CN105428282A - Chip mounter with anti-overlapping function - Google Patents

Chip mounter with anti-overlapping function Download PDF

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Publication number
CN105428282A
CN105428282A CN201510989316.2A CN201510989316A CN105428282A CN 105428282 A CN105428282 A CN 105428282A CN 201510989316 A CN201510989316 A CN 201510989316A CN 105428282 A CN105428282 A CN 105428282A
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CN
China
Prior art keywords
controller
transmission track
active lever
alarm
chip mounter
Prior art date
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Granted
Application number
CN201510989316.2A
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Chinese (zh)
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CN105428282B (en
Inventor
邹波
李勇昌
邹锋
蒋振荣
王常毅
朱金华
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Guilin sizhuanggui Microelectronics Co.,Ltd.
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Strong Guilin Microelectronics Co Ltd
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Priority to CN201510989316.2A priority Critical patent/CN105428282B/en
Publication of CN105428282A publication Critical patent/CN105428282A/en
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Publication of CN105428282B publication Critical patent/CN105428282B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00Climate change mitigation technologies for sector-wide applications
    • Y02P80/30Reducing waste in manufacturing processes; Calculations of released waste quantities

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a chip mounter with an anti-overlapping function, which comprises a frame accommodating box, a transmission rail, a mounting head and an anti-overlapping frame detection mechanism. The transmission rail is positioned at the front end of the frame accommodating box, and the mounting head is positioned at the rear end of the transmission rail. The anti-overlapping frame detection mechanism comprises a fixed bracket, a movable lever, a detection roller, a sensor, a controller and an alarm. When a thickness of a lead frame transmitted on the transmission rail is greater than a gap between the lower end face of the detection roller and the transmission rail, the detection roller is lifted up, the movable lever is ascended along with the detection roller, at the moment, the sensor detects the ascending motion of the movable lever and sends a signal to the controller, and the alarm is controlled by the controller to give an alarm. According to the chip mounter, the case that two or more frames are transmitted to the rail in an overlapped manner can be effectively checked, equipment is shut down to give an alarm and personnel is reminded to carry out processing, so that welding quality is directly improved and loss of raw materials is reduced, thereby reducing production cost.

