CN105401124A - Machining method for film plating of cutting mould - Google Patents

Machining method for film plating of cutting mould Download PDF

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Publication number
CN105401124A
CN105401124A CN201510791157.5A CN201510791157A CN105401124A CN 105401124 A CN105401124 A CN 105401124A CN 201510791157 A CN201510791157 A CN 201510791157A CN 105401124 A CN105401124 A CN 105401124A
Authority
CN
China
Prior art keywords
cutting die
plated film
film
carried out
coated surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510791157.5A
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Chinese (zh)
Inventor
王春生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Anjie Technology Co Ltd
Original Assignee
Suzhou Anjie Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Anjie Technology Co Ltd filed Critical Suzhou Anjie Technology Co Ltd
Priority to CN201510791157.5A priority Critical patent/CN105401124A/en
Publication of CN105401124A publication Critical patent/CN105401124A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention provides a machining method for film plating of a cutting mould. A layer of thin film is plated on the surface of the cutting mould, so that the effects of protection and adhesive resistance are achieved; the thin film is resistant to adhesive, so that the adhesion rate is decreased; the maintaining frequency and replacement frequency are decreased and the cost is reduced by means of the thin film. The qualified rate of produced products is increased by means of the cutting mould machined through the method. The surface without the need for film plating of the cutting mould is attached to a film plating umbrella, then the surface needing film plating of the cutting mould is cleaned, the whole film plating umbrella is put on an umbrella stand of a film plating machine, and the film is plated on the surface needing film plating of the cutting mould through the film plating machine.

