CN105379245B - Compound eye imaging device - Google Patents
Compound eye imaging device Download PDFInfo
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- CN105379245B CN105379245B CN201480038398.6A CN201480038398A CN105379245B CN 105379245 B CN105379245 B CN 105379245B CN 201480038398 A CN201480038398 A CN 201480038398A CN 105379245 B CN105379245 B CN 105379245B
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Cameras In General (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
There is provided even if due to lens array and holder are deformed with the variation of environmental condition and generate in the case of the position deviation of each cyclopic image on sensor array, can carry out rapidly and well the compound eye imaging device of image procossing.Image processing circuit (80) is at least based on executing image procossing along with the information of the degree of the deformation of the variation of the environmental condition of lens array (10) with the relevant information of difference of first position (T1) and the second position (T2) and expression.To the variation of the position of each cyclopic image on the sensor array (60) that is for example generated with the variation of environmental condition etc., it is i.e. corresponding with the optical image on sensor array (60) obtained from the variation of position of image be corrected.Thus, even if the center of deformation of the lens array (10) and holder (50) when in terms of the direction the optical axis of lens section (10a) (OA) is inconsistent, also the position deviation of each cyclopic image on sensor array (60) can be quickly and accurately grasped, good image procossing can be carried out relative to the variation of environmental condition.
Description
Technical field
The present invention relates to the compound eye imaging devices of the lens array comprising multiple lens sections with two-dimensional arrangements.
Background technology
In recent years the requirement of the slimming for imaging optical system is very high.In order to be coped with to it, carried out with
The error-sensitivity that overall length based on optical design shortens or is accompanied by this increases corresponding accuracy of manufacture raising, but in order to cope with
The requirement being further thinned becomes not fill by previous an optical system and photographing element come the method for obtaining picture
Point.
Therefore, the optical system for being referred to as compound eye optical system is paid close attention in order to cope with to the requirement of slimming, the optics
System is to be split in the detection zone to photographing element, and optical system is configured in a manner of corresponding to each, to institute
Obtained image is handled the optical system used in the compound eye imaging device that final image exports.But
In the photographic device comprising compound eye optical system, the lens section of photographic device according to the variation of the environmental conditions such as environment temperature
Arrangement spacing etc. change, so needing to cope with it, such as consider to be solved by image procossing.
As an example for the compound eye imaging device for carrying out image procossing, describes and match between lens array and photographing element
It has set corresponding with each lens and has opened the photographic device of the shading wall in the hole of rectangle, shading wall is set as to defer to the variation of ambient temperature
Shape or material as the change in shape of caused lens array, to the shadow that can obtain shading wall between cyclopic image
Incident luminance information obtain reflect shading wall position bianry image, calculated along with week based on this
It encloses the crooked amount of the shading wall of the variation of temperature and is corrected (referring to patent document 1).
But according to the research of the present inventors, the deformation for being only conceived to lens array or shading wall is distinguished, has then existed
Cannot fully the variation of environmental conditions such as response environment temperature the case where.It is thought that because usual lens array is with first with camera shooting
The opposed mode of part is kept by holder (Holder), but the holder deformed due to environmental condition etc. cause it is each on photographing element
The change in location of cyclopic image becomes complexity to become unable to the variation of accurately response environment condition in appearance.In more detail and
Speech, the center of deformation for making the holder of the variation along with environmental condition consistent with the center of deformation of lens array is actually difficulty
, it is believed that the lens section generated with the variation of environmental condition becomes complicated relative to the offset of photographing element.Upper
It states in patent document 1, grasps the change of the lens array along with temperature change indirectly using the position of the shadow of shading wall
Shape, but the position of the shadow of shading wall be easy to due to the state of light source or the use environment etc. of photographic device and be affected to
Testing result is easy to become unstable.Further, it is difficult to shading wall and photographing element is made to touch, the screening being projected on photographing element
The shadow of light wall is easy to thicken.It accordingly, there are the position of the position, particularly quadrangle that cannot accurately acquire shading wall
Misgivings.In addition, in patent document 1, estimating the deformation of lens array indirectly according to the deformation of shading wall, therefore cannot be accurate
Really grasp the deformation of lens array and the deformation of the framework kept to lens array.To in patent document 1
In photographic device, it is difficult to accurately realize and obtain one according to the image by the identical visual field that each lens section is imaged
The calculating of the superresolution processing (processing of supersolution picture) of high-resolution image and the parallax of each lens section.
Existing technical literature
Patent document
Patent document 1：(Japan) special open 2011-147079 bulletins
Invention content
Even if the object of the present invention is to provide being deformed due to the variation of environmental condition in lens array and holder
Image procossing can be also carried out rapidly and well in the case of the position deviation for generating each cyclopic image on sensor array
Compound eye imaging device.
In order to solve the above problems, compound eye imaging device according to the present invention has：Compound eye optical system, including having
The lens array of the multiple lens sections two-dimensionally arranged on the direction vertical relative to optical axis；Sensor array passes through compound eye
Optical system, multiple optical images corresponding with multiple lens sections are imaged, and picture signal corresponding with multiple optical images is exported；Branch
Frame remains compound eye optical system opposed with sensor array；And image processing circuit, for defeated from sensor array
The picture signal gone out is handled, under the conditions of reference atmosphere, the environmental condition along with holder when in terms of optical axis direction
Variation deformation center, that is, first position and the environmental condition along with lens array when in terms of optical axis direction
In the state of the center of the deformation of variation, that is, second position separation, lens array is fixed in holder, image processing circuit
At least based on the relevant information of the difference of first position and the second position and indicate along with lens array environmental condition
The information of degree of deformation of variation carry out image procossing.Here, first position is, in the holder for being fixed with lens array
With the variation of environmental condition when expansion or shrinkage, in terms of optical axis direction from lens section when the center for becoming deformation branch
Position on frame.In the case of fixing bracket on sensor array or the substrate provided with sensor array, first position energy
Enough it is set as the place essentially without variation with the relative position of sensor array.In addition, the second position is, relative to holder
And fixed lens array with the variation of environmental condition and when expansion or shrinkage, in terms of optical axis direction from lens section when at
For the position on the lens array at the center of deformation.The second position can be set as the bearing relative to holder and relative position is real
There is no the place of variation in matter.As with the relevant information of the difference of first position and the second position, such as can use indicate
The vector of movement from first position to the second position.Deformation as the variation for indicating the environmental condition along with lens array
Degree information, such as can use and indicate each position derived from the linear expansion coefficient of lens array in lens array
Deformation vector.
In above-mentioned compound eye imaging device, image processing circuit is at least based on the difference phase with first position and the second position
The information of pass and expression are executed along with the information of the degree of the deformation of the variation of the environmental condition of lens array at image
Reason.For example, each cyclopic image on the sensor array generated to the variation with the environmental conditions such as variation of environment temperature
The variation of position, it is i.e. corresponding with the optical image on sensor array obtained from the variation of position of image be corrected.As a result,
Even if the center of deformation of the lens array and holder when in terms of the optical axis direction from lens section can be rapid and accurate if inconsistent
The position deviation of each cyclopic image on sensor array really is grasped, good figure can be carried out relative to the variation of environmental condition
As processing.
In the specific side of the present invention or mode, lens array is bonded in holder by binder.
In the another side of the present invention, multiple lens are arranged by binding part setting in lens array among to lens array
The center in the lens section arrangement region in portion becomes on the position of point symmetry.
The present invention yet another side, lens array it is continuous to surround the mode of multiple lens sections by binding part.
In yet another side of the present invention, holder has top plate portion and supports the leg of the top plate portion.
In yet another side of the present invention, lens array is fixed in the top plate portion of holder.
In yet another side of the present invention, the side of the object of lens array is fixed in the image side surface of the top plate portion of holder.
In yet another side of the present invention, holder is configured with to be generated and optical axis in the variation with environmental condition
When the change in shape in vertical direction, the center of deformation constant relative to the substantial relative position of sensor array.
In yet another side of the present invention, has the substrate provided with sensor array, holder is fixed in substrate.
In yet another side of the present invention, has the substrate provided with sensor array, the leg of holder is fixed in base
Plate.
In yet another side of the present invention, lens array is formed by resin.
In yet another side of the present invention, holder is formed by resin.Suitable lens array, sensor can be readily derived
The holder of the shape of array etc..
In yet another side of the present invention, the linear expansion coefficient α 1 (1/ DEG C) of holder, first position and the second position away from
Pel spacing P (mm) from L (mm) and sensor array meets the relationship of 1 ＜ 5P of 30L α.Here, above-mentioned relation formula is set
Think 30 DEG C of temperature change.
