CN105423937A - Carbon needle and detection method for detecting deformation of air-tight packaging structure - Google Patents
Carbon needle and detection method for detecting deformation of air-tight packaging structure Download PDFInfo
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- CN105423937A CN105423937A CN201510952206.9A CN201510952206A CN105423937A CN 105423937 A CN105423937 A CN 105423937A CN 201510952206 A CN201510952206 A CN 201510952206A CN 105423937 A CN105423937 A CN 105423937A
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- carbon pin
- hermetic package
- carbon
- level hermetic
- pin
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/30—Measuring arrangements characterised by the use of mechanical techniques for measuring the deformation in a solid, e.g. mechanical strain gauge
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention relates to a carbon needle and a detection method for accurately measuring the deformation of an air-tight packaging structure under the influence of complex environmental stress. A high carbon core probe is used as a displacement sensor, the deformation of the air-tight packaging structure in the complex environmental stress is characterized by using excellent plastic deformation characteristic of the high carbon core probe, and the deformation is measured in combination with a high-precision measuring microscope, so that the measurement result precision is high, the process difficulty is low, and the implementation cost is low; and the carbon needle and the detection method in combination with a finite element analysis method can effectively and accurately measure the deformation of the air-tight packaging structure in the complex environmental stress, and have very important significance for users needing to learn the structural reliability of air-tight packaging products.
Description
Technical field
The present invention relates to a kind of carbon pin and the detection method thereof that accurately can measure level Hermetic Package structural deformation amount under complex environment stress influence.
Background technology
When a kind of level Hermetic Package structure is when being subject to environmental stress impact (such as bearing pressure, temperature shock stress, physical shock stress, acceleration stress etc.) of more complicated, inwardly certain deformation can be produced.This deformation may cause encapsulating structure to contact with package interior or external devices, and this surface contact may cause electronic devices and components short circuit or extrude impaired.And encapsulating structure experience environmental stress to carry out in process accurately cannot be tested structural deformation amount by the method for testing of routine.Such as: certain level Hermetic Package metal shell is as shown in Figure 1 bearing under 200kPa relative pressure conditions, thinner covering plate structure can produce the elastic deformation caved inward, often cannot test in back pressure process, back pressure terminates rear cover plate structure and returns to atmospheric pressure state, causes deformation quantity to review.
Summary of the invention
The object of this invention is to provide a kind of carbon pin and the detection method thereof that accurately can measure level Hermetic Package structural deformation amount under complex environment stress influence.
For achieving the above object, the invention provides following technical scheme:
For detecting a carbon pin for level Hermetic Package structural deformation amount, described carbon pin is made up of plastic yield material, and described carbon pin is cone-shaped structure, and the height of described carbon pin is greater than the cavity thickness of level Hermetic Package structure to be measured;
Described carbon pin is made up less than or equal to the drawing pencil core of B6 hardness or art designing's pencil-lead of high-purity carbon of hardness.
Utilize above-mentioned carbon pin to detect a method for level Hermetic Package structural deformation amount, comprise the following steps:
A. before air-tight structure encapsulates completely, be placed on by described carbon pin on the less side inwall of level Hermetic Package structural deformation amount, needle point expects the location point measured on the inwall of deformation larger side, and carbon pin central shaft is consistent with largest deformation position sense of displacement;
B. when after level Hermetic Package structure experience environmental stress conditions, carry out operation of uncapping, side inwall larger for deformation quantity is removed, during dismounting, should retain an original sealing face of circle;
C. implant point for initial point with precision measuring microscope with carbon pin, measure the height that original sealing face correspondence implants some position respectively, and the height of carbon pin end face after air-tight structure experience environmental stress;
D. the height of some position is implanted according to original sealing face correspondence, calculate the apical side height that level Hermetic Package structure encapsulates rear carbon pin completely, be specially: cross carbon pin set-point, and draw x-y coordinate axis along the direction on the long and short limit of packaging body, x-axis and y-axis and the original sealing face of packaging body intersect at 4 points, measure this height value of 4 respectively with above-mentioned precision measuring microscope, average afterwards and be the apical side height that level Hermetic Package structure encapsulates rear carbon pin completely;
E. calculate carbon pin variable, namely deduct with the apical side height that level Hermetic Package structure encapsulates rear carbon pin completely the height that air-tight structure experiences carbon pin end face after environmental stress, this variable is the deformation quantity of level Hermetic Package structure and this carbon pin corresponding point position.
