CN105415775A - Carbon fiber plate and electronic device - Google Patents
Carbon fiber plate and electronic device Download PDFInfo
- Publication number
- CN105415775A CN105415775A CN201511027762.1A CN201511027762A CN105415775A CN 105415775 A CN105415775 A CN 105415775A CN 201511027762 A CN201511027762 A CN 201511027762A CN 105415775 A CN105415775 A CN 105415775A
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- China
- Prior art keywords
- carbon fiber
- fiber layer
- layer
- fiber board
- layer group
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/20—All layers being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/718—Weight, e.g. weight per square meter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a carbon fiber plate. The carbon fiber plate comprises a first carbon fiber layer set, a middle layer and a second carbon fiber layer set. The middle layer is clamped between the first carbon fiber layer set and the second carbon fiber layer set and is a non-immersed non-woven fabric structural layer. The arrangement directions of carbon fibers of every two adjacent carbon fiber layers in each carbon fiber layer set are perpendicular to each other. The rigidity of the carbon fiber plate can be improved, the thickness of the carbon fiber plate can be reduced on the basis that the requirement of an electronic device for the rigidity of a shell made of the carbon fiber plate is met, the thickness can be set to range from 0.7 mm to 0.9 mm, the thickness and the weight of the carbon fiber plate can be reduced, and light weight and thinning of the electronic device with the shell made of the carbon fiber plate can be achieved. The invention further discloses the electronic device. The shell of the electronic device is made of the carbon fiber plate. The rigidity of the shell can meet use requirements; in addition, the shell is small in thickness and weight, and the requirements of a user for light weight and thinning of the electronic device can be met.
Description
Technical field
The present invention relates to Mechanical Industry Technology field, more particularly, relate to a kind of carbon fiber board, also relate to a kind of electronic equipment.
Background technology
Along with the development of society, electronic equipment is applied to production and the life of people more and more widely.The electronic component that electronic equipment comprises shell and arranges in the enclosure.
At present, electronic equipment housing adopts carbon fiber board more and more, to meet the needs of client.But the density of the common metal shell such as the density of existing carbon fiber board and almag shell is close, but in order to meet the requirement of electronic equipment to shell rigidity, carbon fiber board need be set to more than 1.2mm, cause its thickness and weight all comparatively large, be difficult to meet user to the lightening requirement of electronic equipment.
In sum, how when carbon fiber board meets the rigidity requirement of electronic equipment to shell, reducing thickness and the weight of carbon fiber board, to meet the lightening requirement of the electronic equipment of the shell that the corresponding above-mentioned carbon fiber board of user is made, is those skilled in the art's problem demanding prompt solutions.
Summary of the invention
In view of this, the invention provides a kind of carbon fiber board, intermediate layer adopts the nonwoven fabric construct layer do not infiltrated, and the carbon fibers extend direction of two carbon fiber layers adjacent in the carbon fiber layer group of its both sides is mutually vertical respectively, the rigidity of carbon fiber board is improved, not only can meet the rigidity requirement of electronic equipment, the thickness range of carbon fiber board can also be made to be set to 0.7mm-0.9mm, not only reduce the thickness of carbon fiber board but also alleviate its weight, the electronic equipment being convenient to apply the shell be made up of this carbon fiber board realizes lightening.The present invention also provides a kind of electronic equipment, and it applies the shell that above-mentioned carbon fiber board is made, and the rigidity of shell can meet instructions for use, and lightweight, thickness is thin, facilitates electronic equipment to realize lightening.
For achieving the above object, the invention provides following technical scheme:
A kind of carbon fiber board, comprising: the first carbon fiber layer group, intermediate layer and the second carbon fiber layer group, described intermediate layer is clipped between described first carbon fiber layer group and described second carbon fiber layer group, and described intermediate layer is the nonwoven fabric construct layer do not infiltrated; The carbon fibers extend direction often organizing two-layer carbon fiber layer adjacent in carbon fiber layer group is mutually vertical; The thickness range of described carbon fiber board is 0.7mm-0.9mm.
Preferably, in above-mentioned carbon fiber board, described first carbon fiber layer group and described second carbon fiber layer group are symmetrical arranged along described intermediate layer.
Preferably, in above-mentioned carbon fiber board, in described first carbon fiber layer group, the number of plies of carbon fiber layer is 2.
Preferably, in above-mentioned carbon fiber board, in described first carbon fiber layer group and described second carbon fiber layer group, the carbon fiber that each carbon fiber layer is not less than 475Gpa by stretch modulus is respectively paved into.
