CN105384445A - Ceramic heat radiation material and application thereof in heat radiation substrate - Google Patents
Ceramic heat radiation material and application thereof in heat radiation substrate Download PDFInfo
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- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
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Abstract
The invention belongs to the technical field of high-power LED lamp heat radiation, and particularly relates to a ceramic heat radiation material and an application thereof in a heat radiation substrate. The ceramic heat radiation material is prepared from, by weight, 40-55 parts of silicon nitride powder, 10-20 parts of quartz powder, 3-8 parts of melamine, 3-6 parts of hydroxymethyl cellulose, 8-12 parts of polyvinyl alcohol and 5-10 parts of sintering aid. The ceramic heat radiation material and the application thereof in the heat radiation substrate have the advantages that the ceramic heat radiation composite material is large in heat conductivity coefficient, excellent in heat resistance, high in flexure strength and free of bending, warping and other phenomena; different molding needs can be met through the ceramic heat radiation composite material according to the shape, thickness and other conditions of products, and different ceramic substrates with the thickness of 0.2 mm to 10 mm can be prepared.
Description
Technical field
The invention belongs to high-powered LED lamp technical field of heat dissipation, be specifically related to a kind of ceramic heat emission material and and application in heat-radiating substrate thereof.
Background technology
LED is a kind of can be the semiconductive luminescent materials of luminous energy by converting electric energy, LED lamp have low in energy consumption, volume is little, reliability is high, control is convenient, the life-span is long and respond the advantage such as fast and be widely used in instrument, computer, automobile, automatically control, the field such as outdoor large screen information displaying and full-color TV indicating system.Because LED only has the electric energy of 15% ~ 25% to be converted to luminous energy in its working process, remaining electric energy is almost all converted to heat energy, LED ground temperature is raised, thus affect the luminosity of LED, the reliability of LED information display system and work-ing life, therefore the demand along with LED illumination is increasingly urgent, and the heat dissipation problem of great power LED comes into one's own increasingly.
Present stage, more general ceramic heat-dissipating substrate had 4 kinds: directly cover copper ceramic plate (DBC), direct copper plating substrate (DPC), high temperature co-firing multilayer ceramic substrate (HTCC) and low temperature co-fired multilayer ceramic substrate (LTCC).And the LED ceramic baseplate how designing a kind of superior performance especially perfect heat-dissipating is the focus of research.
Summary of the invention
The present invention is directed to existing heat-radiating substrate poor radiation, poor insulativity problem and a kind of ceramic heat emission material and the application in heat-radiating substrate thereof are provided.
The technical scheme adopted to realize the object of the invention is: a kind of ceramic heat emission material, described ceramic heat emission material, count by weight, comprise silicon nitride powder 40 ~ 55 parts, silica powder 10 ~ 20 parts, trimeric cyanamide 3 ~ 8 parts, Walocel MT 20.000PV 3 ~ 6 parts, polyvinyl alcohol 8 ~ 12 parts and sintering aid 5 ~ 10 parts.
Ceramic heat emission material of the present invention is obtained by following steps: 1) add the silicon nitride powder of 40 ~ 55 parts, silica powder 10 ~ 20 parts, trimeric cyanamide 3 ~ 8 parts, Walocel MT 20.000PV 3 ~ 6 parts, polyvinyl alcohol 8 ~ 12 parts and sintering aid 5 ~ 10 parts successively and carry out wet ball grinding, ball milling 2 ~ 4 hours, carry out vacuum stirring de-bubble, obtained ceramic size; 2) by step 1) obtained ceramic size by mold bottom press-in die, naturally placed gelation process; Take out ceramic green sheet and carry out drying treatment, put into hot pressing die and be placed in hot pressing furnace and carry out high temperature sintering compacting, then cooling down obtains ceramic heat emission material.
Sintering aid of the present invention, counts by weight, comprises silica flour 60 ~ 70 parts, aluminium powder 5 ~ 10 parts, attapulgite 10 ~ 20 parts and 10 ~ 20 parts, calcium oxide.Described sintering aid is obtained by following steps: silica flour 60 ~ 70 parts, aluminium powder 5 ~ 10 parts, attapulgite 10 ~ 20 parts, 10 ~ 20 parts, calcium oxide are scattered in dehydrated alcohol and form mixed slurry, namely complex sintering aids is obtained after drying, wherein, the mass volume ratio of described silica flour and dehydrated alcohol is 1g:5mL.
