CN105390539A - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
CN105390539A
CN105390539A CN201510524932.0A CN201510524932A CN105390539A CN 105390539 A CN105390539 A CN 105390539A CN 201510524932 A CN201510524932 A CN 201510524932A CN 105390539 A CN105390539 A CN 105390539A
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film
semiconductor device
insulating film
gate electrode
groove
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CN201510524932.0A
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CN105390539B (en
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川口宏
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Renesas Electronics Corp
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Renesas Electronics Corp
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    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
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Abstract

The semiconductor device includes: a channel layer, a barrier layer, a first insulating film, and a second insulating film, each of which is formed above a substrate; a trench that penetrates the second insulating film, the first insulating film, and the barrier layer to reach the middle of the channel layer; and a gate electrode arranged in the trench and over the second insulating film via a gate insulating film. The band gap of the second insulating film is smaller than that of the first insulating film, and the band gap of the second insulating film is smaller than that of the gate insulating film GI. Accordingly, a charge (electron) can be accumulated in the second (upper) insulating film, thereby allowing the electric field strength at a corner of the trench to be improved. As a result, a channel is fully formed even at a corner of the trench, thereby allowing an ON-resistance to be reduced and an ON-current to be increased.

Description

Semiconductor device
The cross reference of related application
On August 25th, 2014 propose disclosing of Japanese patent application No.2014-170330 comprise specification, accompanying drawing and summary, by reference to mode it can be used as entirety to be herein incorporated.
Technical field
The present invention relates to a kind of method of semiconductor device and manufacture semiconductor device, and can preferably be used in the semiconductor device using such as nitride-based semiconductor and manufacture method thereof.
Background technology
In recent years, each semiconductor device with the III-V of the band gap being greater than Si is adopted to attract attention.Among them, the semiconductor device adopting gallium nitride (GaN) is being developed, because gallium nitride is a kind of material with following advantage: 1) breakdown electric field is large; 2) electron saturation velocities is large; 3) thermal conductivity is large; 4) good heterojunction can be formed between AlGaN and GaN; 5) gallium nitride is nontoxic and fail safe is high; Deng.
And because the height of gallium nitride is withstand voltage and speed-sensitive switch characteristic, developing each is the semiconductor device adopting the power MOSFET (conductor insulator semiconductor fet) of gallium nitride and often can close operation in each middle execution.
Such as, Japanese Unexamined Patent Application Publication No.2013-118343 discloses a kind of MIS type compound semiconductor device adopting gate recess structure.In this semiconductor device, for the groove of gate electrode be formed in interlayer dielectric, passivating film and compound semiconductor layer folded in.
Summary of the invention
The present inventor is studied using the semiconductor device of above-mentioned nitride-based semiconductor and develops, and furthers investigate, to improve the characteristic of normal off status type semiconductor device.In the process of research and development, disclose the space that there is the characteristic improving the semiconductor device using nitride-based semiconductor further.
From description and the accompanying drawing of this specification, other problems and new feature will become obvious.
In preferred embodiment disclosed in the present application, by the following concise and to the point general introduction describing its exemplary embodiments.
Have according to the semiconductor device of an embodiment disclosed in the present application penetrate upper nonconductive Film, groove that lower dielectric film and barrier layer arrive the centre of channel layer, and be arranged in groove via gate insulating film and gate electrode on upper nonconductive Film.The band gap of upper nonconductive Film is less than the band gap of lower dielectric film.In addition, the band gap of upper nonconductive Film is less than the band gap of gate insulating film.
According in the semiconductor device of exemplary embodiments disclosed in the present application and as described below, the characteristic of semiconductor device can be improved.
Accompanying drawing explanation
Fig. 1 is the sectional view of the structure of the semiconductor device illustrated according to the first embodiment;
Fig. 2 is the plane graph of the structure of the semiconductor device illustrated according to the first embodiment;
Fig. 3 is the sectional view of the manufacturing step of the semiconductor device illustrated according to the first embodiment;
Fig. 4 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Fig. 3;
Fig. 5 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Fig. 4;
Fig. 6 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Fig. 5;
Fig. 7 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Fig. 6;
Fig. 8 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Fig. 7;
Fig. 9 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Fig. 8;
Figure 10 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Fig. 9;
Figure 11 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Figure 10;
Figure 12 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Figure 11;
Figure 13 be the manufacturing step of the semiconductor device illustrated according to the first embodiment, the sectional view of manufacturing step after Figure 12;
Figure 14 A to 14D is the schematic diagram near the end of the lower surface of groove, for illustration of the effect of the first embodiment;
Figure 15 A to 15D is the energy band diagram that charge injection state is shown.
Figure 16 illustrates the sequential chart of charge injection to the actuation step of the step in the upper nonconductive Film in transistor and transistor;
Figure 17 is the sectional view of the structure of the semiconductor device illustrated according to the second embodiment;
Figure 18 is the plane graph of the structure of the semiconductor device illustrated according to the second embodiment;
Figure 19 is the sectional view of the structure of the semiconductor device illustrated according to the second embodiment;
Figure 20 is the sectional view of the manufacturing step of the semiconductor device illustrated according to the second embodiment;
Figure 21 be the manufacturing step of the semiconductor device illustrated according to the second embodiment, the sectional view of manufacturing step after Figure 20;
Figure 22 be the manufacturing step of the semiconductor device illustrated according to the second embodiment, the sectional view of manufacturing step after Figure 21;
Figure 23 be the manufacturing step of the semiconductor device illustrated according to the second embodiment, the sectional view of manufacturing step after Figure 22;
Figure 24 be the manufacturing step of the semiconductor device illustrated according to the second embodiment, the sectional view of manufacturing step after Figure 23;
Figure 25 is the sectional view of the manufacturing step of the semiconductor device illustrated according to the second embodiment;
Figure 26 is the plane graph of the manufacturing step of the semiconductor device illustrated according to the second embodiment;
Figure 27 be the manufacturing step of the semiconductor device illustrated according to the second embodiment, the sectional view of manufacturing step after Figure 24;
Figure 28 be the manufacturing step of the semiconductor device illustrated according to the second embodiment and the sectional view consistent with the line B that Figure 18 specifies;
Figure 29 is the plane graph of the manufacturing step of the semiconductor device illustrated according to the second embodiment;
Figure 30 be the manufacturing step of the semiconductor device illustrated according to the second embodiment, the sectional view of manufacturing step after Figure 27;
Figure 31 be the manufacturing step of the semiconductor device illustrated according to the second embodiment and the sectional view consistent with the line B that Figure 18 specifies;
Figure 32 A and 32B is the schematic diagram near the end of the lower surface of groove, for illustration of the effect of the second embodiment; With
Figure 33 illustrates the sequential chart of charge injection to the actuation step of the step in the upper nonconductive Film of transistor and transistor.
Embodiment
If need for simplicity, by each in the following examples being divided into multiple part or embodiment describes them; But multiple part or embodiment are not incoherent each other, but they also exist the relation of that one of them is other part or whole distortion, application example, detailed description or supplementary notes, except as otherwise noted.(number, numerical value, amount, scope etc. are comprised) when mentioning the numeral etc. of key element in the following embodiments, this numeral is not restricted to specific numeral, and can be greater than or less than that this is specifically digital, be obviously limited to except optional network specific digit except as otherwise noted or except this numeral in principle.