Preferably, in above-mentioned carbon fiber board, in described first carbon fiber layer group and described second carbon fiber layer group, all carbon fiber layers all adopt identical carbon fiber to be paved into.
Preferably, in above-mentioned carbon fiber board, in described first carbon fiber layer group and described second carbon fiber layer group, each carbon fiber layer all adopts thermosetting resin impregnation.
Preferably, in above-mentioned carbon fiber board, the nonwoven fabric construct layer that described intermediate layer is made up of random carbon fiber.
Preferably, in above-mentioned carbon fiber board, the thickness of described carbon fiber board is 0.8mm; The thickness range in described intermediate layer is 0.2mm-0.3mm; The density of described carbon fiber board is not more than 1g/cm
3.
Preferably, in above-mentioned carbon fiber board, described carbon fiber board is formed by heat pressing process.
A kind of electronic equipment, comprise shell, described shell is the shell be made up of the carbon fiber board in technique scheme described in any one.
The invention provides a kind of carbon fiber board, it comprises the first carbon fiber layer group, intermediate layer and the second carbon fiber layer group, and intermediate layer is clipped between the first carbon fiber layer group and the second carbon fiber layer group, and intermediate layer is the nonwoven fabric construct layer do not infiltrated; In each group of carbon fiber layer group, the carbon fibers extend direction of two adjacent carbon fiber layers is mutually vertical; The thickness range of this carbon fiber board is 0.7mm-0.9mm.
In carbon fiber board provided by the invention, intermediate layer adopts the nonwoven fabric construct layer that do not infiltrate and is clipped between two groups of carbon fiber layer groups, the carbon fibers extend direction of two-layer carbon fiber layer adjacent in two groups of carbon fiber layer groups is set to mutually vertical respectively, the rigidity of carbon fiber board can be improved, realize meeting electronic equipment on the rigidity requirement basis of the shell be made up of carbon fiber board, reduce the thickness of carbon fiber board, enable to be set to 0.7-0.9mm, alleviate its thickness and weight, the electronic equipment being beneficial to the shell that this carbon fiber board of application is made realizes lightening.
The present invention also provides a kind of electronic equipment, and the shell of this electronic equipment is made up of above-mentioned carbon fiber board, and the rigidity of shell can meet use needs, and outer casing thickness is thin, lightweight, is beneficial to and meets the lightening requirement of user to this electronic equipment.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of the carbon fiber board that Fig. 1 provides for the embodiment of the present invention;
Wherein, in upper Fig. 1:
Carbon fiber layer 101; First carbon fiber layer group 100; Second carbon fiber layer group 200; Intermediate layer 300.
Detailed description of the invention
The embodiment of the invention discloses a kind of carbon fiber board, intermediate layer adopts the nonwoven fabric construct layer do not infiltrated, and the carbon fibers extend direction of two carbon fiber layers adjacent in the carbon fiber layer group of its both sides is mutually vertical respectively, the rigidity of carbon fiber board is improved, not only can meet the rigidity requirement of electronic equipment, the thickness range of carbon fiber board can also be made to be set to 0.7mm-0.9mm, not only reduce the thickness of carbon fiber board but also alleviate its weight, the electronic equipment being convenient to apply the shell be made up of this carbon fiber board realizes lightening.The embodiment of the invention also discloses a kind of electronic equipment, it applies the shell that above-mentioned carbon fiber board is made, and the rigidity of shell can meet instructions for use, and containment weight is light, thickness is thin, facilitates electronic equipment to realize lightening.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the embodiment of the present invention provides a kind of carbon fiber board, it comprises the first carbon fiber layer group 100, intermediate layer 300 and the second carbon fiber layer group 200, intermediate layer 300 is clipped between the first carbon fiber layer group 100 and the second carbon fiber layer group 200, and intermediate layer 300 is the nonwoven fabric construct layer do not infiltrated, the carbon fibers extend direction of the two-layer carbon fiber layer 101 that the carbon fibers extend direction of two-layer carbon fiber layer 101 adjacent in above-mentioned first carbon fiber layer group 100 is mutually adjacent in vertical, the second carbon fiber layer group 200 is mutually vertical; The thickness range of this carbon fiber board is 0.7mm-0.9mm.