Preferably, the mean particle size of silicon nitride powder of the present invention is 1 ~ 3 μm, and density is 2 ~ 3g/cm
3.
In the preparation process of ceramic heat emission material, step 2) in ceramic green sheet adopt at least 2 layer by layer poststack carry out high temperature sintering.
More preferably, the actual conditions of high temperature sintering is: at temperature is 1300 ~ 1500 DEG C, be incubated 0.5 ~ 2 hour, to continue to improve at temperature to 1600 DEG C ~ 1750 DEG C insulation 0.5 ~ 2 hour.
Step 2) in drying treatment is carried out to ceramic green sheet, drying temperature is 60 ~ 90 DEG C, 2 ~ 4 hours time of drying.
Stupalith of the present invention is applied in high-powered LED lamp, and as LED heat-radiating substrate, this heat-radiating substrate length of side is 150 ~ 350mm, and thickness is 0.2 ~ 10mm.
Beneficial effect of the present invention is as follows:
(1) ceramic heat-dissipating thermal conductivity of composite materials of the present invention is large, and resistance toheat is excellent, and bending strength is high, there is not the phenomenons such as bending, warpage.
(2) the present invention is by adopting suitable sintering method and choosing suitable sintering aid, realizes the densification of ceramic sintered bodies, substantially increases the thermal conductivity of stupalith.
(3) trimeric cyanamide in the present invention's formula at high temperature can produce aluminium nitride and carbonitride, adds hardness and the surface gloss of stupalith.
(4) ceramic heat-dissipating matrix material of the present invention can carry out different shaping demand according to situations such as the shape of product, thickness, can prepare the different ceramic substrates of thickness 0.2 ~ 10mm.
Embodiment
Below in conjunction with embodiment, the invention will be further described.
A kind of ceramic heat emission material of the present invention, counts by weight, comprises silicon nitride powder 40 ~ 55 parts, silica powder 10 ~ 20 parts, trimeric cyanamide 3 ~ 8 parts, Walocel MT 20.000PV 3 ~ 6 parts, polyvinyl alcohol 8 ~ 12 parts and sintering aid 5 ~ 10 parts.
Sintering aid of the present invention, counts by weight, comprises silica flour 60 ~ 70 parts, aluminium powder 5 ~ 10 parts, attapulgite 10 ~ 20 parts and 10 ~ 20 parts, calcium oxide.
Embodiment 1
1) silica flour 60 kilograms, aluminium powder 8 kilograms, attapulgite 10 kilograms, 20 kilograms, calcium oxide are scattered in 300 kilograms of dehydrated alcohols and form mixed slurry, dry obtained complex sintering aids, for subsequent use;
2) in ball mill, mean particle size 1 μm, density 3g/cm is added successively
3the obtained complex sintering aids 10 kilograms of silicon nitride powder 40 kilograms, silica powder 10 kilograms, trimeric cyanamide 4 kilograms, Walocel MT 20.000PV 6 kilograms, polyvinyl alcohol 10 kilograms and step (1) carry out wet ball grinding, ball milling 2 hours, carry out vacuum stirring de-bubble, obtained ceramic size, for subsequent use;
3) ceramic size obtained for step (2) to be pressed in 300mm × 300mm × 2.9mm in cavity mould by mold bottom, naturally to have placed gelation process; Take out ceramic green sheet under temperature 60 C condition dry 2 hours, then folded for ceramic body monolithic spreading aluminum oxide powder 2 layers are placed on load bearing board, put into hot pressing die to be placed in hot pressing furnace to sinter 0.5 hour at 1500 DEG C, to continue to improve at temperature to 1750 DEG C insulation 0.5 hour, cooling down obtains ceramic plate.
The ceramic plate cooling the length and width about 240 × 240mm × 2.9mm obtained is carried out being laser-cut into the ceramic substrate of size 220 × 220mm × 2.9mm.
