CN105374789A - Circuit module structure and manufacturing method therefor - Google Patents
Circuit module structure and manufacturing method therefor Download PDFInfo
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- CN105374789A CN105374789A CN201510779980.4A CN201510779980A CN105374789A CN 105374789 A CN105374789 A CN 105374789A CN 201510779980 A CN201510779980 A CN 201510779980A CN 105374789 A CN105374789 A CN 105374789A
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- circuit module
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- circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention relates to the encapsulating field of circuit components and parts, and in particular to a circuit module structure and a manufacturing method therefor. According to the embodiments of the invention, the circuit module structure comprises a PCB, a pin connected with the PCB and an encapsulating structure for wrapping the PCB and the pin; a concave part is formed in one end, connected with the PCB, of the pin; the PCB is connected with the inner side of the concave part of the pin; the concave part is positioned in the encapsulating structure; and the free end of the pin extends out of the encapsulating structure. According to the embodiments of the invention, the PCB takes the plane of the pin as an interface plane; the thicknesses of the two parts of the PCB that is divided by the interface plane are basically the same, so that the mold flow is steady in the encapsulating, and the encapsulating quality is high; the pin and the encapsulated circuit module are combined into one body; equivalently, the pin extends from the internal of the encapsulated circuit module out of the encapsulating structure that is for encapsulating the circuit module, therefore, the problems of the loosening of the circuit module structure caused by high temperature or even the falling off the circuit module structure are avoided.
Description
Technical field
The present invention relates to circuit components encapsulation field, be specifically related to a kind of circuit modular structure and manufacture method thereof.
Background technology
Electronic circuit surface installation technique (SurfaceMountTechnology, SMT), is called surface mount or surface mounting technology.It is that one will be arranged on printed circuit board (PrintedCircuitBoard without pin or short leg surface-assembled components and parts, PCB) on surface or the surface of other substrate, by the circuit load technology of the method such as Reflow Soldering or immersed solder welding assembly in addition.
For power circuit, power circuit is in the past that components and parts are directly mounted on PCB and complete; Along with the development of power circuit, power circuit is towards the future development of high current density, little bonding area, high-cooling property.The circuit module of existing power supply circuit is in manufacture, can first by components and parts Surface Mount on PCB, then encapsulating process is carried out, the side of the circuit module after encapsulating can reserve connecting terminal, then can connect pin at this connecting terminal place, in order to ensure the reliability of pin and connecting terminal, the mode of welding is usually adopted to connect.
But, the pin that this connected mode connects, pin adopts with the connecting terminal exposed after encapsulating and welds, but because stitch itself is very little, bonding area is also very little, therefore at high temperature probably occur getting loose, and cause loose contact, circuit module cannot be worked.
Summary of the invention
Embodiments provide a kind of circuit modular structure and manufacture method thereof, the connecting terminal exposed after can solving pin and encapsulating adopts and welds, but because stitch itself is very little, bonding area is also very little, therefore at high temperature probably occur getting loose, and cause loose contact, make the problem that circuit module cannot work.
In view of this, embodiment of the present invention first aspect also provides a kind of circuit modular structure, the pin can comprise PCB, being connected with PCB, and the encapsulating structure of coated PCB and pin, one end that pin is connected with PCB is provided with recess, PCB is connected with the inner side of the recess of pin, and recess is positioned at encapsulating structure, and the free end of pin stretches out encapsulating structure.
Be understandable that, owing to adopting the design of recess, and this recess is inner with encapsulating structure, the problem that the pin that there will not be linear pattern design to cause is deviate from, free end due to pin stretches out encapsulating structure in encapsulating structure, therefore without the need to welding pin again, thus the problem that there will not be high temperature to get loose.
In conjunction with first aspect, in the first possible implementation of first aspect, the degree of depth of recess is not less than the thickness 1/3rd of PCB.Wherein, the mode degree of depth of recess being set to 1/3rd of the thickness of the PCB being not less than circuit module can make follow-up encapsulation process mould levelling steady on the one hand, also meets the primary demand of location on the other hand.
In conjunction with a kind of possible implementation of first aspect or first aspect, in the implementation that the second of first aspect is possible, the magnetic core on PCB is exposed to encapsulating structure.Wherein, the magnetic core exposed can intensifier circuit module heat-sinking capability operationally.
In conjunction with first aspect, in the third possible implementation of first aspect, recess is hierarchic structure, and the bottom of hierarchic structure is connected with PCB, and the top of hierarchic structure is between the top and bottom of PCB.Hierarchic structure can make PCB just in time embed in the ladder of hierarchic structure, one end of hierarchic structure is positioned at the bottom of PCB, the other end between the top and bottom of PCB, thus realizes location PCB, and the position of stepped top can make the mould levelling of follow-up encapsulating whole.
In conjunction with the third possible implementation of first aspect, in the 4th kind of possible implementation of first aspect, PCB is provided with pin installation position.The side that the bottom of hierarchic structure is connected with PCB is provided with the tie point that contact corresponding to pin installation position.Bottom arranges tie point, can realize precise positioning.
In conjunction with the 4th kind of possible implementation of first aspect, in the 5th kind of possible implementation of first aspect, tie point is positioned on the upper surface of the bottom of hierarchic structure.
