CN105400468A - Preparation method of high-bonding-strength low-formaldehyde-emission adhesive used for glued boards - Google Patents
Preparation method of high-bonding-strength low-formaldehyde-emission adhesive used for glued boards Download PDFInfo
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- CN105400468A CN105400468A CN201510952272.6A CN201510952272A CN105400468A CN 105400468 A CN105400468 A CN 105400468A CN 201510952272 A CN201510952272 A CN 201510952272A CN 105400468 A CN105400468 A CN 105400468A
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- Prior art keywords
- preparation
- methanal
- sizing agent
- burst size
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/30—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic and acyclic or carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G12/00—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08G12/02—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes
- C08G12/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08G12/34—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds and acyclic or carbocyclic compounds
- C08G12/36—Ureas; Thioureas
- C08G12/38—Ureas; Thioureas and melamines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a preparation method of a high-bonding-strength low-formaldehyde-emission adhesive used for glued boards. The preparation method comprises following steps: (1) primary raw material mixing; (2) addition reaction; (3) secondary raw material mixing; (4) condensation polymerization; and (5) obtaining of a finished product. The preparation method is simple and convenient; reasonable formula design is capable of increasing binding strength and mechanical strength of the high-bonding-strength low-formaldehyde-emission adhesive, and improving performance of conventional adhesive completely; and the binding strength of the high-bonding-strength low-formaldehyde-emission adhesive is capable of reaching standards of II-type glued boards, formaldehyde emission is capable of reaching E0 grade, and comprehensive properties are excellent.
Description
Technical field
The present invention relates to sizing agent field, particularly relate to a kind of preparation method of glued board high-adhesion low burst size of methanal sizing agent.
Background technology
Along with the develop rapidly of China's timber industry, now become the first big country of world's Wood-based Panel Production.Present Domestic wood industry glue adopts urea-formaldehyde glue, phenolic glue, melamino-formaldehyde glue and polyvinyl acetate glue mostly, their bonding strengths are poor, bonding plane is hard, crisp, immalleable, non-watertight, not resistance toly wait so long, and poisonous, contaminate environment, has peppery eye and pungent smell.In various tackiness agent, the over-all properties of urea-formaldehyde resin adhesive is best, and have and manufacture simply, curing speed is fast, cheap, easy construction, cohesive strength advantages of higher, is widely used in creating card, glued board, core-board, the material such as casting sand type connects, and is the maximum industrial adhesive of market demand amount.But this kind of sizing agent is usually by formaldehyde and urea synthesis, and formaldehyde content is higher, uses dangerous.
At present, industry reduces the content of formaldehyde in Derlin by various mode, mainly by adding formaldehyde-trapping agent or other have the material catching formaldehyde performance and reduce formaldehyde content.But these Improving ways not only increase difficulty and the cost of technique, and fundamentally can not solve the high problem of formaldehyde content.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of preparation method of glued board high-adhesion low burst size of methanal sizing agent, fundamentally can reduce formaldehyde content.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the preparation method providing a kind of glued board high-adhesion low burst size of methanal sizing agent, comprises the steps:
(1) primary material mixing: under room temperature, getting weight part is that the oxalic dialdehyde of 100 ~ 200 parts adds in the reactor of band heated and stirred function, add basic solution and regulate its pH value to 9 ~ 9.5, then add the strengthening agent that weight part is the urea of 50 ~ 80 parts, the thread polyvinyl alcohol of 20 ~ 30 parts and 5 ~ 10 parts, then stir 30 ~ 60min to evenly;
(2) addition reaction: the uniform mixture obtained in step (1) is heated to temperature t1, constant temperature stirring reaction certain hour, obtains addition reaction mixture;
(3) secondary raw material mixing: add the tackifier that weight part is the trimeric cyanamide of 8 ~ 12 parts, the water-proofing agent of 5 ~ 10 parts and 1 ~ 3 part in the addition reaction mixture obtained in step (2), be uniformly mixed;
(4) polycondensation: add acidic solution in the mixture obtained in step (3), regulate its pH value to be 3 ~ 3.5, be then warming up to temperature t2, constant temperature is stirred to reaction to be terminated;
(5) finished product: the reaction product in step (4) is cooled to room temperature, adds the basic solution identical with step (1), regulates the pH value of reactant to neutral, obtains described glued board high-adhesion low burst size of methanal sizing agent.
In a preferred embodiment of the present invention, in described step (1), described basic solution to be massfraction concentration be 25 ~ 30% sodium hydroxide solution or potassium hydroxide solution.
In a preferred embodiment of the present invention, in described step (2), described temperature t1 is 55 ~ 60 DEG C, and the described reaction times is 1 ~ 3h.
In a preferred embodiment of the present invention, in described step (3), described water-proofing agent is epoxy resin; Described tackifier are borax.
In a preferred embodiment of the present invention, in described step (4), described acidic solution to be massfraction concentration be 15 ~ 18% formic acid or hydrochloric acid.
