CN105392747A - Methods for processing a thin flexible glass substrate with a glass carrier - Google Patents
Methods for processing a thin flexible glass substrate with a glass carrier Download PDFInfo
- Publication number
- CN105392747A CN105392747A CN201480041042.8A CN201480041042A CN105392747A CN 105392747 A CN105392747 A CN 105392747A CN 201480041042 A CN201480041042 A CN 201480041042A CN 105392747 A CN105392747 A CN 105392747A
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- CN
- China
- Prior art keywords
- glass
- glass carrier
- thin flexible
- base material
- ammonium fluoride
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
Abstract
A method of processing a thin flexible glass substrate is provided. The method may include the steps of (I) providing the glass carrier including a release area and a mount area; then (II) providing the release area of the glass carrier with a textured surface by contacting an etchant including an ammonium fluoride mixture to the release area for a period; then (III) removing the etchant from the glass carrier; and then (IV) bonding a mount area of the thin flexible glass substrate to the mount area of the glass carrier. The textured surface prevents a target area of the thin flexible glass substrate from bonding to the release area of the glass carrier.
Description
This application claims the right of priority of the U.S. Provisional Application Ser numbers 61/826,181 submitted to on 05 22nd, 2013, based on the content of this application, be intactly incorporated into this by reference to by it herein.
Field
Description below relates to the method using glass carrier to process thin flexible glass base material, specifically, relates to the method using the glass carrier with texturizing surfaces to process thin flexible glass base material.
Background
Flexible parent metal appear as manufacture thinner, cost that lighter, more flexible and more durable indicating meter and reduction comprise the device of this indicating meter provides hope.Therefore, concentrate in the past develop make can on the existing suite of equipment being designed for the large glass sheet of processing the solution of manufacturing flexible base material.One of these solutions comprise flexible parent metal are laminated to glass carrier, make to be used in sheet material on existing suite of equipment-manufacture the display equipment with flexible parent metal to-sheet material technique thus.In glass-and-associated exemplary of glass combined process, can form the release areas of glass carrier within the circumference combined, it is designed to not be combined or have the region seldom combined with thin flexible glass base material.The mode forming the release areas of glass carrier can be the surfaceness increasing release areas.Therefore, this area needs a kind of method, can carry out to the release areas of glass carrier the combination that veining suppresses itself and the thin a certain region of flexible glass base material by the method, allow the installation region of glass carrier to be attached to the installation region of thin flexible glass base material simultaneously.
General introduction
In the embodiments described herein, use ammonium fluoride mixture as etching reagent, wet chemical etching process is carried out to glass carrier, this glass carrier is provided for processing thin flexible glass base material subsequently.This method is suitable for carrying out veining to the release areas of glass carrier, and this glass carrier is used as rigid substrate to support thin flexible glass base material in the liquid-crystal display (LCD) processing the display equipment for including but not limited to mobile phone, panel computer and TV and Organic Light Emitting Diode (OLED) process.The concentration that can change ammonium fluoride mixture and the time being exposed to ammonium fluoride mixture prepare the glass carrier with release areas, and this release areas has different texture level.Ammonium fluoride mixture can be solvable, makes the installation region that the installation region of glass carrier hermetic can be encapsulated into thin flexible glass base material thus.In addition, compared with conventional hydrofluoric acid, it is usually safer and easier that ammonium fluoride mixture is used as etching reagent.
In a first aspect, a kind of method using glass carrier to process thin flexible glass base material comprises the steps: that (I) providing package contains the glass carrier of release areas and installation region; Then (II) to be contacted with release areas certain hour section by the etching reagent that makes to comprise ammonium fluoride mixture, and the release areas for glass carrier provides texturizing surfaces; Then (III) removes etching reagent from glass carrier; Then the installation region of thin flexible glass base material is attached to the installation region of glass carrier by (IV).Texturizing surfaces prevents the target area of thin flexible glass base material to be attached to the release areas of glass carrier.
In an embodiment of first aspect, time period of step (II) is about 1 minute-Yue 10 minutes.
In another embodiment of first aspect, step (II) provides rms surface roughness to be the texturizing surfaces that about 3nm-is about 232nm.
Again in another embodiment of first aspect, step (II) provides rms surface roughness to be greater than about 2nm and is equal to or less than the texturizing surfaces of about 6nm.
Again in another embodiment of first aspect, the etching reagent of step (II) is made up of following substances: ammonium fluoride mixture, and this ammonium fluoride mixture is made up of following substances: the ammonium fluoride solution in Glacial acetic acid.
In other embodiment of first aspect, the concentration of ammonium fluoride solution is about 4%-about 20%.
In other embodiment of first aspect, the ammonium fluoride solution of step (II) is the ammonium fluoride aqueous solution of about 40%.
Again in other embodiment of first aspect, after step (I) and before step (II), described method also comprises the steps: installation region mask being applied to glass carrier.In step (II), mask prevents etching reagent from contacting the installation region of glass carrier.
In another embodiment of first aspect, mask comprises adhesivity film.
Again in another embodiment of first aspect, the release areas that step (II) is included in glass carrier prints etching reagent.
