CN105368337A - Bonding adhesive tape for thin-film sensor and preparation method for bonding adhesive tape - Google Patents
Bonding adhesive tape for thin-film sensor and preparation method for bonding adhesive tape Download PDFInfo
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- CN105368337A CN105368337A CN201510887644.1A CN201510887644A CN105368337A CN 105368337 A CN105368337 A CN 105368337A CN 201510887644 A CN201510887644 A CN 201510887644A CN 105368337 A CN105368337 A CN 105368337A
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Abstract
The present invention discloses a bonding adhesive tape for a thin-film sensor and a preparation method for the bonding adhesive tape. The preparation method for the bonding adhesive tape for the thin-film sensor comprises: performing a reaction on sodium dodecyl benzene sulfonate, polythene amide, methyl cellulose, polymethyl methacrylate, hydroxyethyl methylacrylate, allyloxy hydroxypropyl sodium sulfonate, aluminium hydroxide, sodium hydroxide, tin oxide and dicumyl peroxide under a condition of 600-800 DEG C; then adding polyvinyl alcohol to uniformly stir the mixture to obtain a mixture; coating the mixture on a polytetrafluoroethylene substrate; and drying the substrate at 100-200 DEG C. Because of addition of the tin oxide, the bonding force and the tensile strength of the bonding adhesive tape disclosed by the invention are obviously improved.
Description
Technical field
The present invention relates to a kind of adhesive tape for thin film sensor and preparation method thereof.
Background technology
The principle of liquid detection sensor is on load voltage thus detect liquid short circuit phenomenon between wire on two wires.Thin film sensor is the liquid detection sensor designing thin layer printed patterns on circuit film.
Denomination of invention is " preparation method and application of organic silicon potting adhesive binding agent ", application number is the preparation method that the Chinese patent application of CN201510096454.8 discloses a kind of organic silicon potting adhesive binding agent, comprise first by methacrylic acid hydroxyl ester and titanic acid ester mixed at room temperature even; Add silane coupling agent again, be warming up to and react; Finally slough low-boiling-point substance, obtain binding agent.The preparation being applied to LED organic silicon potting adhesive of binding agent: vinyl silicone oil, methyl vinyl MQ resin, binding agent, containing hydrogen silicone oil and 1-ethynyl-1-hexalin are added kneader, at room temperature stir, and then add the divinyl tetramethyl disiloxane complex compound of Platinic chloride, stir, in vacuum defoamation, final curing is shaping.Binding agent of the present invention, significantly can improve the cohesiveness of joint sealant to base material, and not affect the transmittance of joint sealant, and the method construction technology is simple, significantly can enhance productivity, but not be suitable for thin film sensor.
Denomination of invention is " compoiste adhering layer materials of a kind of anti-1200 DEG C of resistance to combustion gas thermal etchings of high temperature oxidation and preparation method thereof ", and application number is that the Chinese patent application of CN201310378715.6 discloses compoiste adhering layer material of a kind of anti-1200 DEG C of resistance to combustion gas thermal etchings of high temperature oxidation and preparation method thereof.First the present invention adopts plating or electro beam physics vapour deposition method at substrate deposit one deck Ru, then electro beam physics vapour deposition method is adopted to deposit layer of Ni AlHfCrSi layer on Ru layer, after Overheating Treatment, obtain Ni (Ru) Al/NiAlHfCrSi bilayer structure tack coat, wherein in Ni (Ru) Al layer, Ru content successively decreases in gradient from matrix skin outer layers direction.This bilayer structure tack coat can stop matrix and the mutual diffusion being coated with interlayer element effectively, suppress the formation of second time reaction zone (SRZ), suppress the formation of spinel-like in During Process of Hot Corrosion, improving the resistance to high temperature oxidation of superalloy and the performance of heat and corrosion resistant, is a kind of novel heat barrier coating bonding layer material.This bonding layer material can reach grade of oxidation resistance at 1200 DEG C, and secondary reaction district does not appear in 1100 DEG C of diffusion in vacuum 100h, and resistance to combustion gas thermal etching ability is also far above common NiAl system metal bonding coating simultaneously, but viscosifying power is general.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, provide a kind of adhesive tape for thin film sensor and preparation method thereof, the viscosifying power of adhesive tape is strong.