Description

There is the chip mounter of anti-azido functional
Technical field
The present invention relates to chip mounter technical field, be specifically related to a kind of chip mounter with anti-azido functional.
Background technology
Chip mounter, also known as placement equipment or surface mount system, is a kind of equipment be fixed to by chip on lead frame.Chip mounter forms primarily of framework container, transmission track and mounting head.Lead frame stacks and is stored in framework container.During production, framework container is fallen on transmission track one by one by the lead frame of its inside, and by transmission track, lead frame is sent to the below of mounting head, and by mobile mounting head, the patch sites that chip places lead frame is exactly carried out paster.Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.Along with the development trend of miniature semiconductor, existing lead frame is constantly thinning, and its thickness is generally no more than lmm.And the lead frame of this thickness is when dropping to transmission track from framework container, the as easy as rolling off a log phenomenon that sticks together, and occur that two panels lead frame drops into the situation on transmission track simultaneously.When there being two panels lead frame to overlap, laminating between chip and lead frame can being made unstable, and cause product defective, and finally causing lead frame and chip waste.
Summary of the invention
To be solved by this invention is that lead frame overlapping phenomenon easily appears in existing chip mounter, and the product caused is defective and the problem of wastage of material, provides a kind of chip mounter with anti-azido functional.
For solving the problem, the present invention is achieved by the following technical solutions:
There is a chip mounter for anti-azido functional, comprise framework container, transmission track and mounting head; Transmission track is positioned at the front end of framework container, and mounting head is positioned at the rear end of transmission track; Its difference is, also comprises anti-stacked framework testing agency further; This anti-stacked framework testing agency comprises fixed support, active lever, detection running roller, transducer, controller and alarm composition; Wherein fixed support is fixed on the edge of transmission track; The fulcrum of active lever is connected with fixed support, and active lever is vertically placed in directly over transmission track; Detect the lower end that running roller is arranged on active lever, and leave certain gap between the lower surface of detection running roller and transmission track, the height in this gap equals the thickness of lead frame to be transmitted; Transducer and active lever are just right, and the output of transducer is connected with the input of controller, and the output of controller is connected with alarm.When the thickness of the lead frame that transmission track transmits is greater than the gap between lower surface and transmission track detecting running roller, detect running roller upwards to be lifted, active lever rises thereupon, now transducer detects the ascending motion of active lever, issue a signal to controller, and send warning by controller control alarm.
In such scheme, described transducer is photoelectric sensor, and this photoelectric sensor comprises optical transmitting set, optical receiver and testing circuit composition; There is certain difference in height between level height residing for the upper surface of wherein level height residing for optical transmitting set and active lever, this difference in height is less than the thickness of lead frame to be transmitted; Optical receiver and optical transmitting set are in same level height, and the output of this optical receiver after testing circuit is connected with the input of controller.
In such scheme, described controller is connected with the halt switch of chip mounter.
In such scheme, described alarm is audible-visual annunciator.
Compared with prior art; the present invention by installing anti-stacked framework testing agency additional on existing chip mounter; effectively can check out that two panels and two panels deliver to track with upper frame overlap; equipment downtime is reported to the police; reminding employees process; so directly improve welding quality, reduce raw material loss, thus reduce production cost.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation with the chip mounter of anti-azido functional.
Number in the figure: 1, framework container; 2, transmission track; 3, mounting head; 4, lead frame, 5, chip; 6-1, fixed support; 6-2, active lever; 6-3, detection running roller; 6-4, transducer.
Embodiment
There is a chip mounter for anti-azido functional, as shown in Figure 1, comprise framework container 1, transmission track 2 and mounting head 3.Transmission track 2 is positioned at the front end of framework container 1, and mounting head 3 is positioned at the rear end of transmission track 2.It is characterized in that: also comprise anti-stacked framework testing agency further.This anti-stacked framework testing agency comprises fixed support 6-1, active lever 6-2, detects running roller 6-3, transducer 6-4, controller and alarm composition.Wherein fixed support 6-1 is fixed on the edge of transmission track 2.The fulcrum of active lever 6-2 is connected with fixed support 6-1, and active lever 6-2 is vertically placed in directly over transmission track 2.Detect the lower end that running roller 6-3 is arranged on active lever 6-2, and leave certain gap between the lower surface of detection running roller 6-3 and transmission track 2, the height in this gap equals the thickness of lead frame 4 to be transmitted.Transducer 6-4 and active lever 6-2 is just right, and the output of transducer 6-4 is connected with the input of controller, and the output of controller is connected with alarm.When the thickness of the lead frame 4 that transmission track 2 transmits is greater than the gap between lower surface and transmission track 2 detecting running roller 6-3, detect running roller 6-3 upwards to be lifted, active lever 6-2 rises thereupon, now transducer 6-4 detects the ascending motion of active lever 6-2, issue a signal to controller, and send warning by controller control alarm.
In order to detect the state of active lever 6-2, described transducer 6-4 can for height sensor 6-4, displacement transducer 6-4 or other can detect the transducer 6-4 of active lever 6-2 lifting.But consider the reason of easy implementation and cost, in a preferred embodiment of the invention, described transducer 6-4 is photoelectric sensor 6-4.This photoelectric sensor 6-4 comprises optical transmitting set, optical receiver and testing circuit composition.There is certain difference in height between level height residing for the upper surface of wherein level height residing for optical transmitting set and active lever 6-2, this difference in height is less than the thickness of lead frame 4 to be transmitted.Optical receiver and optical transmitting set are in same level height, and the output of this optical receiver after testing circuit is connected with the input of controller.Optical transmitting set continues outwards to send light signal: when active lever 6-2 is under non-lifting state, the light signal that optical transmitting set sends is blocked, optical receiver cannot receive the light signal reflected, testing circuit cannot detect the signal that optical receiver returns, and does not therefore send signal or sends non-lamination signal to controller; When active lever 6-2 is under lifting state, the light signal that optical transmitting set sends reflects because being subject to blocking of active lever 6-2, optical receiver receives this light signal reflected and is sent to testing circuit, testing circuit detects the signal that optical receiver returns, and sends lamination signal to controller.
Described controller and alarm can be controller and the alarm of special setting, the controller that also can directly adopt former chip mounter itself to carry and alarm.In order to chip mounter be occurred that the lamination phenomenon of lead frame 4 informs direct labor in time, described alarm is audible-visual annunciator.But consider direct labor may ignore alarm and sends alarm signal because of busy; described controller is also connected with the halt switch of chip mounter; like this when anti-stacked framework testing agency detects that lamination appears in lead frame 4; controller sends signal and goes to control chip mounter shutdown; to avoid the appearance of substandard product, and the waste of therefore caused lead frame 4 and chip 5.

Claims (4)

