CN105382711A - Modified silicon oxide resin grinding wheel and preparing method thereof - Google Patents
Modified silicon oxide resin grinding wheel and preparing method thereof Download PDFInfo
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- CN105382711A CN105382711A CN201510651511.4A CN201510651511A CN105382711A CN 105382711 A CN105382711 A CN 105382711A CN 201510651511 A CN201510651511 A CN 201510651511A CN 105382711 A CN105382711 A CN 105382711A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/285—Reaction products obtained from aldehydes or ketones
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
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- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a modified silicon oxide resin grinding wheel. The modified silicon oxide resin grinding wheel comprises, by weight, 0.2-0.35 part of 25-28 weight percent of ammonium hydroxide, 0.1-0.2 part of sp800, 570-600 parts of CBN abrasive, 90-100 parts of phenol, 96-110 parts of 35-40% of formaldehyde solution, 5-7 parts of boric acid, 2-6 parts of hexamethylenetetramine, 13-20 parts of aniline, 4-5 parts of tributyl citrate, 10-13 parts of styrene, 0.3-0.6 part of divinyl benzene, 0.8-2 parts of methacrylic acid, 0.2-0.3 part of potassium persulfate and 60-76 parts of tetraethoxysilane. According to the modified silicon oxide resin grinding wheel, the tetraethoxysilane is adopted as the precursor, polystyrene latex is used for modifying, and modified silicon oxide particles are obtained. The particles have very high strength and very high bonding strength, and the comprehensive performance of the finished grinding wheel is effectively improved.
Description
Technical field
The present invention relates to emery wheel technical field, particularly relate to a kind of modified silicon oxide resin wheel and preparation method thereof.
Background technology
Along with automobile, the improving constantly of aircraft uniform velocity, more strict to the requirement of the friction material such as transmission, braking, and matrix is exploitation and the emphasis of research as the important component part of friction material always.Phenolic resins, epoxy resin, butadiene-styrene rubber and polytetrafluoroethylene (PTFE) all can be used as the matrix of friction material, but epoxy resin, butadiene-styrene rubber and polytetrafluoroethylene (PTFE) limit its application in friction material due to poor anti-wear performance, heat resistance and bond performance.The advantage of phenolic resins in heat resistance, bond performance, mechanical property, moulding processability and cost etc., becomes the most frequently used adhesive matrix material of composite friction material.But the defects such as when pure phenolic resin exists that fragility is large, poor toughness, hardness are high, heat resistance is not enough, intensity is low and use noise is large, extreme influence Properties of Friction Materials, therefore, carrying out modification to phenolic resins is the effective ways improving its combination property.
Summary of the invention
The object of the invention is exactly the defect in order to make up prior art, provides a kind of modified silicon oxide resin wheel and preparation method thereof.
The present invention is achieved by the following technical solutions:
A kind of modified silicon oxide resin wheel, it is made up of the raw material of following weight parts:
25-28wt% ammoniacal liquor 0.2-0.35, sp800.1-0.2, CBN abrasive material 570-600, phenol 90-100,35-40% formalin 96-110, boric acid 5-7, hexamethylenetetramine 2-6, aniline 13-20, ATBC 4-5, styrene 10-13, divinylbenzene 0.3-0.6, methacrylic acid 0.8-2, potassium peroxydisulfate 0.2-0.3, ethyl orthosilicate 60-76.
