CN105392298A - Manufacturing method using black film to align film directly - Google Patents
Manufacturing method using black film to align film directly Download PDFInfo
- Publication number
- CN105392298A CN105392298A CN201510754491.3A CN201510754491A CN105392298A CN 105392298 A CN105392298 A CN 105392298A CN 201510754491 A CN201510754491 A CN 201510754491A CN 105392298 A CN105392298 A CN 105392298A
- Authority
- CN
- China
- Prior art keywords
- film
- pin
- circuit board
- black
- punching machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention relates to a manufacturing method using a black film to align a film directly. The method comprises the following steps that: S1, punching is carried out on a circuit board; to be specific, a circuit board after exposure, development, electroplating, and etching processes is placed on a punching machine and a plurality of pin alignment holes are punched in the periphery of the circuit board, wherein the aperture of the pin hole is between 2.05 to 2.15mm; S2, film punching is carried out; to be specific, a pin hole target ring with the aperture of 2.05 to 2.15mm is arranged at the edge of a black film and pin holes are punched by using a film punching machine; S3, pin installation is carried out; to be specific, the puncher head of the film punching machine is changed into one with the diameter of 1.95mm and pins with the diameters of 2.0mm are installed into the pin holes obtained at the step 2; and S4, the pins in the step 3 are pressed into the corresponding pin holes of the periphery of the circuit board, thereby completing pin alignment. The provided method has the following advantages: usage of yellow films can be reduced; the cost is low; and the alignment precision is high.
Description
Technical field
The present invention relates to printed circuit board production technical field, particularly the manufacture method of the direct alignment film of a kind of black-film.
Background technology
Current most enterprises adopts engineering light to draw black-film (the black film) to be exposed by exposure machine again, painted circuit image is transferred to pornographic movie (the yellow film) and smokes sheet by ammoniacal liquor machine and presented completely by circuit image, play and block the ultraviolet function of exposure.
Along with the variation of circuit board, be difficult to use CCD para-position exposure machine to substitute manual alignment completely in exposure operation comprehensively, the brown sheet film aligning of existing employing, copy brown sheet film process and easily produce the bad problems of quality such as the red point of the film, man efficiency and the more difficult to govern control of material consumption, cancelling the brown sheet film directly adopts black-film film aligning, difficult point is that the black-film film is light tight, affects cannot ensure its contraposition precision when circuit and welding resistance contraposition by viewpoint.
In process of production, film use amount is large, and the production cost of circuit board is high, and the useful life of the yellow film is shorter, more increases the burden of enterprise.
Summary of the invention
The object of the invention is to the shortcoming overcoming prior art, provide the low and contraposition of a kind of use, cost saving the yellow film accurately by the manufacture method of the direct alignment film of black-film.
Object of the present invention is achieved through the following technical solutions: the manufacture method of the direct alignment film of a kind of black-film, and it comprises the following steps:
S1, circuit board punch: will be placed on puncher by the circuit board after exposure, development, plating and etching work procedure, get multiple PIN to the periphery of circuit board and follow closely registration holes, the aperture in PIN hole is between 2.05 ~ 2.15mm;
S2, the film punch: in the edge of the black-film film, arrange the PIN nail scoring ring that aperture is 2.05 ~ 2.15mm, PIN nail got by film punching machine;
S3, installation PIN nail: changing the drift of film punching machine into drift that diameter is 1.95mm, is that the PIN of 2.0mm binds in the PIN nail of step S2 by diameter;
S4, contraposition: the PIN in step S3 is pressed into again circuit board perimeter for PIN hole in, complete PIN contraposition.
The side that described PIN follows closely registration holes is also equipped with inspection hole by puncher.
The present invention has the following advantages:
1, follow closely in conjunction with PIN, respectively the PIN nail of PIN nail press-in black-film and the PIN of circuit board are followed closely in registration holes, realize the direct contraposition of black-film, thus save the use cost of the yellow film, reduce the production cost of circuit board, and the useful life of black-film is than the length more than one times of pornographic movie.