Again in another embodiment of first aspect, silk screen printing or stencil printing etching reagent in the release areas that step (II) is included in glass carrier.
In other embodiment of first aspect, step (II) applies etching reagent with the form of gel etching reagent.
Again in other embodiment of first aspect, gel etching reagent is made up of following substances: ammonium fluoride mixture and thickening material, and this ammonium fluoride mixture is made up of following substances: the ammonium fluoride solution in Glacial acetic acid.
In other embodiment of first aspect, the concentration of ammonium fluoride solution is about 13%-about 20%.
In another embodiment of first aspect, ammonium fluoride solution is the ammonium fluoride aqueous solution of 40%.
Again in another embodiment of first aspect, step (III) comprises falls etching reagent from glass carrier drip washing, then dry glass carrier.
Again in another embodiment of first aspect, etching reagent is made up of following substances: solvable chemical substance.
In other embodiment of first aspect, after step (IV), the method also comprises following step (V): the installation region of removing thin flexible glass base material from the target area of thin flexible glass base material, thus the target area discharging thin flexible glass base material from glass carrier.
Again in other embodiment of first aspect, after step (IV), the method also comprises the steps: (V) for the target area of thin flexible glass base material provides functional character; Then (VI) removes the installation region of thin flexible glass base material from the target area of thin flexible glass base material, thus discharges the target area of thin flexible glass base material from glass carrier.
First aspect can provide individually or with first aspect as above any one or more plant embodiment and provide in combination.
Brief Description Of Drawings
With reference to accompanying drawing, read following detailed description of the present invention, the above-mentioned aspects, features and advantages that the present invention may be better understood and other aspects, features and advantages, wherein:
Fig. 1 is schematic plan, and its display has the example of the goods of the thin flexible glass base material being attached to glass carrier;
Fig. 2 is end view, the example of the goods of its display Fig. 1;
Fig. 3 is schema, and its display uses glass carrier to process the first embodiment of the first aspect of the method for thin flexible glass base material;
The example of the superficial makings profile of the glass that Fig. 4-5 graphic software platform etches under two kinds of extreme etchant concentration, and utilize use glass carrier to process the first aspect of the method for thin flexible glass base material the first embodiment by this glass exposure in etching reagent;
Fig. 6 is schema, and its display uses glass carrier to process the second embodiment of the first aspect of the method for thin flexible glass base material;
Fig. 7 graphic software platform is according to the superficial makings using glass carrier to process the second embodiment etching glass carrier gained of the first aspect of the method for thin flexible glass base material; With
Fig. 8 is schema, and its display uses glass carrier to process the embodiment of the second aspect of the method for thin flexible glass base material;
Describe in detail
More completely describe the present invention with reference to the accompanying drawings at this, in accompanying drawing, give the example embodiment of claimed invention.Whenever possible, use identical Reference numeral to represent same or similar part in all of the figs.But the present invention for required protection can be implemented in a number of different ways, the embodiment being defined in and proposing at this should be interpreted to.These exemplary embodiments make explanation thorough and complete, can fully show claimed scope of the present invention to those skilled in the art.
Fig. 1 is schematic plan, and its display has the example of the goods of the thin flexible glass base material 20 being attached to glass carrier 10.Fig. 2 is end view, the example of the goods of its display Fig. 1.
With reference to Fig. 1 and 2, the glass carrier 10 with thickness 12 is attached to thin flexible glass base material 20, thus thin flexible glass base material 20 can be utilized in existing device processing Infrastructure.When glass carrier 10 and thin flexible glass base material 20 are bonded to each other, their thickness sum 24 equal this device processing units designed for thicker sheet material.Such as, if processing units is designed for 700 microns of sheet materials, and the thickness 22 of thin flexible glass base material 20 is 300 microns, so thickness 12 is chosen to be 400 microns.
Glass carrier 10 and thin flexible glass base material 20 can have the composition of any appropriate, comprise aluminosilicate, borosilicate, boroaluminosilicate and sodium-calcium-silicate, and depend on that its final application can comprise alkali or alkali-free.In addition, glass carrier 10 can be made up (as shown in the figure) or be made up of the multilayer combining (comprising multiple fine sheet) of one deck.
Thin flexible glass base material 20 is attached to glass carrier 10 by installation region 40.In installation region 40, exist between the surface and the surface of glass carrier 10 of thin flexible glass base material 20 and directly contact, the wherein low combination to being enough to allow to carry out glass and glass of the average surface roughness Ra on these surfaces, such as, Ra≤2nm.In the release areas 50 of glass carrier 10, do not exist between glass carrier 10 and thin flexible glass base material 20 and combine or there is the lower combination of intensity, wherein provide release areas in the following manner: the surface roughening making glass baseplate 20 and/or glass carrier 10, thus its numerical value is high enough to the combination preventing in fact directly glass and glass, such as, Ra > 2nm.The release areas 50 of glass carrier 10 has circumference 52, in this circumference 52 arranged outside installation region 40.