In yet another side of the present invention, the linear expansion coefficient α 1 of holder, first position with second position distance L, with
And the pel spacing P of sensor array meets the relationship of 1 ＜ 2P of 30L α.
In yet another side of the present invention, the linear expansion coefficient α 1 of holder and the linear expansion coefficient α 2 of lens array are full
The relationship of 1.2 ＞ α of foot, 2/ α, 1 ＞ 0.8.At this point, since the linear expansion coefficient of lens array and the linear expansion coefficient of holder are close,
So the deflection of the two when changes in environmental conditions becomes close to, therefore the multiple optical images being imaged in sensor array
Opposite position deviation becomes smaller.
In yet another side of the present invention, the linear expansion coefficient α 2 of lens array and the line expansion system of sensor array
Number α 3 meets the relationship of 2/ α of α, 3 ＞ 5.
In yet another side of the present invention, image processing circuit uses the movement indicated from first position to the second position
First vector and indicate that the resultant vector of the second vector of the deformation of each position in lens array carries out image procossing.
In yet another side of the present invention, image processing circuit is based on related to the difference of first position and the second position
Information and indicate along with lens array environmental condition variation deformation degree information, pair with environmental condition phase
Domain of the existence on the sensor array for each cyclopic image answered is estimated, figure corresponding with estimated domain of the existence is executed
As the pattern match of signal, the correcting value of the change in location of each cyclopic image of the variation along with environmental condition is acquired.
In yet another side of the present invention, reference atmosphere condition is that environment temperature is set as to the condition of room temperature.
In yet another side of the present invention, compound eye optical system be also equipped with by lens array be set as the first lens array and
The second lens array to overlap on the optical axis direction of first lens array.
Description of the drawings
Figure 1A and 1B is the vertical view and sectional view for the compound eye imaging device for illustrating an embodiment.
Fig. 2 is the figure of the lens array laminated body and holder among illustrating compound eye imaging device.
Fig. 3 A~3C be indicate environmental condition have occurred variation in the case of each lens section relative to sensor array
Offset situation schematic diagram.
Fig. 4 is to illustrate to indicate the variation with environmental condition and the position deviation of image on the sensor array that generates
The figure of actual measured results.
Fig. 5 A are the block diagrams for the basic structure for indicating the compound eye imaging device involved by embodiment, and Fig. 5 B are functional
Ground illustrates the block diagram for the image processing circuit being arranged in digital processing circuit.
Fig. 6 is the concept of the multiple transition regions or input picture that illustrate to arrange on the photoelectric conversion surface of sensor array
Figure.
Fig. 7 is the flow chart for the flow for indicating the action in image processing circuit.
Fig. 8 is the deviation for illustrating the location of pixels caused by the temperature change of the input picture from each synthesis lens
Figure.
Fig. 9 is position deviation in the step S12 for definition graph 7, as first position estimation of deviation treatment process
The figure of first concrete example of outline estimation processing.
Figure 10 is the figure of the second concrete example for illustrating the estimation processing of position deviation outline.
Figure 11 is the figure of the third concrete example for illustrating the estimation processing of position deviation outline.
Figure 12 is the figure of the variation for illustrating the estimation processing of position deviation outline.
Figure 13 A~13C are the concrete examples of second position estimation of deviation treatment process in the step S13 for definition graph 7
Figure.
Figure 14 is the figure of the flow of the superresolution processing in the step S14 for indicate Fig. 7.
Figure 15 is the figure for the deterioration information for illustrating to use in the step S33 of Figure 14.
Figure 16 is the figure for indicating to deteriorate the concrete example of information.
Specific implementation mode
(the picture test section of photographic device)
Figure 1A and 1B is among the compound eye imaging device illustrated involved by one embodiment of the present invention for carrying out
As detection as test section vertical view and sectional view.
As shown in Figure 1A and 1B etc., photographic device 100 (compound eye imaging device) has lens array laminated body 1, has
The sensor array 60 of sensor region corresponding with each synthesis lens 1a of lens array laminated body 1 is constituted 61 includes pair
The picture signal detected by sensor array 60 be suitable for visual field partitioning scheme or the image procossing of super-resolution mode
The digital processing circuit 103 of image processing circuit 80 and the substrate SB for installing sensor array 60.Wherein, lens array layer
Stack 1, sensor array 60 and substrate SB play a role as test section.Here, visual field partitioning scheme refers to, it is right
The image in each visual field splice obtaining by the image in the different visuals field by each lens imaging by image procossing
To the mode of an image.In addition, super-resolution mode refers to, according to the image in the identical visual field by each lens imaging, lead to
It crosses image procossing and obtains the mode of a high-resolution image.In addition, in the present specification, image procossing refers to, in order to
Reconstructed image is obtained according to each cyclopic image, to picture number by image processing circuit comprising arithmetic units such as computers
The working processes such as the correction or conversion factually applied.
The lens array laminated body 1 of diagram is that multiple (specifically two) lens arrays 10,20 have been carried out product to fold
Laminated body is used as compound eye optical system.In the following description, lens array laminated body 1 is known as lens array sometimes
Row.These first and second lens arrays 10,20 are the flat component in quadrangle extended parallel on the faces XY, edge and XY
The vertical Z-direction product in face is folded and is interconnected.
Lens array laminated body 1 is incorporated in rectangular box-like holder 50 in the state of opposed with sensor array 60
In.In lens array laminated body 1, the first lens array 10 of object side is the optical material i.e. thermoplastic resin of translucency
In other words the integrally formed product of system are the one thing being made of thermoplastic resin.First lens array 10 is from the central shaft side AX
To or Z-direction see the profile with rectangle.Here, central shaft AX refer to aftermentioned multiple lens section 10a arrangement region (thoroughly
Mirror portion arrange region LR) center axis.First lens array 10 have be respectively optical element multiple lens section 10a, from
Surrounding supports the support portion 10b of multiple lens section 10a and extends to band-like quadrangle frame-shaped on the outside of support portion 10b
Edge part 10r.Constitute the square grid point that multiple lens section 10a of the first lens array 10 are arranged in parallel on the faces XY
Two-dimensionally it is configured on (in the example in the figures 16 points of 4 × 4).Each lens section 10a has on the first interarea 10p of object side
There is the first convex optical surface 11a, there is the second convex optical surface 11b on the second interarea 10q of image side.First and second light
Face 11a, 11b are for example as aspherical.Support portion 10b is flat part, to surround the surrounding of each lens section 10a respectively
Mode have multiple peripheral part 10c.The edge part of the quadrangle frame-shaped on the lateral periphery or outside in support portion 10b
10r becomes the part for engaging the first lens array 10 with the second lens array 20.In addition it is possible to be interpreted as first
In lens array 10, there is the region and be not provided with that lens section 10a is arranged on grid point on support portion 10b
The region of the frame-shaped of mirror portion 10a.
Second lens array 20 of image side is the integrally formed product of thermoplastic resin, is had in terms of the directions central shaft AX
The profile of rectangle.It is respectively multiple lens section 20a of optical element that second lens array 20, which has, supports multiple lens from surrounding
The support portion 20b of the portion 20a and edge part 20r that band-like quadrangle frame-shaped is extended on the outside of support portion 20b.It is multiple
On the square grid point (in the example in the figures 16 points of 4 × 4) that mirror portion 20a is arranged in parallel on the faces XY two-dimensionally by with
It sets.Each lens section 20a has the first recessed optical surface 21a, the second interarea in image side on the first interarea 20p of object side
There is the second convex optical surface 21b on 20q.First and second optical surface 21a, 21b is for example as aspherical.Support portion 20b
For flat part, have multiple peripheral part 20c in a manner of surrounding the surrounding of each lens section 20a respectively.In support
The edge part 20r of the quadrangle frame-shaped on the lateral periphery or outside of portion 20b becomes for the second lens array 20 and first is saturating
The part that lens array 10 engages.In addition it is possible to be interpreted as in the second lens array 20, there are the lens on support portion 20b
Region that portion 20a is arranged on grid point and be not provided with lens section 20a frame-shaped region.
Product is folded successively by mechanical or manual operation for above lens array 10,20, to due to the construction of itself with
And dead weight or electrostatic force etc. and be mutually located.That is, being self-aligned (self-alignment).It wherein, can also be saturating
Positioning region is set on lens array, it is made to bias and abut to be positioned.In addition, lens array 10,20 when product is folded on side
Supply such as photocurable resin between edge 10r, 20r and so that photocurable resin is hardened in product poststack, to being interconnected or
It bonds.Engagement in this way or bonding obtain having the lens array for being two-dimensionally arranged as rectangular multiple synthesis lens 1a
Row laminated body 1.The optical axis OA of each synthesis lens 1a and the central shaft AX of the overall region of multiple lens section 10a, 20a become flat
Row.
