CN105426689A - Method for inspecting state of secondary loop of metering device - Google Patents

Abstract

The invention discloses a method for inspecting the state of a secondary loop of a metering device. The method is high in efficiency and comprehensive and accurate in inspection result. The method comprises the following steps: collecting field operation data of the secondary loop, classifying collected data, calculating the operation state value GD of the secondary loop, and determining a practical operation state corresponding to a practical state value of the secondary loop through the preset corresponding relationship between the state value and the operation state of the secondary loop. The inspection method is high in efficiency; detection data and monitoring data of the secondary loop are considered in the inspection method; comprehensive inspection of the state of the secondary loop can be realized; the finally obtained inspection result is accurate, comprehensive and high in reliability; the dynamic security stability of the secondary loop can be accurately grasped; therefore, safe, steady and accurate operation of various secondary loops can be ensured; accident treatment information can be dynamically tracked and analyzed, such that serious failures can be dynamically controlled. The method disclosed by the invention is applied to being popularized and applied in the technical field of state evaluation of gateway metering equipment.

Description

A kind of measuring apparatus secondary circuit thermodynamic state verification method

Technical field

The present invention relates to energy metering equipment state assessment technology field, especially a kind of measuring apparatus secondary circuit thermodynamic state verification method.

Background technology

In order to ensure that measuring apparatus secondary circuit can normally run, usually need to carry out long-range estimation to the running status of secondary circuit, existing secondary circuit thermodynamic state verification method is mostly the mode adopting desk checking, the mode of desk checking needs a large amount of computation process of manually carrying out field test and complexity, inefficiency; Secondly, manually when carrying out on-the-spot accuracy test to secondary circuit, because human intervention is easy to cause the normal secondary circuit run originally to break down, there is larger potential faults; Moreover, existing secondary circuit thermodynamic state verification method can not realize the complete examination of secondary circuit state, cause the assay that finally draws inaccurate, and manual intervention easily makes mistakes and causes assay reliability low, accurately cannot grasp the dynamic security stability of secondary circuit, and then also cannot ensure each secondary circuit safety, stable, accurately run, lack and accident treatment information dynamically followed the tracks of and analyzes, Dynamic controlling can not be carried out to catastrophic failure.

Summary of the invention

Technical matters to be solved by this invention is to provide a kind of high and assay comprehensive and accurate measuring apparatus secondary circuit thermodynamic state verification method of efficiency.

The technical solution adopted for the present invention to solve the technical problems is: this measuring apparatus secondary circuit thermodynamic state verification method, comprises the following steps:

The on-the-spot service data of A, collection secondary circuit;

B, data to be classified, data are divided into following two classes: secondary circuit detects data, secondary circuit Monitoring Data;

C, detect data according to secondary circuit, secondary circuit Monitoring Data calculates secondary circuit running status value G _d, by the secondary circuit state value preset and the corresponding relation of running status, determine the actual motion state corresponding to actual condition value of secondary circuit.

Further, described secondary circuit running status value G _dfollowing formulae discovery is adopted to draw;

$G_D=100\×\sqrt{T_D\×M_D};$

$T_D=\frac{3T_{D1}}{10}+\frac{3T_{D2}}{5}+\frac{T_{D3}}{10};$ Wherein,

d _1Afor the secondary circuit voltage drop in-phase component value of on-the-spot real-load examination, D _1Bfor the secondary circuit voltage drop quadrature component value of on-the-spot real-load examination;

work as T _d2during <0, T _d2=0; D ₂for the secondary circuit voltage drop relative value of on-line monitoring;

D ₃for the standard deviation of the secondary circuit voltage drop relative value of on-line monitoring, work as D ₃during <0.2 × limit value, T _d3=1; Work as D ₃during>=0.2 × limit value, work as T _d3during <0, T _d3=0;

M _D＝M _D4；

d ₄for the anomalous event number of times that the secondary voltage drop of on-line monitoring is out-of-limit; .

Beneficial effect of the present invention: this measuring apparatus secondary circuit thermodynamic state verification method, by collecting the on-the-spot service data of secondary circuit, is classified to the data of collecting and calculates secondary circuit running status value G _dby the secondary circuit state value preset and the corresponding relation of running status, determine the actual motion state corresponding to actual condition value of secondary circuit, this method of inspection is the running status by drawing measuring apparatus to the analysis of data, without the need to manually carrying out field test, efficiency is high; Secondly, decrease artificial intervention, there will not be because artificial origin causes the normal secondary circuit run originally to break down, secondary circuit failure hidden danger is lower; Moreover, this method of inspection considers secondary circuit and detects data, secondary circuit Monitoring Data, the complete examination of secondary circuit state can be realized, the assay that guarantee finally draws accurately, comprehensive, reliability is high, accurately can grasp the dynamic security stability of secondary circuit, and then ensure each secondary circuit safety, stable, accurately run, can dynamically follow the tracks of accident treatment information and analyze, thus Dynamic controlling is carried out to catastrophic failure.