Thin flexible glass base material 20 is attached to glass carrier 10 by Van der Waals force in initial.Then, bonding strength can be increased in some region, be retained in the thin sheet material/carrier products of processing with after forming apparatus thereon simultaneously, remove the ability of thin flexible glass base material 20.Thin flexible glass base material 20 can be attached to glass carrier 10 at least partially, thus anti-locking apparatus process fluid enters between thin flexible glass base material 20 and glass carrier 10, reduces the possibility of contingent pollution in downstream process thus.In other words, the installation region 40 between thin flexible glass base material 20 and glass carrier 10 can be bubble-tight.Glass carrier 10 and thin flexible glass base material 20 can clean, and their surface combines for the preparation of promotion.At installation region 40 place, the initial combination between thin flexible glass base material 20 and glass carrier 10 can be strengthened.Thin flexible glass base material 20 provides from release areas 50 by glass carrier of the releasability of glass carrier 10, allows thus to extract the required part 56 with the thin flexible glass base material 20 of circumference 58.
Fig. 3 is schema, and its display uses glass carrier 10 to process the first embodiment of the first aspect of the method (300) of thin flexible glass base material 20.With reference to the embodiment shown in figure 3, the glass carrier 10 that (301) comprise release areas 50 and installation region 40 can be provided.
After providing (301) glass carrier 10, the etching reagent by making to comprise ammonium fluoride mixture to contact with release areas 50 certain hour section, and the release areas 50 for glass carrier 10 provides (302) texturizing surfaces.The time period that release areas 50 contacts with the etching reagent comprising ammonium fluoride mixture can be about 1 minute-Yue 10 minutes.Rootmean-square (root-mean-squared) surfaceness (being hereafter called " Rq ") of texturizing surfaces can be about 4nm-and is about 232nm.
Etching reagent can be made up of solvable chemical substance.In addition, etching reagent can be made up of ammonium fluoride mixture.This ammonium fluoride mixture can be made up of following substances: ammonium fluoride solution in glacial acetic acid.The concentration of ammonium fluoride solution can be about 4%-about 20%.Ammonium fluoride solution can be the ammonium fluoride aqueous solution of about 40%.
After (301) glass carrier 10 is provided and before the release areas 50 that (302) glass carrier 10 is provided, mask can be applied (305) installation region 40 to glass carrier 10.In release areas 50 process providing (302) glass carrier 10, mask can prevent etching reagent from contacting the installation region 40 of glass carrier 10.Mask can comprise adhesivity film.
After the release areas 50 that (302) glass carrier 10 is provided, (303) etching reagent can be removed from glass carrier 10.Remove (303) etching reagent can comprise drip washing (306) etching reagent and subsequently subsequently drying (307) glass carrier 10.
After removal (303) etching reagent, the installation region of thin flexible glass base material 20 can be combined (304) installation region 40 to glass carrier 10.Like this, for the release areas 50 of glass carrier 10 provides the texturizing surfaces of (302) that thin flexible glass base material 20 target area can be prevented to be attached to the release areas 50 of glass carrier 10.
By the installation region of thin flexible glass base material 20 combine (304) to glass carrier 10 installation region 40 after, the target area 56 of the installation region of thin flexible glass base material 20 with thin flexible glass base material 20 can be separated (308), thus discharge the target area of thin flexible glass base material 20 from glass carrier 10.
By the installation region of thin flexible glass base material 20 combine (304) to glass carrier 10 installation region 40 after, the target area 56 that can be thin flexible glass base material 20 provides (309) functional character.After the target area for thin flexible glass base material 20 provides (309) functional character, the installation region of removing (308) thin flexible glass base material 20 from the target area of thin flexible glass base material 20 can be carried out, thus there is from glass carrier 10 release the target area 56 of the thin flexible glass base material 20 of circumference 58.
The method (300) of Fig. 3 can represent the wet chemical etching method for textured glass, and veining is carried out in the surface of the release areas 50 making glass carrier 10 by it.The veining on release areas 50 surface can be carried out, to make in the liquid-crystal display (LCD) or Organic Light Emitting Diode (OLED) course of processing of the display equipment for including but not limited to mobile phone, panel computer and TV, glass carrier 10 can be used as rigid substrate and support thin flexible glass base material 20.
The chemical milling of the wet chemical etching method of the method (300) of Fig. 3 can comprise glass carrier 10 is exposed to etching reagent, and this etching reagent is made up of the mixture of 40% aqueous mixture of Glacial acetic acid and Neutral ammonium fluoride.Chemical milling optionally can be applied to glass carrier 10 and produce one or more release areas 50 on a surface of glass carrier 10, this release areas 50 carries out veining by chemical milling.By controlling the composition of etching reagent, concentration and temperature and glass carrier 10 being exposed to the time length of etching reagent, decide the texture of release areas 50.
Operation glass carrier 10 being exposed to etching reagent realizes by glass carrier 10 vertically being immersed etching reagent.Such as, can at the upper strata, side of clean glass carrier 10 pressure adhesivity film.Adhesivity film can have opening on glass carrier 10, and it is equivalent to the desired size of the release areas 50 by etching reagent patterning.Then, glass carrier 10 can be immersed etchant bath, and keep the time period of 1-10 minute.After glass carrier 10 is immersed etchant bath, can drip washing glass carrier 10, such as drip washing 3 times in 3 independently drip washing groove, and dry.Then, the adhesivity film of removable layer pressure, then can use washed with isopropyl alcohol glass carrier 10 and use air knife dry.
