore and heavily hole.Compared with prior art, the present invention has saving man-hour and manpower, quality yield advantages of higher.
Description
Technical field
The present invention relates to a kind of correlation technique of printed circuit board, especially relate to a kind of manufacture method of printed circuit board 8-shaped hole.
Background technology
Wiring board is in production Eight characters hole, when hardy hole and each tangent special hole, connect the place at place in hole, produce very large burr, whole hole shape is rough, as shown in Figure 1 and Figure 2, can find out from above two figure, in Fig. 1 and Fig. 2, distinguish the lower cutter of boring successively with two numerical orders, according to the size (diameter) of tangency location between Kong Yukong, increase the weight of to hole (when client is without particular/special requirement).
As in the production process of Fig. 3, subdrilling 1, then bore 2, finally bore 3 (heavily holing), Yin Maoci is the flexible materials such as filament, wind-engaging or stressed after can swing.Thus it is unclean to cause burr to be removed, hole is yielding, therefore can increase flow process to process exception: boring-polishing-manpower (hairbrush) burr brushing-polish-brush-high-pressure washing-oven dry.In above flow process, manpower (hairbrush) burr brushing is: hole hairbrush wiping jagged in every PNL plate, to reduce or removing hole inner burr, and this measure not only waste of manpower and more expend man-hour.
Summary of the invention
Object of the present invention is exactly provide a kind of manufacture method of more saving manpower and man-hour, printed circuit board 8-shaped hole that quality yield is high to overcome defect that above-mentioned prior art exists.
Object of the present invention can be achieved through the following technical solutions:
The manufacture method in printed circuit board 8-shaped hole, is characterized in that,
1) boring is led in subdrilling;
2) the first circular hole is bored again;
3) the second circular hole is bored again;
4) finally bore and heavily hole.
The first described circular hole and the second circular hole arranged in a crossed manner, described heavily boring for using the first circular hole and the second circular hole crosspoint line as the ellipse of major axis, described led boring and to be attached most importance to the inscribed circle structure of boring.
Compared with prior art, the present invention more saves manpower and man-hour than prior art, and after the quality in January is followed the trail of, show that quality yield of the present invention is promoted to present 98% by former 75%.
Accompanying drawing explanation
Fig. 1 is the drilling technique mode figure in existing formed objects hole;
Fig. 2 is the drilling technique mode figure of the large aperture of existing difference;
Fig. 3 is existing boring flow chart;
Fig. 4 is technical approach figure of the present invention;
Fig. 5 is flow chart of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
As shown in Figure 4, printed circuit board 8-shaped hole comprises leads the normal circular hole 3 of the normal circular hole of boring 1, first 2, second, heavily holes 4, what increase tangency location same diameter at the 4 tangent places that heavily hole leads boring 1, first increases that to lead the hole that boring can effectively reduce or avoid to cause because of the second normal circular hole 3 unbalance stress askew before boring.
As in the production process of Fig. 5,1) boring 1 is led in subdrilling; 2) the first circular hole 2 is bored again; 3) the second circular hole 3 is bored again; 4) finally bore and heavily hole 4, and after boring the askew and burr phenomena of atresia.
Claims (1)
1. the manufacture method in printed circuit board 8-shaped hole, is characterized in that,
1) boring is led in subdrilling;
2) the first circular hole is bored again;
3) the second circular hole is bored again;
4) finally bore and heavily hole;
The first described circular hole and the second circular hole arranged in a crossed manner, described heavily boring for using the first circular hole and the second circular hole crosspoint line as the ellipse of major axis, described led boring and to be attached most importance to the inscribed circle structure of boring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110317462.2A CN103068161B (en) | 2011-10-19 | 2011-10-19 | A kind of manufacture method of printed circuit board 8-shaped hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110317462.2A CN103068161B (en) | 2011-10-19 | 2011-10-19 | A kind of manufacture method of printed circuit board 8-shaped hole |
Publications (2)
Publication Number | Publication Date |
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CN103068161A CN103068161A (en) | 2013-04-24 |
CN103068161B true CN103068161B (en) | 2015-10-28 |
Family
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Application Number | Title | Priority Date | Filing Date |
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CN201110317462.2A Active CN103068161B (en) | 2011-10-19 | 2011-10-19 | A kind of manufacture method of printed circuit board 8-shaped hole |
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CN (1) | CN103068161B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105430910A (en) * | 2015-11-23 | 2016-03-23 | 梅州市志浩电子科技有限公司 | Printed circuit board overlapped groove processing method |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105430911A (en) * | 2015-11-25 | 2016-03-23 | 大连崇达电路有限公司 | Manufacturing method for 8-shaped hole of printed circuit board |
CN106455323A (en) * | 2016-08-31 | 2017-02-22 | 奥士康精密电路(惠州)有限公司 | Printed circuit board splayed hole burring prevention molding method |
CN106455331A (en) * | 2016-11-12 | 2017-02-22 | 广东科翔电子科技有限公司 | Burr preventive forming method for splayed holes of PCB (printed circuit boards) |
CN111629524B (en) * | 2020-07-10 | 2021-07-20 | 全成信电子(深圳)股份有限公司 | Forming method for preventing burrs of splayed intersecting holes of PCB (printed circuit board) |
CN112074091A (en) * | 2020-09-10 | 2020-12-11 | 黄石星河电路有限公司 | Method for processing 8-shaped hole PCB |
CN113246214B (en) * | 2021-04-09 | 2022-12-23 | 广州广合科技股份有限公司 | Processing method of gourd-shaped special-shaped hole |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4042369B2 (en) * | 2001-09-05 | 2008-02-06 | 松下電器産業株式会社 | Long hole machining method for printed wiring boards |
CN101720173A (en) * | 2009-11-20 | 2010-06-02 | 深南电路有限公司 | Method for processing PCB |
CN102098879A (en) * | 2011-03-04 | 2011-06-15 | 奥士康精密电路(惠州)有限公司 | Method for drilling internal layer thick copper plate |
CN201893988U (en) * | 2010-10-22 | 2011-07-06 | 春焱电子科技(苏州)有限公司 | Printed circuit board (PCB) |
-
2011
- 2011-10-19 CN CN201110317462.2A patent/CN103068161B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4042369B2 (en) * | 2001-09-05 | 2008-02-06 | 松下電器産業株式会社 | Long hole machining method for printed wiring boards |
CN101720173A (en) * | 2009-11-20 | 2010-06-02 | 深南电路有限公司 | Method for processing PCB |
CN201893988U (en) * | 2010-10-22 | 2011-07-06 | 春焱电子科技(苏州)有限公司 | Printed circuit board (PCB) |
CN102098879A (en) * | 2011-03-04 | 2011-06-15 | 奥士康精密电路(惠州)有限公司 | Method for drilling internal layer thick copper plate |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105430910A (en) * | 2015-11-23 | 2016-03-23 | 梅州市志浩电子科技有限公司 | Printed circuit board overlapped groove processing method |
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CN103068161A (en) | 2013-04-24 |
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Effective date of registration: 20190306 Address after: 201807 699 Xingqing Road, Jiading Industrial Park, Jiading District, Shanghai Patentee after: SHANGHAI FAST-PCB CIRCUIT TECHNOLOGY CORPORATION LIMITED Address before: 201807 699 Xingqing Road, Jiading Industrial Park, Jiading District, Shanghai Patentee before: Shanghai Jiajie Information Technology Co., Ltd. |
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