In conjunction with first aspect, in the 6th kind of possible implementation of first aspect, the structure of the recess of pin is at least twice bending forming structure.The overbending direction of twice bending structure is contrary, makes the pin portions at the two ends of the structure after twice bending be parallel substantially, and the bending of more than twice also needs the pin portions keeping bending structure two ends to be parallel substantially.Can be used between the structure be bent to form for twice locating PCB.
In conjunction with the 6th kind of possible implementation of first aspect, in the 7th kind of possible implementation of first aspect, each bending angle of at least twice bending forming structure is respectively 30 degree to 150 degree.The angle of each bending reaches 30 degree to 150 degree, makes the structure that is bent to form for twice more effective for locating PCB.
Embodiment of the present invention second aspect also provides a kind of manufacture method of circuit module, can comprise:
Circuit module substrate cut is become single circuit module, and circuit module is provided with pin pad;
The one end be provided with on the pin of the framework of pin is processed out recess, and the tie point of pin is located in recess;
Circuit module is mounted the recess place to the pin of framework, and the pin pad of circuit module is corresponding with the tie point of pin to contact;
Circuit module after attachment is encapsulated.
Can find out, the one end on the pin of framework is adopted to process out recess, the tie point corresponding with the pin pad of circuit module is provided with in recess, at the recess place of pin circuit module being labelled to framework, then encapsulate, design due to recess makes the PCB of circuit module be embedded in the pin institute of framework planar, PCB can be made with pin place plane for interface, PCB is roughly the same with two parts thickness after the boundary of this interface, thus make the mould levelling when encapsulating steady, and then make encapsulating quality high, and the setting of recess also helps the attachment location of circuit module, because pin place is the mode adopting encapsulating, pin and the circuit module after encapsulating are combined as a whole, be equivalent to pin stretches out this circuit module of encapsulating encapsulating structure from the circuit module inside after encapsulating, thus the problem that there will not be high temperature to loosen even to come off.
In conjunction with first aspect, in the first possible implementation of first aspect, recess depths is not less than 1/3rd of the thickness of the PCB of circuit module.Wherein, the mode degree of depth of recess being set to 1/3rd of the thickness of the PCB being not less than circuit module can make follow-up encapsulation process mould levelling steady on the one hand, also meets the primary demand of location on the other hand.
In conjunction with first aspect, in the implementation that the second of first aspect is possible, the one end on the pin of framework is processed out recess and is specially:
The recess of pin one end of framework is formed by punching press;
Or,
The recess of pin one end of framework is formed by casting.
Wherein, all can be produced the shape of corresponding recess by the mode of punching press and casting, the stamping parts that the mode due to punching press and casting produces or the physical characteristic of cast member has difference, punching press or casting can be chosen according to actual conditions.
In conjunction with first aspect, in the third possible implementation of first aspect, recess place circuit module being labelled to pin can comprise:
The pin pad of circuit module brushes tin cream;
The tie point of pin brushes tin cream;
Circuit module is placed on the recess place of the pin of framework;
Reflow process is carried out to the framework being placed with circuit module.
Wherein, adopt and carry out Reflow Soldering again at the tie point brush tin cream of pin pad and pin welding can be made more firm.
In conjunction with the third possible implementation of first aspect or the first possible implementation of first aspect or the possible implementation of the second of first aspect or first aspect, in the 4th kind of possible implementation of first aspect, method also can comprise:
Pure Tin Plating Process is carried out to the pin of the circuit module after encapsulating.Wherein, the object of Pure Tin Plating Process is to increase one deck coating to pin, and this coating can make the solderability of pin, ductility and corrosion resistance strengthen to some extent.
In conjunction with the third possible implementation of first aspect or the first possible implementation of first aspect or the possible implementation of the second of first aspect or first aspect, in the 4th kind of possible implementation of first aspect, in the 5th kind of possible implementation of first aspect, method also can comprise:
The encapsulating structure of the circuit module after encapsulating is ground, exposes the magnetic core of circuit module.Wherein, the magnetic core exposed ground out can intensifier circuit module heat-sinking capability operationally.
In conjunction with the third possible implementation of first aspect or the first possible implementation of first aspect or the possible implementation of the second of first aspect or first aspect, in the 4th kind of possible implementation of first aspect, in the 6th kind of possible implementation of first aspect, method also can comprise:
Muscle and bending process are cut to the pin on framework.Wherein, the syndeton of docking with the link slot of various PCB can be formed after bending.
In conjunction with the third possible implementation of first aspect or the first possible implementation of first aspect or the possible implementation of the second of first aspect or first aspect, in the 4th kind of possible implementation of first aspect, in the 7th kind of possible implementation of first aspect, circuit module substrate comprises upper surface and lower surface, also can comprise before circuit module substrate cut is become single circuit module:
Tin cream is brushed in the components and parts Surface Mount position of lower surface of the circuit module substrate designing circuit;
Components and parts are labelled to the lower surface of circuit module substrate, pin pad is positioned at the lower surface of circuit module substrate;
Circuit module substrate lower surface being posted components and parts carries out reflow process.Wherein, before cutting into single circuit module, carry out the components and parts welding of lower surface, components and parts welding efficiency can be improved.