Technique effect of the present invention is: the present invention uses high-carbon core probe as displacement transducer, utilize the deformation quantity in the plastic deformation characteristics sign measurement level Hermetic Package structure experience complex environment stress path of its excellence, the measuring microscope of combined high precision carries out distortion measurement, measurement result precision is high, process implementing difficulty is low, implementation cost is cheap, combining with finite element method can be efficient, exactly the level Hermetic Package structural deformation amount in complex environment stress condition process is measured, very important Practical significance is had to needing the user understanding level Hermetic Package product structure reliability.
Accompanying drawing explanation
Fig. 1 is the perspective view before air-tight structure of the present invention encapsulates completely;
Fig. 2 is the explosive view after level Hermetic Package structure of the present invention encapsulates completely;
Fig. 3 is the structural representation after level Hermetic Package structure of the present invention is uncapped.
Embodiment
As shown in Figure 1, a kind of carbon pin for detecting level Hermetic Package structural deformation amount, described carbon pin 1 is made up of plastic yield material, and described carbon pin 1 is cone-shaped structure, and the height of described carbon pin 1 is greater than the cavity thickness of level Hermetic Package structure to be measured.Consider that carbon pin 1 is ignored to the reacting force of cover plate low maybe can accomplishing of should trying one's best in the process of perception deformation, therefore, carbon pin 1 is designed to coniform shape.
Preferably, described carbon pin 1 is made up less than or equal to the drawing pencil core of B6 hardness or art designing's pencil-lead of high-purity carbon of hardness.Consider that the carbon pin 1 that puts in place almost only should produce plastic deformation in the process of perception cover plate displacement, produce elastic deformation hardly simultaneously.High-carbon core is as the most suitable material of displacement transducer.High-carbon core can select B6 hardness or lower than the drawing pencil core of B6 hardness or art designing's pencil-lead of high-purity carbon.
The manufacturing process of carbon pin 1 is: can make with Handheld rotary type pencil-sharpening device the taper shape that profile compares specification, get off namely to make carbon pin 1 afterwards with scalpel circumgyration incision.Top and the bottom later stage of carbon pin 1 can repair with fine sandpaper, makes to reach satisfied appearance.Carbon pin 1 highly needs to be adjusted to a little more than cavity heights (i.e. visual sealing plane, can see that carbon syringe needle exposes) with sand paper.
Utilize above-mentioned carbon pin to detect a method for level Hermetic Package structural deformation amount, comprise the following steps:
A. before air-tight structure encapsulates completely, described carbon pin 1 is placed on the less side inwall 3 of level Hermetic Package structural deformation amount, needle point expects the location point measured on deformation larger side inwall 2, and carbon pin 1 central shaft is consistent with largest deformation position sense of displacement;
B. when after level Hermetic Package structure experience environmental stress conditions, carry out operation of uncapping, side inwall 2 larger for deformation quantity is removed, during dismounting, should retain an original sealing face 4 of circle;
C. implant point for initial point with precision measuring microscope with carbon pin, measure the height that some position A implanted by the corresponding carbon pin 1 in original sealing face 4 respectively, and the height of carbon pin end face B after air-tight structure experience environmental stress;
D. the height of some position is implanted according to original sealing face correspondence, calculate the end face G height that level Hermetic Package structure encapsulates rear carbon pin 1 completely, be specially: the implantation point A crossing carbon pin 1, and draw x-y coordinate axis along the direction on the long and short limit of level Hermetic Package structure, x-axis and y-axis and the original sealing face 4 of packaging body intersect at C, D, E, F at 4, measure this height value of 4 respectively with above-mentioned precision measuring microscope, average afterwards and be the end face G height that level Hermetic Package structure encapsulates rear carbon pin 1 completely;
E. calculate carbon pin 1 variable, highly deduct the height of the end face B of carbon pin 1 after air-tight structure experience environmental stress with the end face G that level Hermetic Package structure encapsulates rear carbon pin 1 completely, this variable is the deformation quantity of level Hermetic Package structure and this carbon pin 1 corresponding point position.