The present invention is by the following technical solutions:
For the adhesive tape of thin film sensor, comprise the raw material of following parts by weight: tetrafluoroethylene base material 100 ~ 150 parts, Sodium dodecylbenzene sulfonate 40 ~ 80 parts, polyvinyl lactam 70 ~ 80 parts, methylcellulose gum 40 ~ 80 parts, polymethylmethacrylate 70 ~ 80 parts, polyvinyl alcohol 25 ~ 60 parts, hydroxyethyl methylacrylate 10 ~ 60 parts, allyloxy hydroxypropyl azochlorosulfonate acid sodium 40 ~ 60 parts, 10 ~ 50 parts, aluminium hydroxide, 40 ~ 50 parts, sodium hydroxide, 10 ~ 15 parts, stannic oxide, dicumyl peroxide 20 ~ 60 parts.
As preferably, for the adhesive tape of thin film sensor, comprise the raw material of following parts by weight: tetrafluoroethylene base material 120 parts, Sodium dodecylbenzene sulfonate 60 parts, polyvinyl lactam 75 parts, methylcellulose gum 60 parts, polymethylmethacrylate 75 parts, polyvinyl alcohol 40 parts, hydroxyethyl methylacrylate 30 parts, allyloxy hydroxypropyl azochlorosulfonate acid sodium 50 parts, 40 parts, aluminium hydroxide, 45 parts, sodium hydroxide, 12 parts, stannic oxide, dicumyl peroxide 40 parts.
As preferably, the thickness of tetrafluoroethylene base material is 0.1 ~ 0.5mm.
The preparation method of the above-mentioned adhesive tape for thin film sensor, comprises the following steps:
By Sodium dodecylbenzene sulfonate, polyvinyl lactam, methylcellulose gum, polymethylmethacrylate, hydroxyethyl methylacrylate, allyloxy hydroxypropyl azochlorosulfonate acid sodium, aluminium hydroxide, sodium hydroxide, stannic oxide, dicumyl peroxide, react under 600 ~ 800 DEG C of conditions, add polyvinyl alcohol again to stir, obtain mixture, mixture is coated in above tetrafluoroethylene base material, 100 ~ 200 DEG C of oven dry.
As preferably, drying time is 10 ~ 20min.
beneficial effect
Cohesive strength of the present invention is 5.2 ~ 6.4kN/m, and tensile strength is 4.3 ~ 4.9kN/m, and this is because adding of stannic oxide significantly improves cohesive force of the present invention and tensile strength, makes the present invention have good mechanical property.
Embodiment
Below in conjunction with specific embodiment, the present invention is further described in detail.
embodiment 1
For the adhesive tape of thin film sensor, comprise the raw material of following parts by weight: tetrafluoroethylene base material 120 parts, Sodium dodecylbenzene sulfonate 60 parts, polyvinyl lactam 75 parts, methylcellulose gum 60 parts, polymethylmethacrylate 75 parts, polyvinyl alcohol 40 parts, hydroxyethyl methylacrylate 30 parts, allyloxy hydroxypropyl azochlorosulfonate acid sodium 50 parts, 40 parts, aluminium hydroxide, 45 parts, sodium hydroxide, 12 parts, stannic oxide, dicumyl peroxide 40 parts.
The thickness of tetrafluoroethylene base material is 0.3mm.
The preparation method of the above-mentioned adhesive tape for thin film sensor, comprises the following steps:
By Sodium dodecylbenzene sulfonate, polyvinyl lactam, methylcellulose gum, polymethylmethacrylate, hydroxyethyl methylacrylate, allyloxy hydroxypropyl azochlorosulfonate acid sodium, aluminium hydroxide, sodium hydroxide, stannic oxide, dicumyl peroxide, react under 700 DEG C of conditions, add polyvinyl alcohol again to stir, obtain mixture, mixture is coated in above tetrafluoroethylene base material, 150 DEG C of oven dry.
Drying time is 15min.
embodiment 2
For the adhesive tape of thin film sensor, comprise the raw material of following parts by weight: tetrafluoroethylene base material 100 parts, Sodium dodecylbenzene sulfonate 40 parts, polyvinyl lactam 70 parts, methylcellulose gum 40 parts, polymethylmethacrylate 70 parts, polyvinyl alcohol 25 parts, hydroxyethyl methylacrylate 10 parts, allyloxy hydroxypropyl azochlorosulfonate acid sodium 40 parts, 10 parts, aluminium hydroxide, 40 parts, sodium hydroxide, 10 parts, stannic oxide, dicumyl peroxide 20 parts.