And in the following embodiments, component part (also comprising key element step etc.) is not necessarily necessary, is obviously necessary except as otherwise noted or in principle.Similarly, when mentioning the shape and position relationship etc. that constituting portion is graded in the following embodiments, also should comprise substantially with those shapes same or similar etc. such as this shape, except as otherwise noted or except thinking except obvious difference in principle.This waits (comprising number, numerical value, number and scope etc.) to be identical with above-mentioned numeral.
Hereinafter, preferred embodiment is described in detail with reference to accompanying drawing.For illustration of in whole figure of embodiment, the parts each other with identical function represent with identical or relevant reference number, and will omit repeated description.When there is multiple similar parts (part), individual or specific part represents by increasing symbol to common reference manuals.In the following embodiments, the description of same or similar part will do not repeated in principle, except non-specifically is necessary.
In the figure that embodiment uses, be easier to viewing, even if also omit hachure in the sectional views to make them.
In sectional view or plane graph, the size of each part and the size of practical devices are not corresponding, and can show relatively large specific part, to make view be easier to understand.This is identical with the situation that sectional view and plane graph correspond to each other.
(the first embodiment)
Hereinafter, the semiconductor device according to the present embodiment is described in detail with reference to accompanying drawing.
[structure description]
Fig. 1 is the sectional view of the structure of the semiconductor device illustrated according to the present embodiment.Fig. 2 is the plane graph of the structure of the semiconductor device illustrated according to the present embodiment.The sectional view of Fig. 1 such as corresponds to the A-A cross section of Fig. 2.
MIS (metal-insulator semiconductor (MIS)) the type FET (field-effect transistor) adopting nitride-based semiconductor according to the semiconductor device of the present embodiment.This semiconductor device is also referred to as HEMT (High Electron Mobility Transistor) or power transistor.A kind of so-called notched gates polar form semiconductor device according to the semiconductor device of the present embodiment.
According in the semiconductor device of the present embodiment, channel layer CH and barrier layer BA is formed in substrate S successively, as shown in Figure 1.Wherein will form the active area AC of transistor by element isolation zone ISO separately (see Fig. 2).
Dielectric film (IF1, IF2) is formed on the BA of barrier layer.This dielectric film comprises two-layer dielectric film.Lower dielectric film IF1 is formed on the BA of barrier layer, and upper nonconductive Film IF2 is formed on lower dielectric film IF1.
When pattern gate electrode GE, this dielectric film (IF1, IF2) has the effect of etching stopping layer.Upper nonconductive Film IF2 is the film that band gap is less than the band gap of lower dielectric film IF1.In addition, upper nonconductive Film IF2 is the film (see Figure 15) that band gap is less than the band gap of gate insulating film GI described later.
Via gate insulating film GI, in the groove T of centre penetrating dielectric film (IF1, IF2) and barrier layer BA arrival channel layer CH, form gate electrode GE.Channel layer CH and barrier layer BA comprises nitride-based semiconductor, and barrier layer BA is the nitride semiconductor layer of a kind of band gap wider than the band gap of channel layer CH.
Two-dimensional electron gas 2DEG produces the near interface between channel layer CH and barrier layer BA, near channel layer CH.When threshold potential (current potential V2>0, also referred to as driving current potential) is applied to gate electrode GE, raceway groove is formed in the near interface between gate insulating film GI and channel layer CH.
Two-dimensional electron gas 2DEG is formed by mechanism below.The nitride-based semiconductor (here, gallium nitride-based semiconductor) forming channel layer CH and barrier layer BA is not identical each other in band gap with electron affinity.Therefore, square trap gesture produces the composition surface between these semiconductors.By accumulating electronics in square trap gesture, two-dimensional electron gas 2DEG produces the near interface between channel layer CH and barrier layer BA.
, be formed in the two-dimensional electron gas 2DEG of the near interface between channel layer CH and barrier layer BA here, wherein formed the groove T of gate electrode GE separately.Therefore, according in the semiconductor device of the present embodiment, when threshold potential not being applied to gate electrode GE, can remain off state, and when threshold potential is applied to gate electrode GE, can conducting state be kept when forming raceway groove.Therefore, the operation of normal off status can be performed.
By the structure of semiconductor device described in further detail according to the present embodiment.According in the semiconductor device of this embodiment, the channel layer CH comprising nitride-based semiconductor is formed in substrate S, and the barrier layer BA comprising nitride-based semiconductor is formed on channel layer CH, as shown in Figure 1.Alternatively, nucleating layer, strain relaxation layer and resilient coating etc., can be successively set between substrate S and channel layer CH from substrate S side.These layers comprise nitride-based semiconductor.Being formed into stratum nucleare is to produce nucleus when growing the layer, the such as strain relaxation layer that are formed in top.In addition, being formed into stratum nucleare is to prevent substrate to be diffused into substrate S and deteriorated from these layers along with the constitution element (such as, Ga etc.) of the layer being formed in top.Forming strain relaxation layer is to suppress substrate S to bend by relaxing the pressure being applied to substrate S or rupture.Resilient coating is the intermediate layer between channel layer CH and strain relaxation layer.
Via gate insulating film GI, penetrating dielectric film (IF1, IF2) and barrier layer BA and excavating in groove (also referred to as the groove) T of the centre of channel layer CH, form gate electrode GE.
Dielectric film (IF1, IF2) has opening (see Fig. 5) at open region (OA1).To forming groove T by opening.
Gate insulating film GI is formed in groove T with on dielectric film (IF1, IF2).Gate electrode GE is formed on gate insulating film GI.The shape (hereinafter referred to as flat shape) of the gate electrode GE obtained when seeing from above is such as rectangle (see Fig. 2).Here, the flat shape of gate insulating film GI and gate electrode GE is mutually the same.
Outstanding shape that gate electrode GE has in one direction (to the right, namely drain electrode DE side) in FIG.Ledge is called as field plate electrode (being also referred to as Faraday shield electrode).Field plate electrode is the subregion of the GE of the gate electrode extended to drain electrode DE from the end of the groove T near drain electrode DE.
Gate electrode GE also extends from the end of the groove T near source electrode SE to source electrode SE.Dielectric film (IF1, IF2) is arranged in below the gate electrode of drain electrode DE or source electrode SE outstanding (extension).
In addition, source electrode SE and drain electrode DE is formed on the barrier layer BA on gate electrode GE both sides.Barrier layer BA and source electrode SE is coupled via ohm layer ohm.Barrier layer BA and drain electrode DE is coupled via ohm layer ohm.Source electrode SE comprises the coupling unit (connector) in the contact hole C1S being located at and being formed in interlayer dielectric IL1, and is positioned at the wiring portion on coupling unit.Drain electrode DE comprises the coupling unit (connector) in the contact hole C1D being located at and being formed in interlayer dielectric IL1, and is positioned at the wiring portion on coupling unit.Source electrode SE and drain electrode DE protection dielectric film PRO covers.The flat shape of each in source electrode SE and drain electrode DE is such as rectangle (see Fig. 2).
Via the coupling unit (connector) be located in the contact hole C1G that formed in interlayer dielectric IL1, above-mentioned gate electrode GE is coupled to grid wiring GL (see Fig. 2).
By so forming the upper nonconductive Film IF2 with the film of the band gap being less than lower dielectric film IF1, in stored charge in upper nonconductive Film IF2 (, electronics), as described afterwards, thus the electric field strength at trench corners place can be improved here.As a result, even also fully define raceway groove at the bight place of groove, thus can conducting resistance be reduced, and increase On current.Therefore, it is possible to improve the driving force of transistor.