Description

A kind of working method of cutting die being carried out to plated film
Technical field
The present invention relates to the technical field of cutter die structure, be specially a kind of working method of cutting die being carried out to plated film.
Background technology
Along with the popularization gradually of existing electronic product, increasing smart mobile phone and panel computer appear in the life of people.These electronic products have the parts needing cutting die to process, and make the demand of cross cutting increasing.The viscose of not timing can be produced thus the decreasing efficiency of product, fraction defective improve in cutting die use procedure; So need safeguarding cutting die of not timing.Along with the puzzlement of these problems, special process is carried out to cutting die, make to reach better result of use.Carry out anti-fingerprint process on the surface of cutting die, thus cutting die not viscose can be avoided.But the loss in use of the cutting die after surface treatment is unavoidable, so maintenance and reprocessing use regularly will be carried out.
Summary of the invention
For the problems referred to above; the invention provides a kind of working method of cutting die being carried out to plated film; it is at cutting die plated surface thin film; thus reach the effect of protection and anti-viscose, the anti-viscose of film, thus viscose rate reduces; and film makes the frequency of maintenance and changes operating speed to reduce; cost reduction, and adopt the cutting die after the method, the yield of institute's output product have also been obtained lifting.
A kind of working method of cutting die being carried out to plated film, it is characterized in that: after the non-coated surface of cutting die is adsorbed on plated film parachute kit, surface cleaning is carried out to the coated surface of cutting die, is positioned on coating equipment umbrella stand by whole for plated film parachute kit afterwards, by coating equipment, plated film is carried out to the coated surface of cutting die.
It is further characterized in that:
Its concrete operation step is as follows:
A covers protective membrane: be fitted in by the non-coated surface of cutting die on protection face;
B is adsorbed in umbrella stand: be adsorbed on above plated film parachute kit with magnet by the protective membrane posting cutting die;
C electrostatic precipitation: the coated surface surface cleaning cutting die with electrostatic precipitation rifle;
D is added: put into by the parachute kit posting cutting die on coating equipment umbrella stand;
E feeds intake, vacuumize: in coating equipment, drop into plated film starting material, vacuumize plated film work area simultaneously;
F plated film: coating equipment to spraying of material on the parachute kit posting cutting die, carry out plated film, form film at the coated surface of cutting die;
G undercarriage: taken off by parachute kit after plated film terminates, is positioned on bracket, takes off the product after plated film.
It is further characterised in that:
Starting material in step e are specially silica crystals, AF fluorochemical, and wherein AF fluorochemical input amount is AF medicine 9080 stoves, and all the other are silica crystals;
The thickness of the film that step f is formed is 50nm ~ 55nm;
Coating temperature when step f carries out is 120 DEG C, and the time is half an hour, guarantees carrying out smoothly of plated film.
After adopting the present invention, it is at cutting die plated surface thin film, thus reach the effect of protection and anti-viscose, the anti-viscose of film, thus viscose rate reduces, and film makes the frequency of maintenance and changes operating speed to reduce, cost reduction, and the cutting die after employing the method, the yield of institute's output product have also been obtained lifting; To sum up, it is by reaching the anti-viscose of anti-fingerprint to cutting die surface treatment, thus reach cutting die anti-fingerprint, not viscose, processing is quick, cost of manufacture is low, the advantage of long service life.
Accompanying drawing explanation
Fig. 1 is the structural representation after cutting die plated film of the present invention;
Reference name in figure corresponding to each sequence number is as follows:
Cutting die 1, knife edge viscose glue scope 2, film 3.
Embodiment
A kind of working method of cutting die being carried out to plated film, after the non-coated surface of cutting die is adsorbed on plated film parachute kit, surface cleaning is carried out to the coated surface of cutting die, is positioned on coating equipment umbrella stand by whole for plated film parachute kit afterwards, by coating equipment, plated film is carried out to the coated surface of cutting die.
Its concrete operation step is as follows:
A covers protective membrane: be fitted in by the non-coated surface of cutting die on protection face;
B is adsorbed in umbrella stand: be adsorbed on above plated film parachute kit with magnet by the protective membrane posting cutting die;
C electrostatic precipitation: the coated surface surface cleaning cutting die with electrostatic precipitation rifle;
D is added: put into by the parachute kit posting cutting die on coating equipment umbrella stand;
E feeds intake, vacuumize: in coating equipment, drop into plated film starting material, vacuumize plated film work area simultaneously;
F plated film: coating equipment to spraying of material on the parachute kit posting cutting die, carry out plated film, form film at the coated surface of cutting die;
G undercarriage: taken off by parachute kit after plated film terminates, is positioned on bracket, takes off the product after plated film.
Starting material in step e are specially silica crystals, AF fluorochemical, and wherein AF fluorochemical input amount is AF medicine 9080 stoves, and all the other are silica crystals;
The thickness of the film that step f is formed is 50nm ~ 55nm;
Coating temperature when step f carries out is 120 DEG C, and the time is half an hour, guarantees carrying out smoothly of plated film.
By reaching the method for the anti-viscose of anti-fingerprint to cutting die surface treatment, to reach cutting die anti-fingerprint, not viscose, the advantage such as processing is quick, cost of manufacture is low, long service life.
Structure after cutting die plated film is shown in Fig. 1, the knife edge viscose glue scope 2 of cutting die 1 and cutting die 1 just film 3 has all been plated to the region of product, the thickness of film 3 is 50nm ~ 55nm.
Above specific embodiments of the invention have been described in detail, but content being only the preferred embodiment of the invention, the practical range for limiting the invention can not being considered to.All equalizations done according to the invention application range change and improve, and all should still belong within patent covering scope of the present invention.

Claims (5)