The thickness of tetrafluoroethylene base material is 0.1mm.
The preparation method of the above-mentioned adhesive tape for thin film sensor, comprises the following steps:
By Sodium dodecylbenzene sulfonate, polyvinyl lactam, methylcellulose gum, polymethylmethacrylate, hydroxyethyl methylacrylate, allyloxy hydroxypropyl azochlorosulfonate acid sodium, aluminium hydroxide, sodium hydroxide, stannic oxide, dicumyl peroxide, react under 600 DEG C of conditions, add polyvinyl alcohol again to stir, obtain mixture, mixture is coated in above tetrafluoroethylene base material, 100 DEG C of oven dry.
Drying time is 10min.
embodiment 3
For the adhesive tape of thin film sensor, comprise the raw material of following parts by weight: tetrafluoroethylene base material 150 parts, Sodium dodecylbenzene sulfonate 80 parts, polyvinyl lactam 80 parts, methylcellulose gum 80 parts, polymethylmethacrylate 80 parts, polyvinyl alcohol 60 parts, hydroxyethyl methylacrylate 60 parts, allyloxy hydroxypropyl azochlorosulfonate acid sodium 60 parts, 50 parts, aluminium hydroxide, 50 parts, sodium hydroxide, 15 parts, stannic oxide, dicumyl peroxide 60 parts.
The thickness of tetrafluoroethylene base material is 0.5mm.
The preparation method of the above-mentioned adhesive tape for thin film sensor, comprises the following steps:
By Sodium dodecylbenzene sulfonate, polyvinyl lactam, methylcellulose gum, polymethylmethacrylate, hydroxyethyl methylacrylate, allyloxy hydroxypropyl azochlorosulfonate acid sodium, aluminium hydroxide, sodium hydroxide, stannic oxide, dicumyl peroxide, react under 800 DEG C of conditions, add polyvinyl alcohol again to stir, obtain mixture, mixture is coated in above tetrafluoroethylene base material, 200 DEG C of oven dry.
Drying time is 20min.
embodiment 4
For the adhesive tape of thin film sensor, comprise the raw material of following parts by weight: tetrafluoroethylene base material 120 parts, Sodium dodecylbenzene sulfonate 50 parts, polyvinyl lactam 72 parts, methylcellulose gum 50 parts, polymethylmethacrylate 75 parts, polyvinyl alcohol 30 parts, hydroxyethyl methylacrylate 30 parts, allyloxy hydroxypropyl azochlorosulfonate acid sodium 44 parts, 45 parts, aluminium hydroxide, 45 parts, sodium hydroxide, 11 parts, stannic oxide, dicumyl peroxide 30 parts.
The thickness of tetrafluoroethylene base material is 0.2mm.
The preparation method of the above-mentioned adhesive tape for thin film sensor, comprises the following steps:
By Sodium dodecylbenzene sulfonate, polyvinyl lactam, methylcellulose gum, polymethylmethacrylate, hydroxyethyl methylacrylate, allyloxy hydroxypropyl azochlorosulfonate acid sodium, aluminium hydroxide, sodium hydroxide, stannic oxide, dicumyl peroxide, react under 650 DEG C of conditions, add polyvinyl alcohol again to stir, obtain mixture, mixture is coated in above tetrafluoroethylene base material, 120 DEG C of oven dry.
Drying time is 18min.
comparative example 1
Identical with embodiment 1, difference is: do not add stannic oxide.
performance test
Thin film sensor comprises the protective film, circuit film and the adhesive tape that connect successively from top to bottom, and circuit film is provided with printed wiring.
Described adhesive tape is applied to thin film sensor, measures cohesive strength and the tensile strength of adhesive tape and circuit film, the results are shown in Table 1.
Table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Comparative example 1 | |
| Cohesive strength kN/m | 6.1 | 5.2 | 6.4 | 5.9 | 2.3 |
| Tensile strength kN/m | 4.9 | 4.5 | 4.3 | 4.6 | 3.1 |
Conclusion: cohesive strength of the present invention is 5.2 ~ 6.4kN/m, tensile strength is 4.3 ~ 4.9kN/m, and the cohesive strength of comparative example 1 is 2.3kN/m, and tensile strength is 3.1kN/m, illustrates that adding of stannic oxide significantly improves cohesive strength of the present invention and tensile strength.