Glass carrier 10 can be inhomogeneous glass, includes but not limited to
glass,
glass, Lotus
tMglass (above-mentioned glass code name all can be bought from general headquarters in Corning Corp. (CorningIncorporated) of healthy and free from worry NY), and soda-lime glass.Glass carrier 10 can be used to support inhomogeneous thin flexible glass base material 20, includes but not limited to, the glass of thickness≤300 micron, and such as thickness is 300,290,280,270,260,250,240,230,220,210,200,190,180,170,160,150,140,130,120,110,100,90,80,70,60,50,40,30,20, the glass of 10 microns, such as, Willow
tMglass, this glass code name can be bought from general headquarters in Corning Corp. (CorningIncorporated) of healthy and free from worry NY.
In one embodiment, the Neutral ammonium fluoride (NH of wide concentration range is used
4f) and the mixture of Glacial acetic acid (GAA), etch
2 of glass (corning glass code name 2318) " × 2 " sample.NH
4f concentration changes to 20% from 2%.The time length that etching reagent exposes was the range of 30 seconds to 15 minutes.Then sample carried out drip washing in deionized water and dry up.Then, ZygoNewView is used
tMmodel 7300 white-light optics contourgraph, carrys out the superficial makings of measure sample.
Fig. 4-5 comprises figure, and it etches under being presented at two kinds of extreme etchant concentration
the example of the superficial makings profile of glass, and utilize use glass carrier to process the method for thin flexible glass base material the first embodiment by this glass exposure in etching reagent.This picture shows
glass is at 20%NH
4when keeping the etching period of 15 minutes in F concentration etch bath, produce in superficial makings profile more deeply, thicker feature, and
glass is at 4%NH
4when keeping 30 seconds etching periods in F concentration etch bath, in superficial makings profile, produce more shallow, thinner feature.
In other words, by changing etch bath concentration and changing the time length that glass carrier 10 is exposed to etch bath concentration, the superficial makings of glass carrier 10 is regulated.Table 1 provided below is summarized and to be formed by this process
the surface texture feature of glass.Use ZygoNewView
tM7300 optical profilometers are implemented to measure.Microscopie unit is 20 times of lens with 2 times of zooms.Low spectral filter and high spectral filter wavelength are 0.5 micron and 50 microns respectively.Average roughness Ra, rootmean-square (RMS) roughness Rq and the degree of bias (Rsk) and kurtosis (Rku) form the fingerprint on surface.
Table 1
Ra is the center line average of surface profile.Rq is more responsive to peak valley than Ra, because Rq is squared to amplitude.
Rsk is the degree of bias of the altitude distribution of surface characteristic.If Rsk < 0, surface can comprise paddy.If Rsk > 0, surface can be smooth, and has peak.Numerical value is greater than or less than 1 can show to there is extreme paddy or peak on the surface.
Rku is the kurtosis of altitude distribution.Kurtosis is the tolerance of height random and surperficial acutance.Kurtosis be 3 surface there is perfect random surface.Kurtosis be less than or greater than 3 the random degree in surface lower, and along with kurtosis numerical value is from more than 3, become repetition degree higher.The surface with spike (spike) has higher kurtosis numerical value usually, and rough (bumpy) surface has lower kurtosis numerical value usually.
Such as, according to table 1, use the 20%NH had in GAA
4the NH of F solution
4f mixture, one of sample as above is carried out first etching of 10 minutes, the Rq of the sample surfaces obtained is 232nm, and the degree of bias is-0.5, and kurtosis is 3.After this shows etching, the sample surfaces carrying out the first etching is made up of the paddy of random interval.On the other hand, the 4%NH had in GAA is used
4the NH of F
4f mixture, one of sample as above is carried out second etching of 10 minutes, the Rq of the sample surfaces obtained is 4nm, and the degree of bias is-0.3, and kurtosis is 4.This shows, after the etching, although the sample surfaces carrying out the second etching is still made up of the paddy of random interval, the amplitude that Amplitude Ration first etching of the paddy of the random interval that the second etching produces produces is lower.
Fig. 6 is schema, and its display uses glass carrier 10 to process the second embodiment of the first aspect of the method (500) of thin flexible glass base material 20.With reference to the embodiment shown in figure 6, the glass carrier 10 that (501) comprise release areas 50 and installation region 40 can be provided.
After providing (501) glass carrier 10, the etching reagent by making to comprise ammonium fluoride mixture to contact with release areas 50 certain hour section, and the release areas 50 for glass carrier 10 provides (502) texturizing surfaces.The time period that release areas 50 contacts with the etching reagent comprising ammonium fluoride mixture can be about 1 minute-Yue 10 minutes.The Rq of texturizing surfaces can be made to be greater than about 2nm and to be equal to or less than about 6nm.