[description of manufacture method]
Subsequently, with reference to figure 3 to 13, by describing the manufacture method according to the semiconductor device of the present embodiment, make the structure of semiconductor device more clear.Fig. 3 to 13 is sectional views of the manufacturing step of the semiconductor device illustrated according to this embodiment.
Substrate S forms channel layer CH, as shown in Figure 3.Such as, use comprises the Semiconductor substrate of silicon (Si) as substrate S, the Semiconductor substrate comprising silicon (Si) has the resistivity of 1 Ω cm and exposes its (111) face, and by use MOCVD (metal organic chemical vapor deposition) method etc. in substrate S heteroepitaxial growth gallium nitride (GaN) layer as channel layer CH.The thickness of channel layer CH is such as about 1 μm.Alternatively, the SiC comprising and be different from silicon or sapphire substrate can be used as substrate S.In addition, nucleating layer, strain relaxation layer and resilient coating can be successively set between substrate S and channel layer CH from substrate S side.Such as, use aluminium nitride (AlN) layer as nucleating layer; Use the stacked film (AlN/GaN film) of gallium nitride (GaN) layer and aluminium nitride (AlN) layer as strain relaxation layer; And use AlGaN layer etc. as resilient coating.These layers are by using the formation such as MOCVD method.In this case, the thickness from the surface of substrate S to the part on the surface of channel layer CH is about 3 to 5 μm.
Such as, subsequently, by using MOCVD method etc., heteroepitaxial growth AlGaN (Al on channel layer CH xga (1-x)n) layer is as barrier layer BA.The thickness of AlGaN layer is such as about 0.03 μm.
Therefore, the duplexer of channel layer CH and barrier layer BA is formed.Duplexer is formed by above-mentioned heteroepitaxial growth, namely to look unfamiliar microscler one-tenth by wherein performing stacked III on [0001] crystallographic axis (C axle) direction.In other words, duplexer to be looked unfamiliar microscler one-tenth by (0001) Ga.In duplexer, two-dimensional electron gas 2DEG produces the near interface between channel layer CH and barrier layer BA.
Subsequently, barrier layer BA is formed dielectric film (IF1, IF2) as coverlay.Such as, by use CVD (chemical vapour deposition (CVD)) method etc. on the BA of barrier layer, deposited oxide silicon fiml (SiO 2film, comprises the film of silica) as dielectric film IF1, make it have the thickness of about 0.02 μm.Subsequently, by use CVD method etc. on dielectric film IF1, silicon nitride film (Si 3n 4film, comprises the film of silicon nitride) as dielectric film IF2, make it have the thickness of about 0.02 μm.The band gap of lower silicon oxide film is about 8.9eV, and the band gap of upper silicon nitride film is about 4.5eV.Therefore, the band gap of upper silicon nitride film is less than the band gap (see Figure 15) of lower silicon oxide film.
Subsequently, by using photoetching technique, at the upper photoresist PR1 formed for open element isolated area of dielectric film (IF1, IF2), as shown in Figure 4.Subsequently, by using photoresist PR1 as mask doped with boron (B) or nitrogen (N).Via dielectric film (IF1, IF2) boron (B) or nitrogen (N) is injected into channel layer CH and barrier layer BA in.By so by ionic species, such as boron (B), nitrogen (N) etc., be doped in channel layer CH and barrier layer BA, crystal state changed into and has higher resistance.Thus forming element isolated area ISO.After this, photoresist PR1 is removed.To be served as active area AC (see Fig. 2) by the region that element isolation zone ISO surrounds.
Subsequently, by using photoetching technique, dielectric film IF2 is formed in the photoresist PR2 in the OA1 of open area with opening, as shown in Figure 5.Subsequently, by using photoresist PR2 as mask etch dielectric film (IF1, IF2).Here, wherein will be processed into the photoresist of required form by photoetching (exposure, development) or hard mask performs etching as mask by using, process subsurface material being processed into required form is called patterning.Use such as such as CF 4or CHF 3gas, as the etching gas for silicon nitride film and silicon oxide film.Therefore, barrier layer BA is formed in the dielectric film (IF1, IF2) in the OA1 of open area with opening.In other words, in the OA1 of open area, barrier layer BA (Fig. 5) is exposed.
Next, by using photoresist PR2 as mask etch barrier layer BA and channel layer CH, form the groove T of the centre penetrating dielectric film (IF1, IF2) and barrier layer BA arrival channel layer CH, as shown in Figure 6.By using such as halogen based gases (Cl 2, HBr, BCl 3, etc.) as etching gas, under plasma atmosphere, perform dry etching.Such as, ICP (inductively coupled plasma) etc. can be used as plasma source.When using thickness to be barrier layer (AlGaN) BA of 0.03 μm, in order to ensure removing the two-dimensional electron gas 2DEG in the OA1 of open area, perform the degree of depth on about 0.04 μm, the surface etched into from barrier layer (AlGaN) BA.In other words, the difference in height between the lower surface of barrier layer (AlGaN) BA and the lower surface of groove T is about 0.01 μm.Therefore, remove the surface portion of barrier layer (AlGaN) BA in the OA1 of open area and channel layer (GaN) CH, channel layer (GaN) CH is exposed from open area OA1.Subsequently, photoresist PR2 is removed.
Subsequently, in groove T and at the upper GI forming gate insulating film of dielectric film (IF1, IF2), as shown in Figure 7.Such as, by using ALD (ald) method etc. in groove T and on dielectric film (IF1, IF2), deposit thickness is about pellumina (aluminium oxide, the Al of 0.1 μm 2o 3) as gate insulating film GI.The band gap of gate insulating film GI is greater than the band gap (see Figure 15) of dielectric film (silicon nitride film) IF2 be positioned at below it.The band gap of pellumina is about 6eV, and the band gap being positioned at the silicon nitride film below it is about 4.5eV.
As gate insulating film GI, such as, silicon oxide film beyond above-mentioned pellumina or dielectric constant can be used higher than the high-k films of silicon oxide film.As high-k films, other hafnium based insulation film, such as hafnium oxide film (HfO can be used 2film), hafnium aluminate film, HfON film (nitrogen hafnium oxide film), HfSiO film (hafnium silicate film), HfSiON film (nitrogen hafnium oxide silicon fiml), and HfAlO film.The band gap of often kind of hafnium based insulation film is all greater than the band gap of silicon nitride film.
Consider operating voltage, reliability and puncture voltage etc., the type of design gate insulating film GI and thickness are allegedly necessary in circuit operation.Such as, when using pellumina or silicon oxide film as gate insulating film GI, by it being designed to use in the electric field of 2 to 4MV/cm, obtain almost long-term reliability fully.Therefore, when designing the transistor operated at about 20 to 40V, the thickness of gate insulating film (pellumina or silicon oxide film) GI needs for about 0.1 μm.
The thickness (0.1 μm) of gate insulating film GI is greater than the degree of depth of groove T in most cases.Here, by the difference in height (being 0.04 μm in the present embodiment) between the surface of barrier layer BA and the lower surface of groove CH, the degree of depth of groove is defined as first degree of depth.In addition, by the difference in height (being 0.08 μm in this embodiment) between the surface of upper nonconductive Film IF2 and the lower surface of groove T, the degree of depth of groove is defined as second degree of depth.When the thickness of gate insulating film GI is in this embodiment 0.1 μm, the thickness of gate insulating film is greater than second degree of depth of first degree of depth.