A preparation method for described modified silicon oxide resin wheel, comprises the following steps:
(1) above-mentioned potassium peroxydisulfate is joined in 10-12 times of water, stir;
(2) by above-mentioned styrene, divinylbenzene, methacrylic acid mixing, join in the distilled water of 4-5 times of weight, stir, send in the oil bath of 106-100 DEG C, be heated to boiling, keep boiling 3-5 minute, add above-mentioned potassium persulfate solution, stirring reaction 120-130 minute, obtains polystyrene latex;
(3) above-mentioned sp80 is joined in 20-30 times of water, add ATBC, stir, obtain emulsion;
(4) above-mentioned polystyrene latex is joined in 25-30 times of absolute ethyl alcohol, ultrasonic disperse 10-20 minute, add 25-28wt% ammoniacal liquor, ethyl orthosilicate, at 30-35 DEG C, stirring reaction 6-7 hour, adds emulsion, stir, centrifugal, sediment is separated, washes 3-4 time, vacuum drying, calcine 120-130 minute at 500-600 DEG C, obtain modified oxidized silicon grain;
(5) 70-75% of 68-75%, 35-40% formalin weight of above-mentioned phenol weight is mixed, stir, add NaOH, adjustment PH is 8-9, and raised temperature is 70-75 DEG C, insulated and stirred 1.6-2 hour, add boric acid, raised temperature is 110-120 DEG C, decompression dehydration 50-60 minute, add the absolute ethyl alcohol of mixed system weight 2-3%, stir, first at 80-90 DEG C, heat 8-10 hour, then at 110-115 DEG C, heat 8-9 hour, cooling, obtains boric acid phenolic resins;
(6) by above-mentioned hexamethylenetetramine, the mixing of boric acid phenolic resins, wear into fine powder, cross 160-200 mesh sieve, obtain boric acid phenol-formaldehyde resin powder;
(7) by remaining phenol, the mixing of 35-40% formalin, add mixed liquor weight 1-1.5 butanone doubly, stir, be heated to 80-85 DEG C, drip aniline, insulation reaction 4-6 hour at the temperature disclosed above after dropwising, heating decompression distillation to system temperature is 100-105 DEG C, cooling, obtains benzoxazine monomer;
(8) by above-mentioned boric acid phenol-formaldehyde resin powder, the mixing of benzoxazine monomer, join in compound weight 2-3 butanone doubly, stirring and dissolving, vacuum drying 2.6-3 hour at 76-80 DEG C, concentrated, be cured under following intensification system, described intensification system is: 80-90 DEG C, 50-60 minute; 100-110 DEG C, 100-120 minute; 130-140 DEG C, 40-50 minute are benzoxazine phenol-formaldehyde resin modified;
(9) above-mentioned benzoxazine phenol-formaldehyde resin modified, modified oxidized silicon grain are mixed with each raw material of residue, hot-forming, described hot pressing temperature is 160-170 DEG C, pressure 39O-410T, hot pressing time are 30-32 minute, and in hot pressing, every 4-5 minute steam bleeding once;
(10) by above-mentioned hot-forming after resin grinding wheels thickness closed assembly according to demand get up, separate with sheet iron plate, put into the hardening furnace preset and harden, the intensification system of sclerosis is: 100-120 DEG C, 4-5 hour; 125-140 DEG C, 7-8 hour; 150-170 DEG C, 1-2 hour; 180-185 DEG C, 8-9 hour; Naturally cool after stopping heating, obtain described resin wheel.
Advantage of the present invention is:
Emery wheel of the present invention has good heat endurance, and this is owing to introducing benzoxazine resin in phenolic cure structure, and it is a kind of containing phenyl ring and the heteroatomic dicyclic compound of N, O, so heat endurance is strong;
Wheel hardness of the present invention is high, and this is owing to adding benzoxazine monomer, and in its hot pressing at emery wheel and hardening process, volatile substances is few, reduces the porosity of emery wheel, improves compactness and hardness;
Emery wheel revolving strength of the present invention is high, and this is that emery wheel after hardening volume contraction is little owing to adding benzoxazine monomer, decreases internal stress and micro-crack;
The present invention introduces boron at emery wheel in phenolic resins, improve the combination property of finished product, this is because phenolic resins is to connect phenyl ring by C-C key, and boron bakelite resin is by B-" key connects phenyl ring; wherein the bond energy of C-C is the bond energy of 347KJ/mol, B-O is 523KJ/mol, far above the bond energy of C-C; define the three-dimensional cross-linked structure of boracic, can significantly improve the heat resistance of emery wheel, instantaneous heat-resisting quantity, ablation resistance;
The present invention adopts ethyl orthosilicate to be presoma, uses polystyrene latex modification, obtains modified oxidized silicon grain, and this particle not only has very high intensity, also has good adhesion strength, effectively improves the combination property of finished product emery wheel.
Detailed description of the invention
A kind of modified silicon oxide resin wheel, it is made up of the raw material of following weight parts:
25wt% ammoniacal liquor 0.2, sp800.1, CBN abrasive material 570, phenol 90,35% formalin 96, boric acid 5, hexamethylenetetramine 2, aniline 13, ATBC 4, styrene 10, divinylbenzene 0.3, methacrylic acid 0.8, potassium peroxydisulfate 0.2, ethyl orthosilicate 60.