Etching reagent can be made up of solvable chemical substance.Etching reagent can be printed in the release areas 50 of glass carrier 10.The printing of etching reagent can include but not limited to silk screen printing or stencil printing (stencilprinting) etching reagent in the release areas 50 of glass carrier 10.Etching reagent can the form of gel etching reagent apply.Gel etching reagent can be made up of following substances: ammonium fluoride mixture and thickening material.Ammonium fluoride mixture can be made up of following substances: ammonium fluoride solution in glacial acetic acid.The concentration of ammonium fluoride solution can be about 13%-about 20%.Ammonium fluoride solution can be the ammonium fluoride aqueous solution of 40%.
After the release areas 50 that (502) glass carrier 10 is provided, (503) etching reagent can be removed from glass carrier 10.Remove (503) etching reagent can comprise drip washing (505) etching reagent and subsequently subsequently drying (506) glass carrier 10.
After removal (503) etching reagent, the installation region of thin flexible glass base material 20 can be combined (504) installation region 40 to glass carrier 10.Like this, the texturizing surfaces that the release areas 50 being glass carrier 10 in (502) provides can prevent thin flexible glass base material 20 target area to be attached to the release areas 50 of glass carrier 10.
By the installation region of thin flexible glass base material 20 combine (504) to glass carrier 10 installation region 40 after, (507) can be removed from the target area of thin flexible glass base material 20 in the installation region of thin flexible glass base material 20, thus discharge the target area of thin flexible glass base material 20 from glass carrier 10.
By the installation region of thin flexible glass base material 20 combine (504) to glass carrier 10 installation region 40 after, the target area that can be thin flexible glass base material 20 provides (508) functional character.After the target area for thin flexible glass base material 20 provides (508) functional character, the installation region of removing (507) thin flexible glass base material 20 from the target area of thin flexible glass base material 20 can be carried out, thus discharge the target area of thin flexible glass base material 20 from glass carrier 10.
Be similar to the method (300) of Fig. 3, the method (500) of Fig. 6 can represent the wet chemical etching method for textured glass, and veining is carried out in the surface of the release areas 50 making glass carrier 10 by it.The veining on release areas 50 surface can be carried out, to make in the liquid-crystal display (LCD) or Organic Light Emitting Diode (OLED) course of processing of the display equipment for including but not limited to mobile phone, panel computer and TV, glass carrier 10 can be used as rigid substrate and support thin flexible glass base material 20.
The chemical milling of the wet chemical etching method of the method (500) of Fig. 6 can comprise glass carrier 10 is exposed to etching reagent, and this etching reagent is made up of 40% aqueous mixture of Neutral ammonium fluoride and the mixture of Glacial acetic acid.Chemical milling optionally can be applied to glass carrier 10 and produce one or more release areas 50 on a surface of glass carrier 10, this release areas 50 carries out veining by chemical milling.By controlling the composition of etching reagent, concentration and temperature and glass carrier 10 being exposed to the time length of etching reagent, decide the texture of release areas 50.
Contrary with the method (300) of Fig. 3, glass carrier 10 is exposed to etching reagent and etching reagent silk screen printing or stencil printing can be carried out to glass carrier 10 by the method (500) of Fig. 6.Such as, in the method (300) of Fig. 3 when the side of clean glass carrier 10 uses adhesivity film to carry out lamination, and in the method (500) of Fig. 6, can according to the size treated by applying needed for release areas 50 that etching reagent carries out patterning, by etching reagent optionally silk screen printing or stencil printing on glass carrier 10.
Etching reagent silk screen printing or stencil printing to glass carrier 10 may will be needed to add thickening material, this obtains thixotropy gel, its with silk screen printing or stencil printing technique mutually compatible.Such as, can add the polymkeric substance of the water-solvable from polyethylene oxide family, it can from DowWolffCellulosics
tMcompany buys, and trade mark is Polyox
tM.Gained gel etching reagent still can keep the time period of 1-10 minute on glass carrier 10, then can by glass carrier 10 drip washing 3 also dryings.
Similarly, glass carrier 10 can be inhomogeneous glass, includes but not limited to,
glass,
glass, Lotus
tMglass, and soda-lime glass.Glass carrier 10 can be used to support dissimilar thin flexible glass base material 20, includes but not limited to, Willow
tMglass.
In one embodiment, two kinds of different etching gel filament reticulated printings are used
2 of glass " square material.One of gel comprises the 20%NH in GAA
4the NH of F solution
4f mixture and 20%Polyox
tMn80.Another kind of gel pack is containing the 16%NH in GAA
4the NH of F solution
4f mixture and 20%Polyox
tMn80.The time length that etching reagent exposes changes within the time period of 1 minute to 10 minutes.Then sample carried out drip washing in deionized water and dry up.Then, ZygoNewView is used
tMmodel 7300 white-light optics contourgraph, carrys out the superficial makings of measure sample.Microscopie unit is 20 times of lens with 2 times of zooms.Gained surface texturizing parameter is summarized in table 2.
Table 2
PV represents " peak valley ", and represents the distance between the highest peak and minimum paddy.
Based on the texture range shown in table 2, use and pass through Polyox
tMthe 16%NH of N80 thickening
4f/GAA mixture, and use 310mm × 410mm screen printing etch agent gel pattern to incite somebody to action
glass carrier etches 3 minutes.Fig. 7 represents the parametric texture of the carrier surface obtained by etching condition as above.
