CN105430872A - PCB board-edge glue-flowing opening structure - Google Patents
PCB board-edge glue-flowing opening structure Download PDFInfo
- Publication number
- CN105430872A CN105430872A CN201510933889.3A CN201510933889A CN105430872A CN 105430872 A CN105430872 A CN 105430872A CN 201510933889 A CN201510933889 A CN 201510933889A CN 105430872 A CN105430872 A CN 105430872A
- Authority
- CN
- China
- Prior art keywords
- beans
- copper beans
- gummosis
- rhombus copper
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Beans For Foods Or Fodder (AREA)
Abstract
The invention discloses a PCB board-edge glue-flowing opening structure. A ring of board frame is arranged on the board edge of an inner layer board; multiple protruding rhombic copper beans are uniformly distributed on the surface of the board frame at intervals; the spacings among the rhombic copper beans form circulating glue-flowing channels; and the rhombic copper beans are uniformly distributed within a region of 2-10 mm from the inner edge to the outer edge of the board frame. When the glue is pressed, the excessive glue can flow out of the glue-flowing channels; and therefore, the glue-flowing can be accelerated, and the glue-flowing uniformity can be improved to enable bubbles to be discharged smoothly and to avoid corrugation formation in the pressing process.
Description
Technical field
The invention belongs to art of printed circuit boards, be specifically related to a kind of internal layer pressing gummosis mouth.
Background technology
Multi-layer sheet is formed by multiple inner plating pressing, the opposing two sides of each inner plating all arranges multiple hot melt block, the position correspondence of the hot melt block of the plurality of inner plating is arranged, make to form an interval between two adjacent inner platings, when multiple inner plating carries out pressing hot melt, need to place a PP film in the interval between adjacent two inner platings, after PP film hot melt, become gluey, levelling between adjacent two inner platings, thus bonding adjacent two inner platings, unnecessary glue then flows out along the gummosis mouth of the edges of boards of each inner plating, thus realize mutually being adhesively fixed of the plurality of inner plating.
At present, the round beans beans that edges of boards gummosis mouth is 1.8MM by diameter form side by side (becoming tangent between circle beans beans with circle beans beans) and be only located at rivet hot block region, and other regions are not designed, and cause gummosis uneven, bubble row do not go out, thus cause pressing gauffer scrappage to rise.
Summary of the invention
In order to solve the problem, the invention provides a kind of pcb board limit gummosis mouth structure, this pcb board limit gummosis mouth structure can accelerate the gummosis time, promotes gummosis uniformity simultaneously, bubble is discharged smooth and easy, avoids causing pressing gauffer.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of pcb board limit gummosis mouth structure, the edges of boards of inner plating have a girth sheets frame, the surface of described sheet frame has the rhombus copper beans of multiple projection, all rhombus copper beans uniform intervals are distributed in sheet frame surface, spacing between rhombus copper beans and rhombus copper beans forms the gummosis groove circulated, and described rhombus copper beans are evenly distributed within the scope of the inside edge of sheet frame toward the outside 2 to 10 millimeters, edge.
The present invention in order to the further technical scheme solving its technical problem and adopt is:
Say further, the length of side of described rhombus copper beans is 0.9 to 1.5 millimeter, and arrange in 40 ° to 50 ° angles between described rhombus copper beans and rhombus copper beans, the width of described gummosis groove is 0.2 to 0.5 millimeter.
Say further, the length of side of described rhombus copper beans is 1.04 millimeters, and arrange in 45° angle between described rhombus copper beans and rhombus copper beans, the width of described gummosis groove is 0.3 millimeter.
Say further, described inner plating unifies by multiple single piece plate the connection sheet plate that typesetting forms, and described sheet frame is the peripheral sheet frame of whole sheet plate.
Say further, the height of described rhombus copper beans is 1/4 to 2 ounce.Preferably, the height of described rhombus copper beans is 1/3 ounce.
The invention has the beneficial effects as follows: the pressing gummosis mouth by inner plating four limit of the present invention is designed to be covered with the rhombus copper beans of the equalization of edges of boards, gummosis groove is formed between rhombus copper beans and rhombus copper beans, during pressing, unnecessary glue can flow out from gummosis groove, therefore, it is possible to accelerate the gummosis time, promote gummosis uniformity simultaneously, bubble is discharged smooth and easy, avoid causing pressing gauffer.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the A portion enlarged drawing of Fig. 1.
Embodiment
Below by way of specific instantiation, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
Embodiment: a kind of pcb board limit gummosis mouth structure, the edges of boards of inner plating 1 have a girth sheets frame 11, described inner plating 1 is the connection sheet plate be made up of the unified typesetting of multiple single piece plate 100, described sheet frame is the peripheral sheet frame of whole sheet plate, the surface of described sheet frame one of (upper surface and lower surface at least) has the rhombus copper beans 111 of multiple projection, all rhombus copper beans uniform intervals are distributed in sheet frame surface, spacing between rhombus copper beans and rhombus copper beans forms the gummosis groove 112 circulated, described rhombus copper beans are evenly distributed within the scope of the inside edge 113 of sheet frame toward the outside 1142 to 10 millimeters, edge.
The length of side of described rhombus copper beans is 1.04 millimeters, and arrange in 45° angle between described rhombus copper beans and rhombus copper beans, the width of described gummosis groove is 0.3 millimeter, and the height of described rhombus copper beans is 1/3 ounce.
Claims (6)
1. a pcb board limit gummosis mouth structure, it is characterized in that: the edges of boards of inner plating (1) have a girth sheets frame (11), the surface of described sheet frame has the rhombus copper beans (111) of multiple projection, all rhombus copper beans uniform intervals are distributed in sheet frame surface, spacing between rhombus copper beans and rhombus copper beans forms the gummosis groove (112) circulated, and described rhombus copper beans are evenly distributed within the scope of the inside edge (113) of sheet frame toward the outside (114) 2 to 10 millimeters, edge.