In addition, between the first lens array 10 and the second lens array 20, configured with by a pair of of support portion 10b, 20b folder
Hold and the first aperture board (Twisted り plates of fixed relatively thin light-proofness) 41.First aperture board 41 is omitted and is described in detail, but
It is corresponding with each lens section 10a and be formed with multiple openings.In the image side of the second lens array 20, configured with by cohesive etc. bys by
Second aperture board 42 of the fixed relatively thin light-proofness of support portion 20b.Second aperture board 42 is omitted and is described in detail, but with
Each lens section 20a etc. is corresponded to and is formed with multiple openings.
Above lens array 10,20 or lens array laminated body 1 are resin system, therefore light weight and slim, cheap.It is another
On one side, there are lens array 10,20 compared with sensor array 60 linear expansion coefficient bigger, it is each simple eye on sensor array 60
The trend that the position deviation of picture becomes larger.Therefore, the assembling side of lens array 10,20 or lens array laminated body 1 for holder 50
Method becomes important, appropriate in the assemble method, significantly more finds to each cyclopic image on sensor array 60
The corrected effect of position deviation.In addition, using lens array laminated body 1, it is each simple eye by by multigroup
The optical system that mirror portion 10a, 20a are constituted is constituted, so becoming for higher image quality advantageous.
Holder 50 is the integrally formed product of thermoplastic resin, is had from the central shaft side AX of lens array laminated body 1
Be configured to the top plate portion 50a for seeing the profile with rectangle and along the profile it is circle-shaped and from top plate portion 50a along center
The leg 50b for the wall-like that the directions axis AX extend.Holder 50 is being configured to surround lens by top plate portion 50a and leg 50b
In the state of lens array layer stack 1, sensor array 60 etc., base is fixed on by the bottom surface to leg 50b integrally bonds
On plate SB.In the case where holder 50 is fixed on substrate SB in this way, additionally it is possible to by subsidiary electricity on sensor array 60
Road configures on substrate SB close to sensor array 60, can realize the performance of photographic device (compound eye imaging device) 100
It improves.In particular, by the way that the leg 50b of holder 50 to be fixed on substrate SB, become prone to grasp along with environmental condition
The deformation of the holder 50 of variation, image procossing become easy.
By using the holder as described above 50 with top plate portion 50a and leg 50b, can ensure in holder 50
The receiving of sensor array 60 or configuration space, and on the position opposed with sensor array 60, configuration can be by lens array
The top plate portion 50a that row laminated body 1 is supported from the main surface side for constituting its first lens array 10.In addition, by holder 50
The image side of top plate portion 50a bonds the interarea of the first lens array 10 and is fixed, become to compare be difficult to interfere comprising to it is saturating
Change including the lens array laminated body 1 in the vertical directions optical axis OA of mirror portion 10a, 20a or the movement of lens array 10,20
Shape becomes prone to grasp the variation with environmental condition and the deformation of lens array 10,20 for generating etc..In storage lens array
The object side of the holder 50 of laminated body 1, configured with the fixed incidence aperture board 45 bys the bonding etc. to holder 50.To holder
50 top plate portion 50a or incident aperture boards 45 omit detailed description, but corresponding with each lens section 10a etc. and be formed with multiple open
Mouthful.About holder 50, leg 50b is adhesively fixed with substrate SB, so according to the variation of environment temperature, mainly top plate portion
50a is deformed.Therefore, the diagonal center of top plate portion 50a and center of deformation are roughly the same.In addition, the top plate portion 50a of holder 50 also by
The lens array laminated body 1 (lens array 10,20) bonded is restrained, but increases the size of holder 50, or high using flexibility
Binder etc., can reduce lens array 10,20 restrains caused influence.In addition, by being kept with holder 50
Lens array 10,20, even if other components are arranged around sensor array 60, compound eye optical system can also ensure that and sense
The opposed space of device array 60.
Above holder 50 is resin system, therefore cheap, can be readily derived with suitable lens array 10,20 or pass
The shape of sensor array 60 etc..There is the linear expansion coefficient bigger compared with sensor array 60, sensor array 60 in its another side
On each cyclopic image the trend that becomes larger of position deviation.Therefore, it significantly more finds to each cyclopic image on sensor array 60
The corrected effect of position deviation.
Sensor array 60 is installed on substrate SB.The sensor region 61 being arranged on sensor array 60 be by into
The region that multiple pixels of row opto-electronic conversion two-dimensionally arrange, can also be configured on sensor array 60 with each synthesis
On the corresponding regions locally lain in lens 1a, sensor array 60 can also be configured on the whole.In addition, in substrate SB
On, other than sensor array 60, it is also equipped with aftermentioned AD conversion portion 101b etc..
Hereinafter, B, Fig. 2 etc. referring to Fig.1, describe lens array laminated body 1, holder 50 etc. in detail.Such as the institutes such as Figure 1B, Fig. 2
Show, image side surface of the lens array laminated body 1 in the top plate portion 50a of holder 50 is fixed by binder.As a result, by lens array 10,
20 lens array laminated bodies 1 constituted are accommodated in holder 50 and high-precision and are stably fixed at the appropriate portion in holder 50
Position, it is as a result upper relative to 60 high-precision of sensor array and fixation to be stablized.In this case, lens array
The region of laminated body 1 being equipped on by binding part QB to multiple lens section 10a, 20a are arranged among lens array laminated body 1
The central shaft AX of (lens section arranges region LR) becomes the position of point symmetry.Specifically, among lens array laminated body 1
Between the interarea 10p of the object side of one lens array 10 and the image side surface of the top plate portion 50a of holder 50, the first lens array 10
By binding part QB by continuous and essentially become square when looking down bonding is arranged in a manner of making the multiple lens section 10a of encirclement
Agent (in addition, in Figure 1A, 1B and Fig. 2, by binding part QB cannot from object side directly from, so shown in dotted line).
This, on the central shaft AX of lens array laminated body 1, the center configured with the region by being surrounded by binding part QB supports benchmark
Point OS.It configures in this way by binding part QB, according to the variation of environmental condition, lens array laminated body 1 is from central shaft AX or branch
Support group OS is more crooked on schedule and isotropically dilatancy or contraction distortion, central shaft AX or support datum mark OS with
Aftermentioned second position T2 is roughly the same.In particular, lens array 10 is continuously arranged by binding part QB so as to surround multiple
Lens section 10a is whole, to be easily achieved isotropic deformation.Lens array laminated body 1 is fixed by holder 50, to become
Under the conditions of reference atmosphere, the center of the deformation of the environmental change along with holder 50 when in terms of the directions optical axis OA
One position T1 and along with lens array laminated body 1 environmental change deformation center, that is, second position T2 separation away from
State from L.
Here, reference atmosphere condition is to be set as becoming by holder 50 and lens array laminated body 1 deforming for regulation
The environmental condition of the shape of the benchmark of degree.If for example, making the factor of the deformation of generation holder 50 and lens array laminated body 1
For environment temperature, then the temperature (such as 20 DEG C room temperature) that holder 50 and lens array laminated body 1 become reference figure is base
Quasi condition.At this point, can mounted lens lens array layer stack 1, holder 50 etc. at room temperature, can easily make camera shooting dress
Set 100.
In addition, first position T1 is to be fixed with the holder 50 of lens array laminated body 1 to lead with the variation of environmental condition
It is when being deformed along in-plane, relative to supporting support 50 component (substrate SB in the present embodiment) from the directions optical axis OA
Relative position when seeing is essentially without the position on the holder 50 of variation.In this case, first position T1
It is in holder 50, to be fixed on that the center of the part on substrate SB, i.e. the center of rectangle frame is (right in the holder of vertical view 50
The intersection point of linea angulata).Deformation in the environmental change of substrate SB and sensor array 60 is fully small compared with the deformation of holder 50
In the case of, first position T1 can also regard as constant relative to 60 position of sensor array.Like this, by holder 50
In the presence of the first position T1 constant relative to 60 position of sensor array, become prone to grasp the variation along with environmental condition
The deformation of holder 50, image procossing become easy.
In addition, in the present embodiment, second position T2 is, relative to 50 fixed lens array laminated body of holder, 1 companion
It is when mainly being deformed along in-plane with the variation of environmental condition, relative to 50 relative position of holder essentially without variation
Position in lens array laminated body 1.In this case, second position T2 is, in lens array laminated body 1
In, the center (cornerwise intersection point) by binding part QB of frame-shaped.That is, lens section arrangement region LR central shaft AX with
Center of deformation is roughly the same.