2, circuit/welding resistance operation all adopts the mode of PIN contraposition, cancel artificial manual to the film, the production capacity of PIN contraposition is 1.5 times of manual alignment, carries out the alignment operation person that PIN contraposition can save 20%, has saved a large amount of manpowers while the production efficiency of lifting employee and production quality.
Embodiment
Below in conjunction with embodiment, the present invention will be further described, but protection scope of the present invention is not limited to the following stated.
[embodiment 1]:
A manufacture method for the direct alignment film of black-film, it comprises the following steps:
S1, circuit board punch: will be placed on puncher by the circuit board after exposure, development, plating and etching work procedure, get multiple PIN to the periphery of circuit board and follow closely registration holes, the aperture in PIN hole is 2.05mm;
S2, the film punch: in the edge of the black-film film, arrange the PIN nail scoring ring that aperture is 2.05mm, PIN nail got by film punching machine;
S3, installation PIN nail: changing the drift of film punching machine into drift that diameter is 1.95mm, is that the PIN of 2.0mm binds in the PIN nail of step S2 by diameter;
S4, contraposition: the PIN in step S3 is pressed into again circuit board perimeter for PIN hole in, complete PIN contraposition.
The side that described PIN follows closely registration holes is also equipped with inspection hole by puncher.
[embodiment 2]:
A manufacture method for the direct alignment film of black-film, it comprises the following steps:
S1, circuit board punch: will be placed on puncher by the circuit board after exposure, development, plating and etching work procedure, get multiple PIN to the periphery of circuit board and follow closely registration holes, the aperture in PIN hole is 2.1mm;
S2, the film punch: in the edge of the black-film film, arrange the PIN nail scoring ring that aperture is 2.1mm, PIN nail got by film punching machine;
S3, installation PIN nail: changing the drift of film punching machine into drift that diameter is 1.95mm, is that the PIN of 2.0mm binds in the PIN nail of step S2 by diameter;
S4, contraposition: the PIN in step S3 is pressed into again circuit board perimeter for PIN hole in, complete PIN contraposition.
The side that described PIN follows closely registration holes is also equipped with inspection hole by puncher.
[embodiment 3]:
A manufacture method for the direct alignment film of black-film, it comprises the following steps:
S1, circuit board punch: will be placed on puncher by the circuit board after exposure, development, plating and etching work procedure, get multiple PIN to the periphery of circuit board and follow closely registration holes, the aperture in PIN hole is 2.08mm;
S2, the film punch: in the edge of the black-film film, arrange the PIN nail scoring ring that aperture is 2.12mm, PIN nail got by film punching machine;
S3, installation PIN nail: changing the drift of film punching machine into drift that diameter is 1.95mm, is that the PIN of 2.0mm binds in the PIN nail of step S2 by diameter;
S4, contraposition: the PIN in step S3 is pressed into again circuit board perimeter for PIN hole in, complete PIN contraposition.
The side that described PIN follows closely registration holes is also equipped with inspection hole by puncher.
[embodiment 4]:
A manufacture method for the direct alignment film of black-film, it comprises the following steps:
S1, circuit board punch: will be placed on puncher by the circuit board after exposure, development, plating and etching work procedure, get multiple PIN to the periphery of circuit board and follow closely registration holes, the aperture in PIN hole is 2.15mm;
S2, the film punch: in the edge of the black-film film, arrange the PIN nail scoring ring that aperture is 2.15mm, PIN nail got by film punching machine;
S3, installation PIN nail: changing the drift of film punching machine into drift that diameter is 1.95mm, is that the PIN of 2.0mm binds in the PIN nail of step S2 by diameter;
S4, contraposition: the PIN in step S3 is pressed into again circuit board perimeter for PIN hole in, complete PIN contraposition.
The side that described PIN follows closely registration holes is also equipped with inspection hole by puncher.
Claims (2)
1., by a manufacture method for the direct alignment film of black-film, it is characterized in that: it comprises the following steps:
S1, circuit board punch: will be placed on puncher by the circuit board after exposure, development, plating and etching work procedure, get multiple PIN to the periphery of circuit board and follow closely registration holes, the aperture in PIN hole is between 2.05 ~ 2.15mm;
S2, the film punch: in the edge of the black-film film, arrange the PIN nail scoring ring that aperture is 2.05 ~ 2.15mm, PIN nail got by film punching machine;
S3, installation PIN nail: changing the drift of film punching machine into drift that diameter is 1.95mm, is that the PIN of 2.0mm binds in the PIN nail of step S2 by diameter;
S4, contraposition: the PIN in step S3 is pressed into again circuit board perimeter for PIN hole in, complete PIN contraposition.