In conjunction with the 7th kind of possible implementation of first aspect, in the 8th kind of possible implementation of first aspect, after being encapsulated by the circuit module after attachment, method also can comprise:
Tin cream is brushed in the components and parts Surface Mount position of the upper surface of circuit module substrate;
Components and parts are labelled to the upper surface of circuit module substrate;
Circuit module substrate upper surface being posted components and parts carries out reflow process.Wherein, before cutting into single circuit module, carry out the components and parts welding of upper surface, components and parts welding efficiency can be improved.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of prior art circuits module;
Fig. 2 is the structural representation of circuit module in the embodiment of the present invention;
Fig. 2 a is A-A face schematic cross-section in Fig. 2;
Fig. 3 is that of the circuit module of the embodiment of the present invention implements illustration;
Fig. 4 is that of the manufacture method of the embodiment of the present invention implements illustration;
Fig. 5 is the structural representation of the circuit module substrate in the manufacture method of circuit module in the embodiment of the present invention;
Fig. 5 a is the structural representation of the single circuit module in the manufacture method of circuit module in the embodiment of the present invention;
Fig. 6 is the structural representation of the framework in the manufacture method of the embodiment of the present invention;
Fig. 6 a is B regional enlarged drawing in Fig. 6;
Fig. 7 is another enforcement illustration of the manufacture method of the embodiment of the present invention;
Fig. 8 is another enforcement illustration of the manufacture method of the circuit module of the embodiment of the present invention;
Fig. 9 is another enforcement illustration of the manufacture method of the circuit module of the embodiment of the present invention.
In accompanying drawing, each parts are as follows:
1, the first circuit module, the 11, first encapsulating, 12, pin pad, 13, the first pin, 14, connector, 15, cover plate, 2, circuit module, 21, PCB, 22, pin installation position, 23, components and parts, 24, magnetic core, 3, pin, 31, recess, 32, tie point, 4, circuit module substrate, 5, framework, 6, encapsulating structure.
Embodiment
Embodiments provide a kind of circuit modular structure and manufacture method thereof, the connecting terminal exposed after can solving pin and encapsulating adopts and welds, but because stitch itself is very little, bonding area is also very little, therefore at high temperature probably occur getting loose, and cause loose contact, make the problem that circuit module cannot work.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below be described in detail respectively.
Term " first ", " second ", " the 3rd " " 4th " etc. (if existence) in specification of the present invention and claims and above-mentioned accompanying drawing are for distinguishing similar object, and need not be used for describing specific order or precedence.The embodiments described herein should be appreciated that the data used like this can be exchanged in the appropriate case, so that can be implemented with the order except the content except here diagram or description.In addition, term " comprises " and " having " and their any distortion, intention is to cover not exclusive comprising, such as, contain those steps or module that the process of series of steps or module, method, system, product or equipment is not necessarily limited to clearly list, but can comprise clearly do not list or for intrinsic other step of these processes, method, product or equipment or module.
Refer to Fig. 1, Fig. 1 is the structural representation of prior art circuits module, in the manufacture process of this structure, first the circuit board that his-and-hers watches post components and parts is encapsulated, form the first encapsulating 11, this first encapsulating 11 can expose the pin pad 12 of side after circuit board section being encapsulated, this pin pad 12 and being electrically connected for the contact being connected the first pin 13 that circuit board is preset, such as can adopt a metallic plate, this metallic plate comprises pin pad 12 and contact link, after formation first is encapsulated, the first pre-processed pin 13 is welded on pin pad 12, and be fixed further by cover plate 15, again the connector 14 pin after fixing being used for connecting the first pin 13 is removed, the manufacture of the first circuit module 1 of prior art can be completed.
Can find out, owing to being first reserve pin pad 12, then encapsulate after 11 in formation first and to be burn-on the first pin 13 by the modes of welding, but in the circuit module course of work, situation due to high temperature can cause weld sealing-off to loosen, finally may cause loose contact or even come off, in addition, although be also provided with the cover plate 15 fixing the first pin 13 at the weld of the first pin 13, although the problem come off can be solved to a certain extent, the problem that sealing-off loosens the loose contact caused still cannot be solved.In addition, due to the first pin 13 be encapsulated after weld again, because the area of welding pin pad 12 is very little, welding process requirement is higher, and the firmness of welding is still not high, and the processing component owing to needing in this mode is more, technological process is complicated, has considerable influence to production efficiency.
Embodiment 1
The easy sealing-off of pin that the embodiment of the present invention is intended to solve the circuit module that above-mentioned available circuit modular manufacture goes out loosens the loose contact caused, and the problem of manufacturing process complexity, refer to and implement illustration as Fig. 2, Fig. 2 a and Fig. 3, Fig. 2 are one of the circuit module of the embodiment of the present invention, Fig. 2 a is A-A face schematic cross-section in Fig. 2; Fig. 3 is that of the circuit module of the embodiment of the present invention implements illustration, the embodiment of the present invention provides a kind of circuit module 2 structure, the pin 3 that this circuit module 2 structure can comprise PCB21, be connected with PCB21, and the encapsulating structure 6 of coated PCB21 and pin 3, one end that pin 3 is connected with PCB21 is provided with recess 31, PCB21 is connected with the inner side of the recess 31 of pin 3, and recess 31 is positioned at encapsulating structure 6, and the free end of pin 3 stretches out encapsulating structure 6.