In addition, the state for being set as first position T1 and second position T2 separation is due to first, it is difficult to make the two accurately
Consistent reason.Second, the shape of holder 50 cannot be set as to the lens with lens array laminated body 1 because under in following
Portion arranges the reasons why aspect ratio identical shape of region LR.Specifically, (1) in sensor array 60, in addition to photoelectricity turns
It changes other than portion and needs the function parts such as reading unit, (2) there are the wire bondings of sensor array 60 (wire bonding) not to match
The case where set on four sides, (3) exist in the case where installing sensor array 60 on substrate SB, it is necessary to attached in sensor array 60
The case where nearly configuration other electrical components such as resistance or capacitor, the requirement in the design of (4) compound eye imaging device, (5) are in lens
In the case of array 10,20 is plastic, set on the side in the door portion for injection molding in order to improve the stability of injection
Set gutter as a result, the shape of lens array 10,20 becomes without respect to similar shape in lens section arrangement region etc..By
It is fixed on the position deviated relative to holder 50 in the lens section arrangement region LR of these reasons, lens array laminated body 1,
The center for being difficult to that the lens section of lens array laminated body 1 is made to arrange region LR is consistent with the center of holder 50, with environment
The variation of the environmental condition of temperature etc., the position of each optical image being imaged on sensor array 60 show with lens section 10a,
The center of the arrangement of 20a is the different movement of isotropic variation of starting point.
As has been explained above, lens array laminated body 1 and holder 50 are formed by resin respectively.Lens array laminated body
The linear expansion coefficient α 2 of 1 (lens array 10,20) and the linear expansion coefficient α 1 of holder 50 preferably satisfy 1.2 ＞ α, 2/ α, 1 ＞'s 0.8
Relationship.There are holder 50, the linear expansion coefficient α 1 of lens array laminated body 1, α 2 to become to expand system than the line of sensor array 60
Number biggers (such as 5 times or more), the trend that the position deviation of each cyclopic image on sensor array 60 becomes larger.In addition, lens array
The linear expansion coefficient of row laminated body 1 and the linear expansion coefficient of holder 50 relatively, so the deformation in changes in environmental conditions
Center becomes close to the first position T1 of holder 50, therefore the phase for the multiple optical images being imaged on sensor array 60
To position deviation become smaller.Thereby, it is possible to prevent the non-duplicate part that is equivalent to of before and after position deviation generation
Pixel becomes more, and the calculating for correction becomes simple.
Linear expansion coefficient α 1 (1/ DEG C), the first position T1 of holder 50 and second position T2 distances L (mm) and sensing
The relationship that the pel spacing P (mm) of device array 60 meets 1 ＜ 5P of 30L α, more preferably meets 1 ＜ 2P of 30L α.In this way,
It can reliably ensure by the opposite position of lens section 10a, 20a of lens array 10,20, holder 50 and sensor array 60
The effective coverage required for image acquirement that the relationship set determines.In other words, sensor array need not optionally be increased
60 pixel number.Here, above-mentioned relation formula becomes the relational expression for the temperature change for imagining 30 DEG C.
The line expansion of the linear expansion coefficient α 2 and sensor array 60 of lens array laminated body 1 (lens array 10,20)
Factor alpha 3 meets the relationship of 2/ α of α, 3 ＞ 5.In this way, with the deformation of the lens array of the variation along with environment temperature 10,20
Amount is compared, and the deflection of the sensor array 60 along with the variation of environment temperature can be fully reduced, and becomes prone to mitigation pair
The load of image procossing.
Hereinafter, the state of the deformation of lens array laminated body 1 when illustrating changes in environmental conditions, position deviation.Following
In order to keep explanation simple, illustrate the change in shape state of the first lens array 10, but become about the shape of lens array laminated body 1
Change state is also same.That is, the deformation generated about the first lens array 10, position deviation, about lens array
Laminated body 1 similarly generates.At this point, there are the feelings of expansion rate difference slightly between the first and second lens array 10,20
Under condition, the deformation after equalizing the expansion rate of the first and second lens array 10,20, position deviation are generated.
In the case where being assumed to be holder 50 and not being deformed, in changes in environmental conditions, only the first lens array 10
Deformation, center of deformation, that is, second position T2 is consistent with support center (support datum mark OS) or central shaft AX, the first lens array
Row 10 are isotropically deformed centered on supporting center (support datum mark OS) or central shaft AX.To, as shown in Figure 3B,
Relative to sensor array 60 centered on the T2 of the second position isotropism and radially generation position deviation.In addition,
Keep the center of the center of deformation of holder 50, the center of deformation of lens array laminated body 1 and sensor array 60 consistent
In the case of it is also the same.
On the other hand, as in the present embodiment, in the center of deformation of holder 50, that is, first position T1 and the first lens array
(with reference to Fig. 2) in the case of the center of deformation of row 10, that is, second position T2 separating distances L, the first lens array 10 is with first position
It isotropically deforms centered on T1, and is moved relative to sensor array 60 due to the deformation of holder 50.
In figure 3 a, by the vector M1 of the movement of the second position T2 caused by the deformation of expression holder 50 with a chain-dotted line
It indicates, the vector M2 of the deformation for indicating first lens array 10 is indicated with two chain-dotted lines.By vector M1 and vector M2 into
Direction after row synthesis becomes substrate SB, the sensor relative to the first lens array 10 when variation has occurred in environmental condition
The deformation vector M3 of array 60 etc..From 60 side of sensor array, in being viewed as just like being with certain point (the coordinate SP0 of Fig. 3 A)
The heart, each lens section 10a are radially moved.In the case where the degree of the variation of environmental condition is the 1/2 of Fig. 3 A, such as
Shown in Fig. 3 C, the deformation vector M3 of the first lens array 10 becomes the size of half.In addition, in Fig. 3 A~3C, for ease of
Understand and each vector M1, M2, M3 are exaggerated and illustrated.
To as simple model, by the vector M2 and table that will indicate the degree of the deformation of itself of lens array 10
Show that the vector M1 of the movement of lens array 10 is synthesized, the position that can substantially accurately grasp caused by these influences is inclined
Difference.For example, vector M1, M2 under the conditions of prestoring reference atmosphere, variation cooperation with environmental condition and correcting vector M1,
M2, so as to grasp position deviation by the synthesis of vector M1, M2 after correction.In fact, in order to more accurately carry out
Correction reduces region and carries out image analysis to be corrected preferably after predicting deviation based on two vectors.It is logical
It crosses in such manner, it is possible to accurate and be quickly corrected.In addition, sensor region 61 has the variation for capableing of abundant overlay environment condition
The region of the pixel number of the position deviation of caused cyclopic image.
Fig. 4 be indicate to illustrate deformation caused by the changes in environmental conditions of lens array laminated body 1, position deviation reality
The figure of measurement result.When actually measuring, the angles 11mm of matrix arrangement have been carried out with the spacing of 2.5mm using 4 × 4 lens sections
Plastics lens array 10 and top plate portion 50a size be cross (X-direction) 13.9mm, indulge (Y-direction) 13.7mm plastics system
Holder 50.The material of lens array 10 is set as cyclic polyolefin i.e. Mitsui Chemicals, Inc.'s system APEL (linear expansion coefficients 70 × 10- 6/
DEG C), the material of holder 50 is set as makrolon (linear expansion coefficient 60 × 10- 6/℃).As sensor array 60, picture has been used
Plain spacing P is 1.7 μm, and linear expansion coefficient is 4 × 10- 6/ DEG C sensor array.Lens array 10 is bonded using thermosetting
Agent and be bonded on holder 50 so that the distance L of first position T1 and second position T2 become 1.5mm.At this point, relative to multiple
The arrangement of lens section 10a symmetrically in a manner of surrounding multiple lens section 10a quadrilateral shape coated with adhesive and glue
Knot is on holder 50.The leg 50b of holder 50 is bonded and fixed on the substrate for being mounted with sensor array 60.Also, make ring
Border temperature is changed to 58 DEG C from 26 DEG C, analyzes obtained image, to the variation of the center to each cyclopic image
It is measured.Fig. 4 be about with each simple eye corresponding 16 image datas, only take out center pixel nearby and arrange figure.Companion
Rise and generation position deviation with environment temperature, in appearance, observes inclined to arrange the central shaft AX of region LR from lens section
Position deviation is radially produced centered on the position (coordinate SP0) of difference.