Embodiment 2
1) silica flour 70 kilograms, aluminium powder 5 kilograms, attapulgite 20 kilograms, 15 kilograms, calcium oxide are scattered in 350 kilograms of dehydrated alcohols and form mixed slurry, dry obtained complex sintering aids, for subsequent use;
2) in ball mill, mean particle size 3 μm, density 3g/cm is added successively
3the obtained complex sintering aids 8 kilograms of silicon nitride powder 55 kilograms, silica powder 20 kilograms, trimeric cyanamide 8 kilograms, Walocel MT 20.000PV 5 kilograms, polyvinyl alcohol 12 kilograms and step (1) carry out wet ball grinding, ball milling 4 hours, carry out vacuum stirring de-bubble, obtained ceramic size, for subsequent use;
3) ceramic size obtained for step (2) to be pressed in 450mm × 450mm × 10.8mm in cavity mould by mold bottom, naturally to have placed gelation process; Take out ceramic green sheet under temperature 80 DEG C of conditions dry 3 hours, then folded for ceramic body monolithic spreading aluminum oxide powder 4 layers are placed on load bearing board, put into hot pressing die to be placed in hot pressing furnace to sinter 2 hours at 1300 DEG C, to continue to improve at temperature to 1600 DEG C insulation 2 hours, cooling down obtains ceramic plate.
The ceramic plate cooling the length and width about 380 × 380mm × 10.8mm obtained is carried out being laser-cut into the ceramic substrate of size 360 × 360mm × 10.8mm.
Embodiment 3
1) silica flour 65 kilograms, aluminium powder 10 kilograms, attapulgite 15 kilograms, 10 kilograms, calcium oxide are scattered in 325 kilograms of dehydrated alcohols and form mixed slurry, dry obtained complex sintering aids, for subsequent use;
2) in ball mill, mean particle size 3 μm, density 3g/cm is added successively
3the obtained complex sintering aids 12 kilograms of silicon nitride powder 50 kilograms, silica powder 15 kilograms, trimeric cyanamide 3 kilograms, Walocel MT 20.000PV 3 kilograms, polyvinyl alcohol 8 kilograms and step (1) carry out wet ball grinding, ball milling 3 hours, carry out vacuum stirring de-bubble, obtained ceramic size, for subsequent use;
3) ceramic size obtained for step (2) to be pressed in 180mm × 180mm × 1.8mm in cavity mould by mold bottom, naturally to have placed gelation process; Take out ceramic green sheet under temperature 90 DEG C of conditions dry 2 hours, then folded for ceramic body monolithic spreading aluminum oxide powder 3 layers are placed on load bearing board, put into hot pressing die to be placed in hot pressing furnace to sinter 1 hour at 1500 DEG C, to continue to improve at temperature to 1700 DEG C insulation 1.5 hours, cooling down obtains ceramic plate.
The ceramic plate cooling the length and width about 160 × 160mm × 1.8mm obtained is carried out being laser-cut into the ceramic substrate of size 150 × 150mm × 1.8mm.
Claims (9)
1. a ceramic heat emission material, it is characterized in that: described ceramic heat emission material, count by weight, comprise silicon nitride powder 40 ~ 55 parts, silica powder 10 ~ 20 parts, trimeric cyanamide 3 ~ 8 parts, Walocel MT 20.000PV 3 ~ 6 parts, polyvinyl alcohol 8 ~ 12 parts and sintering aid 5 ~ 10 parts.
2. a kind of ceramic heat emission material according to claim 1, is characterized in that: described sintering aid, counts by weight, comprises silica flour 60 ~ 70 parts, aluminium powder 5 ~ 10 parts, attapulgite 10 ~ 20 parts and 10 ~ 20 parts, calcium oxide.
3. a kind of ceramic heat emission material according to claim 1, is characterized in that: the mean particle size of described silicon nitride powder is 1 ~ 3 μm, and density is 2 ~ 3g/cm
3.
4. a kind of ceramic heat emission material according to claim 2, it is characterized in that: described sintering aid is obtained by following steps: silica flour 60 ~ 70 parts, aluminium powder 5 ~ 10 parts, attapulgite 10 ~ 20 parts, 10 ~ 20 parts, calcium oxide are scattered in dehydrated alcohol and form mixed slurry, namely complex sintering aids is obtained after drying, wherein, the mass volume ratio of described silica flour and dehydrated alcohol is 1g:5mL.