Can find out, design due to the recess 31 on pin 3 makes the PCB21 of circuit module 2 can be embedded in pin 3 institute planar, PCB21 can be made with pin 3 place plane for interface, PCB21 is roughly the same with two parts thickness after the boundary of this interface, thus make the mould levelling when encapsulating steady, and then make encapsulating quality high, and the setting of recess 31 also helps the attachment location of circuit module 2, because pin 3 place is the mode adopting encapsulating, pin 3 and the circuit module 2 after encapsulating are combined as a whole, be equivalent to pin 3 stretches out this circuit module 2 of encapsulating encapsulating structure 6 from circuit module 2 inside after encapsulating, because the design of this recess 31 and encapsulating structure 6 are encapsulated in encapsulating structure 6 by whole for pin 3, even if occur that one end of pin 3 loosens, due to structure spacing of this recess 31, pin 3 also can not be deviate from from encapsulating structure 6, and directly adopt a linear pin 3 relative to not adopting recess 31, high temperature is there will not be to loosen and the problem come off.
As optionally, the degree of depth of recess 31 is not less than the thickness 1/3rd of PCB21.
Be appreciated that and be, main purpose due to recess 31 is to place and positioning circuit module 2 on the one hand, in order to make follow-up encapsulation process can mould levelling steady, the non-recess end making pin 3 is needed to be in the centre position of circuit module 2 thickness as much as possible, the degree of depth of recess 31 arranges particularly important, certainly in order to realize the effect of locating, also minimum recess 31 degree of depth is needed, in embodiments of the present invention, after tested, generally being only greater than 1/3rd of PCB21 thickness can realize precise positioning, in addition, consider that circuit module 2 is by the PCB21 of circuit module 2 and all kinds of components and parts 23 arranged on this PCB21, the degree of depth of recess 31 can be divided into highly identical with the components and parts 23 of lower surface or the highly different two kinds of situations of the upper surface of this PCB21, for example, refer to Fig. 2 a, if roughly the same with the height of the components and parts 23 of lower surface at the upper surface of this PCB21, then the degree of depth of recess 31 can be set to the thickness 1/2nd close to PCB21, the degree of depth of recess 31 and the thickness of PCB21 more close, encapsulating effect is higher, thus after PCB21 puts into recess 31, the upper surface of the upper surface of PCB21 and the non-recess end of pin 3 maintains an equal level, thus the non-recess end of pin 3 just in time can be in the centre position of circuit module 2.
Again for example, if the upper surface of this PCB21 is not identical with the height of the components and parts 23 of lower surface, three kinds of situations below point, thickness as PCB21 is d1, the components and parts 23 height d2 of the upper surface of first PCB21 is greater than the components and parts 23 height d3 of the lower surface of PCB21, and d2 is greater than (d1+d2+d3)/2, namely when components and parts 23 height tolerance of upper and lower surface is larger, due to the centre position that the non-recess end of pin 3 will be made to be positioned at the thickness of circuit module 2, now for the degree of depth of recess 31, more close to (d1+d2-d3)/2, last encapsulating effect is better, its two be the upper surface of PCB21 components and parts 23 height d2 be greater than the lower surface of PCB21 components and parts 23 height d3, and d2 is less than (d1+d2+d3)/2, namely when components and parts 23 height tolerance of upper and lower surface is little, now for the degree of depth of recess 31, more close to (d1+d2-d3)/2, last encapsulating effect is better, its three be the upper surface of PCB21 components and parts 23 height d2 be less than the lower surface of PCB21 components and parts 23 height d3, and d3 is less than (d1+d2+d3)/2, when components and parts 23 height tolerance of upper and lower surface is little, now for the degree of depth of recess 31, more close to (d1+d2-d3)/2, last encapsulating effect is better.
As optionally, the magnetic core 24 on PCB21 is exposed to encapsulating structure 6.
Be understandable that, the object that magnetic core 24 on the PCB21 of circuit module 2 is exposed to encapsulating structure 6 is the heat-sinking capability strengthening module, the existing design not grinding magnetic core 24 can produce heat in the course of the work due to circuit module 2, long-time use can make heat at circuit module 2 inner accumulation, thus finally may affect the normal work of circuit module 2, and confidence is exposed encapsulating structure 6 by employing, magnetic core 24 and extraneous contact then can be utilized to discharge the heat accumulated, thus make circuit module 2 to be in steady-working state, in addition, in order to strengthen heat-sinking capability further, the tow sides place of encapsulating structure 6 all can be ground magnetic core 24, thus strengthen heat-sinking capability further.
As optionally, recess 31 is hierarchic structure, and the bottom of hierarchic structure is connected with PCB21, and the top of hierarchic structure is between the top and bottom of PCB21.Optionally, PCB is provided with pin installation position.The side that the bottom of hierarchic structure is connected with PCB21 is provided with the tie point 32 that contact corresponding to pin installation position 22.Optionally, tie point 32 is positioned on the upper surface of the bottom of hierarchic structure.
Be understandable that, hierarchic structure can make PCB21 just in time embed in the ladder of hierarchic structure, one end of hierarchic structure is positioned at the bottom of PCB21, the other end is between the top and bottom of PCB21, thus realize location PCB21, and the position of stepped top can make the mould levelling of follow-up encapsulating whole, tie point 32 energy and the pin installation position 22 that arrange hierarchic structure cooperatively interact, and make pin contact conducting with PCB.
It should be noted that, forging type can be adopted directly to cast out should the recess 31 of shape of hierarchic structure, also can adopt and the recess 31 that punching press obtains this hierarchic structure is carried out to linear pin.
As optionally, the structure of recess 31 is the structure of at least twice bending forming.Optionally, each bending angle of at least twice bending forming structure is respectively 30 degree to 150 degree.