Concrete:
Carbon pin 1 is fixed on the position wanting to measure cover plate 2 deformation, then cover plate 2 and encapsulating housing is completed sealing.To note in capping procedure: because carbon pin 1 tip portion is soft, object before sealing, can not be had to touch inner carbon pin.Implant the package body structure schematic diagram after a carbon pin 1 as shown in Figure 1.When cover plate 2 has step to the inside, cover-plate step height need be cut in subsequent calculations.
Thinner cover plate 2 structure can cause carbon pin 1 top to be pressed downward out deformation after producing in environmental stress conditions process and sinking.Because the sagging process of cover plate 2 belongs to elastic deformation, off-test back shroud 2 can reply the pattern before test.Carbon pin 1 is being plastic deformation by what produce after pressing, and after off-test, this plastic deformation still can keep.The carbon pin 1 top pattern of capping (needing the original sealing face 4 of reserve part) is removed as shown in Figure 3 by Milling Machining mode after test.
Through measuring successively with measuring microscope and recording the vertical coordinate of the A → B → C → D → E point in Fig. 3 structure after environmental stress conditions terminates, be respectively HA, HB, HC, HD, HE, HF.Wherein A point is positioned at and implants some position root near carbon pin, and its vertical coordinate makes zero by measuring microscope, and B point is the top plan after the pressing of carbon pin.Cross carbon pin 1 set-point A, and draw x-y coordinate axis along the direction on the long and short limit of packaging body, the original cap face of x-axis and y-axis and packaging body intersects at 4 points, is set to C, D, E, F point.
For reducing the measuring error that packaging body bottom surface injustice is brought, the mean value getting HC, HD, HE, HF is approximately equal to the height H G of the distance A point into sealing face.That is: HG=(HC+HD+HE+HF)/4.Therefore, we wish that the carbon core deformation quantity Δ H obtained is the distance of B point distance G point, are Δ H=HG-HB.Also small measuring error can be produced due to during measuring microscope guide rail way moving.Obtain the most accurate measurement result if expect, individual event can move microscope guide rail respectively, measure A → B respectively, the distance of A → C, A → D, A → E, A → F, A point vertical height be reset at every turn.
Carbon pin 1 can not be placed to obtain more data to all positions, only need to set up finite element analysis model, the parameters such as the material properties of the Δ H value revision realistic model recorded with a bit (suggestion is packaging body mid point) and boundary condition, then calculate the deformation quantity of optional position with corrected model.The method can accomplish that settlement efficiency is the highest and results contrast is accurate.
The method uses high-carbon core probe as displacement transducer, and utilize the deformation quantity in the plastic deformation characteristics sign measurement level Hermetic Package structure experience complex environment stress path of its excellence, the measuring microscope of combined high precision carries out distortion measurement.Measurement result precision is high, and process implementing difficulty is low, and implementation cost is cheap, combines can measure the level Hermetic Package structural deformation amount in complex environment stress condition process efficiently and accurately with finite element method.Very important Practical significance is had to needing the user understanding level Hermetic Package product structure reliability.
Claims (3)
1. one kind for detecting the carbon pin of level Hermetic Package structural deformation amount, it is characterized in that: described carbon pin (1) is made up of plastic yield material, described carbon pin (1) is cone-shaped structure, and the height of described carbon pin (1) is greater than the cavity thickness of level Hermetic Package structure to be measured.
2. the carbon pin for detecting level Hermetic Package structural deformation amount according to claim 1, is characterized in that: described carbon pin (1) is made up less than or equal to the drawing pencil core of B6 hardness or art designing's pencil-lead of high-purity carbon of hardness.