A preparation method for described modified silicon oxide resin wheel, comprises the following steps:
(1) above-mentioned potassium peroxydisulfate is joined in 10 times of water, stir;
(2) by above-mentioned styrene, divinylbenzene, methacrylic acid mixing, join in the distilled water of 4 times of weight, stir, send in the oil bath of 106 DEG C, be heated to boiling, keep boiling 3 minutes, add above-mentioned potassium persulfate solution, stirring reaction 120 minutes, obtains polystyrene latex;
(3) above-mentioned sp80 is joined in 20 times of water, add ATBC, stir, obtain emulsion;
(4) above-mentioned polystyrene latex is joined in 25 times of absolute ethyl alcohols, ultrasonic disperse 10 minutes, add 25wt% ammoniacal liquor, ethyl orthosilicate, at 30 DEG C, stirring reaction 6 hours, adds emulsion, stir, centrifugal, sediment is separated, washes 3 times, vacuum drying, calcine 120 minutes at 500 DEG C, obtain modified oxidized silicon grain;
(5) mix 70% of 68%, 35% formalin weight of above-mentioned phenol weight, stir, add NaOH, regulate PH to be 8, raised temperature is 70 DEG C, insulated and stirred 1.6 hours, add boric acid, raised temperature is 110 DEG C, decompression dehydration 50 minutes, add the absolute ethyl alcohol of mixed system weight 2%, stir, first heat 8 hours at 80 DEG C, then heat 8 hours at 110 DEG C, cooling, obtains boric acid phenolic resins;
(6) by above-mentioned hexamethylenetetramine, the mixing of boric acid phenolic resins, wear into fine powder, cross 160 mesh sieves, obtain boric acid phenol-formaldehyde resin powder;
(7) by remaining phenol, 35% formalin mixing, add the butanone of mixed liquor weight 1 times, stir, be heated to 80 DEG C, drip aniline, insulation reaction 4 hours at the temperature disclosed above after dropwising, heating decompression distillation to system temperature is 100 DEG C, and cooling, obtains benzoxazine monomer;
(8) by above-mentioned boric acid phenol-formaldehyde resin powder, the mixing of benzoxazine monomer, join in the butanone of compound weight 2 times, stirring and dissolving, vacuum drying 2.6 hours at 76 DEG C, concentrated, be cured under following intensification system, described intensification system is: 80 DEG C, 50 minutes; 100 DEG C, 100 minutes; 130 DEG C, 40 minutes is benzoxazine phenol-formaldehyde resin modified;
(9) above-mentioned benzoxazine phenol-formaldehyde resin modified, modified oxidized silicon grain are mixed with each raw material of residue, hot-forming, described hot pressing temperature is 160 DEG C, pressure 39OT, hot pressing time are 30 minutes, and in hot pressing, every 4 minutes steam bleedings once;
(10) by above-mentioned hot-forming after resin grinding wheels thickness closed assembly according to demand get up, separate with sheet iron plate, put into the hardening furnace preset and harden, the intensification system of sclerosis is: 100 DEG C, 4 hours; 125 DEG C, 7 hours; 150 DEG C, 1 hour; 180 DEG C, 8 hours; Naturally cool after stopping heating, obtain described resin wheel.
Performance test:
Heat decomposition temperature: >=420 DEG C;
Revolving strength 143m/s
Abrasion test: with commercially available phenolic resins emery wheel and the emery wheel of the present invention of identical weight, same size, weight is 1kg, cut channel-section steel continuously in the same way respectively, emery wheel weight after commercially available phenol resin sand wheel cutting is 973g, weight after emery wheel cutting of the present invention is 983g, wear away little, durability is high.
Claims (2)
1. a modified silicon oxide resin wheel, is characterized in that what it was made up of the raw material of following weight parts:
25-28wt% ammoniacal liquor 0.2-0.35, sp800.1-0.2, CBN abrasive material 570-600, phenol 90-100,35-40% formalin 96-110, boric acid 5-7, hexamethylenetetramine 2-6, aniline 13-20, ATBC 4-5, styrene 10-13, divinylbenzene 0.3-0.6, methacrylic acid 0.8-2, potassium peroxydisulfate 0.2-0.3, ethyl orthosilicate 60-76.