Be appreciated that and be, the overbending direction of twice bending structure is contrary, the structure of similar " Z " type can be formed, the pin portions at the two ends of the structure after twice bending is made to be parallel substantially, Z " type structure top and bottom between junction then can be used for locate PCB21, the bending of more than twice also needs pin 3 part keeping bending structure two ends to be parallel substantially, the shape of composition can be the folded structures of multiple " Z " type, also can superposition otherwise, as long as ensure that final is substantially parallel with the two ends of the anatomical connectivity of " Z " type of being somebody's turn to do, in addition, each bending angle can be 30 degree to 150 degree respectively, excessive angle or too small angle all can make bending structure become more complicated, increase difficulty of processing, then be convenient to for 30 degree to 150 degree process for pin 31, thus can improving production efficiency.
Embodiment 2
Above the circuit module of the embodiment of the present invention is introduced, below the manufacture method of the circuit module of the embodiment of the present invention is introduced, concrete, refer to Fig. 4, Fig. 4 is that of the manufacture method of the embodiment of the present invention implements illustration, as shown in Figure 4, one embodiment of the present of invention provide a kind of manufacture method of circuit module, can comprise following content:
401, circuit module substrate 4 is cut into single circuit module 2.
For example, for the circuit module substrate 4 mentioned in the embodiment of the present invention, as shown in Figure 5, Fig. 5 is the structural representation of the circuit module substrate in the manufacture method of circuit module in the embodiment of the present invention, wherein circuit module substrate 4 is provided with multiple circuit module 2, can cut out single circuit module 2 by the mode of cutting.
Wherein, the structure of single circuit module 2 as shown in Figure 5 a, Fig. 5 a is the structural representation of the single circuit module in the manufacture method of circuit module in the embodiment of the present invention, circuit module 2 is provided with pin installation position 22, this pin installation position 22 is for the pin 3 of welding circuit module, and this pin 3 is electrically connected with other equipment for circuit module 2.
Be understandable that, when manufacturing circuit module, normally first making one piece of larger PCB21, this PCB21 comprises multiple circuit module, the circuit module on this PCB21 is separated by the mode by cutting.
402, the one end of the pin 3 being provided with the framework 5 of pin 3 is processed out recess 31.
Wherein, the tie point 32 of pin 3 is located in recess 31.
For example, refer to Fig. 6 and Fig. 6 a, Fig. 6 is the structural representation of the framework in the manufacture method of circuit module in the embodiment of the present invention, Fig. 6 a is B regional enlarged drawing in Fig. 6, wherein, pin 3 on this framework 5 is used as the pin 3 of circuit module 2, and the tie point 32 of this pin 3 welds together with the pin installation position 22 on circuit module 2.
403, circuit module 2 is mounted recess 31 place of the pin 3 to framework 5.
Wherein, refer to Fig. 2 a, in this figure, the pin installation position 22 of circuit module 2 is corresponding with the tie point 32 of pin 3 to contact, the pin mounting points 22 of circuit module 2 is corresponding with the tie point 32 at recess 31 place of pin 3 when contacting, between the top and bottom of the circuit module 2 of part place plane after attachment that can make the non-recess place of pin 3, follow-up encapsulating better effects if can be made.
For example, if circuit module 2 bottom surface is a to the thickness of end face, this thickness a is made up of with components and parts 23 part be mounted on PCB21 the PCB21 part of circuit module 2, then the non-concave portion of pin 3 can be in a/2 or a/3 equal thickness place, to be in a/2 thickness place, the plane being now equivalent to the non-concave portion place of pin 3 divides equally the thickness of circuit module 2, in follow-up encapsulation process because circuit module 2 mediates, the material that the upper and lower surface of circuit module 2 is encapsulated can be uniformly distributed, thus make the mould levelling when encapsulating steady, thus reach and encapsulate effect preferably.
404, the circuit module 2 after attachment is encapsulated.
Wherein, after circuit module 2 being mounted recess 31 place to the pin 3 of framework 5, will encapsulate circuit module 2, namely adopt non-conducting material to carry out coated to the surface of circuit module 2, thus obtain the circuit module 2 that can be used as the attachments such as SMT.
As can be seen here, recess 31 is processed out in one end of the pin 3 of framework 5 owing to adopting, the tie point 32 corresponding with the pin installation position 22 of circuit module 2 is provided with in recess 31, at recess 31 place of pin 3 circuit module 2 being labelled to framework 5, then encapsulate, design due to recess 31 makes the PCB21 of circuit module 2 be embedded in pin 3 institute of framework 5 planar, PCB21 can be made with pin 3 place plane for interface, PCB21 is roughly the same with two parts thickness after the boundary of this interface, thus make the mould levelling when encapsulating steady, and then make encapsulating quality high, and the setting of recess 31 also helps the attachment location of circuit module 2, because pin 3 place is the mode adopting encapsulating, pin 3 and the circuit module 2 after encapsulating are combined as a whole, be equivalent to pin 3 stretches out this circuit module 2 of encapsulating encapsulating structure 6 from circuit module 2 inside after encapsulating, thus the problem that there will not be high temperature to come off.
As optionally, recess 31 degree of depth is not less than 1/3rd of the thickness of the PCB21 of circuit module 2.