(circuit part of photographic device)
Fig. 5 A are the block diagrams for the basic circuit structure for illustrating the photographic device involved by present embodiment.As shown that
Sample, photographic device 100 include as test section 101, CPU (central processing unit, Central Processing Unit) 102, number
Word processing circuit 103, image displaying part 104, card interface (I/F) 107, storage part 108, operation key 109.
In addition, photographic device 100 can be configured to the system for embodying each portion with independent device, universally say, makees
It is embodied for digital camera, personal computer, portable mobile terminal etc..That is, the user of digital camera etc. uses camera shooting
Device 100 carrys out shooting subject, so as to carry out visuognosis, energy to high-resolution image in image displaying part 104
It is enough that high-resolution image is taken care of in storage part 108.Specifically, in photographic device 100, as test section 101 is to coming from
The light of subject is detected and generates the picture signal (input picture) for being equivalent to subject, the figure of digital processing circuit 103
The image procossing as processing circuit 80 is aftermentioned to picture signal progress, has high frequency to generate compared with input picture
The high-resolution output image of rate component (hereinafter also referred to as " high-definition picture ").Also, digital processing circuit 103 will
The high-definition picture is exported to image displaying part 104, storage part 108 etc..
As test section 101 is by shooting subject, to generate the image of subject as data (by subject shadow
Input picture after pictureization) part, also referred to as camera module.As has been explained above as test section 101, including such as Figure 1A
And the main part 101a comprising optical system shown in 1B and the A/D that connect with main part 101a (are simulated to number
Word, Analog to Digital) converter section 101b.The expression detected by main part 101a is shot by A/D converter sections 101b
The video signal (analog electrical signal) of body is converted to digital signal and is exported.It is being as test section from A/D converter sections 101b
In the digital signals of 101 outputs, including with by the relevant information of input picture after subject Image Creation.In addition, as test section
101 can also include the control process circuit etc. controlled for each section to photographic device 100.
CPU102 executes processing based on program, the setting value in advance stored in ROM or RAM, to as test section
101, the action of digital processing circuit 103, image displaying part 104, card interface (I/F) 107 etc. is uniformly controlled, and makes camera shooting
The entirety of device 100 image etc. the corresponding action of the request with user or the scheduled action such as Stateful Inspection.Above-mentioned
One position T1, second position T2, the linear expansion coefficient α 1 of holder 50, the line of lens array laminated body 1 (lens array 10,20) are swollen
Swollen factor alpha 2, the linear expansion coefficient α 3 of sensor array 60, vector W1, W2 and environment temperature variation caused by vector
The correction coefficient etc. of W1, W2 are stored in ROM or RAM.
Digital processing circuit 103 is acted under the control of CPU102, and it includes the image for deferring to present embodiment to execute
The various digital processings of processing.Digital processing circuit 103 is typically by DSP (digital signal processor, Digital Signal
Processor), ASIC (application-specific integrated circuit, Application Specific Integrated Circuit), LSI are (big
Scale integrated circuit, Large Scale Integration), FPGA (field programmable gate array, Field-
Programmable Gate Array) etc. compositions.The digital processing circuit 103 includes to the input by being obtained as test section 101
Image carries out generating the image processing circuit 80 for exporting image comprising the desired image procossing of superresolution processing etc..
Image displaying part 104 to by being provided as test section 101 input picture, generated by digital processing circuit 103 it is defeated
Go out the relevant various set informations of image, photographic device 100, control GUI (graphic user interface, Graphical User
Interface) picture etc. is shown.
Card interface (I/F) 107 is the output image for will be generated by the image processing circuit 80 of digital processing circuit 103
Or image data is written to storage part 108, or the interface of image data etc. is read from storage part 108.Storage part 108 is to by scheming
As processing circuit 80 generate image data, (control parameter of photographic device 100, pattern etc. are set other various information
Definite value) storage device that is stored.The storage part 108 is made of flash memory, CD, disk etc., and data are non-volatile
Store to property.
Fig. 5 B are the block diagrams for the image processing circuit 80 for functionally illustrating to be arranged in digital processing circuit 103.Image
Processing circuit 80 to the input picture by being obtained as test section 101, implement to defer to the image processing method of present embodiment to
Generate high-definition picture.More specifically, image processing circuit 80 includes for carrying out aftermentioned position deviation estimation processing
Position deviation estimator 81, superresolution processing portion 82, input and output portion 83.Position deviation estimator 81 also includes for carrying out
First estimator 81a of first position estimation of deviation treatment process and for carrying out second position estimation of deviation treatment process
Two estimator 81b.First estimator 81a includes the configuration part 81d for setting aftermentioned region of search.In addition, at super-resolution
Reason portion 82 includes the calculating part for calculating the parameter used in superresolution processing based on estimated position deviation etc.
82a。
Superresolution processing portion 82 carries out aftermentioned superresolution processing to input picture.Superresolution processing is generated more than input
The processing of the frequency information for the nyquist frequency that image has.At this point, position deviation estimator 81 carries out aftermentioned first
Estimation of deviation treatment process and second position estimation of deviation treatment process are set, about each input picture, is estimated from reference map
The position deviation of picture.
(action summary)
In photographic device 100, to the shooting of picture test section 101 by playing a role as camera array to obtain
The multiple input image of the respectively different viewpoint arrived implements superresolution processing, obtains high-definition picture.
Photographic device 100 is rectangular more to being arranged as on the photoelectric conversion surface PC of sensor array 60 shown in Fig. 6
The multiple input image IG detected in a transition region AR considers the location of pixels caused by environmental condition (temperature change etc.)
Deviation and carry out superresolution processing.At this point, photographic device 100 is about corresponding with the image being projected onto on sensor array 60
Input picture IG, not only consider peritropous consistent expansion caused by the equal temperature variation of lens array laminated body 1 or to
The phenomenon that consistent contraction at center, it is also contemplated that the sky with temperature dependency caused by holder 50, lens array laminated body 1 etc.
The consistent shift phenomenon in intersexuality ground, carries out superresolution processing with higher accuracy to evaluate the deviation of location of pixels in advance.
(motion flow)
(molar behavior)
Fig. 7 is the flow chart of the flow of the action in the photographic device 100 indicated involved by present embodiment.
First, it in photographic device 100, executes by constituting as 16 single-lens of test section 101 obtain respectively
The processing of input picture IG, to obtain 16 input picture IG (step S11) shown in fig. 6.Specifically, with Fig. 6 is passed through
Sensor array 60 16 transition region AR in opto-electronic conversion and the corresponding digitized maps of input picture IG that respectively obtain
As signal is input to the image processing circuit 80 of digital processing circuit 103.Here, being for example set as being entered 1000 × 750 pictures
The image of the low resolution of element left and right.In addition, in image processing circuit 80, obtained data image signal can be carried out
Pre-treatment, the thus detection, correction of aftermentioned position deviation become easy.In the preceding processing, including Gaussian filter is such
Smoothing processing, additionally it is possible to obtain the image of each color (RGB) by solving mosaic processing.
If obtaining input picture, the selection (step S10) of image processing mode is carried out.In the case where seeking high image quality
Selection mode 1, selection mode 2 in the case where seeking high speed.The selection of pattern can be switched to cooperation by operator in advance
Operation key operation and specified image processing mode, or the shooting side according to static image shooting and dynamic image shooting etc.
Formula and automatically switch.
It is transferred to step S12 in the case where having selected pattern 1, step is transferred in the case where having selected pattern 2
S16.In step s 12, in the first estimator 81a of image processing circuit 80, the estimation processing of execution position deviation outline is made
For first position estimation of deviation treatment process.In the treatment process, the deviation of (integer pixel) is estimated as unit of pixel
Amount.In addition, here, be estimated constitute lens array laminated body 1 each synthesis lens 1a due to temperature change and position becomes
The position deviation of the pixel of each input picture IG caused by changing.
Then, it based on the departure as unit of pixel, in the second estimator 81b of image processing circuit 80, executes
Second position estimation of deviation treatment process (step S13).Here, being estimated as unit of sub-pixel the deviation of (fractional pixel)
Amount.
Also, in the superresolution processing portion 82 of image processing circuit 80, the position obtained in step S12, S13 is considered
Departure and execute superresolution processing (step S14), generate the high-definition picture of 4000 × 3000 pixels or so as output
Image OG.
(position deviation outline estimation processing)
Fig. 8 and Fig. 9 is for illustrating the position as first position estimation of deviation treatment process in above-mentioned steps S12
The figure of the concrete example of deviation outline estimation processing.Hereinafter, being illustrated for temperature as environmental condition.Fig. 8 is for illustrating
The figure of the deviation of location of pixels caused by the temperature change of input picture IG from each synthesis lens 1a is as an example
Schematically show the figure of the input picture IG before and after 30 DEG C of temperature rise.In addition, Fig. 9, which is explanation, is conceived to a transition region
The figure of the offset (including amplification) of the input picture IG of AR.