After this, the carrier of patterning is attached to 360mm × 460mm × 0.13mmWillow in advance
tMglass, and at 400 DEG C thermal bond 10 minutes.Then, scribing and smash patterning
glass carrier and Willow
tMthe assembly of the combination of glass.The installation region of glass carrier and Willow
tMthe region that glass combines is smashed with unitarily formed form.The release areas of glass carrier and Willow
tMthe respective regions of glass occurs broken, and glass carrier and Willow
tMglass is clearly separated.
Although method (500) provides a kind of Rq changing the release areas 50 of glass carrier 10 on wide region with by Willow
tMglass is attached to glass carrier and subsequently makes to discharge Willow from glass carrier
tMthe method of a part for glass, but required Rq example is about 2nm.Although produce required Rq by the various combinations of etching period and etchant concentration, the example of required ammonium fluoride solution concentration is about 13% and required etching period is about 3 minutes.
Fig. 8 is schema, and its display uses glass carrier 10 to process the embodiment of the second aspect of the method (700) of thin flexible glass base material 20.The method (700) relates to the newborn frost of use etching and carries out roughening to glass surface, this etching breast frost comprises the mixture of villiaumite, insoluble salt, solvable salt and mineral acid, when when the glass (flexible glass base material 20 or glass carrier 10) of roughening is low ionic sodium lime glass, the method is particularly useful, but also can be
class glass uses the method.
With reference to the example shown in figure 8, (701) glass carrier 10 can be cleaned and remove pollutent.Then, glass carrier 10 can be arranged (702) and enter the ultra sonic bath with deionized water, for cleaning further.After dry (703), antiacid polyethylene laminated (704) glass carrier 10 can be used, with the installation region 40 of protective glass carrier 10.Then, by glass carrier 10 time period that submergence (705) is shorter in the hydrofluoric acid and hydrochloric acid soln of dilution, also can clean and activating surface with the very thin upper layer removing glass carrier 10.This time period can be 5 seconds-10 seconds.
Such as in deionized water after drip washing 10 seconds in drip washing (706), make glass carrier 10 be exposed to (707) etching breast frost and keep 30-120 second, make it move up and down a little simultaneously.For this applying, can be made up of following substances for the etching powder etching breast frost: 10-40 % by weight KF is as fluorine source, 10-40 % by weight KCl or KNO
3as extra salt, 5-20 % by weight BaSO
4as filler, 1-10 % by weight starch, and 1-10 % by weight polyacrylamide.By this powder dissolution in the mixture of dense HCl or HCl of 20-50 % by weight and acetic acid, thus etching breast frost can be formed.If the slurry built by the powder dissolved is too thick, the water of the most nearly 20 % by weight can be added.After dissolution, the newborn frost of etching can be preserved 12 hours at ambient conditions before using, and often within 2-4 hour, carry out hand operated mixing to reach chemical equilibrium.
After being exposed to the time that (707) etch needed for newborn frost, can drip washing rapidly (708) glass carrier 10, such as drip washing 10 seconds in deionized water.Then, (709) laminate can be removed, and remaining acid on the surface and etching breast frost can be removed by fully drip washing (710) glass carrier 10.The Ra of the release areas 50 of gained glass carrier 10 can be about 25nm.
The homogeneity of release areas 50 controls by the physical properties etching breast frost, and it includes but not limited to viscosity, sedimentation and and the size-grade distribution of soluble thing.In order to reach the texture homogeneity of required release areas 50, viscosity and the settling time of certain limit can be needed.These parameters regulate by regulating the content of the salt of etching powder, mineral acid and water.Can preferably remove insoluble macrobead, to reach required slurry viscosity and settling time.
The time that the roughness of release areas 50 is exposed to etching breast frost by the concentration and glass carrier 10 etching breast frost controls.The higher etching white concentration of breast and longer etching breast frost can cause larger surfaceness process period.The increase of acid concentration or process period also can cause more coarse superficial makings.
As above about method (700) second aspect described in etching chemistry also can with the coupling of roughening low ionic sodium lime glass, apply for silicon tandem photovoltaic cells.In silicon tandem thin-film photovoltaic cell, coarse glass baseplate can increase light trapping and increase efficiency of conversion thus.
In the third aspect of the method (700) of the flexible glass base material 20 using the processing of glass carrier 10 thin, can use and comprise NH
4hF
2, NH
4f, KCl, BaSO
4with the etching breast frost of HCl.When inciting somebody to action
glass is used as the one in base material 20 or glass carrier 10, and comprises when the surface of roughening is to provide release areas, and this etching breast frost can be particularly useful.For this application, be exposed to (707) etching breast frost and keep needed for time after, the method (700) can comprise be exposed to (711) second acid and keep 2 minutes, this second acid comprises 15 % by weight H
2sO
4with 5 % by weight HCl.In addition, after the deionized water drip washing (712) being exposed to (711) second acid and 10 seconds and before quick drip washing (708), can be exposed to for (713) the 3rd acid times of 90 seconds, the 3rd acid comprises 24 % by weight HF and 45.5 % by weight HCl.