Subsequently, gate insulating film GI is formed the conducting film serving as gate electrode GE.Such as, by using sputtering method etc., the stacked film (also referred to as Au/Ni film) of gold (Au) film that deposition comprises such as nickel (Ni) film and is located thereon face on gate insulating film GI is as conducting film.
Subsequently, by using photoetching technique and etching technique pattern gate electrode GE and gate insulating film GI, gate electrode GE is formed, as shown in Figure 8.By using such as photoetching technique, forming the photoresist PR3 covering and wherein form the region of gate electrode GE, making by using photoresist PR3 as mask etch gate electrode GE and gate insulating film GI.By using such as halogen based gases (Cl 2, HBr, or its mist) as etching gas, under plasma atmosphere, perform dry etching.Such as, ICP (inductively coupled plasma) etc. can be used to make plasma source.Then, photoresist PR3 is removed.
Etching stopping layer is served as at etching dielectric film (IF1, IF2).If by using photoresist PR3 as mask, performing dry etching to the gate electrode GE be formed directly into when not forming dielectric film (IF1, IF2) on the BA of barrier layer and gate insulating film GI, then may damage barrier layer BA.Particularly, if perform process under plasma atmosphere, then plasma damage may be caused.Due to this damage, two-dimensional electron gas can not be formed well.And such as, if the thickness of barrier layer BA is large, then crystallization property may be deteriorated, and may generation device operation institute preferably not reset significantly, otherwise when its thickness hour, then the concentration of two-dimensional electron gas can decline.Therefore, the barrier layer BA with suitable thickness (such as, the thickness of about 0.02 to 0.04 μm) is preferably formed.If the thickness of barrier layer BA is therefore little, then worry the partially-etched barrier layer BA of possibility when being exposed to etching atmosphere, this can cause thickness to become large, partly may lose barrier layer further.In this case, two-dimensional electron gas can not be formed well, and such as, the resistance of two-dimensional electron gas can increase.Therefore, the operating characteristics deterioration of transistor is made.
On the other hand, in the present embodiment, dielectric film (IF1, IF2) plays etching stopping layer, therefore can form two-dimensional electron gas well, and can improve the performance of transistor.
Because dielectric film (IF1, IF2) plays etching stopping layer, so the surface of the dielectric film (IF1, IF2) being exposed to gate electrode GE both sides can be made to retreat.The surface of the dielectric film (IF1, IF2) being exposed to that can be made thus to retreat.But, when etch-stop, preferably retain upper nonconductive Film IF2.Such as, when using silicon oxide film as during gate insulating film GI and when exposing time dielectric film (silicon oxide film) IF2, lower dielectric film IF2 can be etched rapidly and barrier layer BA can be made to be exposed to etching atmosphere, and this may cause barrier layer BA can be etch-damaged.Therefore, preferably stop etching under the state retaining upper nonconductive Film.For playing the preferred thickness of the dielectric film (IF1, IF2) of etching stopping layer, can change according to the type of etching condition and dielectric film; But, in the present embodiment, preferably make the gross thickness of dielectric film IF1 and IF2 be such as about 0.03 to 0.1 μm.In addition, in order to leave dielectric film IF2 as much as possible when etch-stop, the thickness of preferred upper nonconductive Film IF2 is about 0.02 to 0.07 μm.In addition, consider the issuable Tunneling Phenomenon described below, preferably make the thickness of dielectric film IF1 be about 0.01 to 0.03 μm.
Pattern gate electrode GE with make its in one direction (to the right, namely drain electrode DE side) in fig. 8 there is outstanding shape.In other words, perform patterning, make part field plate electrode being provided as gate electrode GE.Field plate electrode is the subregion of gate electrode GE, refers to the electrode part extended to drain electrode DE from the end of the groove T near drain electrode DE.Gate electrode GE also in the other directions (to the left, that is, source electrode SE side) is in fig. 8 outstanding.But the amount outstanding to drain electrode DE side is greater than to the outstanding amount in source electrode SE side.
Subsequently, gate electrode GE forms interlayer dielectric IL1, as shown in Figure 9.Such as, by using CVD method etc., in gate electrode GE and dielectric film (IF1, IF2), deposited oxide silicon fiml is as interlayer dielectric IL1, makes it have the thickness of about 0.7 μm.
Subsequently, by using photoetching technique and etching technique, in interlayer dielectric IL1, contact hole C1S and C1D is formed, as shown in Figure 10.By use such as unshowned photoresist as mask, etching wherein forms the interlayer dielectric IL1 in the region of source electrode SE, form contact hole C1S, and wherein form the interlayer dielectric IL1 in the region of drain electrode DE by etching, form contact hole C1D.In etching, also remove the dielectric film (IF1, IF2) be positioned at below interlayer dielectric IL1.Therefore, barrier layer BA is from the bottom-exposed of each contact hole C1S and C1D.Each contact hole C1S and C1D is arranged on the barrier layer BA of gate electrode GE both sides thus.When forming contact hole C1S and C1D, also formed in gate electrode GE contact hole (C1G) (see Fig. 2).
Subsequently, the interlayer dielectric IL1 comprising the inside such as contact hole C1S and C1D forms conducting film CL, as shown in figure 11.First the interlayer dielectric IL1 comprising contact hole C1S and C1D inside forms ohm layer.Such as, by using sputtering method etc., titanium deposition (Ti) film on the interlayer dielectric IL1 comprising contact hole C1S and C1D inside, makes it have the thickness of about 0.05 μm.Subsequently, by using sputtering method etc., on ohm layer, deposition of aluminum film is as metal film, makes it have the thickness of about 0.6 μm.Subsequently, heat treatment is performed to reduce the coupling resistance between barrier layer BA and ohm layer.Such as, about 30 seconds of heat treatment are performed with the temperature of 650 DEG C under nitrogen atmosphere.Alternatively, aluminium alloy beyond aluminium can be used as metal film.Such as, can use the alloy (Al-Si) of Al and Si, the alloy (Al-Cu) of Al and Cu (copper) and Al, Si and Cu alloy (Al-Si-Cu) etc. as aluminium alloy.
Subsequently, by using photoetching technique and etching technique patterning Ti/Al film, in contact hole C1S and C1D and on contact hole C1S and C1D, form source electrode SE and drain electrode DE, as shown in figure 12.By using such as photoetching technique, conducting film CL forms the photoresist PR4 in the region covering wherein formation source electrode SE and the region wherein forming drain electrode DE, to use photoresist PR4 as mask etch conducting film CL.Form source electrode SE and drain electrode DE thus.In this case, also conducting film CL can be embedded in the contact hole C1G in gate electrode GE, and form grid wiring GL (see Fig. 2) thereon.Then, photoresist PR4 is removed.
Subsequently, on dielectric film IL1, comprise on source electrode SE and drain electrode DE, form protection dielectric film (also referred to as surface protection film) PRO, as shown in figure 13.Such as, by using CVD method etc., on dielectric film IL1, comprise on source electrode SE and drain electrode DE, depositing silicon oxy-nitride (SiON) film is as protection dielectric film.
By above step, the semiconductor device shown in Fig. 1 can be formed.Here, above-mentioned steps is an example, and by the step beyond above-mentioned steps, manufactures the semiconductor device according to the present embodiment.
In the present embodiment, as mentioned above, by being formed, there is the upper nonconductive Film IF2 of the film of the band gap being less than lower dielectric film IF1, can stored charge be (here in upper nonconductive Film IF2, electronics), thus the electric field strength at the bight place at groove can be improved.As a result, even if also can raceway groove be fully formed at the bight place of groove, thus can conducting resistance be reduced and increase On current.Therefore, the driving force of transistor can be improved.