In figure (left figure) before the temperature rise of Fig. 8,16 solid-line rectangles indicate defeated on sensor array 60 respectively
Enter image IG (A~P).In figure (right figure) after the temperature rise of Fig. 8,16 dashed rectangles indicate the input before temperature rise
Image A~P, 16 solid-line rectangles indicate input picture A~P after temperature rise.Label A~P of input picture also identifies structure
At the synthesis lens 1a of lens array laminated body 1.That is, constituting 16 synthesis lens of lens array laminated body 1 sometimes
1a is indicated by label A~P.
As shown in figure 8, if temperature rise, each to synthesize lens 1a and the expansion of holder 50, so the bat of each input picture
Range is taken the photograph to change on the whole.In the present embodiment, photographic device 100 will be from four lens sections for being provided in inside
Among a synthesis lens 1a input picture IG (K) be used as above-mentioned steps S12 in position deviation outline estimation processing when
Benchmark image.In addition, in present treatment, when above flexible, fully enter image IG (A~P) as similar shape and
It is flexible, it is assumed that execute processing to keep the relationship of congruence relatively.
For example, the extension at the interval being set as on input picture IG is 1/1000 times relative to 30 DEG C of temperature rise.At this point,
If being set as with a distance from input picture IG (K) and the input picture IG (A) farthest from it as benchmark image as along inclined direction
(X-direction, Y-direction difference) 4000 pixels, then input picture IG (A) due to 30 DEG C temperature change and the along inclined direction (side X
To Y-direction difference) 4 pixels of variation.That is, input picture IG (A) exists relative to the relative position of input picture IG (K)
In the environment of normal temperature ± 30 DEG C, change in the range of 9 × 9 pixel.
In above-mentioned steps S12, the picture that is indicated using in Fig. 8 on the input picture IG (K) as benchmark image with roundlet
On the basis of element (benchmark pixel) CP, about the corresponding benchmark pixel CP ' on remaining input picture IG (A~J, L~P), with
Position deviation of the pixel for unit come expansion caused by estimating temperature and caused by shrinking.Here, on input picture IG (K)
Benchmark pixel CP is determined based on first position T1 and second position T2.That is, using first position T1, the second position
T2, from the first vector W1 from first position T1 to second position T2 and lens array laminated body 1 (lens array 10,20)
Linear expansion coefficient α 2 calculates the pixel of the mobile minimum caused by temperature change and determines benchmark pixel CP.If benchmark pixel CP
For the small pixel of the movement caused by temperature change, then presence can make the effect that the margin widths of aftermentioned region of search narrow
Fruit.
As shown in figure 9, the input picture IG (A~J, L~P) other than the input picture IG (K) as benchmark image
Among, such as in input picture IG (A), with the position deviation caused by no temperature change the case where corresponding pixel CP '
It is confirmed as the coordinate position (circle of dotted line) suitably set in advance.Also, in the position caused by right ± 30 DEG C of temperature change
In the case that deviation is estimated, centered on pixel CP, cover adjoint ± 30 DEG C of temperature change and in input picture IG
(A) the range A1 for the offset imagined in becomes the region of the bottom line for searching for pixel corresponding with benchmark pixel CP.
Here, the range A1 for being covered in the offset imagined in input picture IG (A) becomes, will be from benchmark pixel CP to pixel CP '
Distance be set as D, in the case that the expansion and contraction of per unit temperature is set as β, centered on by pixel CP ' and by length D × β ×
Expand certain margin widths around quadrangle as defined in the diagonal line of 60 (60 are temperature and DEG C unit).As shown in figure 8, model
It is the last set region set by each input picture IG (A~J, L~P) to enclose region of search shown in A1, from as benchmark
The the input picture IG (K) of image the remote then wider, and the radial direction in this outer is set to longer.Specifically, range (is searched
Rope region) A1 is set to add the such value of table below 1 in the region of margin widths.
(table 1)
In above table, if the spacing of the X-direction of input picture IG is set as Px, the spacing of Y-direction is set as Py, then
Value a, b uses expansion and contraction β, becomes the value for being equivalent to Px × β × 30, Py × β × 30.
About region of search (also referred to as estimative domain of the existence), above range A1 is to illustrate, and is not limited to above-mentioned model
Enclose A1.In input picture IG (A~J, L~P), if think benchmark pixel CP ' along regulation above range A1 diagonal line and
Offset, then, will be along the elongated model corresponding to cornerwise line segment TL compared with range A1 is all set to region of search
Enclosing A2 and being set as the efficiency that region of search is then searched for becomes more preferable.That is, as shown in figure 9, reducing 30 DEG C of temperature by determination
In the case of become corresponding to pixel CP ' position pixel CP1 and in the case where rising 30 DEG C of temperature become correspond to
The pixel CP2 of the position of pixel CP ', to which pixel CP1 and pixel CP2 and the range for expanding certain margin widths will be connected
A2 is set as region of search.Figure 10 is to fully enter image IG (A~J, L~P) about the object as retrieval, shows the field of search
The figure of the range A2 in domain.At this point, range A2 is tilted relative to axis X, Y of input picture IG.
About other input pictures IG (B~J, L~P), also by same method, will be covered in input picture IG (B~
J, L~P) in imagine offset range A1, more preferably along connection ± 30 DEG C upper and lower bound line segment TL and expand
The elongated range A2 of certain margin widths is set as region of search.
Alternatively, it is also possible to based on first position T1, second position T2, first position T1 with second position T2 distances L, with
And the linear expansion coefficient α 2 of lens array laminated body 1 (lens array 10,20) determines region of search.At this point, due in omission
The process stated, processing become high speed.
More than, have for detecting picture premised on it not can determine that as the temperature of test section 101, but in photographic device 100
In the case of the temperature sensor of the temperature on 101 periphery of test section, additionally it is possible to model will be further limited as shown in Figure 11
The range A3 close to square for enclosing A2 is set as region of search.The range A3 of diagram is equivalent to be risen compared with normal temperature
+ 30 DEG C of the case where.That is, range A3 corresponds to the temperature as 101 periphery of test section, moved in range A2.
Above such range A1, A2, A3 are with the domain of the existence of the cyclopic image estimated by comparing easy method
Premise, region of search is set as by such range A1, A2, A3 and execution pattern matches, so as to be born to image procossing
Lotus is set as smaller.
In addition, range A2, A3 corresponding with above-mentioned region of search etc. is other than considering temperature change, such as consider practical
Synthesis lens 1a between distance etc. from the deviation of design value, can be set as and the margin widths imagined according only to temperature change
Compared to larger widened range outward.
In above-mentioned region of search, that is, range A1, A2, A3 (preferably range A2, A3), using including input picture IG
(A) image of benchmark pixel CP ' carries out template matches processing, most with the benchmark pixel CP consistent degrees of input picture IG (K)
High pixel TP is confirmed as the pixel positioned at position corresponding with benchmark pixel CP.One as template matches in this processing
Example, enumerates NCC (normalizated correlation coefficient, Normalized Cross Correlation).As other examples, can also be
SAD (absolute difference summation, Sum of Absolute Difference), SSD (difference of two squares summation, Sum of Squared
Difference) etc..Also, about other input pictures IG (B~J, L~P), same region of search, that is, range A1, A2,
In A3 (preferably range A2, A3), above-mentioned template matches processing is carried out, in each input picture IG (A~J, L~P), is located at
The pixel of position corresponding with the benchmark pixel CP of input picture IG (K) is determined.
Figure 12 corresponds to the figure of Fig. 9, is the figure of the variation of setting for illustrating region of search etc..At this point, benchmark pixel
CP is set in the point SP separation from the position deviation being set as caused by no temperature while on input picture IG (K)
Position.As a result, benchmark pixel CP is also deviated in wider range, but have for detecting as inspection in photographic device 100
In the case of the temperature sensor of the temperature on 101 periphery of survey portion, the range of choice A2 ' according to the peripheral temperature as test section 101
In specific place pixel CPV, which is set as to the benchmark pixel CP of template matches processing.
(position deviation estimation processing 1)
Hereinafter, at the position deviation estimation as second position estimation of deviation treatment process in the step S13 of definition graph 7
Reason 1.In the position in estimation of deviation processing 1, the sub-pixel unit more precisely to improve the estimation of the outline in step S12 is come
Carry out position deviation estimation.