In a preferred embodiment of the present invention, in described step (4), described temperature t2 is 75 ~ 90 DEG C, and the described reaction times is 40 ~ 90min.
The invention has the beneficial effects as follows: the preparation method of a kind of glued board high-adhesion of the present invention low burst size of methanal sizing agent, technique is simple, and easily realize, it is by rational formulating of recipe, improve viscosity intensity and the physical strength of sizing agent, improve the performance of existing sizing agent comprehensively; The cohesive strength of prepared sizing agent reaches the standard of II class glued board, and burst size of methanal reaches EO level level, excellent combination property.
Embodiment
Below preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
The embodiment of the present invention comprises:
Embodiment 1
A preparation method for glued board high-adhesion low burst size of methanal sizing agent, comprises the steps:
(1) primary material mixing: under room temperature, getting weight part is that the oxalic dialdehyde of 100 parts adds in the reactor of band heated and stirred function, add massfraction concentration be 25 ~ 30% sodium hydroxide solution regulate its pH value to 9, then add the strengthening agent that weight part is the urea of 50 parts, the thread polyvinyl alcohol of 20 parts and 5 parts, then stir 30min to evenly with the speed of 50r/min;
(2) addition reaction: the uniform mixture obtained in step (1) is heated to temperature 55 DEG C, constant temperature stirring reaction 1h, obtains addition reaction mixture;
(3) secondary raw material mixing: add the borax that weight part is the trimeric cyanamide of 8 parts, the epoxy resin of 5 parts and 1 part in the addition reaction mixture obtained in step (2), be uniformly mixed;
(4) polycondensation: add the formic acid that massfraction concentration is 15 ~ 18% in the mixture obtained in step (3), regulates its pH value to be 3, is then warming up to temperature 75 DEG C, constant temperature stirring reaction 40min;
(5) finished product: the reaction product in step (4) is cooled to room temperature, adds the basic solution identical with step (1), regulates the pH value of reactant to neutral, obtains described glued board high-adhesion low burst size of methanal sizing agent.
Embodiment 2
A preparation method for glued board high-adhesion low burst size of methanal sizing agent, comprises the steps:
(1) primary material mixing: under room temperature, getting weight part is that the oxalic dialdehyde of 200 parts adds in the reactor of band heated and stirred function, add massfraction concentration be 25 ~ 30% sodium hydroxide solution regulate its pH value to 9.5, then add the strengthening agent that weight part is the urea of 80 parts, the thread polyvinyl alcohol of 30 parts and 10 parts, then stir 60min to evenly with the speed of 80r/min;
(2) addition reaction: the uniform mixture obtained in step (1) is heated to temperature 60 C, constant temperature stirring reaction 3h, obtains addition reaction mixture;
(3) secondary raw material mixing: add the borax that weight part is the trimeric cyanamide of 12 parts, the epoxy resin of 10 parts and 3 parts in the addition reaction mixture obtained in step (2), be uniformly mixed;
(4) polycondensation: add formic acid or the hydrochloric acid that massfraction concentration is 18% in the mixture obtained in step (3), regulates its pH value to be 3.5, is then warming up to temperature 90 DEG C, constant temperature stirring reaction 90min;
(5) finished product: the reaction product in step (4) is cooled to room temperature, adds the basic solution identical with step (1), regulates the pH value of reactant to neutral, obtains described glued board high-adhesion low burst size of methanal sizing agent.
Aforesaid method replaces Formaldehyde Production sizing agent with oxalic dialdehyde, fundamentally solves the problem that sizing agent burst size of methanal is large; Simultaneously according to rational formulating of recipe, improve viscosity intensity and the physical strength of sizing agent, improve the performance of existing sizing agent comprehensively.After tested, prepared sizing agent performance is: viscosity 90 ~ 100mPas, solid content 50 ~ 55%, set time 85 ~ 98s, cohesive strength is 3.5 ~ 5MPa, and free formaldehyde content is lower than 0.08%; Cohesive strength reaches the standard of II class glued board, and burst size of methanal can reach EO level level.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. a glued board preparation method for high-adhesion low burst size of methanal sizing agent, is characterized in that, comprise the steps:
(1) primary material mixing: under room temperature, getting weight part is that the oxalic dialdehyde of 100 ~ 200 parts adds in the reactor of band heated and stirred function, add basic solution and regulate its pH value to 9 ~ 9.5, then add the strengthening agent that weight part is the urea of 50 ~ 80 parts, the thread polyvinyl alcohol of 20 ~ 30 parts and 5 ~ 10 parts, then stir 30 ~ 60min to evenly;
(2) addition reaction: the uniform mixture obtained in step (1) is heated to temperature t1, constant temperature stirring reaction certain hour, obtains addition reaction mixture;
(3) secondary raw material mixing: add the tackifier that weight part is the trimeric cyanamide of 8 ~ 12 parts, the water-proofing agent of 5 ~ 10 parts and 1 ~ 3 part in the addition reaction mixture obtained in step (2), be uniformly mixed;
(4) polycondensation: add acidic solution in the mixture obtained in step (3), regulate its pH value to be 3 ~ 3.5, be then warming up to temperature t2, constant temperature is stirred to reaction to be terminated;
(5) finished product: the reaction product in step (4) is cooled to room temperature, adds the basic solution identical with step (1), regulates the pH value of reactant to neutral, obtains described glued board high-adhesion low burst size of methanal sizing agent.