Figure 14 A to 14D be for illustration of the present embodiment effect, schematic diagram near the end of trench bottom surfaces.When using single-layer insulating film (such as, silicon oxide film) IF as coverlay, the gap between the equipotential curve between the lower surface and the lower surface of gate electrode GE of dielectric film IF becomes large, as shown in Figure 14 A.On the other hand, when in upper nonconductive Film IF2 time stored charge (here, electronics), as in the present embodiment, gap smaller between the equipotential curve between the lower surface and the lower surface of gate electrode GE of dielectric film IF2, as shown in Figure 14B.Make On current become large by strengthening electric field energy in source like this, thus the driving force of transistor can be improved.
Particularly, at end (bight) place of the lower surface of groove T, the thickness of gate insulating film GI becomes large, thus may produce the voltage being wherein applied to gate electrode GE and relaxed and the situation unlikely forming passage.In addition, when the thickness of gate insulating film GI arrives greatly so that when being greater than the degree of depth (first degree of depth, second degree of depth) of groove T, as shown in Figure 14 C, the situation wherein unlikely forming raceway groove further can be produced.Such as, when the thickness of gate insulating film GI arrives greatly so that when being greater than the degree of depth (first degree of depth, second degree of depth) of groove T, as shown in Figure 14 C, with its thickness little to so that be less than the degree of depth of groove T situation compared with, may be larger at the thickness of end (bight) the place gate insulating film GI of the lower surface of groove T, thus the situation wherein unlikely forming raceway groove further may be produced.Here, CP represents current path.
When consider transistor bear voltage intend the voltage drive transistor of use-case 20V or larger according to appointment time, as mentioned above, even if selection has the insulating material of well tolerable voltage (such as, aluminium oxide or silica), the thickness of gate insulating film GI also needs to ask at 0.1 μm (1000A) or larger.On the other hand, if the degree of depth of groove T is made too large, then worry to produce fault as described below.If the degree of depth of groove T is made too large, then the etching of groove T will become difficulty.In addition, if deep-cut channel layer CH, then the ratio taking current path (CP see in Figure 14 C) when operating by the sidewall of groove T when transistor becomes large, thus resistance is increased.Therefore, the bottom of preferred groove T is the position (being about 0.01 μm in the present embodiment) of dark about 0.01 to 0.02 μm from the border (two-dimensional electron gas 2DEG) between barrier layer BA and channel layer CH.The degree of depth of the thickness of barrier layer BA and groove T is made to be greatly both possible; But in this case, be difficult to source electrode SE ohm is coupled to barrier layer BA and drain electrode DE ohm is coupled to barrier layer BA, thus cause the increase of resistance between them.In addition, in order to form barrier layer (AlGaN) BA with well-crystallized characteristic, preferably in the scope of 0.02 to 0.04 μm (200 to 400A), adjust its thickness.
As mentioned above, also exist and make the thickness of gate insulating film GI become large and the trend that diminishes of the degree of depth of groove T, it is more important that this makes to solve the problems referred to above unlikely forming raceway groove.
On the other hand, according to the present embodiment, by being formed, there is the upper nonconductive Film IF2 of the film of the band gap being less than lower dielectric film IF1, can stored charge be (here in upper nonconductive Film IF2, electronics), thus the electric field strength at the bight place at groove can be improved.Therefore, also can strengthen electric field in source, make it possible to effectively form raceway groove.
Subsequently, with reference to figure 15A-16, the reason of upper nonconductive Film IF2 stored charge (, electronics) will be described in here, and the method for stored charge.15A to 15D is the energy band diagram of the situation that charge injection is shown.Figure 16 illustrates the sequential chart of charge injection to the actuation step of the step in the upper nonconductive Film of transistor and transistor.
By providing the high voltage (current potential V1) making tunnelling current flow through the degree of lower dielectric film IF1 to gate electrode GE, can perform charge injection in upper nonconductive Film IF2.Such as, when use describe in the present embodiment and there is the dielectric film IF1 of the thickness of about 0.02 μm time, by applying the current potential of about 30 to 50V to gate electrode GE, can via upper nonconductive Film IF1 from two-dimensional electron gas 2DEG by charge injection to upper nonconductive Film IF2.Alternatively, when the thickness of insulating barrier IF1 is about 0.01 to 0.02 μm, can by charge injection in dielectric film IF2 with the current potential of about 30 to 50V.
When being applied to the current potential hour (such as, about 10V) of gate electrode GE, do not produce Tunneling Phenomenon, as shown in fig. 15.On the other hand, when high potential (such as, about 40V) is applied to gate electrode GE, can Tunneling Phenomenon be produced and via dielectric film IF1 by charge injection in upper nonconductive Film IF2, as shown in fig. 15b.Band gap due to upper nonconductive Film (SiN) IF2 is less than lower dielectric film (SiO 2) band gap of IF1, so accumulate tunneling injection electronics (e in upper nonconductive Film (SiN) IF2 -).And, gate insulating film (Al 2o 3) band gap be greater than the band gap of upper nonconductive Film (SiN) IF2, injected electrons (e -) be maintained in upper nonconductive Film (SiN) IF2.When complete iunjected charge, as shown in figure 15 c, due to the injection of electric charge, the potential difference between arrow has diminished.When not applying current potential to gate electrode GE, also keep the electric charge injected.In addition, when transistor operation, namely, when passing through to apply threshold potential (such as to gate electrode, about 10V) when making transistor be in conducting state, can not Tunneling Phenomenon be produced, as shown in figure 15d, therefore can not inject new electric charge, and still keep injected electrons (e in upper nonconductive Film (SiN) IF2 -), thus it is no problem that the conducting of transistor is operated.
Such as, in standby interval St, current potential (electron injection current potential) V1 is applied to gate electrode GE and reaches period t1, as shown in figure 16.In this state, each in source potential and drain potential is such as 0V.Therefore, electric charge can be accumulated in upper nonconductive Film IF2.Then, in the switching period Sw making transistor turns/cut-off operation, reaching period t2 by applying current potential (threshold potential) V2 to gate electrode GE, making transistor be in conducting state.In this state, source potential is such as 0V and drain potential is such as 0 to 10V.Current potential V1 is greater than current potential V2.Current potential V1 is 30 to 50V, and current potential V2 is 5 to 15V.Period t1 is about 1 to 10 second, and period t2 is about 10 -8to 10 -4second.
Therefore, it is possible in upper nonconductive Film IF2 stored charge, and the gap smaller that can make between equipotential curve in source.And, On current can be made to become large by strengthening electric field in source, thus the driving force of transistor can be improved.
(the second embodiment)
In a first embodiment, by using gate electrode GE and passing through to apply high potential, stored charge in upper nonconductive Film IF2 to gate electrode GE; But, by providing and using charge injection electrode CIE, also can in upper nonconductive Film IF2 stored charge.
Hereinafter, the semiconductor device according to the present embodiment is described in detail with reference to accompanying drawing.In this embodiment, the structure of the part except charge injection electrode CIE is identical with the structure of the semiconductor device according to the first embodiment.Therefore, by structure identical with the first embodiment for brief description and manufacturing step.
[structure description]
Figure 17 and 19 is sectional views of the structure of the semiconductor device illustrated according to the present embodiment.Figure 18 is the plane graph of the structure of the semiconductor device illustrated according to the present embodiment.The sectional view of Figure 17 corresponds to the A-A cross section in such as Figure 18, and the sectional view of Figure 19 corresponds to the B-B cross section in such as Figure 18.