5. a kind of ceramic heat emission material according to claim 2, it is characterized in that: described ceramic heat emission material is obtained by following steps: 1) add the silicon nitride powder of 40 ~ 55 parts, silica powder 10 ~ 20 parts, trimeric cyanamide 3 ~ 8 parts, Walocel MT 20.000PV 3 ~ 6 parts, polyvinyl alcohol 8 ~ 12 parts and sintering aid 5 ~ 10 parts successively and carry out wet ball grinding, ball milling 2 ~ 4 hours, carry out vacuum stirring de-bubble, obtained ceramic size; 2) by step 1) obtained ceramic size by mold bottom press-in die, naturally placed gelation process; Take out ceramic green sheet and carry out drying treatment, put into hot pressing die and be placed in hot pressing furnace and carry out high temperature sintering compacting, then cooling down obtains ceramic heat emission material.
6. a kind of ceramic heat emission material according to claim 5, is characterized in that: step 2) in ceramic green sheet adopt at least 2 layer by layer poststack carry out high temperature sintering.
7. the preparation method of a kind of ceramic heat-dissipating matrix material according to claim 6, it is characterized in that: the actual conditions of high temperature sintering is: at temperature is 1300 ~ 1500 DEG C, be incubated 0.5 ~ 2 hour, to continue to improve at temperature to 1600 DEG C ~ 1750 DEG C insulation 0.5 ~ 2 hour.
8. the preparation method of a kind of ceramic heat-dissipating matrix material according to claim 5, is characterized in that: step 2) in drying treatment is carried out to ceramic green sheet, drying temperature is 60 ~ 90 DEG C, 2 ~ 4 hours time of drying.
9. stupalith, in an application for heat-radiating substrate, is characterized in that as claimed in claim 1: as LED heat radiation substrate, and this heat-radiating substrate length of side is 150 ~ 350mm, and thickness is 0.2 ~ 10mm.
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| CN201510737039.6A CN105384445A (en) | 2015-11-04 | 2015-11-04 | Ceramic heat radiation material and application thereof in heat radiation substrate |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1356292A (en) * | 2000-09-20 | 2002-07-03 | 日立金属株式会社 | Silicon nitride powder, its sintered body, substrate and circuit board and thermoelectric element module thereof |
| CN1769168A (en) * | 2005-12-02 | 2006-05-10 | 中国科学院物理研究所 | Method for synthesizing nitride using metal oxide |
| CN103360039A (en) * | 2013-07-16 | 2013-10-23 | 山东工业陶瓷研究设计院有限公司 | Large-size sheet-type electric-insulation heat-dissipation ceramic substrate and preparation method thereof |
| CN103803955A (en) * | 2014-03-03 | 2014-05-21 | 哈尔滨工业大学 | Method for preparing silicon nitride/silicon oxide composite crucible |
| CN103819197A (en) * | 2014-01-28 | 2014-05-28 | 北京中材人工晶体研究院有限公司 | Preparation method of special-shaped ceramics |
-
2015
- 2015-11-04 CN CN201510737039.6A patent/CN105384445A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1356292A (en) * | 2000-09-20 | 2002-07-03 | 日立金属株式会社 | Silicon nitride powder, its sintered body, substrate and circuit board and thermoelectric element module thereof |
| CN1769168A (en) * | 2005-12-02 | 2006-05-10 | 中国科学院物理研究所 | Method for synthesizing nitride using metal oxide |
| CN103360039A (en) * | 2013-07-16 | 2013-10-23 | 山东工业陶瓷研究设计院有限公司 | Large-size sheet-type electric-insulation heat-dissipation ceramic substrate and preparation method thereof |
| CN103819197A (en) * | 2014-01-28 | 2014-05-28 | 北京中材人工晶体研究院有限公司 | Preparation method of special-shaped ceramics |
| CN103803955A (en) * | 2014-03-03 | 2014-05-21 | 哈尔滨工业大学 | Method for preparing silicon nitride/silicon oxide composite crucible |
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Application publication date: 20160309 |