Be appreciated that and be, main purpose due to recess 31 is to place and positioning circuit module 2, in order to make follow-up encapsulation process can mould levelling steady, the non-recess end making pin 3 is needed to be in the centre position of circuit module 2 thickness as much as possible, the degree of depth of recess 31 arranges particularly important, certainly in order to realize the effect of locating, also minimum recess 31 degree of depth is needed, in embodiments of the present invention, after tested, generally being only greater than 1/3rd of PCB21 thickness can realize precise positioning, in addition, consider that circuit module 2 is by the PCB21 of circuit module 2 and all kinds of components and parts 23 arranged on this PCB21, the degree of depth of recess 31 can be divided into highly identical with the components and parts 23 of lower surface or the highly different two kinds of situations of the upper surface of this PCB21.Specifically see the explanation of the circuit module in embodiments of the invention 1 and illustrating for Fig. 2 a, can repeat no more herein.
As optionally, one end of the pin 3 of framework 5 is processed out recess 31 and is specially:
The recess 31 of pin 3 one end of framework 5 is formed by punching press;
Or,
The recess 31 of pin 3 one end of framework 5 is formed by casting.
Be understandable that, the generation type of this pin 3 can be the mode adopting punching press, namely pressing equipment and diel is adopted, material is made to be subject to deformation force and to be out of shape, thus acquisition required form, the stamping parts of size and performance, punching press can make additive method be difficult to manufacture with reinforcement, rib, the workpiece of fluctuating or flange, to improve its rigidity, and owing to adopting precision die, workpiece accuracy can reach micron order, and repeatable accuracy is high, specification is consistent, can punching press to portal nest, boss etc., it is shaping that the recess 31 of pin 3 one end in the embodiment of the present invention can adopt this mode to carry out,
In addition, the generation type of this pin 3 can also be that the mode of casting is formed, this forging type is the liquid metal that will have smelted, preprepared casting mold is injected with cast, injection, suction or other casting method, after cooling after the following process means such as polishing, what obtain has definite shape, the workpiece of size and performance, and it is shaping that the recess 31 of pin 3 one end in the embodiment of the present invention also can adopt this mode to carry out.
It should be noted that, no matter adopt which kind of molding mode to form the recess 31 of pin 3 one end of framework 5, the size of this recess 31 should be unified, otherwise there will be circuit module 2 contacts not exclusively with the recess 31 of pin 3, thus cause pin 3 and circuit module 2 loose contact, the problem that the circuit module 2 of production cannot use.
Embodiment 3
As optionally, the mode of Reflow Soldering can be adopted between circuit module 2 with pin 3 to weld, refer to Fig. 7, Fig. 7 is another enforcement illustration of the manufacture method of the embodiment of the present invention, as shown in Figure 7, embodiments provide a kind of manufacture method of circuit module, wherein, step 701 in the embodiment of the present invention is similar to step 402 to the step 401 in step 702 and embodiment illustrated in fig. 42, in step 707 and embodiment illustrated in fig. 42, volume step 404 is similar, all repeat no more, wherein, the manufacture method of the embodiment of the present invention also can comprise:
703, on the pin installation position 22 of circuit module 2, tin cream is brushed.
Wherein, in order to make to weld between circuit module 2 with pin 3, need to brush tin cream on the pin installation position 22 of circuit module 2.
704, on the tie point 32 of pin 3, tin cream is brushed.
Wherein, in order to make to weld between circuit module 2 with pin 3, need to brush tin cream on the tie point 32 of pin 3.
705, circuit module 2 is placed on recess 31 place of the pin 3 of framework 5.
Wherein, after having brushed tin cream, circuit module 2 can be placed on recess 31 place of the pin 3 of framework 5, wherein the pin installation position 22 at this recess 31 place and the tie point 32 of pin 3 is corresponding contacts.
706, reflow process is carried out to the framework 5 being placed with circuit module 2.
Wherein, after placing circuit module 2, can carry out reflow process to the framework 5 placing circuit module 2, the object of this Reflow Soldering is to make tin cream solidify thus be welded on circuit module 2 interior drawing.
As can be seen here, the mode of welding the Reflow Soldering adopted in the embodiment of the present invention between circuit module 2 with pin 3, namely first on the pin installation position 22 of circuit module 2 and the tie point 32 of pin 3, all tin cream is brushed, then the two one_to_one corresponding is placed, then by Reflow Soldering, pin 3 is welded on circuit module 2, adopt the firm welding that this mode can ensure between circuit module 2 and pin 3 on the one hand, on the other hand, this mode is adopted to weld, the electrical connection between pin 3 and circuit module 2 can be ensured, namely be not easy to occur that rosin joint causes the problem of circuit module 2 job insecurity.
As optionally, after step 707, this manufacture method also can comprise:
708, Pure Tin Plating Process is carried out to the pin 3 of the circuit module 2 after encapsulating.
Wherein, after circuit module 2 has been encapsulated, for the ease of this circuit module 2 aspect more in use manufactured, as carried out surface mount (SurfaceMountTechnology, SMT) operate, Pure Tin Plating Process can be carried out to the pin 3 of the circuit module 2 after encapsulating.
As optionally, this manufacture method also can comprise:
709, the encapsulating structure 6 of the circuit module 2 after encapsulating is ground, expose the magnetic core 24 of circuit module 2.
Wherein, after the encapsulating of circuit module 2 completes, can grind the encapsulating structure 6 of the circuit module 2 after encapsulating, expose the magnetic core 24 of circuit module 2, the object of this operation is, the magnetic core 24 that exposes can the heat-sinking capability of intensifier circuit module 2, makes the work that circuit module 2 can be steady in a long-term.