In addition, etching breast frost is made up of following substances: the NH of 10-20 % by weight
4the NH of F, 10-20 % by weight
4hF
2, 0-10 % by weight KNO
3as extra salt, 5-20 % by weight BaSO
4as filler.The solvable starch of 1-10 % by weight can be used, and the polyacrylamide of 0-5 % by weight.Solid as above can combine with the dense HCl of 36-38%, and as above to prepare for the mode described in the etching breast frost for veining carrier glass 10.A kind of method applying to etch breast frost can comprise enforcement as above for step (701)-(710) described in the etching breast frost for veining carrier glass 10.In some applications, after being exposed to (707) and etching newborn frost, by being exposed to (711) second acid and keeping certain hour section to carry out further polishing
glass, then carries out quick drip washing (708).
After being exposed to as the newborn frost of etching as above embathing liquid (dip),
the texture homogeneity of the square sample of glass is enough to obtain anti-dazzle character usually.For rectangle or other irregular or 3D shaped samples, spraying etches breast frost instead of embathes liquid and can show better texture homogeneity.In spraying method, in a manual manner or pump can be used, newborn for etching frost is sprayed to
on glass surface.In spraying method,
glass can be arranged on support (rack), and this support is inclined relative to horizontal 30 degree.Spray with can using identical uniform flow
glass.Can be that the antiacid pump of 20L/ minute to 50L/ minute is used for the newborn frost of etching to spray to be of a size of 120mm × 60mm's by flow
on glass surface.Larger glass surface can need the spraying with more high flow capacity.The glass of arbitrary dimension or shape all can use spraying method or dipping method to apply.
Above the etching chemistry described in the third aspect of combining method (700) and method also can with following manner coupling: for cover-plate glass such as
glass provides the surface of roughening, provides anti-glare surface or obtains anti-dazzle character.Specifically, reduce specular reflection is usually required character for the cover-plate glass of Touch sensitive electronic device, electric ink reader, interactive white board and other portable LCD, when particularly using under some has optical condition.There is the cover-plate glass of this character by building texture from the teeth outwards to obtain.Superficial makings reduces reflected light by the random scatter of the light of reflection, and reflection image is fogged, and this is also referred to as anti-glare surface.These superficial makingss provide by the etching chemistry of the third aspect of method (700).The etching cream formulation of this aspect and process can make
glass surface roughening obtains anti-dazzle character.In wide region, regulate texturizing surfaces character as mist degree, gloss, the fresh degree of reflecting of image (DOI) by control etching cream formulation and machined parameters, and roughness, be provided for thus obtaining anti-dazzle
the low cost of glass surface, scrape resistant and method flexibly.This technology becomes in ion-exchange
healthy and free from worry code name 2317 and 2318 class glass before glass is useful especially.
Method (300) and (500) can use solvable composition, and method (700) can use insoluble composition.Solvable composition is used in method (300) and (500), can the middle particle deposition using insoluble composition to stay of avoiding method (700).If in step (708), (710), and in (712), do not have abundant drip washing to fall these particles, they can disturb the formation of the combination between thin flexible glass base material 20 and glass carrier 10 in each installation region.
It will be apparent to those skilled in the art that and can carry out various modifications and changes when not departing from scope and spirit of the present invention to the present invention.Therefore, the present inventor is intended that and the present invention includes modifications and variations of the present invention, as long as these modifications and variations drop in the scope of appended claim and their equivalents.
Claims (12)
1. use glass carrier to process a method for thin flexible glass base material, described method comprises the steps:
(I) providing package contains the glass carrier of release areas and installation region; Then
(II) to be contacted with release areas certain hour section by the etching reagent that makes to comprise ammonium fluoride mixture, for the release areas of glass carrier provides texturizing surfaces; Then
(III) etching reagent is removed from glass carrier; Then
(IV) installation region of thin flexible glass base material is attached to the installation region of glass carrier, wherein said texturizing surfaces prevents the target area of thin flexible glass base material to be attached to the release areas of glass carrier.
2. the method for claim 1, is characterized in that, the time period of step (II) is 1 minute-10 minutes.
3. the method for claim 1, is characterized in that, step (II) provides rms surface roughness to be the texturizing surfaces of 3nm-232nm.
4. the method for claim 1, is characterized in that, step (II) provides rms surface roughness to be greater than 2nm and is equal to or less than the texturizing surfaces of 6nm.
5. the method for claim 1, is characterized in that, the etching reagent of step (II) is made up of ammonium fluoride mixture, and
Wherein said ammonium fluoride mixture is made up of following substances: ammonium fluoride solution in glacial acetic acid.
6. method as claimed in claim 5, it is characterized in that, the concentration of described ammonium fluoride solution is 4%-20%.
7. method as claimed in claim 5, it is characterized in that, the ammonium fluoride solution of step (II) is 40% Neutral ammonium fluoride in water.
8. the method for claim 1, is characterized in that, step (II) applies etching reagent with the form of gel etching reagent.
9. method as claimed in claim 8, it is characterized in that, gel etching reagent is made up of following substances: ammonium fluoride mixture and thickening material, and
Wherein ammonium fluoride mixture is made up of following substances: ammonium fluoride solution in glacial acetic acid.