Figure 13 A~13C are the figures for illustrating the estimation of the position deviation in above-mentioned steps S13 processing 1.As shown in FIG. 13A,
About an input picture IG (A) after temperature change, the position deviation being estimated as unit of sub-pixel.With by above-mentioned
The first position estimation of deviation treatment process of step S12 and determination, be equivalent to benchmark pixel CP ' in input picture IG (A)
Pixel TP centered on such as range of 3 × 3 pixels prescribed limit A4 in, with the consistent of each pixel in template matches
Quadratic Surface Fitting (3B referring to Fig.1) is carried out based on degree (such as NCC values).In the position deviation estimation processing 1 of step S13
In, as an example, it can use in paper " at the ず れ amount を Kao Account Hua Su Election selected To base づ く ロ バ ス ト super-resolution of position
Manage (the robust superresolution processing based on the pixel selection for considering position deviation amount) " (electronic information communication association paper will,
Vol.J92-D, No.5, pp.650-660,2009, in May, 2009) described in method.That is, such as Figure 13 B and 13C institutes
Show, the coordinate of the highest pixel of consistent degree is confirmed as departure among the consistent degree of each pixel.Like this, it is searched in setting
Pattern match is carried out behind region, therefore compared with carrying out pattern match to all images, can be handled at high speed.
The input picture IG (A) about benchmark image is this concludes the description of, the processing of accurate position deviation estimation is carried out,
But about other input pictures IG (B~J, L~P), also with the first position estimation of deviation treatment process of S12 through the above steps
And on the basis of the pixel TP determined, identical processing the case where with input picture IG (A) is carried out, the position of precision is thus allowed for
Set estimation of deviation.
In addition, in step s 13, above-mentioned Quadratic Surface Fitting can also be replaced, using passing through X-coordinate and Y coordinate
It is fitted to the other methods of conic section etc. respectively.
(position deviation estimation processing 2)
In the case of having selected pattern 2 in step slo, in step s 16, easy position deviation estimation processing is executed
That is position estimation of deviation processing 2.In this step, according to based on first position T1 and the difference of second position T2 vector W1,
With the vector W2 of isotropic deformation based on lens array 10, simply estimated location deviation.Specifically, being filled in camera shooting
Interior setting temperature sensor is set, after being corrected by determining the environment temperature of two vector W1, W2, according to the two
Resultant vector and the departure for calculating each pixel, the result of calculation are estimated as indicating position deviation.Alternatively, according to image data
Separation multiple pixels and estimate temperature change, two vector W1, W2 are corrected based on this, two vectors after correction are closed
At and estimated location deviation.According to this method, without the setting as described above based on region of search or the standard of pattern match
True position deviation detection, therefore position deviation estimation can be carried out at high speed.I.e. it is capable to by comparing easy fortune
It calculates, grasps the position deviation of the cyclopic image of the variation along with environmental condition, can promptly carry out good image procossing.Separately
Outside, in the calculating of vector W1, first can also be calculated according to the holder shape and lenticular array shape under fiducial temperature
T1 and second position T2 is set, can also be made gradient of temperature after lens array 10 is bonded on holder 50 and actually measure
First position T1 and second position T2.Vector W2 is respectively different according to position, but is considered as centered on the T2 of the second position
Isotropic deformation readily calculates so as to the function as the position relative to second position T2.
(superresolution processing)
Figure 14 is the figure for the flow for indicating the superresolution processing in above-mentioned steps S14.In fig. 14, as concrete example, show
Go out and is carrying out in paper " Fast and Robust Multiframe Super Resolution " (IEEE TRANSACTIONS
2004 page.1327-1344 of ON IMAGE PROCESSING, VOL.13, NO.10, OCTOBER) described in processing feelings
The flow of superresolution processing under condition.
It as shown in figure 14, will be defeated to interpolation processings such as one in input picture implementation bilinearity methods in step S31
The conversion of resolution for entering image is the resolution ratio i.e. high-resolution after superresolution processing, to generate the output as initial pictures
Candidate image.
In step s 32, it calculates for making noise steadily convergent BTV (bilateral total variation, Bilateral Total
Variation it) measures.
In step S33, the input picture of the output candidate image of above-mentioned generation and 16 tensors is compared, is calculated residual
Difference.That is, in step S33, the output candidate image of above-mentioned generation is based on each input picture and its deteriorates information (expression super-resolution
The information of the relationship between image and input picture afterwards) and converted (low resolution) be input image size (with reference to figure
15 step S41), it calculates the difference with the input picture of 16 tensors and is recorded (5 step S42 referring to Fig.1).Also,
The difference is returned the size (5 step S43 referring to Fig.1) after superresolution processing, is set as residual error.
In step S34, the residual sum BTV amounts that are calculated according to the output candidate image generated in above-mentioned steps S31
It reduces and generates next output candidate image.
The processing of above-mentioned steps S31~S34 is repeated until output candidate image convergence, and the output after convergence is candidate
Image is exported as the output image after superresolution processing.
Repetition can also be the substantially fully predefined number such as convergent number (such as 200 times), can also
It is to carry out convergence judgement, the repetition according to its result in each a series of processing.
Figure 15 is the figure of the deterioration information for illustrating to use in above-mentioned steps S33.It refers to indicating input to deteriorate information
The image respective information relative to the relationship of the high-definition picture after superresolution processing, such as indicate in the matrix form.
Deteriorate in information, the departure for the respective sub-pixel grade of input picture estimated included in above-mentioned steps S13, down-sampling
Amount and fuzzy quantity etc..
Referring to Fig.1 5, by the high-definition picture after input picture and superresolution processing respectively with one-dimensional vector table
In the case of existing, deteriorate information by indicating the matrix of its conversion to provide.Photographic device 100 is based on S12 through the above steps
And the position deviation of S13 estimated processing and estimated, the parameter used in superresolution processing is calculated, as deterioration information
And it is incorporated into.
Figure 16 is the figure for indicating to deteriorate the concrete example of information.Photographic device 100 is estimated as 0.25 in the departure of pixel
Pixel, down-sampling amount are longitudinal and laterally in the case of difference 1/4, it is specified that deterioration information as shown in Figure 16.Right
16 pixels that should be at 1 of 1 pixel in input picture, at 16 with the high-definition picture after superresolution processing to it is corresponding when
In deteriorating information, 1/16 coefficient is recorded at 16.Therefore, right in the case where the departure of pixel is 0.25 pixel
1/16 amount of its departure is contributed respectively in 16 pixels of high-definition picture.
In addition, the superresolution processing in above-mentioned steps S14 is not limited to handle shown in Figure 14, as long as defeated according to multiple
Other processing can also then be used by entering the Reconstructed superresolution processing of image one image of generation.It is calculated in above-mentioned steps S32
Contained item can also using such as 4 nearby Laplces equal other restrain items and replace BTV amounts.
Compound eye imaging device from the description above, image processing circuit 80 are at least based on and first position T1 and second
Set the relevant information of difference of T2 and indicate lens array laminated body 1 (lens array 10,20) along with environmental condition
The information of the degree of the deformation of variation executes image procossing.For example, the variation to environmental conditions such as the variations of adjoint environment temperature
And generate sensor array 60 on each cyclopic image position variation, it is i.e. corresponding with the optical image on sensor array 60 and
The variation of the position of obtained image is corrected.Even if saturating when as a result, in terms of the directions optical axis OA from lens section 10a, 20a
The center of deformation of lens array 10,20 and holder 50 is inconsistent, also can quickly and accurately grasp on sensor array 60
The position deviation of each cyclopic image can carry out good image procossing relative to the variation of environmental condition.
More than, on sensor array 60, substrate SB substantially not premised on dilation, but sensor array 60, substrate SB
There is also less compared with holder 50 but along with the dilation slightly of temperature, it is also contemplated that this and calculated.
In addition, in the above-described embodiment, illustrating due to holder 50, lens array laminated body 1 or the first lens array
The case where 10 deformation and the forming position of picture are along imaging surface generation position deviation, but sometimes as forming position with environment
Temperature and along the directions optical axis OA pettiness generate displacement (focus offset).At this point, can also carry out to being generated with environment temperature
Part the processing that compensates of focus offset.Specifically, at the second position estimation of deviation shown in Figure 13 A~13C
Fog-level estimation processing is carried out when science and engineering sequence, about each input picture, to estimating from the fog-level of benchmark image.
That is, in above-mentioned deformed step S13, also estimate when the departure of (fractional pixel) as unit of estimation is by sub-pixel
Count fog-level.Also, in above-mentioned steps S14, considers position deviation amount and fog-level and execute superresolution processing.