3. utilize carbon pin described in claim 1 to detect a method for level Hermetic Package structural deformation amount, it is characterized in that comprising the following steps:
A. before air-tight structure encapsulates completely, described carbon pin (1) is placed on the less side inwall (3) of level Hermetic Package structural deformation amount, needle point is the upper location point expecting to measure towards deformation larger side inwall (2), and carbon pin (1) central shaft is consistent with largest deformation position sense of displacement;
B. when after level Hermetic Package structure experience environmental stress conditions, carry out operation of uncapping, side inwall (2) larger for deformation quantity is removed, during dismounting, should retain an original sealing face of circle (4);
C. implant point for initial point with precision measuring microscope with carbon pin, measure the height that the corresponding carbon pin (1) in original sealing face (4) implants some position (A) respectively, and the height of carbon pin end face (B) after air-tight structure experience environmental stress;
D. the height of some position is implanted according to original sealing face correspondence, calculate level Hermetic Package structure and encapsulate the end face (G) of rear carbon pin (1) completely highly, be specially: the implantation point (A) crossing carbon pin (1), and draw x-y coordinate axis along the direction on the long and short limit of level Hermetic Package structure, x-axis and y-axis and the original sealing face of packaging body (4) intersect at 4 points (C, D, E, F), measure this height value of 4 respectively with above-mentioned precision measuring microscope, averaging afterwards is level Hermetic Package structure and encapsulates the end face (G) of rear carbon pin (1) completely highly;
E. carbon pin (1) variable is calculated, highly deduct the height of the end face (B) of carbon pin (1) after air-tight structure experience environmental stress with the end face (G) that level Hermetic Package structure encapsulates rear carbon pin (1) completely, this variable is the deformation quantity of level Hermetic Package structure and this carbon pin (1) corresponding point position.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510952206.9A CN105423937B (en) | 2015-12-16 | 2015-12-16 | For detecting the carbon pin and its detection method of level Hermetic Package structural deformation amount |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510952206.9A CN105423937B (en) | 2015-12-16 | 2015-12-16 | For detecting the carbon pin and its detection method of level Hermetic Package structural deformation amount |
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| CN105423937A true CN105423937A (en) | 2016-03-23 |
| CN105423937B CN105423937B (en) | 2017-12-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108828267A (en) * | 2018-03-19 | 2018-11-16 | 长江存储科技有限责任公司 | Silicon wafer warpage degree measurement method and device |
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| US5416592A (en) * | 1992-03-23 | 1995-05-16 | Tokyo Electron Kabushiki Kaisha | Probe apparatus for measuring electrical characteristics of objects |
| CN101403680A (en) * | 2008-11-12 | 2009-04-08 | 中国科学院上海光学精密机械研究所 | Beam tracking device of needle scanning atomic force microscope |
| CN102519351A (en) * | 2011-11-16 | 2012-06-27 | 复旦大学 | Method for measuring warpage of electronic packaging product |
| CN202350724U (en) * | 2011-10-26 | 2012-07-25 | 东莞市欣绿医疗科技有限公司 | Measuring device for deformation of micro-pressure spring leaf |
| CN204214387U (en) * | 2014-10-17 | 2015-03-18 | 深圳麦克维尔空调有限公司 | A kind of deformation rate test suite |
-
2015
- 2015-12-16 CN CN201510952206.9A patent/CN105423937B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5416592A (en) * | 1992-03-23 | 1995-05-16 | Tokyo Electron Kabushiki Kaisha | Probe apparatus for measuring electrical characteristics of objects |
| CN101403680A (en) * | 2008-11-12 | 2009-04-08 | 中国科学院上海光学精密机械研究所 | Beam tracking device of needle scanning atomic force microscope |
| CN202350724U (en) * | 2011-10-26 | 2012-07-25 | 东莞市欣绿医疗科技有限公司 | Measuring device for deformation of micro-pressure spring leaf |
| CN102519351A (en) * | 2011-11-16 | 2012-06-27 | 复旦大学 | Method for measuring warpage of electronic packaging product |
| CN204214387U (en) * | 2014-10-17 | 2015-03-18 | 深圳麦克维尔空调有限公司 | A kind of deformation rate test suite |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108828267A (en) * | 2018-03-19 | 2018-11-16 | 长江存储科技有限责任公司 | Silicon wafer warpage degree measurement method and device |
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