For example, can see Fig. 9, Fig. 9 is another enforcement illustration of the manufacture method of the circuit module of the embodiment of the present invention, circuit module 2 shaping as shown in Figure 9, there is at the upper surface of this circuit module 2 magnetic core 24 ground out, in order to dispel the heat more efficiently, upper and lower surface all can grind out magnetic core 24.
As optionally, this manufacture method also can comprise:
710, muscle and bending process are cut to the pin 3 on framework 5.
It should be noted that, ordinal relation not absolute between step 209 and step 210.
Be understandable that, after the encapsulating of completing circuit module 2, on the one hand in order to make the circuit module 2 on framework 5 form single circuit module 2, need to carry out cutting muscle process, on the other hand, convenient in use for the ease of the circuit module 2 manufactured, as carried out SMT operation, can carry out bending process to the pin 3 on framework 5, the pin 3 after bending is more convenient for installing.
For example, refer to Fig. 8, Fig. 8 is another enforcement illustration of the manufacture method of the circuit module of the embodiment of the present invention, in Fig. 8, the encapsulated structure 6 of a part of the pin 3 on framework 5 is encapsulated, and cuts muscle and bend the shaping circuit module 2 that can obtain in Fig. 9 to the pin 3 on the framework in Fig. 8.
It should be noted that, before circuit module 2 substrate cut is become single circuit module 2, can the components and parts 23 of lower surface of first Surface Mount circuit module 2 substrate, concrete, for the Surface Mount process of the components and parts 23 of the lower surface of circuit module 2 substrate, for example, this Surface Mount process can comprise:
Tin cream is brushed in the components and parts 23 Surface Mount position of lower surface of circuit module 2 substrate designing circuit;
Components and parts 23 are labelled to the lower surface of circuit module 2 substrate, pin 3 installation position is positioned at the lower surface of circuit module 2 substrate;
Circuit module 2 substrate lower surface being posted components and parts 23 carries out reflow process.
It should be noted that, before circuit module 2 substrate cut is become single circuit module 2, can first components and parts 23 Surface Mount on the lower surface of circuit module 2 substrate, the lower surface of this circuit module 2 substrate is the one side being provided with pin 3 installation position, if carry out Surface Mount again after circuit module 2 is mounted on pin 3, Surface Mount difficulty can be increased due to the impact of pin 3, therefore, in order to make Surface Mount process more efficient, and reduce Surface Mount difficulty, can before the cutting stage just first by components and parts 23 Surface Mount of the lower surface of circuit module 2 substrate;
In addition, also can before circuit module 2 substrate cut be become single circuit module 2, also can components and parts 23 in the lump on Surface Mount upper surface, then carry out follow-up operation.
Be understandable that, the mode of welding the Reflow Soldering adopted between circuit module 2 with components and parts 23, namely the components and parts 23 Surface Mount position first designing the lower surface of circuit module 2 substrate of circuit brushes tin cream, then by components and parts 23 Surface Mount on this circuit module 2 substrate, then by Reflow Soldering, components and parts 23 are fixed on circuit module 2, adopt the firm welding that this mode can ensure between circuit module 2 and components and parts 23 on the one hand, on the other hand, this mode is adopted to weld, the electrical connection between components and parts 23 and circuit module 2 can be ensured, namely be not easy to occur that rosin joint causes the problem of circuit module 2 job insecurity.
It should be noted that, before the circuit module 2 after attachment is encapsulated, can the components and parts 23 of upper surface of first Surface Mount circuit module 2 substrate, concrete, for the Surface Mount process of the components and parts 23 of circuit module 2 upper surface of base plate, for example, this Surface Mount process can comprise:
Tin cream is brushed in the components and parts 23 Surface Mount position of the upper surface of circuit module 2 substrate;
Components and parts 23 are labelled to the upper surface of circuit module 2 substrate;
Circuit module 2 substrate upper surface being posted components and parts 23 carries out reflow process.
It should be noted that, before the circuit module 2 after attachment is encapsulated, can first on the upper surface of components and parts 23 Surface Mount paper circuit module 2 substrate, owing to having completed the Surface Mount of the components and parts 23 of lower surface before being cut, after completing the Surface Mount of upper surface, directly can carry out encapsulating process.
Be understandable that, upper surface Surface Mount components and parts 23 adopt the reflow process identical with lower surface Surface Mount, and its effect is identical with lower surface Surface Mount, repeats no more herein.
Those skilled in the art can be well understood to, and for convenience and simplicity of description, the system of foregoing description, the specific works process of device and unit, with reference to the corresponding process in preceding method embodiment, can not repeat them here.
In several embodiments that the application provides, should be understood that, disclosed system, apparatus and method, can realize by another way.Such as, device embodiment described above is only schematic, such as, the division of described unit, be only a kind of logic function to divide, actual can have other dividing mode when realizing, such as multiple unit or assembly can in conjunction with or another system can be integrated into, or some features can be ignored, or do not perform.Another point, shown or discussed coupling each other or direct-coupling or communication connection can be by some interfaces, and the indirect coupling of device or unit or communication connection can be electrical, machinery or other form.
The described unit illustrated as separating component or can may not be and physically separates, and the parts as unit display can be or may not be physical location, namely can be positioned at a place, or also can be distributed in multiple network element.Some or all of unit wherein can be selected according to the actual needs to realize the object of the present embodiment scheme.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, also can be that the independent physics of unit exists, also can two or more unit in a unit integrated.Above-mentioned integrated unit both can adopt the form of hardware to realize, and the form of SFU software functional unit also can be adopted to realize.