1. one kind is carried out the working method of plated film to cutting die, it is characterized in that: after the non-coated surface of cutting die is adsorbed on plated film parachute kit, surface cleaning is carried out to the coated surface of cutting die, is positioned on coating equipment umbrella stand by whole for plated film parachute kit afterwards, by coating equipment, plated film is carried out to the coated surface of cutting die.
2. a kind of working method of cutting die being carried out to plated film as claimed in claim 1, is characterized in that:
Its concrete operation step is as follows:
A covers protective membrane: be fitted in by the non-coated surface of cutting die on protection face;
B is adsorbed in umbrella stand: be adsorbed on above plated film parachute kit with magnet by the protective membrane posting cutting die;
C electrostatic precipitation: the coated surface surface cleaning cutting die with electrostatic precipitation rifle;
D is added: put into by the parachute kit posting cutting die on coating equipment umbrella stand;
E feeds intake, vacuumize: in coating equipment, drop into plated film starting material, vacuumize plated film work area simultaneously;
F plated film: coating equipment to spraying of material on the parachute kit posting cutting die, carry out plated film, form film at the coated surface of cutting die;
G undercarriage: taken off by parachute kit after plated film terminates, is positioned on bracket, takes off the product after plated film.
3. a kind of working method of cutting die being carried out to plated film as claimed in claim 2, it is characterized in that: the starting material in step e are specially silica crystals, AF fluorochemical, wherein AF fluorochemical input amount is AF medicine 9080 stoves, and all the other are silica crystals.
4. a kind of working method of cutting die being carried out to plated film as claimed in claim 2, is characterized in that: the thickness of the film that step f is formed is 50nm ~ 55nm.
5. a kind of working method of cutting die being carried out to plated film as claimed in claim 2, it is characterized in that: coating temperature when step f carries out is 120 DEG C, the time is half an hour.
CN201510791157.5A 2015-11-17 2015-11-17 Machining method for film plating of cutting mould Pending CN105401124A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510791157.5A CN105401124A (en) 2015-11-17 2015-11-17 Machining method for film plating of cutting mould

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510791157.5A CN105401124A (en) 2015-11-17 2015-11-17 Machining method for film plating of cutting mould

Publications (1)

Publication Number Publication Date
CN105401124A true CN105401124A (en) 2016-03-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510791157.5A Pending CN105401124A (en) 2015-11-17 2015-11-17 Machining method for film plating of cutting mould

Country Status (1)

Country Link
CN (1) CN105401124A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003321763A (en) * 2002-04-26 2003-11-14 Toshiba Tungaloy Co Ltd Coated member
CN202088220U (en) * 2011-05-19 2011-12-28 成都斯锐特钨钢刀具有限公司 Cutter capable of preventing adhesion
CN102787099A (en) * 2012-01-20 2012-11-21 宁波大学 Chick embryo culture method for White spot syndrome virus
CN102808148A (en) * 2011-05-30 2012-12-05 比亚迪股份有限公司 Preparation method for touch screen surface anti-fingerprint film
CN103744132A (en) * 2014-01-28 2014-04-23 张家港康得新光电材料有限公司 Anti-reflection structure and anti-reflection film
CN204039529U (en) * 2014-05-06 2014-12-24 深圳市联懋塑胶有限公司 Can the fixing optical coating plating umbrella of magnetic adhesive plaster
CN104849778A (en) * 2014-02-17 2015-08-19 上海雄汉实业有限公司 Preparation method for built-in CCD security and protection monitoring optical filter

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003321763A (en) * 2002-04-26 2003-11-14 Toshiba Tungaloy Co Ltd Coated member
CN202088220U (en) * 2011-05-19 2011-12-28 成都斯锐特钨钢刀具有限公司 Cutter capable of preventing adhesion
CN102808148A (en) * 2011-05-30 2012-12-05 比亚迪股份有限公司 Preparation method for touch screen surface anti-fingerprint film
CN102787099A (en) * 2012-01-20 2012-11-21 宁波大学 Chick embryo culture method for White spot syndrome virus
CN103744132A (en) * 2014-01-28 2014-04-23 张家港康得新光电材料有限公司 Anti-reflection structure and anti-reflection film
CN104849778A (en) * 2014-02-17 2015-08-19 上海雄汉实业有限公司 Preparation method for built-in CCD security and protection monitoring optical filter
CN204039529U (en) * 2014-05-06 2014-12-24 深圳市联懋塑胶有限公司 Can the fixing optical coating plating umbrella of magnetic adhesive plaster

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Application publication date: 20160316

RJ01 Rejection of invention patent application after publication