CN105368376A - 电力设备用开关电源 - Google Patents

电力设备用开关电源 Download PDF

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CN105368376A
CN105368376A CN201510965928.8A CN201510965928A CN105368376A CN 105368376 A CN105368376 A CN 105368376A CN 201510965928 A CN201510965928 A CN 201510965928A CN 105368376 A CN105368376 A CN 105368376A
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parts
heat
oxide
conducting glue
power supply
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陈列文
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CHANGSHU RISE ELECTRONIC EQUIPMENT Co Ltd
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CHANGSHU RISE ELECTRONIC EQUIPMENT Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明公开了一种电力设备用开关电源，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：1～2份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。本发明使用的导热胶性能优异，能保证MOS管的长期使用。

Description

电力设备用开关电源
技术领域
本发明涉及电力设备用开关电源。
背景技术
目前的电力设备用开关电源，其MOS管的散热需要优化。
发明内容
本发明的目的在于提供一种电力设备用开关电源，其使用的导热胶具有优异的粘接强度、耐老化性能、抗冷热交变性能和电绝缘性能，并具有优异的抗震、防潮、耐电晕、抗漏电性能，导热性能好，能保证MOS管的长期使用。
为实现上述目的，本发明的技术方案是设计一种电力设备用开关电源，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：
1～2份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。
优选的，电力设备用开关电源，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：
1份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。
优选的，电力设备用开关电源，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：
2份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。
本发明的优点和有益效果在于：提供一种电力设备用开关电源，其使用的导热胶具有优异的粘接强度、耐老化性能、抗冷热交变性能和电绝缘性能，并具有优异的抗震、防潮、耐电晕、抗漏电性能导热性能好，能保证MOS管的长期使用。
具体实施方式
下面结合实施例，对本发明的具体实施方式作进一步描述。以下实施例仅用于更加清楚地说明本发明的技术方案，而不能以此来限制本发明的保护范围。
本发明具体实施的技术方案是：
实施例1
一种电力设备用开关电源，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：
1～2份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。
实施例2
电力设备用开关电源，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：
1份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。
实施例3
电力设备用开关电源，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：
2份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (3)

1.电力设备用开关电源，其特征在于，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：
1～2份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。
2.根据权利要求1所述的电力设备用开关电源，其特征在于，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：
1份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。
3.根据权利要求1所述的电力设备用开关电源，其特征在于，包括脉冲宽度调制控制IC、MOS管和散热结构，所述MOS管和散热结构通过导热胶固定在一起；按重量份计，所述导热胶由以下组分组成：
2份四烷基一甲基二乙羟基溴化铵，23.6份甲基乙烯基苯基硅橡胶，1.3份泡花碱，2.1份甘油单硬脂酸酯，1.9份乙烯基三甲氧基硅烷，0.7份蓖麻油，0.9份三乙胺，0.2份白碳黑，0.6份三氧化钼。
CN201510965928.8A 2015-12-22 2015-12-22 电力设备用开关电源 Pending CN105368376A (zh)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102250425A (zh) * 2011-05-24 2011-11-23 深圳市博恩实业有限公司 多功能导热复合材料
CN103571201A (zh) * 2012-07-22 2014-02-12 上海利隆化工化纤有限公司 用于太阳能逆变器的导热硅胶片及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102250425A (zh) * 2011-05-24 2011-11-23 深圳市博恩实业有限公司 多功能导热复合材料
CN103571201A (zh) * 2012-07-22 2014-02-12 上海利隆化工化纤有限公司 用于太阳能逆变器的导热硅胶片及其制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
张卫平，等: "《现代电子电路原理与设计》", 28 February 1997 *

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Application publication date: 20160302