If described integrated unit using the form of SFU software functional unit realize and as independently production marketing or use time, can be stored in a computer read/write memory medium.Based on such understanding, the part that technical scheme of the present invention contributes to prior art in essence in other words or all or part of of this technical scheme can embody with the form of software product, this computer software product is stored in a storage medium, comprising some instructions in order to make a computer equipment (can be personal computer, server, or the network equipment etc.) perform all or part of step of method described in each embodiment of the present invention.And aforesaid storage medium comprises: USB flash disk, portable hard drive, read-only memory (ROM, Read-OnlyMemory), random access memory (RAM, RandomAccessMemory), magnetic disc or CD etc. various can be program code stored medium.
The above, above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (17)
1. a circuit modular structure, it is characterized in that: the pin comprise PCB, being connected with described PCB, and the encapsulating structure of coated described PCB and pin, one end that described pin is connected with PCB is provided with recess, described PCB is connected with the inner side of the recess of described pin, described recess is positioned at described encapsulating structure, and the free end of described pin stretches out described encapsulating structure.
2. circuit modular structure according to claim 1, is characterized in that: the degree of depth of described recess is not less than the thickness 1/3rd of PCB.
3. circuit modular structure according to claim 1 and 2, is characterized in that: the magnetic core on described PCB is exposed to described encapsulating structure.
4. circuit modular structure according to claim 1, is characterized in that: described recess is hierarchic structure, and the bottom of described hierarchic structure is connected with described PCB, and the top of described hierarchic structure is between the top and bottom of described PCB.
5. circuit modular structure according to claim 4, is characterized in that: described PCB is provided with pin installation position.Bottom and the side that described PCB is connected of described hierarchic structure are provided with the tie point that contact corresponding to described pin installation position.
6. circuit modular structure according to claim 5, is characterized in that: described tie point is positioned on the upper surface of the bottom of described hierarchic structure.
7. circuit modular structure according to claim 1, is characterized in that: the structure of the recess of described pin is at least twice bending forming structure.
8. circuit modular structure according to claim 1, is characterized in that: each bending angle of described at least twice bending forming structure is respectively 30 degree to 150 degree.
9. a manufacture method for circuit module, is characterized in that, comprising:
Circuit module substrate cut is become single circuit module, and described circuit module is provided with pin installation position;
The one end be provided with on the pin of the framework of pin is processed out recess, and the tie point of described pin is located in described recess;
Described circuit module is mounted the recess place of the pin to described framework, the pin installation position of described circuit module is corresponding with the tie point of described pin to contact;
Circuit module after attachment is encapsulated.
10. the manufacture method of circuit module according to claim 9, is characterized in that, described recess depths is not less than 1/3rd of the thickness of the printing board PCB of described circuit module.
The manufacture method of 11. circuit modules according to claim 9, is characterized in that, describedly one end on the pin of framework is processed out recess is specially:
The recess of pin one end of described framework is formed by punching press;
Or,
The recess of pin one end of described framework is formed by casting.
The manufacture method of 12. circuit modules according to claim 9, is characterized in that, described recess place circuit module being labelled to described pin comprises:
The pin installation position of described circuit module brushes tin cream;
The tie point of described pin brushes tin cream;
Described circuit module is placed on the recess place of the pin of described framework;
Reflow process is carried out to the described framework being placed with described circuit module.
The manufacture method of 13. circuit modules according to any one of claim 9 to 12, it is characterized in that, described method also comprises:
Pure Tin Plating Process is carried out to the pin of the circuit module after encapsulating.
The manufacture method of 14. circuit modules according to any one of claim 9 to 12, it is characterized in that, described method also comprises:
The encapsulating structure of the circuit module after encapsulating is ground, exposes the magnetic core of circuit module.
The manufacture method of 15. circuit modules according to any one of claim 9 to 12, it is characterized in that, described method also comprises:
Muscle and bending process are cut to the pin on described framework.
The manufacture method of 16. circuit modules according to any one of claim 9 to 12, it is characterized in that, described circuit module substrate comprises upper surface and lower surface, described circuit module substrate cut is become single circuit module before also comprise:
Tin cream is brushed in the components and parts Surface Mount position of lower surface of the circuit module substrate designing circuit;
Components and parts are labelled to the lower surface of described circuit module substrate, described pin installation position is positioned at the lower surface of described circuit module substrate;
Described circuit module substrate lower surface being posted components and parts carries out reflow process.
The manufacture method of 17. circuit modules according to claim 16, is characterized in that, before being encapsulated by the circuit module after attachment, described method also comprises:
Tin cream is brushed in the components and parts Surface Mount position of the upper surface of described circuit module substrate;
Components and parts are labelled to the upper surface of described circuit module substrate;
Described circuit module substrate upper surface being posted components and parts carries out reflow process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510779980.4A CN105374789A (en) | 2015-11-13 | 2015-11-13 | Circuit module structure and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510779980.4A CN105374789A (en) | 2015-11-13 | 2015-11-13 | Circuit module structure and manufacturing method therefor |
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| CN105374789A true CN105374789A (en) | 2016-03-02 |
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| CN110931449A (en) * | 2019-12-10 | 2020-03-27 | 青岛歌尔智能传感器有限公司 | Power module packaging structure and packaging method of power module |
| US11887918B2 (en) | 2019-09-30 | 2024-01-30 | Huawei Technologies Co., Ltd. | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method |
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Application publication date: 20160302 |