2. the preparation method of glued board high-adhesion low burst size of methanal sizing agent according to claim 1, is characterized in that, in described step (1), described basic solution to be massfraction concentration be 25 ~ 30% sodium hydroxide solution or potassium hydroxide solution.
3. the preparation method of glued board high-adhesion low burst size of methanal sizing agent according to claim 1, is characterized in that, in described step (2), described temperature t1 is 55 ~ 60 DEG C, and the described reaction times is 1 ~ 3h.
4. the preparation method of glued board high-adhesion low burst size of methanal sizing agent according to claim 1, is characterized in that, in described step (3), described water-proofing agent is epoxy resin; Described tackifier are borax.
5. the preparation method of glued board high-adhesion low burst size of methanal sizing agent according to claim 1, is characterized in that, in described step (4), described acidic solution to be massfraction concentration be 15 ~ 18% formic acid or hydrochloric acid.
6. the preparation method of glued board high-adhesion low burst size of methanal sizing agent according to claim 1, is characterized in that, in described step (4), described temperature t2 is 75 ~ 90 DEG C, and the described reaction times is 40 ~ 90min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510952272.6A CN105400468A (en) | 2015-12-18 | 2015-12-18 | Preparation method of high-bonding-strength low-formaldehyde-emission adhesive used for glued boards |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510952272.6A CN105400468A (en) | 2015-12-18 | 2015-12-18 | Preparation method of high-bonding-strength low-formaldehyde-emission adhesive used for glued boards |
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| CN105400468A true CN105400468A (en) | 2016-03-16 |
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| CN201510952272.6A Pending CN105400468A (en) | 2015-12-18 | 2015-12-18 | Preparation method of high-bonding-strength low-formaldehyde-emission adhesive used for glued boards |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106186243A (en) * | 2016-06-30 | 2016-12-07 | 广州振清环保技术有限公司 | A kind of formaldehydeless cationic coagulant and its preparation method and application |
Citations (5)
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|---|---|---|---|---|
| US4395504A (en) * | 1982-09-07 | 1983-07-26 | Sun Chemical Corporation | Adhesive system for particleboard manufacture |
| CN102229791A (en) * | 2011-06-14 | 2011-11-02 | 王喆 | Environment-friendly type urea-formaldehyde resin adhesive and production method thereof |
| CN102838956A (en) * | 2012-07-04 | 2012-12-26 | 湖北省宏源药业有限公司 | Environment-friendly urea resin adhesive and preparation method thereof |
| CN103305168A (en) * | 2013-07-02 | 2013-09-18 | 西南林业大学 | Resin adhesive free from formaldehyde release as well as preparation method and application thereof |
| CN104311767A (en) * | 2014-10-10 | 2015-01-28 | 湖北省宏源药业科技股份有限公司 | Modified urea-formaldehyde resin adhesive and preparation method thereof |
-
2015
- 2015-12-18 CN CN201510952272.6A patent/CN105400468A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4395504A (en) * | 1982-09-07 | 1983-07-26 | Sun Chemical Corporation | Adhesive system for particleboard manufacture |
| CN102229791A (en) * | 2011-06-14 | 2011-11-02 | 王喆 | Environment-friendly type urea-formaldehyde resin adhesive and production method thereof |
| CN102838956A (en) * | 2012-07-04 | 2012-12-26 | 湖北省宏源药业有限公司 | Environment-friendly urea resin adhesive and preparation method thereof |
| CN103305168A (en) * | 2013-07-02 | 2013-09-18 | 西南林业大学 | Resin adhesive free from formaldehyde release as well as preparation method and application thereof |
| CN104311767A (en) * | 2014-10-10 | 2015-01-28 | 湖北省宏源药业科技股份有限公司 | Modified urea-formaldehyde resin adhesive and preparation method thereof |
Non-Patent Citations (2)
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| 李东光: "《脲醛树脂胶黏剂》", 31 August 2002, 化学工业出版社 * |
| 顾继友: "《胶黏剂与涂料》", 30 September 2012, 中国林业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106186243A (en) * | 2016-06-30 | 2016-12-07 | 广州振清环保技术有限公司 | A kind of formaldehydeless cationic coagulant and its preparation method and application |
| CN106186243B (en) * | 2016-06-30 | 2019-05-31 | 广州振清环保技术有限公司 | A kind of formaldehydeless cationic coagulant and its preparation method and application |
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Application publication date: 20160316 |