2. pcb board limit as claimed in claim 1 gummosis mouth structure, it is characterized in that: the length of side of described rhombus copper beans is 0.9 to 1.5 millimeter, arrange in 40 ° to 50 ° angles between described rhombus copper beans and rhombus copper beans, the width of described gummosis groove is 0.2 to 0.5 millimeter.
3. pcb board limit as claimed in claim 2 gummosis mouth structure, is characterized in that: the length of side of described rhombus copper beans is 1.04 millimeters, and arrange in 45° angle between described rhombus copper beans and rhombus copper beans, the width of described gummosis groove is 0.3 millimeter.
4. pcb board limit as claimed in claim 1 gummosis mouth structure, is characterized in that: described inner plating (1) is the connection sheet plate be made up of the unified typesetting of multiple single piece plate (100), and described sheet frame is the peripheral sheet frame of whole sheet plate.
5. pcb board limit as claimed in claim 1 gummosis mouth structure, is characterized in that: the height of described rhombus copper beans is 1/4 to 2 ounce.
6. pcb board limit as claimed in claim 5 gummosis mouth structure, is characterized in that: the height of described rhombus copper beans is 1/3 ounce.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510933889.3A CN105430872A (en) | 2015-12-15 | 2015-12-15 | PCB board-edge glue-flowing opening structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510933889.3A CN105430872A (en) | 2015-12-15 | 2015-12-15 | PCB board-edge glue-flowing opening structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105430872A true CN105430872A (en) | 2016-03-23 |
Family
ID=55508719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510933889.3A Pending CN105430872A (en) | 2015-12-15 | 2015-12-15 | PCB board-edge glue-flowing opening structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430872A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231799A (en) * | 2016-08-09 | 2016-12-14 | 上海斐讯数据通信技术有限公司 | A kind of pcb board and manufacture method thereof |
| CN109348612A (en) * | 2018-09-30 | 2019-02-15 | 深圳市景旺电子股份有限公司 | The production method and multi-layer PCB board of multi-layer PCB board |
| CN109640548A (en) * | 2018-12-29 | 2019-04-16 | 广州兴森快捷电路科技有限公司 | Prepreg compression method and PCB construction |
| CN110708889A (en) * | 2019-09-20 | 2020-01-17 | 大连崇达电子有限公司 | Method for improving press-fit cavity of printed circuit board |
| CN112243319A (en) * | 2020-10-28 | 2021-01-19 | 瑞声新能源发展(常州)有限公司科教城分公司 | Manufacturing method of flexible circuit board and flexible circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110131803A1 (en) * | 2009-12-03 | 2011-06-09 | Chin-Chi Yang | Method of manufacturing a hollow surface mount type electronic component |
| CN202425188U (en) * | 2011-11-15 | 2012-09-05 | 胜宏科技（惠州）股份有限公司 | PCB with rhombic meshy gummosis slots |
| CN105101625A (en) * | 2015-09-02 | 2015-11-25 | 竞陆电子(昆山)有限公司 | Uniform board edge gumming structure for PCB (Printed Circuit Board) inner-layer boards |
| CN205336649U (en) * | 2015-12-15 | 2016-06-22 | 竞陆电子(昆山)有限公司 | PCB flange gummosis mouth structure |
-
2015
- 2015-12-15 CN CN201510933889.3A patent/CN105430872A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110131803A1 (en) * | 2009-12-03 | 2011-06-09 | Chin-Chi Yang | Method of manufacturing a hollow surface mount type electronic component |
| CN202425188U (en) * | 2011-11-15 | 2012-09-05 | 胜宏科技（惠州）股份有限公司 | PCB with rhombic meshy gummosis slots |
| CN105101625A (en) * | 2015-09-02 | 2015-11-25 | 竞陆电子(昆山)有限公司 | Uniform board edge gumming structure for PCB (Printed Circuit Board) inner-layer boards |
| CN205336649U (en) * | 2015-12-15 | 2016-06-22 | 竞陆电子(昆山)有限公司 | PCB flange gummosis mouth structure |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231799A (en) * | 2016-08-09 | 2016-12-14 | 上海斐讯数据通信技术有限公司 | A kind of pcb board and manufacture method thereof |
| CN109348612A (en) * | 2018-09-30 | 2019-02-15 | 深圳市景旺电子股份有限公司 | The production method and multi-layer PCB board of multi-layer PCB board |
| CN109348612B (en) * | 2018-09-30 | 2020-02-21 | 深圳市景旺电子股份有限公司 | Manufacturing method of multilayer PCB and multilayer PCB |
| CN109640548A (en) * | 2018-12-29 | 2019-04-16 | 广州兴森快捷电路科技有限公司 | Prepreg compression method and PCB construction |
| CN109640548B (en) * | 2018-12-29 | 2020-06-23 | 广州兴森快捷电路科技有限公司 | Prepreg laminating method and PCB structure |
| CN110708889A (en) * | 2019-09-20 | 2020-01-17 | 大连崇达电子有限公司 | Method for improving press-fit cavity of printed circuit board |
| CN112243319A (en) * | 2020-10-28 | 2021-01-19 | 瑞声新能源发展(常州)有限公司科教城分公司 | Manufacturing method of flexible circuit board and flexible circuit board |
| CN112243319B (en) * | 2020-10-28 | 2022-03-01 | 瑞声新能源发展(常州)有限公司科教城分公司 | Manufacturing method of flexible circuit board and flexible circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160323 |