Claims (5)
1. for the adhesive tape of thin film sensor, it is characterized in that, comprise the raw material of following parts by weight: tetrafluoroethylene base material 100 ~ 150 parts, Sodium dodecylbenzene sulfonate 40 ~ 80 parts, polyvinyl lactam 70 ~ 80 parts, methylcellulose gum 40 ~ 80 parts, polymethylmethacrylate 70 ~ 80 parts, polyvinyl alcohol 25 ~ 60 parts, hydroxyethyl methylacrylate 10 ~ 60 parts, allyloxy hydroxypropyl azochlorosulfonate acid sodium 40 ~ 60 parts, 10 ~ 50 parts, aluminium hydroxide, 40 ~ 50 parts, sodium hydroxide, 10 ~ 15 parts, stannic oxide, dicumyl peroxide 20 ~ 60 parts.
2. the adhesive tape for thin film sensor according to claim 1, it is characterized in that, comprise the raw material of following parts by weight: tetrafluoroethylene base material 120 parts, Sodium dodecylbenzene sulfonate 60 parts, polyvinyl lactam 75 parts, methylcellulose gum 60 parts, polymethylmethacrylate 75 parts, polyvinyl alcohol 40 parts, hydroxyethyl methylacrylate 30 parts, allyloxy hydroxypropyl azochlorosulfonate acid sodium 50 parts, 40 parts, aluminium hydroxide, 45 parts, sodium hydroxide, 12 parts, stannic oxide, dicumyl peroxide 40 parts.
3. the adhesive tape for thin film sensor according to claim 1, is characterized in that, the thickness of tetrafluoroethylene base material is 0.1 ~ 0.5mm.
4. based on the preparation method of the adhesive tape for thin film sensor according to claim 1, it is characterized in that, comprise the following steps: by Sodium dodecylbenzene sulfonate, polyvinyl lactam, methylcellulose gum, polymethylmethacrylate, hydroxyethyl methylacrylate, allyloxy hydroxypropyl azochlorosulfonate acid sodium, aluminium hydroxide, sodium hydroxide, stannic oxide, dicumyl peroxide, react under 600 ~ 800 DEG C of conditions, add polyvinyl alcohol again to stir, obtain mixture, mixture is coated in above tetrafluoroethylene base material, 100 ~ 200 DEG C of oven dry.
5. the preparation method of the adhesive tape for thin film sensor according to claim 4, is characterized in that, drying time is 10 ~ 20min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510887644.1A CN105368337A (en) | 2015-12-07 | 2015-12-07 | Bonding adhesive tape for thin-film sensor and preparation method for bonding adhesive tape |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510887644.1A CN105368337A (en) | 2015-12-07 | 2015-12-07 | Bonding adhesive tape for thin-film sensor and preparation method for bonding adhesive tape |
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| CN105368337A true CN105368337A (en) | 2016-03-02 |
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| CN201510887644.1A Pending CN105368337A (en) | 2015-12-07 | 2015-12-07 | Bonding adhesive tape for thin-film sensor and preparation method for bonding adhesive tape |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108795333A (en) * | 2018-07-03 | 2018-11-13 | 佛山市影腾科技有限公司 | A kind of antistatic adhesive agent of gas sensor chip adherency |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103140517A (en) * | 2010-11-02 | 2013-06-05 | 日本合成化学工业株式会社 | Acrylic resin composition, acrylic adhesive, adhesive sheet, double-sided adhesive sheet, adhesive for transparent electrodes, touch-panel and image display device, as well as production method for adhesive layer-containing laminates |
| CN104789176A (en) * | 2015-03-31 | 2015-07-22 | 苏州市鼎立包装有限公司 | Sealing adhesive and preparation method thereof |
-
2015
- 2015-12-07 CN CN201510887644.1A patent/CN105368337A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103140517A (en) * | 2010-11-02 | 2013-06-05 | 日本合成化学工业株式会社 | Acrylic resin composition, acrylic adhesive, adhesive sheet, double-sided adhesive sheet, adhesive for transparent electrodes, touch-panel and image display device, as well as production method for adhesive layer-containing laminates |
| CN104789176A (en) * | 2015-03-31 | 2015-07-22 | 苏州市鼎立包装有限公司 | Sealing adhesive and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108795333A (en) * | 2018-07-03 | 2018-11-13 | 佛山市影腾科技有限公司 | A kind of antistatic adhesive agent of gas sensor chip adherency |
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