2. a preparation method for modified silicon oxide resin wheel as claimed in claim 1, is characterized in that comprising the following steps:
(1) above-mentioned potassium peroxydisulfate is joined in 10-12 times of water, stir;
(2) by above-mentioned styrene, divinylbenzene, methacrylic acid mixing, join in the distilled water of 4-5 times of weight, stir, send in the oil bath of 106-100 DEG C, be heated to boiling, keep boiling 3-5 minute, add above-mentioned potassium persulfate solution, stirring reaction 120-130 minute, obtains polystyrene latex;
(3) above-mentioned sp80 is joined in 20-30 times of water, add ATBC, stir, obtain emulsion;
(4) above-mentioned polystyrene latex is joined in 25-30 times of absolute ethyl alcohol, ultrasonic disperse 10-20 minute, add 25-28wt% ammoniacal liquor, ethyl orthosilicate, at 30-35 DEG C, stirring reaction 6-7 hour, adds emulsion, stir, centrifugal, sediment is separated, washes 3-4 time, vacuum drying, calcine 120-130 minute at 500-600 DEG C, obtain modified oxidized silicon grain;
(5) 70-75% of 68-75%, 35-40% formalin weight of above-mentioned phenol weight is mixed, stir, add NaOH, adjustment PH is 8-9, and raised temperature is 70-75 DEG C, insulated and stirred 1.6-2 hour, add boric acid, raised temperature is 110-120 DEG C, decompression dehydration 50-60 minute, add the absolute ethyl alcohol of mixed system weight 2-3%, stir, first at 80-90 DEG C, heat 8-10 hour, then at 110-115 DEG C, heat 8-9 hour, cooling, obtains boric acid phenolic resins;
(6) by above-mentioned hexamethylenetetramine, the mixing of boric acid phenolic resins, wear into fine powder, cross 160-200 mesh sieve, obtain boric acid phenol-formaldehyde resin powder;
(7) by remaining phenol, the mixing of 35-40% formalin, add mixed liquor weight 1-1.5 butanone doubly, stir, be heated to 80-85 DEG C, drip aniline, insulation reaction 4-6 hour at the temperature disclosed above after dropwising, heating decompression distillation to system temperature is 100-105 DEG C, cooling, obtains benzoxazine monomer;
(8) by above-mentioned boric acid phenol-formaldehyde resin powder, the mixing of benzoxazine monomer, join in compound weight 2-3 butanone doubly, stirring and dissolving, vacuum drying 2.6-3 hour at 76-80 DEG C, concentrated, be cured under following intensification system, described intensification system is: 80-90 DEG C, 50-60 minute; 100-110 DEG C, 100-120 minute; 130-140 DEG C, 40-50 minute are benzoxazine phenol-formaldehyde resin modified;
(9) above-mentioned benzoxazine phenol-formaldehyde resin modified, modified oxidized silicon grain are mixed with each raw material of residue, hot-forming, described hot pressing temperature is 160-170 DEG C, pressure 39O-410T, hot pressing time are 30-32 minute, and in hot pressing, every 4-5 minute steam bleeding once;
(10) by above-mentioned hot-forming after resin grinding wheels thickness closed assembly according to demand get up, separate with sheet iron plate, put into the hardening furnace preset and harden, the intensification system of sclerosis is: 100-120 DEG C, 4-5 hour; 125-140 DEG C, 7-8 hour; 150-170 DEG C, 1-2 hour; 180-185 DEG C, 8-9 hour; Naturally cool after stopping heating, obtain described resin wheel.
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106217274A (en) * | 2016-08-10 | 2016-12-14 | 吴迪 | A kind of preparation method of hexafluoropropylene oxide phenol-formaldehyde resin modified emery wheel |
CN108515470A (en) * | 2018-05-30 | 2018-09-11 | 浙江中晶科技股份有限公司 | A kind of preparation process of the compound mill of diamond |
CN108857935A (en) * | 2018-05-30 | 2018-11-23 | 安徽佑开科技有限公司 | A kind of silicon rubber phenolic resin grinding wheel and preparation method thereof |
CN108972367A (en) * | 2018-05-30 | 2018-12-11 | 安徽佑开科技有限公司 | A kind of modified zirconia resin wheel and preparation method thereof |
CN108972386A (en) * | 2018-05-30 | 2018-12-11 | 安徽佑开科技有限公司 | A kind of modified zirconia silicon rubber phenolic resin grinding wheel and preparation method thereof |
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CN106217274A (en) * | 2016-08-10 | 2016-12-14 | 吴迪 | A kind of preparation method of hexafluoropropylene oxide phenol-formaldehyde resin modified emery wheel |
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CN108515470A (en) * | 2018-05-30 | 2018-09-11 | 浙江中晶科技股份有限公司 | A kind of preparation process of the compound mill of diamond |
CN108857935A (en) * | 2018-05-30 | 2018-11-23 | 安徽佑开科技有限公司 | A kind of silicon rubber phenolic resin grinding wheel and preparation method thereof |
CN108972367A (en) * | 2018-05-30 | 2018-12-11 | 安徽佑开科技有限公司 | A kind of modified zirconia resin wheel and preparation method thereof |
CN108972386A (en) * | 2018-05-30 | 2018-12-11 | 安徽佑开科技有限公司 | A kind of modified zirconia silicon rubber phenolic resin grinding wheel and preparation method thereof |
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Application publication date: 20160309 |