In the above-described embodiment, if the temperature deformation of holder 50, lens array laminated body 1 etc. is linear, but sometimes by
The shape of rigid condition, holder 50 between these components and have nonlinear component.At this point, can also consider such non-
Linear component and the orientation for estimating contraction, at this point, extending with can also being for example set as the range A2 curves of above-mentioned region of search
And carry out image procossing.
It this concludes the description of the compound eye imaging device involved by embodiment, but compound eye imaging device according to the present invention
It is not limited to above-mentioned illustration.For example, constituting the arrangement of lens section 10a, 20a of each lens array 10,20, its optical surface 11a, 11b
Deng shape etc. can be suitably changed according to the purposes or specification of lens array laminated body 1 or photographic device 100.Such as lens
Portion 10a, 20a are not limited to arrange on 4 × 4 grid point, can be arranged on such as 3 × 3,5 × 5 etc. grid point.In addition,
Grid is not limited to square grid, can also be rectangular grid.
In the respective embodiments described above, it is illustrated for environment temperature as environmental condition, but not limited to this, also may be used
Be certain components in the humidity of surrounding enviroment, surrounding enviroment concentration or in which multiple elements combination.It can also basis
It needs that humidity sensor, gas sensor etc. is arranged.
In addition, in the above-described embodiment, lens array has been laminated two, but can not also be laminated but single layer it is saturating
Lens array.In addition it is also possible to which lens array is laminated three or more.
Lens array laminated body 1 is set as generally square when looking down relative to holder 50 by binding part QB, but
It can also be set as rectangle, circle.
In the above-described embodiment, lens array 10,20 is set as resin system but it is also possible to be glass system.In addition, as tree
Fat is not limited to thermoplastic resin, can use thermosetting resin, photocurable resin etc..In addition, lens array 10,20
Can also be the wafer-level lens for the lens section that resin is for example two-dimensionally arranged on the substrate of glass.
In addition, in the above-described embodiment, holder 50 is fixed on substrate SB, but sensor array can also be fixed on
On 60.
In addition, in the above-described embodiment, keep the support datum mark OS of lens array 10,20 consistent with central shaft AX, but
Support datum mark OS can also energetically be moved from central shaft AX and be configured.
Claims (20)
1. a kind of compound eye imaging device, has：
Compound eye optical system, including the lens with the multiple lens sections two-dimensionally arranged on the direction vertical relative to optical axis
Array；
Sensor array, multiple optical images corresponding with the multiple lens section are imaged by the compound eye optical system, defeated
Go out picture signal corresponding with the multiple optical image；
Holder remains the compound eye optical system opposed with the sensor array；And
Image processing circuit, for handling the picture signal exported from the sensor array,
Under the conditions of reference atmosphere, the change of the variation of the environmental condition along with holder when in terms of the optical axis direction
The change of center, that is, first position of shape and the environmental condition along with lens array when in terms of the optical axis direction
In the state of the center of the deformation of change, that is, second position separation, the lens array is fixed in the holder,
Described image processing circuit at least based on the relevant information of the difference of the first position and the second position and
The information of the degree of the deformation of the variation of the environmental condition along with the lens array is indicated to carry out image procossing.
2. compound eye imaging device as described in claim 1, wherein
The lens array is bonded in the holder by binder.
3. compound eye imaging device as claimed in claim 2, wherein
The lens section that the multiple lens section is arranged among to the lens array is arranged by binding part for the lens array
Arranging the center in region becomes on the position of point symmetry.
4. compound eye imaging device as claimed in claim 3, wherein
The lens array it is continuous to surround the mode of multiple lens sections by binding part.
5. such as any one of them compound eye imaging device of Claims 1-4, wherein
The holder has top plate portion and supports the leg of the top plate portion.
6. compound eye imaging device as claimed in claim 5, wherein
The lens array is fixed in the top plate portion of the holder.
7. compound eye imaging device as claimed in claim 6, wherein
The side of the object of the lens array is fixed in the image side surface of the top plate portion of the holder.
8. such as any one of them compound eye imaging device of Claims 1-4, wherein
The holder is configured with the shape that the direction vertical with the optical axis is generated in the variation with environmental condition
When variation, the center of deformation constant relative to the substantial relative position of the sensor array.
9. such as any one of them compound eye imaging device of Claims 1-4, have：
Substrate is provided with the sensor array,
The holder is fixed in the substrate.
10. compound eye imaging device as claimed in claim 5, has：
Substrate is provided with the sensor array,
The leg of the holder is fixed in the substrate.
11. such as any one of them compound eye imaging device of Claims 1-4, wherein
The lens array is formed by resin.
12. such as any one of them compound eye imaging device of Claims 1-4, wherein
The holder is formed by resin.
13. such as any one of them compound eye imaging device of Claims 1-4, wherein
The linear expansion coefficient α 1 of the holder, the first position and the second position distance L and sensor array
Pel spacing P meets
1 ＜ 5P of 30L α
Relationship.
14. such as any one of them compound eye imaging device of Claims 1-4, wherein
The linear expansion coefficient α 1 of the holder, the first position and the second position distance L and sensor array
Pel spacing P meets
1 ＜ 2P of 30L α
Relationship.
15. such as any one of them compound eye imaging device of Claims 1-4, wherein
The linear expansion coefficient α 1 of the holder and the linear expansion coefficient α 2 of the lens array meet
1.2 ＞ α, 2/ α, 1 ＞ 0.8
Relationship.
16. such as any one of them compound eye imaging device of Claims 1-4, wherein
The linear expansion coefficient α 2 of the lens array and the linear expansion coefficient α 3 of the sensor array meet
2/ α of α, 3 ＞ 5
Relationship.
17. such as any one of them compound eye imaging device of Claims 1-4, wherein
Described image processing circuit uses the first vector and table for indicating the movement from the first position to the second position
Show the resultant vector of the second vector of the deformation of each position in the lens array to carry out image procossing.
18. such as any one of them compound eye imaging device of Claims 1-4, wherein
Described image processing circuit based on the relevant information of the difference of the first position and the second position and indicate
It is pair corresponding with environmental condition each simple eye along with the information of the degree of the deformation of the variation of the environmental condition of the lens array
Domain of the existence of the picture on the sensor array is estimated, picture signal corresponding with estimated domain of the existence is executed
Pattern match, acquire the correcting value of the change in location of each cyclopic image of the variation along with environmental condition.
19. such as any one of them compound eye imaging device of Claims 1-4, wherein
The reference atmosphere condition is that environment temperature is set as to the condition of room temperature.
20. such as any one of them compound eye imaging device of Claims 1-4, wherein
The compound eye optical system is also equipped with is set as the first lens array and in first lens array by the lens array
The optical axis direction on the second lens array for overlapping.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-142186 | 2013-07-05 | ||
| JP2013142186 | 2013-07-05 | ||
| PCT/JP2014/066464 WO2015001992A1 (en) | 2013-07-05 | 2014-06-20 | Compound-eye imaging device |
Publications (2)
| Publication Number | Publication Date |
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| CN105379245A CN105379245A (en) | 2016-03-02 |
| CN105379245B true CN105379245B (en) | 2018-08-07 |
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| JP (1) | JPWO2015001992A1 (en) |
| CN (1) | CN105379245B (en) |
| WO (1) | WO2015001992A1 (en) |
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| CN110661960B (en) * | 2019-10-30 | 2022-01-25 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
| CN113188776B (en) * | 2021-04-27 | 2022-11-11 | 哈尔滨工业大学 | Compound eye imaging contact ratio detection system and detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05127002A (en) * | 1991-10-31 | 1993-05-25 | Ricoh Co Ltd | Plastic lens and lens optical system |
| JP4066960B2 (en) * | 2004-01-28 | 2008-03-26 | 三菱電機株式会社 | Image sensor |
| CN101088285A (en) * | 2004-12-22 | 2007-12-12 | 松下电器产业株式会社 | Imaging device and manufacturing method thereof |
| EP2001222A4 (en) * | 2006-03-22 | 2013-03-06 | Panasonic Corp | Imaging device |
| JP2009053011A (en) * | 2007-08-27 | 2009-03-12 | Panasonic Corp | Imaging device |
| CN101682690B (en) * | 2008-01-11 | 2012-05-30 | 松下电器产业株式会社 | Binocular camera module |
| JP2011019088A (en) * | 2009-07-09 | 2011-01-27 | Fujifilm Corp | Compound eye imaging apparatus |
| JP2011197479A (en) * | 2010-03-19 | 2011-10-06 | Fujifilm Corp | Lens, lens array, and manufacturing method thereof |
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2014
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