Similar with the first embodiment, be also the MIS type field-effect transistor using nitride-based semiconductor according to the semiconductor device of the present embodiment.Also be so-called groove grid-type semiconductor device according to the semiconductor device of the present embodiment.
According in the semiconductor device of the present embodiment, channel layer CH and barrier layer BA is formed in substrate S successively, as shown in figure 17.Wherein form the active area AC of transistor by element isolation zone ISO separately (see Figure 18).
Dielectric film (IF1, IF2) is formed on the BA of barrier layer.This dielectric film comprises two-layer dielectric film.Lower dielectric film IF1 is formed on the BA of barrier layer, and upper nonconductive Film IF2 is formed on lower dielectric film IF1.
When pattern gate electrode GE, this dielectric film (IF1, IF2) has the effect of etching stopping layer.Upper nonconductive Film IF2 is the film that band gap is less than the band gap of lower dielectric film IF1.In addition, upper nonconductive Film IF2 is the film that band gap is less than the band gap of gate insulating film GI described later.
In the present embodiment, charge injection electrode CIE is formed on dielectric film IF2 further.
Via gate insulating film GI, in the groove of centre penetrating charge injection electrode CIE, dielectric film (IF1, IF2) and barrier layer BA arrival channel layer CH, form gate electrode GE.Channel layer CH and barrier layer BA comprises nitride-based semiconductor, and barrier layer BA is the nitride-based semiconductor of band gap wider than the band gap of (having less electron affinity) channel layer CH.Charge injection electrode CIE comprises conducting film.
Two-dimensional electron gas 2DEG produces the near interface between channel layer CH and barrier layer BA, near channel layer CH.When threshold potential (current potential V2>0) is applied to gate electrode GE, raceway groove is formed in the near interface between gate insulating film GI and channel layer CH.
By the structure of semiconductor device described in further detail according to the present embodiment.According in the semiconductor device of the present embodiment, the channel layer CH comprising nitride-based semiconductor is formed in substrate S, and the barrier layer BA comprising nitride-based semiconductor is formed on channel layer CH, as shown in figure 17.Alternatively, nucleating layer, strain relaxation layer and resilient coating etc., can be successively set between substrate S and channel layer CH from substrate S side.
Via the GI of gate insulating film, penetrating charge injection electrode CIE, dielectric film (IF1, IF2) and barrier layer BA and digging in the middle groove T of channel layer, forming gate electrode GE.
Each in charge injection electrode CIE and dielectric film (IF1, IF2) has opening (see Figure 21) in the OA1 of open area.To forming groove T by opening.
Gate insulating film GI to be formed in groove T and to be formed on charge injection electrode CIE and dielectric film (IF1, IF2).Gate electrode GE is formed on gate insulating film GI.The flat shape of gate electrode GE is such as rectangle (see Figure 18).Here, the flat shape of gate insulating film GI and gate electrode GE is mutually the same.Charge injection electrode CIE has and is positioned at rectangle part below gate electrode GE and the as described below contact portion (also referred to as pull-out part) pulled out from this part.But, in the part of groove T, do not form charge injection electrode CIE (see Figure 29).
Outstanding shape that gate electrode GE has in one direction (to the right, namely drain electrode DE side) in FIG.This ledge is called as field plate electrode.Gate electrode GE also extends from the end of the groove T near source electrode SE to source electrode SE.Charge injection electrode CIE is arranged in below the gate electrode part of drain electrode DE or source electrode SE outstanding (extension), and dielectric film (IF1, IF2) is arranged in below charge injection electrode CIE further.
In addition, source electrode SE and drain electrode DE is formed on the barrier layer BA that is positioned on gate electrode GE both sides.Any one in barrier layer BA and source electrode SE or drain electrode DE is coupled via ohm layer ohm.Source electrode SE comprises the coupling unit (connector) in the contact hole C1S being located at and being formed in interlayer dielectric IL1, and is positioned at the wiring portion on coupling unit.Drain electrode DE comprises the coupling unit (connector) in the contact hole C1D being located at and being formed in interlayer dielectric IL1, and is positioned at the wiring portion on coupling unit.Source electrode SE and drain electrode DE protection dielectric film PRO covers.The flat shape of each in source electrode SE and drain electrode DE is such as rectangle (see Figure 18).
Via the coupling unit (connector) be located in the contact hole C1G that formed in interlayer dielectric IL1, above-mentioned gate electrode GE is coupled to grid wiring GL (see Figure 18).Via the coupling unit (connector) be located in the contact hole C1CI that formed in interlayer dielectric IL1, charge injection electrode CIE is pulled out from the bottom of gate electrode GE, to be coupled to charge injection wiring CIL (see Figure 18 and 19).
Similar with the first embodiment, by forming the upper nonconductive Film IF2 with the film of the band gap being less than lower dielectric film IF1, as mentioned above, can at stored charge in upper nonconductive Film IF2 (here, electronics), thus the electric field strength at the bight place at groove can be improved.As a result, even also fully define raceway groove at the bight place of groove, thus can conducting resistance be reduced, and increase On current.Therefore, it is possible to improve the driving force of transistor.
Because charge injection electrode CIE is arranged on upper nonconductive Film IF2, thus can with the voltage lower than the first embodiment by charge injection in dielectric film IF2.In addition, gate electrode GE and charge injection electrode CIE can be controlled separately, therefore can perform separately the actuation step of charge injection step and transistor.
[description of manufacture method]
Subsequently, referring to figures 20 through 31, by describing the manufacture method according to the semiconductor device of the present embodiment, make the structure of semiconductor device more clear.Figure 20 to 31 is sectional views of the manufacturing step of the semiconductor device illustrated according to this embodiment.
As shown in figure 20, in the same manner as in the first embodiment, the substrate S identical with the first embodiment forms channel layer (GaN) CH, barrier layer (AlGaN) BA, dielectric film (silicon oxide film) IF1 and dielectric film (silicon nitride) IF2 successively.The band gap of lower silicon oxide film is 8.9eV, and upper silicon nitride film is 4.5eV.Therefore, the band gap of upper silicon nitride film is less than the band gap of lower silicon oxide film.
Subsequently, dielectric film IF2 forms charge injection electrode CIE.Such as, by using sputtering method etc., on dielectric film IF2, deposits tungsten (W) film is as conducting film.Alternatively, the metal beyond W can be used, such as TiN (titanium nitride) and its compound (but, the compound of conduction) as charge injection electrode CIE.
Subsequently, by using photoetching technique, charge injection electrode CIE forms the photoresist PR1 being used for open element isolated area.Subsequently, similar with the first embodiment, by using photoresist PR1 as mask doped with boron (B) or nitrogen (N), forming element isolated area ISO.Then, photoresist PR1 is removed.To be served as active area AC (see Figure 18) by the region that element isolation zone ISO surrounds.
Subsequently, by using photoetching technique, charge injection electrode CIE is formed in the photoresist PR2 in the OA1 of open area with opening, as shown in figure 21.Subsequently, by using photoresist PR2 as mask etch charge injection electrode CIE and dielectric film (IF1, IF2).Gas such as such as Cl can be used 2or CF 4as the etching gas for charge injection electrode CIE.Gas such as such as CF can be used 4or CHF 3as the etching gas for silicon nitride film and silicon oxide film.Therefore, on the BA of barrier layer, be formed in the stacked film of charge injection electrode CIE and the dielectric film (IF1, IF2) in the OA1 of open area with opening.In other words, barrier layer BA (Figure 21) is exposed at open area OA1.