10. method as claimed in claim 9, it is characterized in that, the concentration of described ammonium fluoride solution is 13%-20%.
11. methods as claimed in claim 9, is characterized in that, described ammonium fluoride solution is 40% Neutral ammonium fluoride in water.
12. the method for claim 1, is characterized in that, after step (IV), the method also comprises following step:
(V) for the target area of thin flexible glass base material provides functional character; Then
(VI) remove the installation region of thin flexible glass base material from the target area of thin flexible glass base material, thus discharge the target area of thin flexible glass base material from glass carrier.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361826181P | 2013-05-22 | 2013-05-22 | |
| US61/826,181 | 2013-05-22 | ||
| PCT/US2014/038312 WO2014189775A1 (en) | 2013-05-22 | 2014-05-16 | Methods for processing a thin flexible glass substrate with a glass carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105392747A true CN105392747A (en) | 2016-03-09 |
Family
ID=51933995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480041042.8A Pending CN105392747A (en) | 2013-05-22 | 2014-05-16 | Methods for processing a thin flexible glass substrate with a glass carrier |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP2016523796A (en) |
| KR (1) | KR20160012186A (en) |
| CN (1) | CN105392747A (en) |
| SG (1) | SG11201509626YA (en) |
| TW (1) | TW201500306A (en) |
| WO (1) | WO2014189775A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111499213A (en) * | 2019-01-31 | 2020-08-07 | 比亚迪股份有限公司 | Gradient glass and preparation method and application thereof |
| CN115246711A (en) * | 2021-04-28 | 2022-10-28 | Oppo广东移动通信有限公司 | Glass shell for electronic equipment, preparation method of glass shell and electronic equipment |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015202997A (en) * | 2014-04-16 | 2015-11-16 | 旭硝子株式会社 | Substrate, substrate production system, peeling device, substrate production method and peeling method |
| US10690818B2 (en) | 2014-10-31 | 2020-06-23 | Corning Incorporated | Anti-glare substrates with a uniform textured surface and low sparkle and methods of making the same |
| WO2016112076A1 (en) | 2015-01-06 | 2016-07-14 | Corning Incorporated | Apparatus and method for producing anti-glare surfaces |
| US11691909B2 (en) | 2016-11-30 | 2023-07-04 | Corning Incorporated | Textured glass for light extraction enhancement of OLED lighting |
| JP2020506870A (en) * | 2017-01-31 | 2020-03-05 | コーニング インコーポレイテッド | Method for reducing particles on glass sheet edge |
| JP7024373B2 (en) * | 2017-12-18 | 2022-02-24 | Ａｇｃ株式会社 | Glass substrate for display |
| JP7405757B2 (en) * | 2018-03-07 | 2023-12-26 | コーニング インコーポレイテッド | Contoured glass surface to reduce electrostatic charging |
| EP3798694A4 (en) * | 2018-05-21 | 2022-03-23 | Agc Inc. | Antiglare transparent substrate and display device provided with same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050001201A1 (en) * | 2003-07-03 | 2005-01-06 | Bocko Peter L. | Glass product for use in ultra-thin glass display applications |
| KR101446226B1 (en) * | 2006-11-27 | 2014-10-01 | 엘지디스플레이 주식회사 | Flexible display device and manufacturing method thereof |
| TWI354854B (en) * | 2008-09-15 | 2011-12-21 | Ind Tech Res Inst | Substrate structures applied in flexible electrica |
| TWI377646B (en) * | 2009-08-03 | 2012-11-21 | Substrate structures applied in flexible electrical devices and fabrication method thereof | |
| LT2569802T (en) * | 2010-05-11 | 2017-12-27 | Ultra High Vacuum Solutions Ltd. T/A Nines Engineering | Method to control surface texture modification of silicon wafers for photovoltaic cell devices |
-
2014
- 2014-05-15 TW TW103117171A patent/TW201500306A/en unknown
- 2014-05-16 KR KR1020157036110A patent/KR20160012186A/en not_active Application Discontinuation
- 2014-05-16 WO PCT/US2014/038312 patent/WO2014189775A1/en active Application Filing
- 2014-05-16 JP JP2016514976A patent/JP2016523796A/en active Pending
- 2014-05-16 CN CN201480041042.8A patent/CN105392747A/en active Pending
- 2014-05-16 SG SG11201509626YA patent/SG11201509626YA/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111499213A (en) * | 2019-01-31 | 2020-08-07 | 比亚迪股份有限公司 | Gradient glass and preparation method and application thereof |
| CN111499213B (en) * | 2019-01-31 | 2021-09-21 | 比亚迪股份有限公司 | Gradient glass and preparation method and application thereof |
| CN115246711A (en) * | 2021-04-28 | 2022-10-28 | Oppo广东移动通信有限公司 | Glass shell for electronic equipment, preparation method of glass shell and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160012186A (en) | 2016-02-02 |
| JP2016523796A (en) | 2016-08-12 |
| TW201500306A (en) | 2015-01-01 |
| WO2014189775A1 (en) | 2014-11-27 |
| SG11201509626YA (en) | 2015-12-30 |
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