In the carbon fiber board that the embodiment of the present invention provides, intermediate layer 300 adopts the nonwoven fabric construct layer do not infiltrated, and intermediate layer 300 is clipped between two groups of carbon fiber layer groups, the carbon fibers extend direction of two-layer carbon fiber layer 101 adjacent in two groups of carbon fiber layer groups is set to mutually vertical, the rigidity of carbon fiber board can be improved, realize meeting electronic equipment on the basis of the rigidity requirement of the shell be made up of carbon fiber board, reduce the thickness of carbon fiber board, enable to be set to 0.7-0.9mm, reduce its weight and thickness, being beneficial to the electronic equipment applying the shell be made up of this carbon fiber board realizes lightening.
Concrete, in above-mentioned carbon fiber board, the carbon fiber of every layer of carbon fiber layer 101 is arranged in the same direction.Further, in above-mentioned carbon fiber board, first carbon fiber layer group 100 and the second carbon fiber layer group 200 are symmetrical arranged along intermediate layer 300, namely in the first carbon fiber layer group 100, the number of plies of carbon fiber layer 101 is identical with the number of plies of carbon fiber in the second carbon fiber layer group 200, and the carbon fibers extend direction of the carbon fiber layer 101 be close to intermediate layer 300 in the first carbon fiber layer group 100, identical with the carbon fibers extend direction of the carbon fiber layer 101 that intermediate layer 300 is close to in the second carbon fiber layer group 200.
In above-mentioned carbon fiber board, in the first carbon fiber layer group 100, the number of plies of carbon fiber layer 101 is 2, and in corresponding second carbon fiber layer group 200, the number of plies of carbon fiber layer 101 is also 2.
Better rigidity is obtained in order to make above-mentioned carbon fiber board, in above-mentioned first carbon fiber layer group 100 and the second carbon fiber layer group 200, the carbon fiber that each carbon fiber layer 101 is not less than 475Gpa by stretch modulus is respectively paved into, specifically can adopt eastern beautiful M50 carbon fiber, or with other carbon fibers of above-mentioned east beautiful M50 carbon fiber ad eundem, the carbon fiber more high-grade than the beautiful M50 in above-mentioned east also can be adopted.
In above-mentioned carbon fiber board, above-mentioned each carbon fiber layer 101 can adopt different carbon fibers to be paved into respectively, and the thickness of corresponding each carbon fiber layer 101 need be set to 0.12mm-0.25mm.Preferably, above-mentioned each carbon fiber layer 101 is set to adopt identical carbon fiber to be paved into.
Concrete, in above-mentioned carbon fiber board, in the first carbon fiber layer group 100 and the second carbon fiber layer group 200, each carbon fiber layer 101 all adopts thermosetting resin impregnation, and epoxy resin specifically can be adopted to carry out impregnation.
In above-mentioned carbon fiber board, the nonwoven fabric construct layer that intermediate layer 300 is made up of random carbon fiber.In addition, in above-mentioned carbon fiber layer, the thickness of carbon fiber board is specially 0.8mm; The thickness range in intermediate layer 300 is 0.2mm-0.3mm; The thickness of above-mentioned each carbon fiber layer 101 is set to 0.12mm; Meanwhile, the density of this carbon fiber board is not more than 1g/cm
3.
As described in the background section, in prior art, the shell of electronic equipment often adopts die-casting die magnesium-aluminum alloy plate to prepare, compared to the above-mentioned magnesium-aluminum alloy plate of stack pile, the rigidity of the carbon fiber board that the present embodiment provides is close with it, but the density of carbon fiber board that the present embodiment provides is less than above-mentioned magnesium-aluminum alloy plate, and (density of magnesium-aluminum alloy plate is about 1.7g/cm
3), weight is lighter, is conducive to the weight reducing electronic equipment.
Concrete, above-mentioned carbon fiber board is the carbon fiber board formed by heat pressing process, and it directly can form the shape of the shell of electronic equipment in hot pressing, directly can be used as the shell of electronic equipment.
The embodiment of the present invention also provides a kind of electronic equipment, and it comprises shell, is the shell that the carbon fiber board provided by above-described embodiment is made.
In the electronic equipment that the present embodiment provides, the rigidity of shell can meet use needs, and outer casing thickness is thin, lightweight, is beneficial to and meets the lightening requirement of user to this electronic equipment.In addition, the electronic equipment that the present embodiment provides also has other effect of the relevant carbon fiber board that above-described embodiment provides, and does not repeat them here.
In this description, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a carbon fiber board, it is characterized in that, comprise: the first carbon fiber layer group, intermediate layer and the second carbon fiber layer group, described intermediate layer is clipped between described first carbon fiber layer group and described second carbon fiber layer group, and described intermediate layer is the nonwoven fabric construct layer do not infiltrated; The carbon fibers extend direction often organizing two-layer carbon fiber layer adjacent in carbon fiber layer group is mutually vertical; The thickness range of described carbon fiber board is 0.7mm-0.9mm.