1. there is the chip mounter of anti-azido functional, comprise framework container (1), transmission track (2) and mounting head (3); Transmission track (2) is positioned at the front end of framework container (1), and mounting head (3) is positioned at the rear end of transmission track (2); It is characterized in that: also comprise anti-stacked framework testing agency further; This anti-stacked framework testing agency comprises fixed support (6-1), active lever (6-2), detects running roller (6-3), transducer (6-4), controller and alarm composition; Wherein fixed support (6-1) is fixed on the edge of transmission track (2); The fulcrum of active lever (6-2) is connected with fixed support (6-1), and makes active lever (6-2) vertically be placed in directly over transmission track (2); Detect the lower end that running roller (6-3) is arranged on active lever (6-2), and leaving certain gap between the lower surface of detection running roller (6-3) and transmission track (2), the height in this gap equals the thickness of lead frame (4) to be transmitted; Transducer (6-4) is just right with active lever (6-2), and the output of transducer (6-4) is connected with the input of controller, and the output of controller is connected with alarm;
When the thickness of the lead frame (4) transmitted when transmission track (2) is upper is greater than the gap between lower surface and transmission track (2) detecting running roller (6-3), detect running roller (6-3) upwards to be lifted, active lever (6-2) rises thereupon, now transducer (6-4) detects the ascending motion of active lever (6-2), issue a signal to controller, and send warning by controller control alarm.
2. there is the chip mounter of anti-azido functional according to claim 1, it is characterized in that: described transducer (6-4) is photoelectric sensor (6-4), this photoelectric sensor (6-4) comprises optical transmitting set, optical receiver and testing circuit composition; There is certain difference in height between level height residing for the upper surface of wherein level height residing for optical transmitting set and active lever (6-2), this difference in height is less than the thickness of lead frame (4) to be transmitted; Optical receiver and optical transmitting set are in same level height, and the output of this optical receiver after testing circuit is connected with the input of controller.
3. there is the chip mounter of anti-azido functional according to claim 1, it is characterized in that: described controller is connected with the halt switch of chip mounter.
4. there is the chip mounter of anti-azido functional according to claim 1, it is characterized in that: described alarm is audible-visual annunciator.
CN201510989316.2A 2015-12-25 2015-12-25 Chip mounter with anti-azido functional Active CN105428282B (en)

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CN105428282B CN105428282B (en) 2018-02-13

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107839337A (en) * 2017-11-30 2018-03-27 百力达太阳能股份有限公司 A kind of device for silk-screen weight piece detection alarm
CN108615332A (en) * 2016-12-13 2018-10-02 海太半导体(无锡)有限公司 Patch device substrate position sensor sensing and alarm system
CN113415484A (en) * 2021-06-24 2021-09-21 华天科技(西安)有限公司 Plastic packaging equipment preheating platform and production method for preventing material stacking and wire collapsing
CN114486514A (en) * 2021-12-10 2022-05-13 中船澄西(泰州)装备科技有限公司 Strain strengthening detection device for low-temperature liquid tank container barrel

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010102794A (en) * 2008-10-24 2010-05-06 Kimitake Utsunomiya 3.5 way optical pickup mechanism for cd/dvd/bd/ebd, optical head mechanism for medical diagnosis/operation, solid display/photographing device, and printer/scanner
CN203332892U (en) * 2013-05-23 2013-12-11 北新集团建材股份有限公司 System preventing plates from being overlaid
CN203411110U (en) * 2013-04-28 2014-01-29 苏州北新矿棉板有限公司 Anti-plate-folding device
CN204119668U (en) * 2014-10-20 2015-01-21 苏州河图电子科技有限公司 A kind of mounting head of many suction nozzles for chip mounter device
CN205452241U (en) * 2015-12-25 2016-08-10 桂林斯壮微电子有限责任公司 Chip mounter with prevent folding function

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010102794A (en) * 2008-10-24 2010-05-06 Kimitake Utsunomiya 3.5 way optical pickup mechanism for cd/dvd/bd/ebd, optical head mechanism for medical diagnosis/operation, solid display/photographing device, and printer/scanner
CN203411110U (en) * 2013-04-28 2014-01-29 苏州北新矿棉板有限公司 Anti-plate-folding device
CN203332892U (en) * 2013-05-23 2013-12-11 北新集团建材股份有限公司 System preventing plates from being overlaid
CN204119668U (en) * 2014-10-20 2015-01-21 苏州河图电子科技有限公司 A kind of mounting head of many suction nozzles for chip mounter device
CN205452241U (en) * 2015-12-25 2016-08-10 桂林斯壮微电子有限责任公司 Chip mounter with prevent folding function

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108615332A (en) * 2016-12-13 2018-10-02 海太半导体(无锡)有限公司 Patch device substrate position sensor sensing and alarm system
CN107839337A (en) * 2017-11-30 2018-03-27 百力达太阳能股份有限公司 A kind of device for silk-screen weight piece detection alarm
CN113415484A (en) * 2021-06-24 2021-09-21 华天科技(西安)有限公司 Plastic packaging equipment preheating platform and production method for preventing material stacking and wire collapsing
CN114486514A (en) * 2021-12-10 2022-05-13 中船澄西(泰州)装备科技有限公司 Strain strengthening detection device for low-temperature liquid tank container barrel

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Effective date of registration: 20220110

Address after: 541004 floor 1, SMD new chip transistor production building, plot 8, information industry park, Guilin National High tech Zone, Qixing District, Guilin, Guangxi Zhuang Autonomous Region

Patentee after: Guilin sizhuanggui Microelectronics Co.,Ltd.

Address before: 541004 d-8, information industry park, Guilin National High tech Zone, Guangxi Zhuang Autonomous Region

Patentee before: GUILIN STRONG MICROELECTRONICS Co.,Ltd.