Next, by using photoresist PR2 as mask etch barrier layer BA and channel layer CH, being formed and penetrating the groove T that charge injection electrode CIE, dielectric film (IF1, IF2) and barrier layer BA arrive the centre of channel layer CH, as shown in figure 22.By using such as halogen based gases (Cl 2, HBr, BCl 3, etc.) as etching gas, under plasma atmosphere, perform dry etching.Such as, ICP (inductively coupled plasma) etc. can be used as plasma source.When using thickness to be barrier layer (AlGaN) BA of 0.03 μm, in order to ensure removing the two-dimensional electron gas 2DEG in the OA1 of open area, perform the degree of depth on about 0.04 μm, the surface etched into from barrier layer (AlGaN) BA.Therefore, remove the surface portion of barrier layer (AlGaN) BA in the OA1 of open area and channel layer (GaN) CH, make to expose channel layer (GaN) CH.Subsequently, photoresist PR2 is removed.
Subsequently, in groove T and on charge injection electrode CIE, gate insulating film GI is formed, as shown in figure 23.Such as, similar with the first embodiment, by using ALD method etc., in groove T and on dielectric film (IF1, IF2), pellumina (aluminium oxide, the Al of deposit thickness about 0.1 μm 2o 3) as gate insulating film GI.The band gap of gate insulating film GI is greater than the band gap of dielectric film (silicon nitride film) IF2 be positioned at below it.The band gap of pellumina is 6eV, and the band gap being positioned at the silicon nitride film below it is 4.5eV.
Alternatively, the silicon oxide film described in the first embodiment or dielectric constant can be used higher than the high-k films of silicon oxide film as gate insulating film GI.Here, similar with the first embodiment, the thickness (0.1 μm) of gate insulating film (silicon oxide film) GI is greater than the degree of depth (first degree of depth and second degree of depth) of groove T.
Subsequently, gate insulating film GI forms gate electrode GE.Such as, similar with the first embodiment, by using sputtering method etc., the stacked film (also referred to as Au/Ni film) of gold (Au) film that deposition comprises such as nickel (Ni) film and is located thereon face on gate insulating film GI is as conducting film.
Subsequently, by using photoetching technique and etching technique pattern gate electrode GE and gate insulating film GI, gate electrode GE is formed, as shown in Figure 24 to 26.By using such as photoetching technique, forming the photoresist PR3 covering and wherein form the region of gate electrode GE, making by using photoresist PR3 as mask etch gate electrode GE and gate insulating film GI.By using such as halogen based gases (Cl 2, HBr, BCl 3deng, or its mist) as etching gas, under plasma atmosphere, perform dry etching.Such as, ICP (inductively coupled plasma) etc. can be used to make plasma source.Then, photoresist PR3 is removed.Therefore, it is possible to form the gate electrode GE of rectangle, as shown in figure 26.Charge injection electrode CIE is made to be exposed to the surrounding (Figure 24 to 26) of gate electrode GE.
Subsequently, by using photoetching technique and etching technique, patterning electric charge injecting electrode CIE, as shown in Figure 27 to 29.By using such as photoetching technique, forming the photoresist PR32 covering the region wherein forming charge injection electrode CIE, making by using photoresist PR32 as mask etch charge injection electrode CIE.By using such as Cl 2or HBr, as etching gas, under plasma atmosphere, perform dry etching.Such as, ICP (inductively coupled plasma) etc. can be used to make plasma source.Then, photoresist PR32 is removed.Therefore, it is possible to form the charge injection electrode CIE with the rectangle part be positioned at below gate electrode GE and the contact portion pulled out from this part (also referred to as pull-out part, pull-out part is in the left side of Figure 29), as shown in figure 29.In the part of groove T, in the step forming groove T, remove charge injection electrode CIE.Therefore, the dash area shown in Figure 29 serves as the region for wherein forming charge injection electrode CIE.
As etching charge injecting electrode CIE, dielectric film (IF1, IF2) serves as etching stopping layer.Similar with the first embodiment, if by using photoresist PR32 as mask, dry etching is performed to the charge injection electrode CIE be formed directly into when not forming dielectric film (IF1, IF2) on the BA of barrier layer, then barrier layer BA may damage, and the operating characteristics of transistor may deterioration.
On the other hand, in the present embodiment, dielectric film (IF1, IF2) plays etching stopping layer, thus can improve the performance of transistor.
The surface of the dielectric film (IF1, IF2) of the both sides being exposed to gate electrode GE can be made to retreat.But, when etch-stop, preferably retain upper nonconductive Film IF2.Such as, when using silicon oxide film as during gate insulating film GI and when exposing time dielectric film (silicon oxide film) IF2, lower dielectric film IF2 can be etched rapidly and barrier layer BA can be made to be exposed to etching atmosphere, and this may cause barrier layer BA can be etch-damaged.Because the thickness of barrier layer BA is little as mentioned above, so affect two-dimensional electron gas possibly when barrier layer BA damages.Therefore, preferably stop etching under the state retaining upper nonconductive Film.
The pattern gate electrode GE shape that (to the right, namely drain electrode DE side) is in fig. 24 outstanding making it have in one direction.In other words, perform patterning, make part field plate electrode being provided as gate electrode GE.Field plate electrode is the subregion of gate electrode GE, refers to the electrode part extended to drain electrode DE from the end of the groove T near drain electrode DE.Gate electrode GE also in the other directions (to the left, that is, source electrode SE side) is in fig. 24 outstanding.But the outstanding amount to drain electrode DE side is greater than to the outstanding amount in source electrode SE side.
Subsequently, gate electrode GE is formed interlayer dielectric IL1, source electrode SE and drain electrode DE, as shown in figs. 30 and 31.After formation interlayer dielectric IL1, such as, in the same manner as in the first embodiment, form C1S and C1D of contact hole.In this case, gate electrode GE is formed contact hole (C1G), and on charge injection electrode CIE, forms contact hole C1CI (see Figure 18 and 31).
Subsequently, in the same manner as in the first embodiment, the interlayer dielectric IL1 of inside comprising contact hole C1S and C1D forms conducting film CL, then form source electrode SE and drain electrode DE by pattern conductive film CL.In this case, in the contact hole C1G in gate electrode GE and in the above, form grid wiring GL, in the contact hole C1CI on charge injection electrode CIE and in the above, form charge injection wiring CIL (see Figure 18 and 31).
Subsequently, in the same manner as in the first embodiment, on the dielectric film IL1 comprising source electrode SE and drain electrode DE, formation protection dielectric film PRO (see Figure 17, etc.).
The semiconductor device shown in Figure 17 can be formed by above-mentioned steps.Here, above-mentioned steps is an example, and can by the step manufacture beyond above-mentioned steps according to the semiconductor device of the present embodiment.
Therefore, similar with the first embodiment, in the present embodiment, also the film being less than the band gap of lower dielectric film IF1 by band gap forms upper insulating film IF2, therefore, it is possible in upper nonconductive Film IF2 stored charge (here, electronics), thus improve electric field strength at the bight place of groove.As a result, be even also fully formed raceway groove at the bight place of groove, thus can conducting resistance be reduced, and increase On current.Therefore, it is possible to improve the driving force (see Figure 14 and 15) of transistor.