Embodiment

Measuring apparatus secondary circuit thermodynamic state verification method of the present invention, comprises the following steps:

The on-the-spot service data of A, collection secondary circuit, the on-the-spot service data of measuring apparatus secondary circuit can be obtained by existing power information acquisition system, power information acquisition system can realize the collection monitoring of the Various types of data such as the operating condition of secondary circuit and logout, wherein, on-line monitoring and intelligent diagnostics module are by image data, the compare of analysis of event and data mining, the ruuning situation of secondary circuit is diagnosed and analyzes, the abnormal conditions such as Timeliness coverage load, when collecting the on-the-spot service data of measuring apparatus secondary circuit, only need call the related data that power information acquisition system gathers,

B, data to be classified, data are divided into following two classes: secondary circuit detects data, secondary circuit Monitoring Data;

C, detect data according to secondary circuit, secondary circuit Monitoring Data calculates secondary circuit running status value G _d, by the secondary circuit state value preset and the corresponding relation of running status, determine the actual motion state corresponding to actual condition value of secondary circuit.

This measuring apparatus secondary circuit thermodynamic state verification method, by collecting the on-the-spot service data of secondary circuit, is classified to the data of collecting and calculates secondary circuit running status value G _dby the secondary circuit state value preset and the corresponding relation of running status, determine the actual motion state corresponding to actual condition value of secondary circuit, this method of inspection is the running status by drawing measuring apparatus to the analysis of data, without the need to manually carrying out field test, efficiency is high; Secondly, decrease artificial intervention, there will not be because artificial origin causes the normal secondary circuit run originally to break down, secondary circuit failure hidden danger is lower; Moreover, this method of inspection considers secondary circuit and detects data, secondary circuit Monitoring Data, the complete examination of secondary circuit state can be realized, the assay that guarantee finally draws accurately, comprehensive, reliability is high, accurately can grasp the dynamic security stability of secondary circuit, and then ensure each secondary circuit safety, stable, accurately run, can dynamically follow the tracks of accident treatment information and analyze, thus Dynamic controlling is carried out to catastrophic failure.

In the above-described embodiment, described secondary circuit running status value G _dfollowing formulae discovery is adopted to draw,

$G_D=100\&times;\sqrt{T_D\&times;M_D};$

$T_D=\frac{3T_{D1}}{10}+\frac{3T_{D2}}{5}+\frac{T_{D3}}{10};$ Wherein,

d _1Afor the secondary circuit voltage drop in-phase component value of on-the-spot real-load examination, D _1Bfor the secondary circuit voltage drop quadrature component of on-the-spot real-load examination, this quantity of state reflection secondary circuit Real-time Error situation, limit value refers to that the error limit that secondary circuit is corresponding, value are 0.2;

work as T _d2during <0, T _d2=0; D ₂for the secondary circuit voltage drop relative value of on-line monitoring, this quantity of state reflection secondary circuit Real-time Error situation, limit value refers to that the error limit that secondary circuit is corresponding, value are 0.2;

D ₃for the standard deviation of the secondary circuit voltage drop relative value of on-line monitoring, work as D ₃during <0.2 × limit value, T _d3=1; Work as D ₃during>=0.2 × limit value, work as T _d3during <0, T _d3=0, limit value refers to that the error limit that secondary circuit is corresponding, value are 0.2;

M _d=M _d4; M _dbe the state value of secondary circuit operation exception, whether this state value reflection secondary circuit runs abnormal;

d ₄for the anomalous event number of times that the secondary voltage drop of on-line monitoring is out-of-limit, this quantity of state reflection secondary circuit real time execution situation, its anomalous event quantity refers to the anomalous event quantity that the secondary voltage drop of twice secondary circuit running status value computing interval on-line monitoring discovery is out-of-limit.

The secondary circuit running status value G utilizing said method to calculate _daccurately, comprehensively, reliability is high, accurately can grasp the dynamic security stability of secondary circuit, and then ensure secondary circuit safety, stable, accurately run, can secondary secondary circuit accident treatment information dynamically be followed the tracks of and be analyzed, thus Dynamic controlling is carried out to secondary circuit catastrophic failure.

The corresponding relation of secondary circuit state value and running status is as shown in the table:

Claims (2)

1. a measuring apparatus secondary circuit thermodynamic state verification method, is characterized in that comprising the following steps:

The on-the-spot service data of A, collection secondary circuit;

B, data to be classified, data are divided into following two classes: secondary circuit detects data, secondary circuit Monitoring Data;

C, detect data according to secondary circuit, secondary circuit Monitoring Data calculates secondary circuit running status value G _d, by the secondary circuit state value preset and the corresponding relation of running status, determine the actual motion state corresponding to actual condition value of secondary circuit.

2. measuring apparatus secondary circuit thermodynamic state verification method as claimed in claim 1, is characterized in that: described secondary circuit running status value G _dfollowing formulae discovery is adopted to draw;

$G_D=100\&times;\sqrt{T_D\&times;M_D};$

$T_D=\frac{3T_{D1}}{10}+\frac{3T_{D2}}{5}+\frac{T_{D3}}{10};$ Wherein,

d _1Afor the secondary circuit voltage drop in-phase component value of on-the-spot real-load examination, D _1Bfor the secondary circuit voltage drop quadrature component value of on-the-spot real-load examination;

work as T _d2during <0, T _d2=0; D ₂for the secondary circuit voltage drop relative value of on-line monitoring;

D ₃for the standard deviation of the secondary circuit voltage drop relative value of on-line monitoring, work as D ₃during <0.2 × limit value, T _d3=1; Work as D ₃during>=0.2 × limit value, work as T _d3during <0, T _d3=0;

M _D＝M _D4；

d ₄for the anomalous event number of times that the secondary voltage drop of on-line monitoring is out-of-limit.