2. the manufacture method of the direct alignment film of a kind of black-film according to claim 1, is characterized in that: the side that described PIN follows closely registration holes is also equipped with inspection hole by puncher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510754491.3A CN105392298A (en) | 2015-11-09 | 2015-11-09 | Manufacturing method using black film to align film directly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510754491.3A CN105392298A (en) | 2015-11-09 | 2015-11-09 | Manufacturing method using black film to align film directly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105392298A true CN105392298A (en) | 2016-03-09 |
Family
ID=55424007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510754491.3A Pending CN105392298A (en) | 2015-11-09 | 2015-11-09 | Manufacturing method using black film to align film directly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105392298A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001094229A (en) * | 1999-09-27 | 2001-04-06 | Matsushita Electric Works Ltd | Method of manufacturing circuit board and mask film attachment hole drilling apparatus |
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN202145260U (en) * | 2011-06-13 | 2012-02-15 | 深圳华祥荣正电子有限公司 | Film locating structure |
| CN203086856U (en) * | 2013-01-25 | 2013-07-24 | 四川超声印制板有限公司 | Pin nail film tooling used in PCB pattern transferring process |
-
2015
- 2015-11-09 CN CN201510754491.3A patent/CN105392298A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001094229A (en) * | 1999-09-27 | 2001-04-06 | Matsushita Electric Works Ltd | Method of manufacturing circuit board and mask film attachment hole drilling apparatus |
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN202145260U (en) * | 2011-06-13 | 2012-02-15 | 深圳华祥荣正电子有限公司 | Film locating structure |
| CN203086856U (en) * | 2013-01-25 | 2013-07-24 | 四川超声印制板有限公司 | Pin nail film tooling used in PCB pattern transferring process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104808434B (en) | Substrate, mask plate and display device, alignment method | |
| CN101772268A (en) | Technology for aligning circuit board by PIN nail | |
| TW200637051A (en) | Mask, mask manufacturing method, pattern forming apparatus, and pattern formation method | |
| WO2012150846A3 (en) | Wall-climbing printing method and system | |
| CN206289294U (en) | A kind of high accuracy evaporation metal mask structure being | |
| EP3826070A3 (en) | Display device, mask assembly, method of manufacturing the mask assembly, apparatus for manufacturing the display device, and method of manufacturing the display device | |
| TW200737484A (en) | Method for fabricating identification code on a substrate | |
| CN206332922U (en) | Suitable for the jigsaw of the big thickness PCB single board sharp processing of small size | |
| CN105392298A (en) | Manufacturing method using black film to align film directly | |
| CN103552392B (en) | A kind of transactional cards opens greatly the production method of built-in thermoprint metal forming | |
| CN203708620U (en) | Printed circuit board (PCB) with multiple alignment system | |
| CN103324040A (en) | Method for raising contraposition precision between printed circuit board and film | |
| CN105629683B (en) | The alignment method of exposure machine | |
| CN203527969U (en) | Multi-positioning-hole steel template | |
| CN104260549A (en) | Cigarette case processing system | |
| CN203387769U (en) | Large-size spliced film | |
| CN201319668Y (en) | Working version for horn mesh product aligning graph | |
| CN206674339U (en) | A kind of pcb board riveting device | |
| CN110868808A (en) | Method for reducing dry film fragments generated in outer layer pattern manufacturing | |
| CN204929410U (en) | Accurate counterpoint equipment double exposes | |
| CN105353589B (en) | A kind of High Efficiency PC B re-expose methods | |
| CN106028669A (en) | Novel circuit board solder mask PIN alignment method | |
| CN203415167U (en) | Three-dimensional identification jointing sheet | |
| JP2013163866A (en) | Method for manufacturing metal foil sheet | |
| CN204046926U (en) | The high-accuracy target practice hole FPC of a kind of band |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160309 |