Figure 32 A and 32B be for illustration of the present embodiment effect, schematic diagram near the end of trench bottom surfaces.Figure 33 illustrates by the sequential chart of charge injection to the actuation step of the step in the upper nonconductive Film of transistor and transistor.
When using single-layer insulating film (such as, silicon oxide film) IF as coverlay, the gap between the equipotential curve between the lower surface and the lower surface of gate electrode GE of dielectric film IF becomes large, as shown in fig. 32 a.On the other hand, when in upper nonconductive Film IF2 time stored charge (here, electronics), as in the present embodiment, gap smaller between the equipotential curve between the lower surface and the lower surface of gate electrode GE of dielectric film IF2, as shown in fig. 32b.Make On current become large by strengthening electric field energy in source like this, thus the driving force of transistor can be improved.
By providing the high voltage (current potential V1) making tunnelling current flow through the degree of lower dielectric film IF1 to charge injection electrode CIE, can perform charge injection in upper nonconductive Film IF2.Such as, when use describe in the present embodiment and the dielectric film IF1 of thickness about 0.02 μm time, by applying the current potential of about 30 to 50V to charge injection electrode CIE, can via upper nonconductive Film IF1 from two-dimensional electron gas 2DEG by charge injection to upper nonconductive Film IF2.Alternatively, when the thickness of insulating barrier IF1 is about 0.01 to 0.03 μm, can by charge injection in dielectric film IF2 with the current potential of about 15 to 30V.
Such as, current potential V1 is applied to charge injection electrode CIE in standby interval St and reaches period t1, as shown in figure 33.In this state, each in source potential and drain potential is such as 0V.Therefore, electric charge is accumulated in upper nonconductive Film IF2.Then, in the switching period Sw making transistor turns/cut-off operation, reaching period t2 by applying current potential (threshold potential) V2 to charge injection electrode CIE, making transistor be in conducting state.In this state, source potential is such as 0V and drain potential is such as 0 to 10V.Current potential V1 is 15 to 30V, and current potential V2 is 5 to 15V.Period t1 is about 1 to 10 second, and period t2 is about 10 -8to 10 -4second.
Therefore, it is possible in upper nonconductive Film IF2 stored charge, and the gap smaller that can make between equipotential curve in source, and On current can be made to become large by strengthening electric field in source, thus the driving force of transistor can be improved.
The present invention of the present inventor's proposition is specifically described above based on preferred embodiment; But much less, the present invention should not be limited to preferred embodiment, and various change can be carried out to the present invention in the scope not departing from purport of the present invention.
In the first above-mentioned embodiment (see Figure 15), describe the example of the combination wherein using silicon oxide film, silicon nitride film and pellumina as dielectric film IF1, dielectric film IF2 and gate insulating film GI.On the other hand, other can be used to combine, and wherein the band gap (Eg (IF1), Eg (IF2) and Eg (GI)) of these films meets relation: Eg (IF1) >Eg (IF2); And Eg (GI) >Eg (IF2).Such as, the combination of silicon oxide film, silicon nitride film and silicon oxide film can be used as the combination of dielectric film IF1, dielectric film IF2 and gate insulating film GI.
In addition, iunjected charge in standby interval St, and in switching period Sw subsequently driving transistors (conduction and cut-off operation); But standby interval St can only provide once in the initial period, or must switching period Sw in termly (every scheduled time slot) provide.Alternatively, can before the operation of each conduction and cut-off, by charge injection in dielectric film IF2.

Claims (20)

1. a semiconductor device, comprising:
First nitride semiconductor layer, described first nitride semiconductor layer is formed in types of flexure;
Second nitride semiconductor layer, described second nitride semiconductor layer to be formed on described first nitride semiconductor layer and to have the band gap of the band gap length than described first nitride semiconductor layer;
Dielectric film, described dielectric film is formed in above described second nitride semiconductor layer;
Groove, described groove penetrates described dielectric film and described second nitride semiconductor layer to arrive the centre of described first nitride semiconductor layer; And
Gate electrode, described gate electrode is formed in on described dielectric film in described groove via gate insulating film,
Wherein, described dielectric film has the first film and is formed in the second film on described first film, and
Wherein, the band gap of described second film is less than the band gap of described first film.
2. semiconductor device according to claim 1,
Wherein, the band gap of described second film is less than the band gap of described gate insulating film.
3. semiconductor device according to claim 2,
Wherein, described first film is oxidation film, and described second film is nitride film.
4. semiconductor device according to claim 3,
Wherein, described first film is silicon oxide film, and described second film is silicon nitride film.
5. semiconductor device according to claim 4,
Wherein, described gate insulating film is silicon oxide film or pellumina.
6. semiconductor device according to claim 1,
Wherein, the thickness of described gate insulating film is greater than the difference in height between the surface of described second nitride semiconductor layer and the lower surface of described groove.
7. semiconductor device according to claim 1,
Wherein, the thickness of described gate insulating film is greater than the difference in height between the surface of described second film and the lower surface of described groove.
8. semiconductor device according to claim 1,
Wherein, stored charge in described second film.
9. semiconductor device according to claim 8,
Wherein, by applying the first current potential to described gate electrode, by described charge injection in described second film.
10. semiconductor device according to claim 9,
Wherein, by applying the second current potential to described gate electrode, in the bottom of described groove, form raceway groove, and
Wherein, described first current potential is greater than described second current potential.
11. semiconductor device according to claim 10,
Wherein, is longer than the period described second current potential being applied to described gate electrode the period that described first current potential is applied to described gate electrode.
12. 1 kinds of semiconductor device, comprising:
First nitride semiconductor layer, described first nitride semiconductor layer is formed in types of flexure;
Second nitride semiconductor layer, described second nitride semiconductor layer to be formed on described first nitride semiconductor layer and to have the band gap of the band gap length than described first nitride semiconductor layer;
Dielectric film, described dielectric film is formed in above described second nitride semiconductor layer;
Conducting film, described conducting film is formed on described dielectric film;
Groove, described groove penetrates the centre that described conducting film, described dielectric film and described second nitride semiconductor layer arrive described first nitride semiconductor layer; And
Gate electrode, described gate electrode is formed in on described conducting film in described groove via gate insulating film,
Wherein, described dielectric film has the first film and is formed in the second film on described first film, and
Wherein, the band gap of described second film is less than the band gap of described first film.
13. semiconductor device according to claim 12,
Wherein, the band gap of described second film is less than the band gap of described gate insulating film.
14. semiconductor device according to claim 13,
Wherein, described first film is silicon oxide film, and described second film is silicon nitride film, and
Wherein, described gate insulating film is silicon oxide film or pellumina.
15. semiconductor device according to claim 12,
Wherein, the thickness of described gate insulating film is greater than the difference in height between the surface of described second nitride semiconductor layer and the lower surface of described groove.
16. semiconductor device according to claim 12,
Wherein, the thickness of described gate insulating film is greater than the difference in height between the surface of described conducting film and the lower surface of described groove.
17. semiconductor device according to claim 12,
Wherein, charge accumulated is in described second film.
18. semiconductor device according to claim 17,
Wherein, by applying the first current potential to described conducting film, by described charge injection in described second film.
19. semiconductor device according to claim 18,
Wherein, by applying the second current potential to described gate electrode, in the bottom of described groove, form raceway groove, and
Wherein, described first current potential is greater than described second current potential.
20. semiconductor device according to claim 19,
Wherein, is longer than the period described second current potential being applied to described gate electrode the period that described first current potential is applied to described conducting film.
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