2. carbon fiber board according to claim 1, is characterized in that, described first carbon fiber layer group and described second carbon fiber layer group are symmetrical arranged along described intermediate layer.
3. carbon fiber board according to claim 2, is characterized in that, in described first carbon fiber layer group, the number of plies of carbon fiber layer is 2.
4. carbon fiber board according to claim 1, is characterized in that, in described first carbon fiber layer group and described second carbon fiber layer group, the carbon fiber that each carbon fiber layer is not less than 475Gpa by stretch modulus is respectively paved into.
5. carbon fiber board according to claim 4, is characterized in that, in described first carbon fiber layer group and described second carbon fiber layer group, all carbon fiber layers all adopt identical carbon fiber to be paved into.
6. carbon fiber board according to claim 1, is characterized in that, in described first carbon fiber layer group and described second carbon fiber layer group, each carbon fiber layer all adopts thermosetting resin impregnation.
7. carbon fiber board according to claim 1, is characterized in that, the nonwoven fabric construct layer that described intermediate layer is made up of random carbon fiber.
8. the carbon fiber board according to claim 1-7 any one, is characterized in that, the thickness of described carbon fiber board is 0.8mm; The thickness range in described intermediate layer is 0.2mm-0.3mm; The density of described carbon fiber board is not more than 1g/cm
3.
9. carbon fiber board according to claim 1, is characterized in that, described carbon fiber board is formed by heat pressing process.
10. an electronic equipment, comprises shell, it is characterized in that, described shell is the shell be made up of the carbon fiber board described in claim 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027762.1A CN105415775A (en) | 2015-12-30 | 2015-12-30 | Carbon fiber plate and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027762.1A CN105415775A (en) | 2015-12-30 | 2015-12-30 | Carbon fiber plate and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105415775A true CN105415775A (en) | 2016-03-23 |
Family
ID=55494515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511027762.1A Pending CN105415775A (en) | 2015-12-30 | 2015-12-30 | Carbon fiber plate and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105415775A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017219514A1 (en) * | 2016-06-23 | 2017-12-28 | 合一智能科技（深圳）有限公司 | Television back panel and television |
| CN109109336A (en) * | 2018-08-24 | 2019-01-01 | 蔚来汽车有限公司 | The production method of vehicle and its supporting member and supporting member |
| CN109278773A (en) * | 2018-11-22 | 2019-01-29 | 南京雷尔伟新技术股份有限公司 | A kind of floating floor and its technique for sticking |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05269909A (en) * | 1992-03-30 | 1993-10-19 | Aisin Seiki Co Ltd | Fiber reinforced resin molded product |
| CN101181828A (en) * | 2002-07-18 | 2008-05-21 | 三菱丽阳株式会社 | Intermediate material for forming FRP, and method for production thereof |
| US20140087178A1 (en) * | 2011-03-30 | 2014-03-27 | Toray Industries, Inc. | Prepreg, fiber reinforced composite material, and manufacturing method for fiber reinforced composite material |
| JP2015085613A (en) * | 2013-10-31 | 2015-05-07 | 東レ株式会社 | Integrally molded body and method for producing the same |
-
2015
- 2015-12-30 CN CN201511027762.1A patent/CN105415775A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05269909A (en) * | 1992-03-30 | 1993-10-19 | Aisin Seiki Co Ltd | Fiber reinforced resin molded product |
| CN101181828A (en) * | 2002-07-18 | 2008-05-21 | 三菱丽阳株式会社 | Intermediate material for forming FRP, and method for production thereof |
| US20140087178A1 (en) * | 2011-03-30 | 2014-03-27 | Toray Industries, Inc. | Prepreg, fiber reinforced composite material, and manufacturing method for fiber reinforced composite material |
| JP2015085613A (en) * | 2013-10-31 | 2015-05-07 | 東レ株式会社 | Integrally molded body and method for producing the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017219514A1 (en) * | 2016-06-23 | 2017-12-28 | 合一智能科技（深圳）有限公司 | Television back panel and television |
| CN109109336A (en) * | 2018-08-24 | 2019-01-01 | 蔚来汽车有限公司 | The production method of vehicle and its supporting member and supporting member |
| CN109278773A (en) * | 2018-11-22 | 2019-01-29 | 南京雷尔伟新技术股份有限公司 | A kind of floating floor and its technique for sticking |
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Application publication date: 20160323 |
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